MGC3130
Hillstar Development Kit
User’s Guide
2013-2016 Microchip Technology Inc.
DS40001721B
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0206-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS40001721B-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2013-2016 Microchip Technology Inc.
Object of Declaration: MGC3130 Hillstar Development Kit User’s Guide
2013-2016 Microchip Technology Inc.
DS40001721B-page 3
MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 4
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT KIT
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
Warranty Registration............................................................................................ 9
Recommended Reading........................................................................................ 9
The Microchip Website........................................................................................ 10
Development Systems Customer Change Notification Service .......................... 10
Customer Support ............................................................................................... 11
Revision History .................................................................................................. 11
Chapter 1. Overview
1.1 Introduction ................................................................................................... 13
1.2 Hillstar Concept and Deliverables ................................................................ 13
1.3 Hillstar Development Kit Package Content .................................................. 14
1.4 Hillstar Development Kit Reference Electrodes ........................................... 15
1.5 MGC3130 Software Package – Aurea GUI and GestIC Library ................... 17
1.6 MGC3130 Software Development Kit (SDK) ................................................ 17
Chapter 2. Getting Started
2.1 Prerequisites ................................................................................................ 19
2.2 Step 1: Build-up Development Kit ................................................................ 19
2.3 Step 2: Connecting Hillstar Development Kit with Your PC ......................... 20
2.4 Step 3: Install Windows CDC Driver ............................................................. 20
2.5 Step 4: Start Aurea ....................................................................................... 20
Chapter 3. Hillstar Boards – Hardware Description
3.1 Overview ...................................................................................................... 23
3.1.1 I2C to USB Bridge ..................................................................................... 23
3.1.2 MGC3130 Unit ........................................................................................... 23
3.1.3 95x60 mm Reference Electrode PCB ........................................................ 24
3.2 MGC3130 Unit ............................................................................................. 24
3.3 Hillstar 95x60 mm Reference Electrode ...................................................... 25
3.4 I2C to USB Bridge ....................................................................................... 27
Chapter 4. Design In: Hillstar In Target Application
4.1 Introduction ................................................................................................... 31
4.2 Integration Examples .................................................................................... 31
Chapter 5. Troubleshooting
2013-2016 Microchip Technology Inc.
DS40001721B-page 5
MGC3130 Hillstar Development Kit User’s Guide
Appendix A. Schematics
A.1 Introduction .................................................................................................. 37
A.2 Bill of Materials ............................................................................................. 37
A.3 Board – Schematics and Layout .................................................................. 39
Appendix B. Sensitivity Profile and Capacitances
B.1 Introduction .................................................................................................. 43
B.2 Sensitivity Profiles ........................................................................................ 43
B.3 Electrode Capacities .................................................................................... 44
Appendix C. Parameterization Support
C.1 How to Build a Hand Brick ........................................................................... 45
C.2 Usage of the Hand Brick as Artificial Hand .................................................. 47
Appendix D. Driver Installation Manual
D.1 Open Device Manager ................................................................................. 49
D.2 Select Device ............................................................................................... 49
D.3 Locate Driver ............................................................................................... 50
D.4 Verify Communication .................................................................................. 50
Appendix E. Glossary
Worldwide Sales and Service .....................................................................................53
DS40001721B-page 6
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs and/
or tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MGC3130 Hillstar Development Kit. Items discussed in this chapter include:
•
•
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Warranty Registration
Recommended Reading
The Microchip website
Development Systems Customer Change Notification Service
Customer Support
Revision History
DOCUMENT LAYOUT
This document describes the installation and use of the MGC3130 Hillstar
Development Kit. The document is organized as follows:
•
•
•
•
•
•
•
•
•
•
Chapter 1. “Overview”
Chapter 2. “Getting Started”
Chapter 3. “Hillstar Boards – Hardware Description”
Chapter 4. “Design In: Hillstar In Target Application”
Chapter 5. “Troubleshooting”
Appendix A. “Schematics”
Appendix B. “Sensitivity Profile and Capacitances”
Appendix C. “Parameterization Support”
Appendix D. “Driver Installation Manual”
Appendix E. “Glossary”
2013-2016 Microchip Technology Inc.
DS40001721B-page 7
MGC3130 Hillstar Development Kit User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Examples
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS40001721B-page 8
File>Save
Press ,
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
2013-2016 Microchip Technology Inc.
Preface
WARRANTY REGISTRATION
Please complete the enclosed Warranty Registration Card and mail it promptly. Sending in the Warranty Registration Card entitles users to receive new product updates.
Interim software releases are available at the Microchip website.
RECOMMENDED READING
This user’s guide describes how to use the MGC3130 Hillstar Development Kit. Other
useful documents are listed below. The following Microchip documents are available
and recommended as supplemental reference resources.
GestIC® Design Guide: Electrodes and System Design (DS40001716)
This document describes the MGC3130 system characteristic parameters and the
design process. It enables the user to generate a good electrode design and to
parameterize the full GestIC system.
MGC3030/MGC3130 GestIC® Library Interface Description (DS40001718)
This document is the interface description of the MGC3130’s GestIC Library. It outlines
the function of the Library’s message interface, and contains the complete message
reference to control and operate the MGC3130 system.
MGC3030/MGC3130 3D Gesture Controller Data Sheet (DS40001667)
Consult this document for information regarding the MGC3130 3D Tracking and
Gesture Controller.
Aurea Graphical User Interface User’s Guides (DS40001681)
This document describes how to use the MGC3130 Aurea Graphical User Interface.
2013-2016 Microchip Technology Inc.
DS40001721B-page 9
MGC3130 Hillstar Development Kit User’s Guide
THE MICROCHIP WEBSITE
Microchip provides online support via our website at www.microchip.com. This website
is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives™
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip website at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers, assemblers, linkers
and other language tools. These include all MPLAB® C compilers; all MPLAB
assemblers (including MPASM™ assembler); all MPLAB linkers (including
MPLINK™ object linker); and all MPLAB librarians (including MPLIB™ object
librarian).
• Emulators – The latest information on Microchip in-circuit emulators.This
includes the MPLAB REAL ICE™ and MPLAB ICE 2000 in-circuit emulators.
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit™ 3
debug express.
• MPLAB® IDE – The latest information on Microchip MPLAB IDE, the Windows®
Integrated Development Environment for development systems tools. This list is
focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and
MPLAB SIM simulator, as well as general editing and debugging features.
• Programmers – The latest information on Microchip programmers. These include
production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB
ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included
are nonproduction development programmers such as PICSTART® Plus and
PICkit 2 and 3.
DS40001721B-page 10
2013-2016 Microchip Technology Inc.
Preface
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the website at:
http://www.microchip.com/support.
REVISION HISTORY
Revision A (October, 2013)
This is the initial release of the document.
Revision B (January, 2016)
Updated Recommended Reading section; Updated Figures 2-1, 3-2, 3-6, A-2, A-3 and
A-4.
2013-2016 Microchip Technology Inc.
DS40001721B-page 11
MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 12
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 1. Overview
1.1
INTRODUCTION
The MGC3130 is a 3G gesture controller based on Microchip’s GestIC® technology. It
is developed as a mixed-signal controller. The MGC3130 has one transmit and five very
sensitive receive channels that are capable to detect changes of a transmitted electrical
field (E-field) corresponding to capacitive changes in the femtofarad (1 fF = 10-15F)
range.
In order to transmit and receive an electrical field, electrodes have to be connected to
the transmitting and receiving channels of the MGC3130 controller. The spatial
arrangement of the electrodes allows the chip to determine the center of gravity of the
electric field distortion, and thus position tracking and gesture recognition of a user’s
hand in the detection space.
1.2
HILLSTAR CONCEPT AND DELIVERABLES
The Hillstar Development Kit is designed to support an easy integration of Microchip’s
MGC3130 3D Gesture and Tracking Controller into customer’s applications. It provides
MGC3130 system setup, related hardware and software references.
With the MGC3130 Software Package, including Aurea Graphical User Interface and
GestIC Library, the MGC3130 Software Development Kit (SDK) and PIC18 Host
Reference code, design-in is easy in five steps:
1.
2.
3.
4.
5.
Feature Definition
Electrode Design
MGC3130 Parameterization
Host Application Programming
Verification
Hillstar hardware builds a complete MGC3130 reference system consisting of three
individual PCBs:
• MGC3130 Unit
• I2C to USB Bridge
• Reference Electrode with a 95x60 mm sensitive area
It can be plugged to a PC via USB cable and used for evaluation of MGC3130 chip and
GestIC technology. During the customer’s design-in process the individual boards can
be combined according to the customers need.
Three examples are given below:
• Combine MGC3130 Unit and I2C to USB Bridge to evaluate customized
electrodes
• Use I2C to USB Bridge to parameterize and debug the MGC3130 application
circuitry in the customer’s design
• Combine MGC3130 Unit and Electrodes to develop gesture-driven applications
for PC-based or embedded software environments
2013-2016 Microchip Technology Inc.
DS40001721B-page 13
MGC3130 Hillstar Development Kit User’s Guide
The Hillstar Development Kit provides an artificial test hand, further called hand brick,
helping to stimulate the human hand operating the GestIC application. The hand brick
has to be used during the design-in process to parametrize and evaluate customer’s
applications. The hand brick’s surface is conductive and connected to GND via cable
in order to reproduce the grounding conditions of the human body.
1.3
HILLSTAR DEVELOPMENT KIT PACKAGE CONTENT
The Hillstar Development Kit package content is listed below:
•
•
•
•
•
MGC3130 Module
I2C to USB Bridge Module
4-layer reference electrode (95x60 mm sensitive area)
‘Hand brick’ set (self-assembly, four foam blocks, one copper foil)
USB Cable for PC connection
FIGURE 1-1:
HILLSTAR DEVELOPMENT KIT
The ‘hand brick’ set is used during the design-in process for sensor calibration and
performance evaluation purposes. For usage and assembly information, refer to
Appendix C. “Parameterization Support”.
DS40001721B-page 14
2013-2016 Microchip Technology Inc.
Overview
1.4
HILLSTAR DEVELOPMENT KIT REFERENCE ELECTRODES
The Hillstar Development Kit includes a collection of layout references (Gerber files) for
electrode designs and ready-to-use sensor modules with MGC3130 backside
assembly.
The following electrode designs are included:
•
•
•
•
•
•
140x90 mm sensitive area – outline 168 x 119 mm
95x60 mm sensitive area – outline of 120 x 85 mm
80x80 mm sensitive area – outline 104 x 104 mm
100x50 mm sensitive area – outline 128 x 72 mm
50x30 mm sensitive area – outline 63 x 47 mm
30x30 mm sensitive area – outline 49 x 49 mm
Sensor Modules
• 95x60 mm sensitive area – outline of 120 x 85 mm
• 30x30 mm sensitive area – outline 49 x 52 mm
FIGURE 1-2:
HILLSTAR DEVELOPMENT KIT REFERENCE
ELECTRODES
50x30
80x80
140x90
95x60
2013-2016 Microchip Technology Inc.
100x50
30x30
DS40001721B-page 15
MGC3130 Hillstar Development Kit User’s Guide
Dimensions of the designs are given in Table 1-1 and Figure 1-3 below.
TABLE 1-1:
ELECTRODE DIMENSIONS
Sensitive Area
140x90 mm
95x60 mm(1)
50x30 mm
30x30 mm(2)
1.0
Layer
2
2
Aspect Ratio
approx. 3:2
approx. 3:2
A
168 mm
120 mm
104 mm
128 mm
63 mm
49 mm
B
119 mm
85 mm
104 mm
72 mm
47 mm
49 mm
C
138 mm
95,7 mm
79.8 mm
103,6 mm
50 mm
31.8 mm
D
88,7 mm
60,5 mm
79.8 mm
46,8 mm
30 mm
27,3 mm
E
131,7 mm
91,7 mm
75,8 mm
99,6 mm
46 mm
27,3 mm
F
5 mm
5 mm
5 mm
5 mm
2,5 mm
3,5 mm
G
128 mm
85,7 mm
69,8 mm
93,6 mm
44 mm
25,8 mm
H
78,7 mm
50, 5 mm
69, 8 mm
36, 8 mm
24 mm
25,8 mm
Center Electrode
cross-hatching
3%
3%
5%
5%
5%
5%
50%
20%
50%
20%
50 %
20 %
50 %
20 %
50 %
20 %
Note 1:
2:
1.0
100x50 mm
Version
Tx Electrode crosshatching
50 %
-under center
20 %
electrode
-outside center
electrode
1.0
80x80 mm
1.0
1.0
1.0
2
2
2
2
1:1
approx. 2:1
5:3
1:1
These dimensions are also valid for 95x60 mm sensor module.
These dimensions are also valid for 30x30 mm sensor module except the B dimension which is equal to
52 and Tx electrode which is solid instead of cross-hatched.
DS40001721B-page 16
2013-2016 Microchip Technology Inc.
Overview
ELECTRODE DIMENSIONS
Rx
C
Tx
F
H
D
A
B
FIGURE 1-3:
G
F
E
The Gerber data of all electrode reference designs are included in the MGC3130
Hillstar Hardware Reference package and can be downloaded from Microchip’s
website www.microchip.com/GestICGettingStarted.
1.5
MGC3130 SOFTWARE PACKAGE – AUREA GUI AND GestIC LIBRARY
The MGC3130 Software Package contains all relevant system software and
documentation. Hillstar Development Kit is supported by MGC3130 Software Package
0.4 and following versions.
The package contains:
•
•
•
•
•
Aurea PC software
GestIC Library binary file
GestIC Parameterization files
Windows CDC driver
Documentation
The latest MGC3130 software package can be downloaded from Microchip’s website
www.microchip.com/GestICGettingStarted.
1.6
MGC3130 SOFTWARE DEVELOPMENT KIT (SDK)
The MGC3130 Software Development Kit (SDK) supports the integration of MGC3130
into a software environment. Thus, it includes a C reference code for GestIC API, a
precompiled library for Windows operating systems and a demo application using the
GestIC API interface.
Hillstar Development Kit is supported by MGC3130 SDK 0.4 and the following versions.
The latest SDK can be downloaded from Microchip’s website www.microchip.com/
GestICGettingStarted.
2013-2016 Microchip Technology Inc.
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MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 18
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT KIT
USER’S GUIDE
Chapter 2. Getting Started
Hillstar Development Kit can be used as a stand-alone GestIC system and evaluated
in conjunction with the Aurea PC software. This section describes how to get started.
2.1
PREREQUISITES
The following prerequisites have to be fulfilled:
• PC with Windows 7 or Windows 8 operating system and USB port and minimum
screen resolution of 1024x768
• Hillstar Development Kit (MGC3130 Unit, I2C to USB Bridge, 95x60 mm frame
electrode)
• MGC3130 Software Package 0.4 and following versions
The MGC3130 Software Package is available as a .zip file. Unzip the file, run
setup.exe and install the package to your PC. The folder structure is as shown in
Figure 2-1.
FIGURE 2-1:
2.2
FOLDER STRUCTURE
STEP 1: BUILD-UP DEVELOPMENT KIT
Connect Electrodes, MGC3130 Unit and I2C to USB Bridge as shown in Figure 2-2.
Note:
Make sure the MGC3130 Unit and the I2C USB Bridge are already
connected before plugging in the USB connection.
2013-2016 Microchip Technology Inc.
DS40001721B-page 19
MGC3130 Hillstar Development Kit User’s Guide
FIGURE 2-2:
HILLSTAR DEVELOPMENT KIT ASSEMBLING
I2C to USB Bridge
2.3
STEP 2: CONNECTING HILLSTAR DEVELOPMENT KIT WITH YOUR PC
Use the supplied USB cable to connect the Hillstar Development Kit to your PC. The
Power LEDs on both, I2C to USB Bridge and MGC3130 Unit will illuminate.
Furthermore, LED 1 on the I2C to USB Bridge will flash very fast (~10 Hz). In case LED
1 is flashing slow (~1 Hz), the Windows CDC driver is already installed on your PC.
Please skip the next step and go to Section 2.5 “Step 4: Start Aurea”.
2.4
STEP 3: INSTALL WINDOWS CDC DRIVER
The Windows CDC driver can be found in the MGC3130 Software Package in folder
04_Driver.
When the Hillstar Development Kit is connected to your PC for the first time, Windows
requests the appropriate device driver and guides you through the installation process.
Alternatively, you can install the driver manually, (e.g., using the device manager). An
example for Windows 7 is given in Appendix D. “Driver Installation Manual”.
2.5
STEP 4: START AUREA
Aurea Graphical User Interface, shown in Figure 2-3, is included in the MGC3130
Software Package in the folder 02_GUI.
Open Aurea.exe. Aurea detects the connected device automatically and is ready for
use.
DS40001721B-page 20
2013-2016 Microchip Technology Inc.
Getting Started
FIGURE 2-3:
AUREA GRAPHICAL USER INTERFACE
Evaluate Colibri Suite
Discover Signals
Setup MGC3130
1. Positions Tracking
1. View signals
1. AFE parameterisation
2. Gesture Recognition
2. Write log file
2. Colibri Suite parameterization
3. Demo applications
3. Advanced features
3. Update GestIC Library
4. Measure Electrode capacitances
2013-2016 Microchip Technology Inc.
DS40001721B-page 21
MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 22
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 3. Hillstar Boards – Hardware Description
3.1
OVERVIEW
The Hillstar key components are listed below and highlighted in Figure 3-1.
FIGURE 3-1:
HILLSTAR DEVELOPMENT KIT OVERVIEW
12
1
2
5
8
6
11
10
7
4
13
14
9
3
3.1.1
1.
2.
3.
4.
5.
PIC18F14K50 USB microcontroller
Micro-USB connector
MCP1801T LDO voltage regulator (converts 5V USB to 3.3 V board supply)
Status LEDs (power, communication status)
Data interface: 6-pin socket for data communication and power supply
3.1.2
6.
7.
8.
9.
10.
11.
I2C to USB Bridge
MGC3130 Unit
MGC3130 3D Tracking and Gesture Controller
Data interface: 6-pin header for data communication and power supply
Status LED (power)
Interface select
Electrode interface: 7-pin socket
GesturePort interface (pads for 5 EIOs, 1 GND)
2013-2016 Microchip Technology Inc.
DS40001721B-page 23
MGC3130 Hillstar Development Kit User’s Guide
3.1.3
95x60 mm Reference Electrode PCB
12. Receive electrodes
13. Acrylic cover glass (120 x 85 x 2 mm)
14. Electrode interface: 7-pin header (mounted on backside)
The Gerber data of all Hillstar Development Kit components are included in the
MGC3130 Hillstar Hardware Reference package and can be downloaded from
Microchip’s website www.microchip.com/GestICGettingStarting.
3.2
MGC3130 UNIT
The key element of the MGC3130 Unit is Microchip’s MGC3130 3D Tracking and
Gesture Controller. The layout print of the unit is shown in Figure 3-2.
FIGURE 3-2:
MGC3130 UNIT
- GesturePort
The unit provides a 2 mm 7-pin board-to-board connector (socket) to connect the
electrode. The interface includes the following signals: GND, Rx4, Rx3, Tx, Rx2, Rx1,
and Rx0. Alternatively, the board-to-board connector can be replaced by a 1 mm
Flexible Printed Circuitry (FPC) connector which is prepared as a design option. The
five Rx channels of the MGC3130 (Rx0…Rx4) are connected to the receive electrodes
via 10 k resistors in order to suppress irradiated high-frequency signals (R11, R12,
R13, R14, and R15). The MGC3130 signal generator is connected via the Tx signal to
the transmit electrode.
The data connection to the Hillstar I2C to USB Bridge is realized by a 6-pin 2 mm boardto-board connector (header). The interface includes the following signals: EIO0, 3.3V,
GND, SDA0, SCL0, and MCLR. Alternatively, it is possible to use a 1 mm FPC
connector which can be assembled to the bottom side.
DS40001721B-page 24
2013-2016 Microchip Technology Inc.
Hillstar Boards – Hardware Description
The MGC3130 unit acts as an I2C slave device. Table 3-1 shows the configuration of
the MGC3130 interface selection pins (IS1, IS2) which can be pulled to VDD or to GND
via resistors (R3, R4, R5, and R6) to select the I2C slave address. The I2C device
address 0x42 is set as default.
TABLE 3-1:
MGC3130 UNIT I2C INTERFACE SELECTION
MGC3130 Interface
Selection Pins
Assembly Option
Mode (Address)
IS2
IS1
0
0
I2C 0 Slave Address = 0x42 (default)
1
0
I2C 0 Slave Address = 0x43
R3
R4
R5
R6
n.p.
10 k
n.p.
10 k
10 k
n.p.
n.p.
10 k
For Schematics, Layout and Bill of Material of the MGC3130 Unit please refer to
Section Appendix A. “Schematics”.
3.3
HILLSTAR 95x60 mm REFERENCE ELECTRODE
The 95x60 mm Reference Electrode provided with the Hillstar Development Kit
consists of one Tx and a set of five Rx electrodes (north, east, south, west, center),
which are placed in two different layers. An additional ground layer is placed
underneath the Tx electrode and shields the electrode’s back from external influences.
FIGURE 3-3:
HILLSTAR PCB ELECTRODE
The PCB is connected to the MGC3130 Unit by the 2 mm 7-pin board-to-board
connector. The interface includes the following signals: GND, Rx4, Rx3, Tx, Rx2, Rx1,
and Rx0.
The dimension of the board is 120 x 85 mm; the sensitive area is 95 x 60 mm.
2013-2016 Microchip Technology Inc.
DS40001721B-page 25
MGC3130 Hillstar Development Kit User’s Guide
The five Rx electrodes include four frame electrodes and one center electrode, as
shown in Figure 3-3. The frame electrodes are named according to their cardinal
directions: north, east, south and west. The dimensions of the four Rx frame electrodes
define the maximum sensing area. The center electrode is structured (cross-hatched)
to get a similar input signal level as the four frame electrodes.
The Tx electrode spans over the complete area underneath the Rx electrodes. It is
cross-hatched to reduce the capacitance between Rx and Tx (CRxTx). The Tx area
below the center electrode covers 50% of the copper plane, the area around only 20%.
The Rx feeding lines are embedded into the Tx electrode in the third layer (refer to
Figure 3-4 and Figure 3-5). This supports shielding of the feeding lines.
Dimensions are given in Table 3-2.
FIGURE 3-4:
TABLE 3-2:
ELECTRODE LAYOUT
HILLSTAR ELECTRODE DIMENSIONS
Length
Width
Design
Horizontal Electrodes (Rx)
91.7 mm
5 mm
Vertical Electrodes (Rx)
70.5 mm
5 mm
solid
Center Electrode (Rx)
85.7 mm
50.5 mm
3% cross-hatched
Tx Electrode (refer to Figure 3-4)
Part I (under center electrode)
Part II (outside Part I)
120 mm
85.7 mm
120 mm
85 mm
50.5 mm
85 mm
50% cross-hatched
20% cross-hatched
Ground Area
120 mm
85 mm
solid
DS40001721B-page 26
solid
2013-2016 Microchip Technology Inc.
Hillstar Boards – Hardware Description
The electrode PCB is based on a 4-layer PCB design using FR4 material. Three
functional layers are used:
• Layer 1 (Top): Rx electrodes
• Layer 3: Tx electrode and Rx feeding lines
• Layer 4 (Bottom): Ground
Layer 2 is not used.
FIGURE 3-5:
PCB LAYER STACK
935 µm
Top layer
2nd layer
Not Used: 35 µm
0.15 mm
Tx: 35 µm
540 µm
1.546 mm
Rx : 18 µm
Tx
3rd layer
0.25 mm
Bottom
layer
GND: 18 µm
Rx feeding line
In a target system design the GND layer is not required. It is added for the Hillstar
sensing electrode as a shielding layer and shall simulate the presence of static
components which are placed in a target device underneath the sensing electrodes.
Note:
3.4
Please refer to the “MGC3130 GestIC® Design Guide” for the electrodes
equivalent circuitry, capacitances (CRxTx, CRxG, TxRxG) and their typical values.
I2C TO USB BRIDGE
Connecting the MGC3130 Unit to a PC requires an I2C to USB Bridge. The Hillstar
Bridge works as a Composite Device Class (CDC). It controls the USB transfer towards
the host PC and handles the I2C communication with the MGC3130 Unit. Moreover, it
provides 3.3V power supply and the MCLR signal to the MGC3130 Unit.
The bridge function is handled by Microchip’s PIC18F14K50 USB microcontroller.
The board is equipped with a micro-USB connector (Type B) and a 2 mm 6-pin female
board-to-board connector for the I2C interface. The interface to the MGC3130 Unit
includes the following signals: EIO0, 3.3V, GND, SDA0, SCL0, and MCLR. Please refer
to Figure 3-6.
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DS40001721B-page 27
MGC3130 Hillstar Development Kit User’s Guide
FIGURE 3-6:
I2C TO USB BRIDGE
Micro-USB
Interface
N/C
CLK
DAT
GND
VDD
VDD
ICSP™ INTERFACE
The I2C to USB Bridge is powered via the USB port. Microchip’s Low Dropout (LDO)
Voltage Regulator MCP1801 is used to transform the 5V USB power to 3.3V required
for the PIC18F14K50. By default, 3.3V are also routed to the MGC3130 Unit via the I2C
interface. The 3.3V power supply towards the MGC3130 Unit can be cut by removing
the 0 resistor R7.
The LEDs indicate the following:
• POWER – signals that the I2C to USB Bridge is powered (3.3V)
• LED1 – blinks fast (~10 Hz) to indicate that there is no USB connection
established
• LED1 – blinks slow (~1 Hz) to indicate that the USB connection is established
• LED 2 – is on when there is data on the I2C bus
• LED 2 – is off when there is no data on the I2C bus
The communication between Bridge and MGC3130 Unit is accomplished via a 2-wire
I2C compatible serial port. Please refer to Figure 3-7.
In addition, the Hillstar Development Kit integrates an open-drain transfer status line
(TS) and the MGC3130 MCLR signal, according to the MGC3130 reference circuitry.
TS is connected to the RC0 pin of the PIC18F14K50 and MCLR to RC6.
For a detailed description of the I2C interface refer to the “MGC3130 Single-Zone 3D
Gesture Controller Data Sheet” (DS40001667).
The default I2C address of the bridge is set to 0x42 but can also be switched to 0x43
by changing the firmware running on the PIC18F14K50.
Note:
DS40001721B-page 28
To update the PIC18F14K50 firmware, please refer to ‘MGC3130
PIC18F14K50 Host Reference Code’, available on www.microchip.com/
GestICGettingStarted.’
2013-2016 Microchip Technology Inc.
Hillstar Boards – Hardware Description
I2C AND USB DATA INTERFACE
3.3V
SI0
SI1
EIO0
MCLR
SDA
SCL
TS
MCLR
MGC3130 Unit
I2C Master
10kΩ
MGC3130
1.8kΩ
1.8kΩ
I2C Slave
10kΩ
FIGURE 3-7:
PIC18F14K50
RB4
RB6
RA0
RA1
USB D+
USB
USB D-
RC0
RC6
I2C to USB Bridge
PC
For Schematics, Layout and Bill of Material of the I2C to USB Bridge please refer to
Section Appendix A. “Schematics”.
2013-2016 Microchip Technology Inc.
DS40001721B-page 29
MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 30
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 4. Design In: Hillstar In Target Application
4.1
INTRODUCTION
The Hillstar Development Kit is designed to support an easy integration of Microchip’s
MGC3130 3D Gesture and Tracking Controller into customer’s applications.
The three Hillstar PCBs can be plugged to a PC via USB cable and used for
evaluation of MGC3130 chip and GestIC technology.
During the customer’s design-in process the individual boards can be combined
according to the customers need.
Three examples are given below:
• Combine MGC3130 Unit and I2C to USB Bridge to evaluate customized
electrodes
• Use I2C to USB Bridge to parameterize and debug the MGC3130 application
circuitry in the customer’s design (in-circuit)
• Combine MGC3130 Unit and Electrodes to develop gesture-driven applications
for PC-based or embedded software environments
For in-circuit parameterization and debugging it is mandatory to control the MGC3130
via Aurea Control Software. For that purpose, the customer’s application should
provide an appropriate hardware or software interface.
4.2
INTEGRATION EXAMPLES
The following figures show typical hardware circuits for MGC3130 integration into a
customer’s application.
Figure 4-1 and Figure 4-2 show the control via I2C and an external PC. The Hillstar I2C
to USB Bridge acts as an I2C master, the application processor I2C should be:
• Switched off (I2C lines configured as high Z, refer to Figure 4-1)
• Switched to Slave or Listen mode or
• Disconnected (through an external switch, refer to Figure 4-2)
As an alternative, it is also possible to establish an USB connection between the
application processor and a PC without using an I2C to USB Bridge. Please refer to
Figure 4-3.
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DS40001721B-page 31
MGC3130 Hillstar Development Kit User’s Guide
FIGURE 4-1:
MGC3130 PARAMETERIZATION CIRCUIT WITH INTERNAL SWITCH
AU
USB cable
A
TS
I²C SDA
I²C SCL
Reset
I²C to USB
Bridge
USB
Bridge
USB to I²C
(HID)
RE
For debugging and
parametetrization
purposes
Customer application
TS
I²C SDA
I²C SCL
Reset
Application
Processor
MGC
3130
To electrodes
FIGURE 4-2:
High Z for
bridge
access
I2C
client
MGC3130 PARAMETERIZATION CIRCUIT WITH EXTERNAL SWITCH
AU
USB cable
A
TS
I²C SDA
I²C SCL
Reset
I²C to USB
Bridge
USB
Bridge
USB to I²C
(HID)
RE
For debugging and
parametetrization
purposes
Customer application
TS
I²C SDA
I²C SCL
Reset
open for
bridge
access
Application
Processor
MGC
3130
To electrodes
DS40001721B-page 32
I2C
client
2013-2016 Microchip Technology Inc.
Design In: Hillstar In Target Application
FIGURE 4-3:
MGC3130 PARAMETERIZATION CIRCUIT FOR USB BASED APPLICATIONS
AU
RE
A
USB cable
For debugging and
parametetrization
purposes
Customer application
Application
Processor
TS
I²C SDA
I²C SCL
Reset
MGC
3130
I2C
client
To electrodes
TABLE 4-1:
USB to I²C
(CDC/HID)
MGC3130 PARAMETERIZATION CIRCUITS COMPARISON
Parameterization Circuit
Advantages
Drawbacks
Easy Approach
Processor pins need to be
switchable to high Z
Low hardware efforts
No other clients can be
controlled during Aurea
access
With External Switch
Communication to other I2C
clients not interrupted
Additional hardware switch
USB Based Applications
No hardware efforts
Additional software efforts
With Internal Switch
Works if other I2C clients
connected to the bus
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DS40001721B-page 33
MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 34
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 5. Troubleshooting
Troubleshooting Information
Power LED does not illuminate
In case the power LED does not illuminate it is likely that the board is not powered.
Possible Solutions:
• Check the board is connected to your PC’s USB port.
• Change the USB cable or use a different USB port on your PC.
• Check if the PC is switched on.
LED 1 blinks fast
When LED 1 blinks fast (~10 Hz) the USB connection is not established towards the PC.
Possible Solutions:
• Make sure the Windows CDC driver is installed (refer to Appendix D. “Driver Installation Manual”).
• Makes sure the MGC3130 Unit and the I2C to USB Bridge are already connected before plugging in
the USB connection (refer to Section 2.2 “Step 1: Build-up Development Kit”).
• Reconnect the board by unplugging and plugging in again the USB connection.
Signal streaming stops
Signal stream in Aurea GUI stops when there is no approach towards the sensing area. This behavior is
intended. When using the Aurea GUI, the Wake-up on Approach feature is automatically enabled.
Possible Solutions:
Disable the Wake-up on Approach feature in the Real-Time Control bar of Aurea by unchecking the
Approach Detection/Power Saving check box for continuous signal streaming.
No Position data displayed, Electrode signals are zero
Signal matching parameters have been mismatched and accidentally stored into the Flash.
Possible Solutions:
• Perform “Autoparameterization” in the AFE Parameterization of Aurea Setup tab. Make sure there is
no hand approach towards the electrodes during autoparamterization process.
• Restore the default Signal Matching parameters by re-flashing the original MGC3130 GestIC®
Library file.
LED 1 and 2 on I2C to USB Bridge are Off
When LED 1 and LED 2 on the I2C to USB Bridge are Off but the power LED is On, the PIC18F14K50 is
in Bootloader Update mode and therefore not operating code. The PIC18F14K50 will start in Bootloader
Update mode in case the MGC3130 Unit is not connected to the I2C to USB Bridge.
Possible Solutions:
• Please disconnect the I2C to USB Bridge from USB. Connect the MGC3130 Unit and the I2C to USB
Bridge first and then plug in the USB connection.
2013-2016 Microchip Technology Inc.
DS40001721B-page 35
MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 36
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix A. Schematics
A.1
INTRODUCTION
This appendix contains the MGC3130 Hillstar Development Kit schematic and Bill of
Materials.
A.2
BILL OF MATERIALS
TABLE A-1:
I2C TO USB BRIDGE BILL OF MATERIALS
Qty.
Description
Name
1
Connector, Micro-USB 5-pin Type B, SMD
1
Connector, 2 mm socket 6-pin, SMD
BU2
1
Capacitor, 100 nF, 10%, X7R, SMD 0402
C1
3
Capacitor, 1 µF, 10%, X5R, 10 V, SMD 0402
C2, C3, C5
1
Capacitor, 10 µF, 20%, X5R, 6.3 V, SMD 0603
C4
3
LED, 571 nm, green clear, 0603 SMD
D1, D2, D3
1
IC, MCP1801T LDO, Voltage Regulator, 3.3V, 150 mA, 5-Pin SOT-23
IC1
1
IC, PIC18F14K50 USB Flash Microcontroller, 20-Pin SSOP
IC2
3
Resistor, 1 kΩ, 1%, 1/16W, SMD 0402
R3, R4, R6
1
Resistor, 150 kΩ, 1%, 1/16W, SMD 0402
R5
1
Resistor, 0 kΩ, 1%, 1/16W, SMD 0603
R7
1
Crystal, 12 MHz, 33 pF, SMD
XTAL1
TABLE A-2:
Qty.
1
BU1
HILLSTAR – I2C TO USB BRIDGE MOUNTING OPTION
Description
Connector, 1 mm FPC 6-pin, SMD
2013-2016 Microchip Technology Inc.
Name
ST1
DS40001721B-page 37
MGC3130 Hillstar Development Kit User’s Guide
TABLE A-3:
HILLSTAR – MGC3130 UNIT BILL OF MATERIALS
Qty.
1
Description
Connector, 2 mm socket 7-pin, SMD
BU1
1
Connector, 2 mm header 6-pin, SMD
ST1
1
Capacitor, 100 nF, 10%, X7R, SMD 0402
C1
2
Capacitor, 4,7 µF, 20%, X5R, 6.3V, SMD 0402
C2, C3
1
LED, 571 nm green clear, 0603 SMD
D2
1
IC, MGC3130, 28-Pin QFN
IC1
2
Resistor, 1,8 kΩ, 1%, 1/16W, SMD 0402
R1, R2
8
Resistor, 10 kΩ, 1%, 1/16W, SMD 0603
R4, R6, R7,
R11, R12, R13,
R14, R15
1
Resistor, 0 kΩ, 1%, 1/16W, SMD 0402
R16
1
Resistor, 10 kΩ, 1%, 1/16W, SMD 0402
R17
1
Resistor, 1 kΩ, 1%, 1/16W, SMD 0402
R18
TABLE A-4:
Qty.
1
A-5:
Qty.
1
DS40001721B-page 38
Name
HILLSTAR – MGC3130 UNIT MOUNTING OPTION
Description
Name
Connector, 1 mm FPC 6-pin, SMD
ST3
HILLSTAR – ELECTRODE BILL OF MATERIALS
Description
Connector, 2 mm header 7-pin, SMD
Name
ST1
2013-2016 Microchip Technology Inc.
Schematics
A.3
BOARD – SCHEMATICS AND LAYOUT
FIGURE A-1:
HILLSTAR GestIC® UNIT SCHEMATIC
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DS40001721B-page 39
MGC3130 Hillstar Development Kit User’s Guide
FIGURE A-2:
ASSEMBLY OF MGC3130 UNIT
- GesturePort
Top View
Bottom View
DS40001721B-page 40
2013-2016 Microchip Technology Inc.
HILLSTAR I2C TO USB BRIDGE SCHEMATIC
2013-2016 Microchip Technology Inc.
FIGURE A-3:
Schematics
DS40001721B-page 41
MGC3130 Hillstar Development Kit User’s Guide
FIGURE A-4:
ASSEMBLY OF HILLSTAR I2C TO USB BRIDGE
Micro-USB
Interface
VPP
VDD
CLK
DAT
GND
N/C
ICSPTM INTERFACE
Top View
Bottom View
DS40001721B-page 42
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MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix B. Sensitivity Profile and Capacitances
B.1
INTRODUCTION
This appendix contains the sensitivity profile and the electrode capacitances of the
Hillstar Development Kit hardware.
The measurement procedure of both, the sensitivity profile and the electrode
capacitances are outlined in “MGC3130 GestIC® Design Guide”.
B.2
SENSITIVITY PROFILES
The sensitivity profiles were conducted using a 40x40x70 mm hand brick and a 30 mm
spacer brick.
FIGURE B-1:
SENSITIVITY PROFILE FROM WEST TO EAST
West -> East
500
450
signal deviation / digits
400
350 312 320
285
300
319 317
299
293
257
250
256
211
200
SD North
204
SD East
164
158
150
120
88
100
2550
296
36
48
SD South
130
98
63
SD West
76
58
SD Center
43
34
0
distance to West
SD: Signal Deviation
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DS40001721B-page 43
MGC3130 Hillstar Development Kit User’s Guide
FIGURE B-2:
SENSITIVITY PROFILE FROM NORTH TO SOUTH
North -> South
500
450
signal deviation / digits
400
339
320 350
375 382 382
354 355 353
329
250
207
200
90
78 100
363
334
319
292 283
266
255
300
150
350
227
SD North
193
171
SD East
150
135
110
SD South
131
103
SD West
84
SD Center
64
50
0
distance to North
SD: Signal Deviation
B.3
ELECTRODE CAPACITIES
The capacitances between the Rx electrodes and GND (CRxG) does not include the
5 pF input capacitance of the MGC3130 Rx input buffer (CBuf).
TABLE B-3:
HILLSTAR ELECTRODE CAPACITIES
CRxG
Channel
CRxTx
North
9 pF
20 pF
East
9 pF
18 pF
South
9 pF
20 pF
West
8 pF
18 pF
Center
7 pF
65 pF
CTxG = 590 pF
DS40001721B-page 44
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix C. Parameterization Support
C.1
HOW TO BUILD A HAND BRICK
For parameterization and performance evaluation of the customer’s electrode design,
the Hillstar Development Kit contains a set of hand and spacer bricks. The hand brick
is a conductive block of 40x40x70 mm and represents a human hand. It must be
connected to ground via cable in order to simulate the grounding conditions of the
human body.
The Hillstar package contains an assembly set to build the hand brick consisting of a
Styrofoam block (40x40x70 mm) and an adhesive copper foil.
The following section explains how to assemble the hand brick.
1. Take the copper layer and the Styrofoam block with the dimensions of
(40x40x70 mm).
2. Revert the copper layer and remove the glue foil.
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DS40001721B-page 45
MGC3130 Hillstar Development Kit User’s Guide
3. Place the Styrofoam block on the copper layer exactly on the middle. Be
careful to be accurate! Fold the copper. Follow along the inside lines, and
fold the copper inward. Start with right, left sides and then with middle part.
Align the folds.
4. Finish up your box. Tape all of the sides together, and you’re done.
DS40001721B-page 46
2013-2016 Microchip Technology Inc.
Parameterization Support
5. Solder a thin wire (approx. 50 cm) on the top of the brick which will be
connected later to ground.
Thin wire for grounding (e.g.
0,15mm diameter, 50cm length)
6. Finished.
C.2
USAGE OF THE HAND BRICK AS ARTIFICIAL HAND
For parameterization and performance evaluation purposes of the customer’s
electrode design, the kit contains a set of hand and spacer bricks. This artificial hand
brick simulates Human Hand effect and is made of a Styrofoam block covered with light
copper and has a fixed size. Spacer bricks (Styrofoam block without copper layer) are
used to position the hand brick in different heights to the electrode. Because of a εr≈1of
Styrofoam, the spacer brick does not influence the measurement results.
For quick parameterization, the ground wire connected to the hand brick should be
maintained using your hand which emulates the ground connection. The wire should
be hold at 50 cm minimum and the line should also be straight to avoid any influence
to the system sensitivity as shown in Figure C-1.
For parameterization process, please refer to “MGC3130 GestIC® Design Guide” and
the appropriate wizards in Aurea PC software.
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DS40001721B-page 47
MGC3130 Hillstar Development Kit User’s Guide
FIGURE C-1:
DS40001721B-page 48
USAGE OF ARTIFICIAL HAND
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix D. Driver Installation Manual
Go through the following steps to manually install the Windows CDC Driver on your PC.
D.1
OPEN DEVICE MANAGER
While the Hillstar Development Board is connected to your PC press Start, right-click
on Computers and select Manage. This will bring up the Computer Management
window shown in Figure D-1. On the left sidebar select Device Manager.
FIGURE D-1:
D.2
COMPUTER MANAGEMENT
SELECT DEVICE
1. Right Click on GestIC Bridge and select Update Driver Software.
2. Select Search Method
3. The window shown in Figure D-2 will open. Choose Browse my Computer for
driver software.
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DS40001721B-page 49
MGC3130 Hillstar Development Kit User’s Guide
FIGURE D-2:
D.3
Update Driver Software
LOCATE DRIVER
1. Click Browse and navigate to the driver files on your local drive (refer to
Figure D-3).
2. Press Next and the driver will be installed.
FIGURE D-3:
D.4
Browse for Driver Software
VERIFY COMMUNICATION
The driver is properly installed and the communication between the PC and the Hillstar
Development Board is successfully established when LED 1 and LED 2 blink
alternatively.
DS40001721B-page 50
2013-2016 Microchip Technology Inc.
MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix E. Glossary
TABLE E-1:
GestIC® GLOSSARY
Term
Definition
AFE
Analog front end
Application Host
PC or embedded controller which controls the MGC3130
Aurea
MGC3130 PC control software with graphical user interface
Colibri Suite
Embedded DSP suite within the GestIC® Library
Deep Sleep
MGC3130 Power-Saving mode
E-field
Electrical field
Frame Electrodes
Rectangular set of four electrodes for E-field sensing
GestIC Technology
Microchip’s patented technology providing 3D free-space gesture
recognition utilizing the principles of electrical near-field sensing
GestIC Library
Includes the implementation of MGC3130 features and is delivered
as a binary file preprogrammed on the MGC3130
Gesture Recognition
Microchip’s stochastic HMM classifier to automatically detect and
classify hand movement patterns
Gesture Set
A set of provided hand movement patterns
Hand Brick
Copper coated test block (40x40x70 mm)
HMM
Hidden Markov Model
MGC3130
Single-Zone 3D Gesture Sensing Controller
Position Tracking
GestIC technology feature
Sabrewing
MGC3130 evaluation board
Self Wake-up
MGC3130 Power-Saving mode
Sensing Area
Area enclosed by the four frame electrodes
Sensing Space
Space above sensing area
Signal Deviation
Term for the delta of the sensor signal on approach of the hand
versus non-approach
Spacer Brick
Spacer between the sensor layer and hand brick
(Styrofoam block 40x40xh mm) with h= 1 / 2 / 3 / 5 / 8 / 12 cm
SPU
Signal Processing Unit
Approach Detection
GestIC technology feature: Power-Saving mode of the MGC3130
with approach detection
2013-2016 Microchip Technology Inc.
DS40001721B-page 51
MGC3130 Hillstar Development Kit User’s Guide
NOTES:
DS40001721B-page 52
2013-2016 Microchip Technology Inc.
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