CWCI0603F-100KT

Specification Sheet for SMD Chip Inductor Specification Sheet for Approved Customer Name: Customer Part No.: Ceaiya Part No: CWCI0603F Series Spec No: C-063 【For Customer Approval Only】 If you Approval, Please Stamp 【RoHS Compliant Parts】 Approved By 李庆辉 Checked By Prepared By 朱宏亮 劳水花 深圳市柯爱亚电子有限公司 Shenzhen Ceaiya Electronics Co., Ltd. 深圳地址: 深圳市龙华区观澜街道新澜社区观光路 1301-74 号银星智界 4 号楼（综合楼）716 东莞地址：广东省东莞清溪镇青滨东路 105 号力合紫荆智能制造中心 10 栋一单元 Http//www.szceaiya.com Tel: 0769-89135516 Fax: 0769-89135519 1 Specification Sheet for SMD Chip Inductor 【Version of Changed Record】 Rev. Effective Date Changed Contents Change Reasons Approved By A0 2020-06-11 New release / Li qing hui 2 Specification Sheet for SMD Chip Inductor 1. Scope This specification applies to the CWCI0603F Series of wire wound SMD chip inductor. 2. Product Description and Identification (Part Number) 1) Description: CWCI0603F series of Wire wound SMD chip inductor. 2) Product Identification (Part Number) CWCI 0603 F 2R2 K T □□ ① ② ③ ④ ⑤ ⑥ ⑦ ① ② External Dimensions(L×W) 【inch】 Type CWCI ③ F 0603 Wire Wound Chip Inductor Material type ④ Ferrite ⑤ ±5% K ±10% M ±20% ⑥ Nominal Value 1R0 1.0uH 100 10uH 101 100uH ⑦ Desjgn Code □□ Packing T Nominal Inductance Example Inductance Tolerance J 1.60mm×0.8mm Desjgn Code * Standard product is blank Tape Carrier Package 3. Electrical Characteristics Please refer to Item 5. 1） Operating temperature range (individual chip without packing): -25℃ ~ +100℃ （Including Self-heating）. 2） Storage temperature range (packaging conditions): -25℃ ~ +100℃ and RH 70% (Max.). 4. Shape and Dimensions (Unit:mm) Dimensions and recommended PCB pattern for reflow soldering, please see Fig4-1 and Table4-1 Fig4-1. Table 4-1. Series A B C D E H I J CWCI0603F 1.80 Max. 1.20 Max. 1.0 Max. 0.90 typ. 0.30 Ref 1.15 Ref 0.64 Ref 0.64 Ref 3 Specification Sheet for SMD Chip Inductor 5. Electrical Characteristics Part No. L(uH) Tol. L Test Freq. MHz Q Typ. Q Test Freq MHz DCR ±30% (Ω) Idc Typ. (mA) I rms Typ. (mA) SRF(MHz) Typ. CWCI0603F-R68□T 0.68 J/K 7.9 15 7.9 0.39 1000 800 400 CWCI0603F-1R0□T01 1.0 M/N 1.0 15 1.0 0.14 800 900 350 CWCI0603F-1R0□T 1.0 K/M 7.9 17 7.9 0.37 860 700 390 CWCI0603F-1R8□T 1.8 J/K 7.9 16 7.9 0.43 640 580 121 CWCI0603F-2R2□T 2.2 J/K 7.9 16 7.9 0.56 600 580 103 CWCI0603F-4R7□T 4.7 J/K 7.9 16 7.9 0.97 400 400 51 CWCI0603F-6R8□T 6.8 J/K 7.9 16 7.9 1.50 340 340 43 CWCI0603F-100□T 10 J/K 2.5 14 2.5 1.85 280 280 36 CWCI0603F-150□T 15 J/K 2.5 14 2.5 2.60 240 240 29 CWCI0603F-220□T 22 J/K 2.5 14 2.5 3.61 200 200 24 Note: 1. When ordering, please specify tolerance and packaging codes. Ex:CWCI0603F-100K-T Tolerance: J=±5%,K=±10%,M=±20%, N=±30% Packaging: Clear tape and reel {standard} 2. L, Q, SRF : Agilent /HP 4287A + Agilent / HP 8722ES or Equivalent 3. Rdc: Digital Milliohm Meter Chroma 16502, or equivalent. 4. Idc for a 15℃ rise above 25℃ ambient. 5. Package spec.: 7 inch Reel , 4000pcs/Reel . 6. Structure: See the following. No. Components Material A Coating Ultraviolet epoxy resin B Core Ferrite C Wire Polyurethane system enameled copper wire D Electrodes Ag/Ag-Pd with Ni and Sn plating 4 Specification Sheet for SMD Chip Inductor 7. Reliability Test Items Performance 7.1 Solder Heat Resiestance 耐焊锡热 Appearance: No significant abnormality. Inductance change: Within ±20% 外观： 无明显异常 电感值：变化值在初始值 20%以内 7.2 Solderability Test 端面焊锡性 More than 90% of the teminal electrode should be covered with solder. 端电极之锡覆盖面达 90%以上 90% 7.3 High Temperature Resistance Test 高温放置测试 Appearance: no damage. Inductance: within±20% 20% of initial value. 7.4 Humidity Resistance Test 高湿放置测试 7.5 Thermal shock 热冲击试验 7.6 Humidity Resistance 高湿测试 No disconnection or short circuit. 外观不能破损 电感值：变化值在初始值 20%以内 电性无短路或断线。 Appearance: no damage. 20% of initial value. Inductance: within±20% No disconnection or short circuit. 外观不能破损 电感值：变化值在初始值 20%以内 电性无短路或断线。 Appearance: no damage. Inductance: within±20% 20% of initial value. No disconnection or short circuit. 外观不能破损 电感值：变化值在初始值 20%以内 电性无短路或断线。 Appearance: no damage. 20% of initial value. Inductance: within±20% No disconnection or short circuit. 外观不能破损 电感值：变化值在初始值 20%以内 电性无短路或断线。 Test Condition Preheat: 150℃, 60sec. Solder: H63A Solder temperature: 260±5℃ Flux for lead free: rosin Dip time: 10±0.5sec. 预热：150℃，60 sec 锡炉温度：260±5℃ 助焊剂：rosin. 时间：10±0.5sec Preheat: 125±25℃, 60sec. Solder: H63A Solder temperature:230±5℃ Flux for lead free: rosin Dip time: 4±1sec 预热：125℃，60 sec 锡炉温度：230±5℃ 助焊剂：rosin. 时间：4±1sec Temperature: 85±2℃. Applied current: rated current. Duration: 500 hrs Temperature: 40±2℃. Applied current: rated current. Duration: 500 hrs Humidity: 90~95% Condition for 1 cycle Step1: -25±2℃ , 30±3 min. Step2: Room temperature within 15 min. Step3: +85±5℃, 30±3 min. Step4: Room temperature within 15 min. Number of cycles: 50PCS Humidity: 90~95%RH. Temperature: 40±5℃. Applied current: rated current. Duration: 500±12hrs. Measured at room temperature after placing for 2 to 3hrs. 湿度：90~95%RH. 温度：40±5℃. 须加电流：额定电流。 放置时间：500±12hrs. 5 Specification Sheet for SMD Chip Inductor 8. Packaging and Storage 8.1 Packaging There is one type of packaging for the chip chip inductors. Please specify the packing code when ordering. Tape Carrier Packaging: Packaging code: T i. Tape carrier packaging are specified in attached figure ii. Tape ape carrier packaging quantity please see the following table: Type 0603 Tape Punched Tape Quantity 4K (1) Taping Drawings (Unit: mm) Remark: The sprocket holes are to the right as the tape is pulled toward the user. (2) Taping Dimensions (Unit: mm) Type A B P K T 0603 1.30±0.10 1.90±0.10 4.0±0.05 1.08±0.10 1.12±0.10 6 Specification Sheet for SMD Chip Inductor (3) Leader and blank portion (4) Reel Dimensions (Unit: mm) (5) Peeling off force: 10gf to 70gf in the direction show below. 7