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CLT-133-02-F-D-P-TR

CLT-133-02-F-D-P-TR

  • 厂商:

    SAMTEC(申泰)

  • 封装:

    CONN-66P_66X4MM_SM

  • 描述:

    CONN RCPT 66POS 0.079 GOLD SMD

  • 详情介绍
  • 数据手册
  • 价格&库存
CLT-133-02-F-D-P-TR 数据手册
COST-EFFECTIVE & DUAL WIPE SOCKETS 8 G b p s (2.00 mm) .0787" PITCH • TLE/CLT SERIES TLE Mates: TMMH, TMM, MTMM, MMT, TW, LTMM, ZLTMM, TCMD, TSH -1 TLE - 01 - NO. PINS PER ROW 02 thru 50 CLT PROCESSING –G –P = Metal Pick & Place Pad (4 positions minimum)   –TR —P Option   —A Option -1 CLT NO. PINS PER ROW - 02 thru 50 LEAD STYLE   - –01 = Throughhole = Surface Mount - D - –03 All options require Style –02 –L = Bottom Entry (Required for bottom entry applications) –G = Alignment Pin (3 positions minimum) Metal or plastic at Samtec’s discretion –BE –A = 10 µ" (0.25 µm) Gold on contact, Gold flash on tail Other Platings –K = (5.00 mm) .197" DIA Polyimide Film Pick & Place Pad (04 thru 50 only) No. of positions x (2.00) .0787 –P (4.00) .157 = Pick & Place Pad (4 positions minimum) (Not always necessary for auto placement.) (2.121) .0835 CLT –TR = Tape & Reel (36 positions max) (2.29) .090 A (3.02) .119 —01 or —03 LEAD STYLE A –01 (2.16) .085 –03 (2.95) .116 OTHER OPTIONS –F = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail = Throughhole MOQ Required -FR = Gold flash on contact, Matte Tin on tail –02 ALSO AVAILABLE PLATING OPTION = Tape & Reel Packaging (2-37 positions only) = Full Reel Tape & Reel (must order maximum quantity per reel; contact Samtec for quantity breaks) (2-37 positions only)   Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (02-26) (0.15 mm) .006" max (27-50)* *(.004" stencil solution may be available; contact ipg@samtec.com) Note: Some lengths, styles and options are non-standard, non-returnable. –A = Alignment Pin (3 positions minimum) 1RRISRVLWLRQV[   TLE Same as TLE except: SMT Lead Coplanarity: (0.10 mm) .004" max (02-25) (0.15 mm) .006" max (26-34)* (0.20 mm) .008" max (35-50)* *(.004" stencil solution may be available; contact ipg@samtec.com) OPTIONS –K TLE Same as TLE except: Plating: Sn or Au over 50 µ" (1.27 µm) Ni Current Rating (TMMH/CLT): 4.1 A per pin (2 pins powered) Insertion Depth: Top Entry= (1.40 mm) .055" minimum Bottom Entry= (2.57 mm) .101" minimum (add board thickness for correct post OAL) Max Cycles: 100 with 10 µ" (0.25 µm) Au - = (5.00 mm) .197" DIA Polyimide Film Pick & Place Pad (3 positions minimum) SPECIFICATIONS CLT DV = 10 µ" (0.25 µm) Gold Mates: TMM, TMMH, MTMM, MMT, TW, TSH Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au over 50 µ" (1.27 µm) Ni Current Rating (TLE/TMMH): 3.2 A per pin (2 pins powered) Operating Temp Range: -55 °C to +125 °C Insertion Depth: (2.08 mm) .082" to (4.37 mm) .172" with (0.38 mm) .015" wipe, pass-through, or (3.35 mm) .132" min for bottom entry - PLATING OPTION (5.16) .203 –02 —A Option —P Option –FR = Full Reel Tape & Reel (must order maximum quantity per reel; contact Samtec for quantity breaks) (36 positions max) samtec.com?TLE or samtec.com?CLT Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-224
CLT-133-02-F-D-P-TR AI解析
1. 物料型号:TLE/CLT系列,具有不同的引脚间距和配置选项。 2. 器件简介:文档描述了一种成本效益高的双擦插座,适用于高速数据传输。 3. 引脚分配:提供了不同引脚数量的配置,从01到50个引脚每排。 4. 参数特性: - TLE绝缘体材料:黑色液晶聚合物 - 接触材料:磷青铜 - 镀层:金层覆盖在50微米(1.27微米)镍上 - 电流额定值:每针3.2安培(2针供电) - 工作温度范围:-55°C至+125°C - 插入深度:2.08毫米至4.37毫米,具有0.38毫米的擦拭 5. 功能详解:文档详细描述了插座的电气性能和物理特性,包括插入深度和电流额定值。 6. 应用信息:适用于高速数据传输和需要高可靠性的应用。 7. 封装信息:提供了不同封装选项,如通孔、表面贴装和底部入口等。
*介绍内容由AI识别生成
CLT-133-02-F-D-P-TR 价格&库存

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