SDWL1608C15NGSTFN01

Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 1 of 14 S P E C I F I C AT I O N S Customer Product Name Wire Wound Chip Ceramic Inductor Sunlord Part Number SDWL1608C STFN Customer Part Number [ New Released, Revised] SPEC No.: SDWL0912200000 【This SPEC is total 14 pages including specifications and appendix.】 【ROHS, Halogen-Free and SVHC Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China 518110 Tel: 0086-755-29832333 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Restricted Date: Rejected Re-checked By Checked By Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 2 of 14 【Version change history】 Rev. Effective Date 01 / Changed Contents New release Change reasons / Approved By Jingxin Huang Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 3 of 14 Caution All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. nuclear control equipment 5. military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc.) 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Data-processing equipment 12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 【Precautions】 1. Magnetic materials shall be far away from parts to avoid impacts on their electrical characteristics. 2. Parts could be damaged by external mechanical pressure or stacked heavy objects, as well as strong shaking & dropping. 3. Please do not store parts in bulk to prevent coils and parts being damaged. 4. Oversized external force to parts on PCB may lead to parts being damaged or slipped off. 5. Please do not use parts on edge or top of PCB board in your design to avoid parts being damaged during PCB is moved. 6.Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage the insulation film of wires, then causing short circuit of parts. 7.Please do not use the brush to clean product or its surroundings. If you use the brush to clean product or its surroundings on PCB,copper wire may be broke, causing the product open . Sunlord 1. 2. Categories: general confidential Scope This specification applies to the SDWL1608C Wire Wound Chip Ceramic Inductor STFN Page 4 of 14 of Wire Wound Chip Ceramic Inductor. Product Description and Identification (Part Number) 1) Description Wire Wound Chip Ceramic Inductor, 1608, XXX nH± X% @XXXMHz, XXXΩ, XXX Ma 2) Product Identification (Part Number) SDWL 1608 C S T F N ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ② External Dimensions [L X W] (mm) ① Type 1608 Wire Wound Chip Inductor SDWL ④ Nominal Inductance (nH) ③ Material Code C Example Ceramic ⑤ Inductance Tolerance C ±0.2nH S ±0.3nH D ±0.5nH G ±2% H ±3% J ±5% K ±10% 1.6 X 0.8 Nominal Value 1N8 1.8 10N 10 R10 100 ⑥ Product Classification Code Sn Plating Five-faces Coating S ⑧ HSF Products Hazardous Substance Free Products ⑦ Packing B Bulk Package T Tape & Reel ⑨ Internal Code N01 3. Electrical Characteristics Please refer to Appendix A. 1) Operating and storage temperature range (individual chip without packing): -40℃ to +125℃ 2) Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.) 4. Shape and Dimensions 1) Dimensions: See the following. Unit：mm A MAX. 1.8 B MAX. 1.12 C MAX. 1.02 D REF. 0.38 E REF. F REF. H REF. I REF. J REF. 0.76 0.33 1.02 0.64 0.64 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 5 of 14 2) Electrode Coplanarity:0.1mm Max. 3) Structure: See the following. 5. No. Components Material A Coating Ultraviolet epoxy resin B Core Ceramic C Wire Polyurethane system enameled copper wire D Electrodes Ag-Pd with Ni and Sn plating Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65%±20% c. Air Pressure: 86 KPa to 106 KPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65%±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 30X magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Item 3. b. Test equipment: HIOKI3540 or equivalent. 5.3.2 Inductance (L) a. Refer to Item 3. b. Test equipment: Agilent4287A+Agilent16197A or equivalent. c. Test signal: -13dBm or 10mA d. Test frequency refers to Item 3. 5.3.3 Q Factor (Q) a. Refer to Item 3. b. Test equipment: Agilent4287A+Agilent16197A or equivalent. c. Test signal: -13dBm or 10mA d. Test frequency refers to Item 3. 5.3.4 Self-Resonant Frequency (SRF) a. Refer to Item 3. b. Test equipment: Agilent4991B+Agilent16197A and HP 8753E or equivalent. c. Test signal: -20dBm or 50mV 5.3.5 Rated Current a. Refer to Item 3. b. Test equipment (see Fig.5.3.5-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 5.3.5-1): 1. Set test current to be 0 mA. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. d. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 15℃ against chip initial surface temperature (Ta) (see Fig. 5.3.5-2). Ta+15℃ Ta 0 Rated current Fig. 5.3.5-1 Fig. 5.3.5-2 Ir (mA) Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 6 of 14 5.4 Reliability Test Items 5.4.1 Terminal Strength Requirements Test Methods and Remarks No removal or split of the termination or other defects ① shall occur. ② ③ ④ 5.4.2 Resistance to Flexure ① No visible mechanical damage. 20 Unit: mm 10 ② ③ ④ R10 45 5.4.3 Vibration ① ② ③ 45 No visible mechanical damage. Inductance change: within ±5% Q factor change: within ±20% Cu pad Solder the inductor to the testing jig (glass epoxy board) using eutectic solder. Then apply a force in the direction of the arrow. 7N force. Keep time: 10±1s Speed: 1.0 mm/s. Solder the inductor to the test jig. Using a eutectic solder. Then apply a force in the direction shown as left. Flexure: 2mm Pressurizing Speed: 0.5mm/sec. Keep time: 5sec. Flexure ① ② Solder mask ③ Solder the inductor to the testing jig (glass epoxy board )using eutectic solder. The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours) Glass Epoxy Board 5.4.4 Dropping ① ② ③ 5.4.5 Temperature coefficient +50±100ppm/℃ ① ② Between -40℃ and +125℃ With a reference value of +20℃ 5.4.6 Solderability 90% or more of electrode area shall be Coated by new solder. ① Electrode of the coil shall be immersed in flux for 5 to 10 Seconds. The coil shall be immersed in solder bath at a temperature of 240±5℃, Duration for 3±0.5 seconds. Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight. No visible mechanical damage. Inductance change: within ±5% Q factor change: within ±20% Drop chip inductor 10 times on a concrete floor from a height of 100 cm. ② ③ ④ 5.4.7 Resistance to Soldering Heat ① ② ③ No visible mechanical damage. Inductance change: within ±5% Q factor change: within ±20% Re-flowing Profile: Max: 260℃/10sec 260℃ 200℃ 240℃ 190℃ 150℃ 90±30sec. 20~40sec. Gradual Cooling Sunlord Categories: general confidential 5.4.8 ① Thermal Shock ② ③ Wire Wound Chip Ceramic Inductor ① No visible mechanical damage. Inductance change: within ±5% Q factor change: within ±20% +125℃ 30 min. ② ③ ④ Page 7 of 14 Temperature, Time: -40℃ for 30±3 min→+125℃ for 30±3min Transforming interval: 20s (max.) Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring. 30 min. Ambient Temperature -40℃ 30 min. 20s (max.) 5.4.9 Resistance to Low Temperature ① ② ③ No visible mechanical damage. Inductance change: within ±5% Q factor change: within ±20% ① ② ③ Temperature: -40±2℃ Duration: 1000+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.10 Resistance to High Temperature ① ② ③ No mechanical damage. Inductance change: within ±5% Q factor change: within ±20% ① ② ③ Temperature: 125±2℃ Duration: 1000+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.11 Damp Heat (Steady States) ① ② ③ No mechanical damage. Inductance change: within ±5% Q factor change: within ±20% ① ② ③ Temperature: 60±2℃, Humidity: 90% to 95% RH Duration: 1000+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.12 ① Loading Under ② Damp Heat ③ No mechanical damage. Inductance change: within ±5% Q factor change: within ±20% ① ② ③ ④ Temperature: 60±2℃ ,Humidity: 90% to 95% RH Duration: 1000+24hours Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① ② ③ No mechanical damage. Inductance change: within ±5% Q factor change: within ±20% ① ② ③ ④ Temperature: 125±2℃ Duration: 1000+24hours Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.13 Loading at High Temperature (Life Test) 6. Packaging and Storage 6.1 Packaging There is one type of packaging for the chip inductors. Please specify the packing code when ordering. Tape Carrier Packaging: Packaging code: T i. Tape carrier packaging are specified in attached figure Fig.6.1-1~5 ii. Tape carrier packaging quantity please see the following table: Type 1608 Tape Paper Tape Quantity 3K Categories: general confidential Wire Wound Chip Ceramic Inductor Page 8 of 14 (1) Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Sprocket Hole Chip Cavity Fig. 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. (2) Taping Dimensions (Unit: mm) T 1.75±0.1 Φ1.50 -0/+0.1 8.0±0.1 3.5±0.05 4.0±0.1 B K A P 2.0±0.05 Fig. 6.1-2 Type A 1608 1.17±0.05 图7.1-3 B 1.80±0.05 P K T 4.0±0.10 1.03±0.10 1.07±0.10 (3) Leader and blank portion Fig. 6.1-3 图7.1-3 (4) Reel Dimensions (Unit: mm) 10±1.5 2.45±0.2 3.0±0.1 178±2 5.0±0.1 58±2 4.0±0.1 13.5±0.2 Sunlord 9 9 ± 0 Fig. 6.1-4 . 图7.1-3 3 9 9 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 9 of 14 (5) Peeling off force: 10gf to 70gf in the direction show below. Top tape or cover tape 165°~ 180° Base tape Fig. 6.1-5 6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S) c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. d. Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as possible. e. Solderability shall be guaranteed for 12 months from the date of delivery on condition that they are stored at the environment specified in specification. .For those parts, which passed more than 12 months shall be checked solder-ability before use. 7. Warning and Attentions 7.1 Precautions on Use a. Always wear static control bands to protect against ESD. b. Any devices used (soldering iron, measuring instruments) should be properly grounded. c. Use non-magnetic tweezers when handing the chips. d. Pre-heating when soldering, and refer to the recommended condition specified in specification. e. Don’t apply current in excess of the rated current value. It may cause damage to components due to over-current. f. Keep clear of anything that may generate magnetic fields such as speakers, coils. g. When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress. h. When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please evaluate reliability with the product mounted in your application set. i. When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use. j. Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat by other products may cause deterioration at joint of this product with substrate. k. Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic coupling. l. Please do not give the product any excessive mechanical shocks in transportation. m. Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires. n. Please do not add any shock and power to the soldered product to avoid causing any damage to chip body. o. Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on the skin. 7.2 PCB Bending Design The following shall be considered when designing and laying out PCB’s. a. PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection. Products shall be located in the sideways direction to the (Poor example) b. (Good example) mechanical stress. Products location on PCB separation. C Separation B Product shall be located carefully because they may be subjected to the mechanical stress in order of A>C=B>D. A D Sunlord c. Categories: general confidential Wire Wound Chip Ceramic Inductor Page 10 of 14 When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not to give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices. 7.3 Recommended PCB Design for SMT Land-Patterns When chips are mounted on a PCB, the amount of solder used (size of fillet) and the size of PCB Land-Patterns can directly affect chip performance (such as Q). And they can also cause other soldering question (such as offset and side lap). Therefore, the following items must be carefully considered in the design of solder land patterns. a. Please use the PCB pad and solder paste we recommend, and contact us in advance if they need to be changed. b. Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage the insulation film of wires, then causing short circuit of parts. c. The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. d. When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering point is separated by solder-resist. Recommended land dimensions please refer to product specification. 8. Recommended Soldering Technologies This product is only for reflow soldering and iron soldering. 8.1 Re-flowing Profile △ Preheat condition: 150~200℃/60~120sec. △ Allowed time above 217C: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2 times max. Peak 260℃max 260℃ Max Ramp Up Rate=3℃/sec. 217℃ Max Ramp Down Rate =6℃/sec. 60～90sec. 200℃ 150℃ 60～120sec. 25℃ Time 25℃ to Peak= 8 min Max [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 8.2 △ △ △ △ △ △ Iron Soldering Profile Iron soldering power: 30W Max. Preheat condition: 150℃/60sec. Soldering tip temperature: 350℃ Max. Soldering time: 3sec. Max. Solder paste: Sn/3.0Ag/0.5Cu Iron Soldering time: 1 time max. 3sec. Max. 350℃ Soldering Iron Power： Max.30W Diameter of Soldering： Iron 1.0mm max. Tc ℃ [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 8.3 △ △ △ 9. Maintenance of heat gun (for your reference) Power output: 30W Temperature: 350℃ Max Heat time: More than 5 seconds heating may cause short circuit of parts. Solder Volume Solder shall be used not to exceed as shown below. Sunlord a. b. c. Categories: general confidential Wire Wound Chip Ceramic Inductor Page 11 of 14 Accordingly increasing the solder volume, the mechanical stress to chip is also increased.Exceeding solder volume may cause the failure of mechanical or electrical performance. Before soldering, please ensure that the solder should not adhere to the wire part of chip. Please pay particular attention to whether there is flux remaining on surface of the wire part of chip after subjected to reflow soldering since this may causing short circuit of parts. 10. Cleaning Products shall be cleaned on the following conditions: a. Cleaning temperature shall be limited to 60℃ Max. (40℃ Max. for fluoride and alcohol type cleaner.) b. Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and PCB. Power: 20W/l Max. Frequency: 28 KHz to 40 KHz Time: 5 minutes Max c. Cleaner i. Alternative cleaner  Isopropyl alcohol (IPA)  HCFC-225 ii. Aqueous agent  Surface Active Agent Type (Clean through-750H)  Hydrocarbon Type (Techno Cleaner-335)  Higher Alcohol Type (Pine Alpha ST-100S)  Alkali saponifier Type (※ Aqua Cleaner 240) ※ Alkali saponification shall be diluted to 20% volume with de-ionized water. ※ Please contact our technical service department before using other cleaner. d. There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, product shall be dried completely after rinse with de-ionized water in order to remove the cleaner. e. Some products may become slightly whitened. However, product performance or usage is not affected. f. Please take care of winding part while cleaning. g. After cleaning, parts could be subjected to the next reflow soldering till the solvent remaining on surface of parts being volatilized. Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 12 of 14 Appendix A: Electrical Characteristics ⅠSDWL1608C STFN Series Part Number Inductance Tolerance Min. Quality Factor L/Q Test Freq. Max. DC Resistance Max. Rated Current Min. Self-resonant Frequency Units nH - - MHz Ω mA MHz Symbol L - Q Freq. DCR Ir S.R.F SDWL1608C1N6□STFN01 1.6 S 24 250 0.030 700 12500 SDWL1608C1N8□STFN01 1.8 J, K 16 250 0.045 700 12500 SDWL1608C2N2□STFN01 2.2 J, K 13 250 0.250 100 12500 SDWL1608C2N7□STFN01 2.7 J, K 25 250 0.043 1000 6000 SDWL1608C3N3□STFN01 3.3 J, K 35 250 0.045 700 5900 SDWL1608C3N6□STFN01 3.6 J, K 22 250 0.063 700 5900 SDWL1608C3N9□STFN01 3.9 J, K 22 250 0.080 700 6900 SDWL1608C4N3□STFN01 4.3 J, K 22 250 0.063 700 5900 SDWL1608C4N7□STFN01 4.7 J, K 20 250 0.116 700 5800 SDWL1608C5N1□STFN01 5.1 J, K 20 250 0.140 700 5700 SDWL1608C5N6□STFN01 5.6 J, K 26 250 0.075 700 4760 SDWL1608C6N8□STFN01 6.8 G, J 27 250 0.110 700 5800 SDWL1608C7N5□STFN01 7.5 G, J 28 250 0.106 700 4800 SDWL1608C8N2□STFN01 8.2 G, J 30 250 0.115 700 4200 SDWL1608C8N7□STFN01 8.7 G, J 28 250 0.109 700 4600 SDWL1608C9N5□STFN01 9.5 G, J 28 250 0.135 700 5400 SDWL1608C10N□STFN01 10 G, J 31 250 0.130 700 4800 SDWL1608C11N□STFN01 11 G, J 30 250 0.130 700 4000 SDWL1608C12N□STFN01 12 G, J 35 250 0.130 700 4000 SDWL1608C15N□STFN01 15 G, J 35 250 0.170 700 4000 SDWL1608C16N□STFN01 16 G, J 34 250 0.17 700 3300 SDWL1608C18N□STFN01 18 G, J 35 250 0.170 700 3100 SDWL1608C22N□STFN01 22 G, J 38 250 0.190 700 3000 SDWL1608C23N□STFN01 23 G, J 38 250 0.19 700 2850 SDWL1608C24N□STFN01 24 G, J 36 250 0.190 700 2650 SDWL1608C27N□STFN01 27 G, J 40 250 0.220 600 2800 SDWL1608C30N□STFN01 30 G, J 37 250 0.220 600 2250 SDWL1608C33N□STFN01 33 G, J 40 250 0.220 600 2300 SDWL1608C36N□STFN01 36 G, J 37 250 0.250 600 2080 SDWL1608C39N□STFN01 39 G, J 40 250 0.250 600 2200 SDWL1608C43N□STFN01 43 G, J 38 250 0.280 600 2000 SDWL1608C47N□STFN01 47 G, J 38 200 0.280 600 2000 SDWL1608C51N□STFN01 51 G, J 35 200 0.250 600 1900 SDWL1608C56N□STFN01 56 G, J 38 200 0.310 600 1900 SDWL1608C68N□STFN01 68 G, J 37 200 0.340 600 1700 SDWL1608C72N□STFN01 72 G, J 34 150 0.490 400 1700 SDWL1608C82N□STFN01 82 G, J 34 150 0.540 400 1700 SDWL1608CR10□STFN01 100 G, J 34 150 0.580 400 1400 SDWL1608CR11□STFN01 110 G, J 32 150 0.610 300 1350 SDWL1608CR12□STFN01 120 G, J 32 150 0.650 300 1300 SDWL1608CR15□STFN01 150 G, J 28 150 0.920 280 990 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 13 of 14 Part Number Inductance Tolerance Min. Quality Factor L/Q Test Freq. Max. DC Resistance Max. Rated Current Min. Self-resonant Frequency Units nH - - MHz Ω mA MHz Symbol L - Q Freq. DCR Ir S.R.F SDWL1608CR18□STFN01 180 G, J 25 100 1.250 240 990 SDWL1608CR20□STFN01 200 G, J 25 100 1.980 200 900 SDWL1608CR21□STFN01 210 G, J 27 100 2.060 200 895 SDWL1608CR22□STFN01 220 G, J 25 100 2.100 200 900 SDWL1608CR23□STFN01 230 G, J 25 100 2.120 190 875 SDWL1608CR25□STFN01 250 G, J 25 100 3.550 120 822 SDWL1608CR27□STFN01 270 G, J 26 100 2.160 170 830 SDWL1608CR33□STFN01 330 G, J 25 100 3.890 100 900 SDWL1608CR39□STFN01 390 G, J 25 100 4.350 100 780 II. Typical Electrical Characteristics Inductance vs. Frequency Characteristics Q vs. Frequency Characteristics 1000 140 SDWL1005CS3N9 SDWL1608C3N9 □STFN01 SDWL1005CS47N SDWL1608C47N□STFN01 SDWL1005CSR10 SDWL1608CR10□STFN01 120 100nH S S 100 100 3.9nH 47nH 80 47nH Q Inductance(nH) SDWL1005CS3N9 SDWL1608C3N9□STFN01 SDWL1005CS47N SDWL1608C47N□STFN01 SDWL1608CR10□STFN01 SDWL1005CSR10 60 10 3.9nH 40 100nH 20 0 1 10 100100 10001000 Frequency(MHz) Frequency (MHz) 10000 10 100 1000 100 1000 Frequency(MHz) Frequency (MHz) 10000 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 14 of 14 Appendix B: Appearance standard File No: Applied to Wire Wound Ceramic Inductor Series Effective date: No. Defect Item Graphic Item Schematic Drawing Rejection identification Criteria 1 Wire off/ Welding Spot Off The solder joint Welding Spot of wire break away from electrodes, or over the electrodes. 2 Solder misplace Solder joints are not at electrode side but at the coating side or flank. Coating side(Non-A region): if B≥0.20mm, NG. B: Resin starved diameter ; A: electrode region, A=0.48mm 3 Starvation Flank: uncontrolled. Coating at flank 4 Coating misplace Coating at electrodes side