MCP1624T-I/MC

MCP1623/24 Low-Voltage Input Boost Regulator for PIC® Microcontrollers Features General Description • Up to 96% Typical Efficiency • 425 mA Typical Peak Input Current Limit: - IOUT > 50 mA @ 1.2V VIN, 3.3V VOUT - IOUT > 175 mA @ 2.4V VIN, 3.3V VOUT - IOUT > 175 mA @ 3.3V VIN, 5.0V VOUT • Low Start-Up Voltage: 0.65V, 3.3V VOUT @ 1 mA (typical) • Low Operating Input Voltage: 0.35V, typical 3.3VOUT @ 1 mA • Adjustable Output Voltage Range: 2.0V to 5.5V • Maximum Input Voltage  VOUT < 5.5V • Automatic PFM/PWM Operation (MCP1624) • PWM-Only Operation (MCP1623) • PWM Operation: 500 kHz • Low Device Quiescent Current: 19 µA, typical PFM Mode • Internal Synchronous Rectifier • Internal Compensation • Inrush Current Limiting and Internal Soft Start • True Load Disconnect • Shutdown Current (All States): VOUT, VOUT will not remain in regulation. IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)). Peak current limit determined by characterization, not production tested 220 resistive load, 3.3VOUT (15 mA).  2010-2016 Microchip Technology Inc. DS40001420D-page 3 MCP1623/24 DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Conditions RDS(ON)P — 0.9 —  IN(MAX) 300 425 — mA Note 4 VOUT% -7.4 — +7.4 % Includes line and load regulation; VIN = 1.5V, IOUT = 50 mA Line Regulation VOUT/ VOUT)/ VIN| — 0.01 — %/V Load Regulation VOUT/ VOUT| — 0.01 — % Maximum Duty Cycle DCMAX — 90 — % Switching Frequency fSW 370 500 630 kHz EN Input Logic High VIH 90 — — %of VIN IOUT = 1 mA EN Input Logic Low VIL — — 20 %of VIN IOUT = 1 mA µA VEN = 5V PMOS Switch ON Resistance NMOS Peak Switch Current Limit VOUT Accuracy EN Input Leakage Current IENLK — 0.005 — Soft Start Time tSS — 750 — µS Thermal Shutdown Die Temperature TSD — 150 — C TSDHYS — 10 — C Die Temperature Hysteresis Note 1: 2: 3: 4: 5: VIN = 3.3V, ISW = 100 mA VIN = 1.5V to 3V IOUT = 25 mA IOUT = 25 mA to 50 mA; VIN = 1.5V EN Low-to-High, 90% of VOUT (Note 5) 3.3 k resistive load, 3.3VOUT (1 mA). For VIN > VOUT, VOUT will not remain in regulation. IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)). Peak current limit determined by characterization, not production tested 220 resistive load, 3.3VOUT (15 mA). TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Operating Junction Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C TJ — — +150 °C Thermal Resistance, 6LD-SOT-23 JA — 190.5 — °C/W Thermal Resistance, 8LD-2x3 DFN JA — 75 — °C/W Conditions Temperature Ranges Maximum Junction Temperature Steady state Transient Package Thermal Resistance DS40001420D-page 4  2010-2016 Microchip Technology Inc. MCP1623/24 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. 27.5 VOUT = 5.0V Efficiency (%) IQ PFM Mode (µA) 25.0 22.5 20.0 17.5 VOUT = 3.3V 15.0 VOUT = 2.0V 12.5 10.0 -40 -25 -10 5 20 35 50 65 80 100 90 VIN = 1.6V 80 70 60 50 40 30 20 10 0.01 0.1 VIN = 1.2V VIN = 0.8V 1 Ambient Temperature (°C) FIGURE 2-1: MCP1624 VOUT IQ vs. Ambient Temperature in PFM Mode, VIN = 1.2V. 100 90 VIN = 2.5 80 70 60 50 40 30 20 10 0.01 0.1 VOUT = 5.0V 275 250 225 VOUT = 3.3V 200 175 150 -40 -25 -10 5 20 35 50 65 80 VIN = 1.2 1 10 IOUT (mA) 100 1000 FIGURE 2-5: MCP1624 Efficiency vs. IOUT, VOUT = 3.3V. 600 100 500 90 VOUT = 3.3V 400 300 VIN = 3.6 80 Efficiency (%) IOUT (mA) 1000 VIN = 0.8 Ambient Temperature (°C) FIGURE 2-2: MCP1623 VOUT IQ vs. Ambient Temperature in PWM Mode, VIN = 1.2V. 100 FIGURE 2-4: MCP1624 Efficiency vs. IOUT, VOUT = 2.0V. Efficiency (%) IQ PWM Mode (µA) 300 10 IOUT (mA) VOUT = 2.0V VOUT = 5.0V 200 100 70 VIN = 1.8 60 VIN = 1.2 50 40 30 20 0 0 0.5 1 1.5 2 2.5 3 3.5 4 VIN (V) FIGURE 2-3: IOUTMAX vs. VOUT.  2010-2016 Microchip Technology Inc. 4.5 5 10 0.01 0.1 1 10 100 1000 IOUT (mA) FIGURE 2-6: MCP1624 Efficiency vs. IOUT, VOUT = 5.0V. DS40001420D-page 5 MCP1623/24 100 90 80 70 60 50 40 30 20 10 0.01 1.00 VIN =1.6 0.85 VIN (V) Efficiency (%) Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. VIN = 1.2 VIN = 0.8 1 10 IOUT (mA) 100 0 1000 20 40 60 IOUT (mA) 80 100 FIGURE 2-10: Minimum Start-Up and Shutdown VIN into Resistive Load vs. IOUT, VOUT = 3.3V. Switching Frequency (kHz) 525 Efficiency (%) VIN = 2.5 VIN = 1.2 VIN = 0.8 0.1 1 10 IOUT (mA) 100 VIN (V) 50 VIN = 1.2 30 20 0.1 1 10 IOUT (mA) 100 1000 FIGURE 2-9: MCP1623 Efficiency vs. IOUT, VOUT = 5.0V. DS40001420D-page 6 505 500 495 490 485 480 -25 -10 5 20 35 50 65 80 FIGURE 2-11: FOSC vs. Ambient Temperature, VOUT = 3.3V. VIN = 1.8 60 40 510 Ambient Temperature (°C) VIN = 3.6 70 515 -40 90 80 520 1000 100 Efficiency (%) Shutdown 0.25 0.1 FIGURE 2-8: MCP1623 Efficiency vs. IOUT, VOUT = 3.3V. 10 0.01 0.55 0.40 FIGURE 2-7: MCP1623 Efficiency vs. IOUT, VOUT = 2.0V. 100 90 80 70 60 50 40 30 20 10 0.01 Startup 0.70 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 VOUT = 5.0V VOUT = 3.3V VOUT = 2.0V 0 1 2 3 4 5 6 IOUT (mA) 7 8 9 10 FIGURE 2-12: MCP1623 PWM Pulse Skipping Mode Threshold vs. IOUT.  2010-2016 Microchip Technology Inc. MCP1623/24 Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. 10000 PWM/PFM PWM ONLY 1000 IIN (µA) VOUT = 5.0V VOUT = 3.3V VOUT = 2.0V 100 VOUT = 2.0V VOUT = 3.3V VOUT = 5.0V 10 0.8 1.1 1.4 1.7 2 2.3 2.6 2.9 3.2 3.5 VIN (V) Switch Resistance (Ohms) FIGURE 2-13: VIN. Input No Load Current vs. FIGURE 2-16: MCP1624 3.3V VOUT PFM Mode Waveforms. 5 4 P-Channel 3 2 1 N-Channel 0 1 1.5 2 2.5 3 3.5 > VIN or VOUT 4 4.5 5 FIGURE 2-14: N-Channel and P-Channel RDSON vs. > of VIN or VOUT. FIGURE 2-17: MCP1623 3.3V VOUT PWM Mode Waveforms. 16 14 IOUT (mA) 12 VOUT = 5.0V VOUT = 3.3V VOUT = 2.0V 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 VIN (V) FIGURE 2-15: MCP1624 PFM/PWM Threshold Current vs. VIN.  2010-2016 Microchip Technology Inc. FIGURE 2-18: High Load Waveforms. DS40001420D-page 7 MCP1623/24 Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. FIGURE 2-19: 3.3V Start-Up after Enable. FIGURE 2-22: MCP1623 3.3V VOUT Load Transient Waveforms. MCP1623 PWM FIGURE 2-20: VIN = VENABLE. 3.3V Start-Up when FIGURE 2-21: MCP1624 3.3V VOUT Load Transient Waveforms. DS40001420D-page 8 FIGURE 2-23: MCP1623 2.0V VOUT Load Transient Waveforms. FIGURE 2-24: Waveforms. 3.3V VOUT Line Transient  2010-2016 Microchip Technology Inc. MCP1623/24 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP1623/24 Symbol 3.1 2x3 DFN 1 5 SW 2 — GND 3 4 EN Enable Control Input Pin 4 1 FB Feedback Voltage Pin 5 — VOUT 6 8 VIN Input Voltage Pin — 2 SGND Signal Ground Pin — 3 PGND Power Ground Pin — 7 VOUTS Output Voltage Sense Pin — 6 VOUTP Output Voltage Power Pin — 9 EP Switch Node Pin (SW) Connects the inductor from the input voltage to the SW pin. The SW pin carries inductor current and can be as high as 425 mA peak. The integrated N-Channel switch drain and integrated P-Channel switch source are internally connected at the SW node. 3.2 Ground Pin (GND) The ground or return pin is used for circuit ground connection. Length of trace from input cap return, output cap return and GND pin should be made as short as possible to minimize noise on the GND pin. 3.3 Enable Pin (EN) The EN pin is a logic-level input used to enable or disable device switching and lower quiescent current while disabled. A logic high (greater than 90% of VIN) will enable the regulator output. A logic low (less than 20% of VIN) will ensure that the regulator is disabled. 3.4 Feedback Voltage Pin (FB) The FB pin is used to provide output voltage regulation by using a resistor divider. The FB voltage will be 1.21V typical with the output voltage in regulation. 3.5 Description SOT-23 Output Voltage Pin (VOUT) The output voltage pin connects the integrated P-Channel MOSFET to the output capacitor. The FB voltage divider is also connected to the VOUT pin for voltage regulation.  2010-2016 Microchip Technology Inc. Switch Node, Boost Inductor Input Pin Ground Pin Output Voltage Pin Exposed Thermal Pad (EP); must be connected to VSS. 3.6 Power Supply Input Voltage Pin (VIN) Connects the input voltage source to VIN. The input source should be decoupled to GND with a 4.7 µF minimum capacitor. 3.7 Signal Ground Pin (SGND) The signal ground pin is used as a return for the integrated VREF and error amplifier. In the 2x3 DFN package, the SGND and power ground (PGND) pins are connected externally. 3.8 Power Ground Pin (PGND) The power ground pin is used as a return for the high--current N-Channel switch. In the 2x3 DFN package, the PGND and signal ground (SGND) pins are connected externally. 3.9 Output Voltage Sense Pin (VOUTS) The output voltage sense pin connects the regulated output voltage to the internal bias circuits. In the 2x3 DFN package, VOUTS and VOUTP are connected externally. 3.10 Output Voltage Power Pin (VOUTP) The output voltage power pin connects the output voltage to the switch node. High current flows through the integrated P-Channel and out of this pin to the output capacitor and output. In the 2x3 DFN package, VOUTS and VOUTP are connected externally. 3.11 Exposed Thermal Pad (EP) There is an internal electrical connection between the Exposed Thermal Pad (EP) and the VSS pin; they must be connected to the same potential on the Printed Circuit Board (PCB). DS40001420D-page 9 MCP1623/24 NOTES: DS40001420D-page 10  2010-2016 Microchip Technology Inc. MCP1623/24 4.0 DETAILED DESCRIPTION 4.1 Device Option Overview The MCP1623/24 family of devices is capable of low start-up voltage and delivers high efficiency over a wide load range for single-cell, two-cell, three-cell alkaline, NiMH, NiCd and single-cell Li-Ion battery inputs. A high level of integration lowers total system cost, eases implementation and reduces board area. The devices feature low start-up voltage, adjustable output voltage, PWM/PFM mode operation, low IQ, integrated synchronous switch, internal compensation, low noise anti-ringing control, inrush current limit and soft start. There is one feature option for the MCP1623/24 family: PWM/PFM mode or PWM mode only. 4.1.1 PWM/PFM MODE OPTION The MCP1624 devices use an automatic switchover from PWM to PFM mode for light load conditions to maximize efficiency over a wide range of output current. During PFM mode, higher peak current is used to pump the output up to the threshold limit. While operating in PFM or PWM mode, the P-Channel switch is used as a synchronous rectifier, turning off when the inductor current reaches 0 mA to maximize efficiency. In PFM mode, a comparator is used to terminate switching when the output voltage reaches the upper threshold limit. Once switching has terminated, the output voltage will decay or coast down. During this period, very low IQ is consumed from the device and input source, which keeps power efficiency high at light load. The disadvantages of PWM/PFM mode are higher output ripple voltage and variable PFM mode frequency. The PFM mode frequency is a function of input voltage, output voltage and load. While in PFM mode, the boost converter pumps the output up at a switching frequency of 500 kHz.  2010-2016 Microchip Technology Inc. 4.1.2 PWM MODE ONLY OPTION The MCP1623 devices disable PFM mode switching, and operate only in PWM mode over the entire load range. During periods of light load operation, the MCP1623 continues to operate at a constant 500 kHz switching frequency, keeping the output ripple voltage lower than PFM mode. During PWM-only mode, the MCP1623 P-Channel switch acts as a synchronous rectifier by turning off to prevent reverse current flow from the output cap back to the input in order to keep efficiency high. For noise immunity, the N-Channel MOSFET current sense is blanked for approximately 100 ns. With a typical minimum duty cycle of 100 ns, the MCP1623 continues to switch at a constant frequency under light load conditions. Figure 2-12 represents the input voltage versus load current for the pulse-skipping threshold in PWM-only mode. At lighter loads, the MCP1623 device begins to skip pulses. TABLE 4-1: Part Number PART NUMBER SELECTION PWM/PFM MCP1623 MCP1624 PWM X X DS40001420D-page 11 MCP1623/24 4.2 Functional Description During this time, the boost switch current is limited to 50% of its nominal value. Once the output voltage reaches 1.6V, normal closed-loop PWM operation is initiated. The MCP1623/24 charges an internal capacitor with a very weak current source. The voltage on this capacitor, in turn, slowly ramps the current limit of the boost switch to its nominal value. The soft-start capacitor is completely discharged in the event of a commanded shutdown or a thermal shutdown. There is no undervoltage lockout feature for the MCP1623/24. The device will start up at the lowest possible voltage and run down to the lowest possible voltage. For typical battery applications, this may result in “motor-boating” for deeply discharged batteries. The MCP1623/24 is a compact, high-efficiency, fixed-frequency, step-up DC-DC converter that provides an easy-to-use power supply solution for PIC® microcontroller applications powered by either single-cell, two-cell, or three-cell alkaline, NiCd, or NiMH, and single-cell Li-Ion or Li-Polymer batteries. Figure 4-1 depicts the functional block diagram of the MCP1623/24. 4.2.1 LOW-VOLTAGE START-UP The MCP1623/24 is capable of starting from a low input voltage. Start-up voltage is typically 0.65V for a 3.3V output and 1 mA resistive load. When enabled, the internal start-up logic turns the rectifying P-Channel switch on until the output capacitor is charged to a value close to the input voltage. The rectifying switch is current limited during this time. After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below 1.6V, the device runs open-loop with a fixed duty cycle of 70% until the output reaches 1.6V. VOUT VIN Internal Bias IZERO Direction Control SW EN GND 0.3V Gate Drive and Shutdown Control Logic Oscillator Soft Start 0V ILIMIT ISENSE Slope Comp. S PWM/PFM Logic 1.21V FB EA FIGURE 4-1: DS40001420D-page 12 MCP1623/24 Block Diagram.  2010-2016 Microchip Technology Inc. MCP1623/24 4.2.2 PWM MODE OPERATION In normal PWM operation, the MCP1623/24 operates as a fixed frequency, synchronous boost converter. The switching frequency is internally maintained with a oscillator typically set to 500 kHz. The MCP1623 device will operate in PWM-only mode even during periods of light load operation. By operating in PWM-only mode, the output ripple remains low and the frequency is constant. Operating in fixed PWM mode results in lower efficiency during light load operation (when compared to PFM mode (MCP1624)). Lossless current sensing converts the peak current signal to a voltage to sum with the internal slope compensation. This summed signal is compared to the voltage error amplifier output to provide a peak current control command for the PWM signal. The slope compensation is adaptive to the input and output voltage. Therefore, the converter provides the proper amount of slope compensation to ensure stability, but is not excessive, which causes a loss of phase margin. The peak current limit is set to 425 mA typical. 4.2.3 PFM MODE OPERATION The MCP1624 device is capable of operating in normal PWM mode and PFM mode to maintain high efficiency at all loads. In PFM mode, the output ripple has a variable frequency component that changes with the input voltage and output current. With no load, the quiescent current draw from the output is typically 19 µA. The PFM mode can be disabled in selected device options. PFM operation is initiated if the output load current falls below an internally programmed threshold. The output voltage is continuously monitored. When the output voltage drops below its nominal value, PFM operation pulses one or several times to bring the output back into regulation. If the output load current rises above the upper threshold, the MCP1624 transitions smoothly into PWM mode. 4.2.4 ADJUSTABLE OUTPUT VOLTAGE The MCP1623/24 devices incorporate a true output disconnect feature. With the EN pin pulled low, the output of the MCP1623/24 is isolated or disconnected from the input by turning off the integrated P-Channel switch and removing the switch bulk diode connection. This removes the DC path typical in boost converters, which allows the output to be disconnected from the input. During this mode, less than 1 µA of current is consumed from the input (battery). True output disconnect does not discharge the output; the output voltage is held up by the external COUT capacitance. 4.2.6 INTERNAL BIAS The MCP1623/24 gets its start-up bias from VIN. Once the output exceeds the input, bias comes from the output. Therefore, once started, operation is completely independent of VIN. Operation is only limited by the output power level and the input source series resistance. Once started, the output will remain in regulation down to 0.35V typical with 1 mA output current for low source impedance inputs. 4.2.7 INTERNAL COMPENSATION The error amplifier, with its associated compensation network, completes the closed-loop system by comparing the output voltage to a reference at the input of the error amplifier, and feeding the amplified and inverted signal to the control input of the inner current loop. The compensation network provides phase leads and lags at appropriate frequencies to cancel excessive phase lags and leads of the power circuit. All necessary compensation components and slope compensation are integrated. 4.2.8 SHORT-CIRCUIT PROTECTION Unlike most boost converters, the MCP1623/24 allows its output to be shorted during normal operation. The internal current limit and overtemperature protection limit excessive stress and protect the device during periods of short circuit, overcurrent and overtemperature. 4.2.9 LOW-NOISE OPERATION The MCP1623/24 output voltage is adjustable with a resistor divider over a 2.0V minimum to 5.5V maximum range. High-value resistors are recommended to minimize quiescent current to keep efficiency high at light loads. The MCP1623/24 integrates a low-noise anti-ringing switch that damps the oscillations typically observed at the switch node of a boost converter when operating in the Discontinuous Inductor Current mode. This removes the high-frequency radiated noise. 4.2.5 4.2.10 ENABLE/OUTPUT DISCONNECT The enable pin is used to turn the boost converter on and off. The enable threshold voltage varies with input voltage. To enable the boost converter, the EN voltage level must be greater than 90% of the VIN voltage. To disable the boost converter, the EN voltage must be less than 20% of the VIN voltage.  2010-2016 Microchip Technology Inc. OVERTEMPERATURE PROTECTION Overtemperature protection circuitry is integrated in the MCP1623/24. This circuitry monitors the device junction temperature and shuts the device off if the junction temperature exceeds the typical +150oC threshold. If this threshold is exceeded, the device will automatically restart once the junction temperature drops by 10oC. The soft start is reset during an overtemperature condition. DS40001420D-page 13 MCP1623/24 NOTES: DS40001420D-page 14  2010-2016 Microchip Technology Inc. MCP1623/24 5.0 APPLICATION INFORMATION 5.1 Typical Applications The MCP1623/24 synchronous boost regulator operates over a wide input voltage and output voltage range. The power efficiency is high for several decades of load range. Output current capability increases with input voltage and decreases with increasing output voltage. The maximum output current is based on the N-Channel peak current limit. Typical characterization curves in this data sheet are presented to display the typical output current capability. 5.2 Adjustable Output Voltage Calculations To calculate the resistor divider values for the MCP1623/24, Equation 5-1 can be used, where RTOP is connected to VOUT, RBOT is connected to GND and both are connected to the FB input pin. EQUATION 5-1: V OUT  R TOP = R BOT   ------------–1  V FB  EXAMPLE 1: VOUT = 3.3V VFB = 1.21V RBOT = 309 k RTOP = 533.7 k (Standard Value = 536 k) EXAMPLE 2: 5.3 Input Capacitor Selection The boost input current is smoothed by the boost inductor reducing the amount of filtering necessary at the input. Some capacitance is recommended to provide decoupling from the source. Low ESR X5R or X7R are well suited since they have a low-temperature coefficient and small size. For most applications, 4.7 µF of capacitance is sufficient at the input. For high-power applications that have high source impedance or long leads, connecting the battery to the input 10 µF of capacitance is recommended. Additional input capacitance can be added to provide a stable input voltage. Table 5-1 contains the recommended range for the input capacitor value. 5.4 Output Capacitor Selection The output capacitor helps provide a stable output voltage during sudden load transients and reduces the output voltage ripple. As with the input capacitor, X5R and X7R ceramic capacitors are well suited for this application. The MCP1623/24 is internally compensated so output capacitance range is limited. See Table 5-1 for the recommended output capacitor range. While the N-Channel switch is on, the output current is supplied by the output capacitor COUT. The amount of output capacitance and equivalent series resistance will have a significant effect on the output ripple voltage. While COUT provides load current, a voltage drop also appears across its internal ESR that results in ripple voltage. EQUATION 5-2: dV I OUT = C OUT   ------- dt VOUT = 5.0V VFB = 1.21V RBOT = 309 k RTOP = 967.9 k (Standard Value = 976 k) There are some potential issues with higher value resistors. For small surface mount resistors, environment contamination can create leakage paths that significantly change the resistor divider that effect the output voltage. The FB input leakage current can also impact the divider and change the output voltage tolerance. Where: dV = ripple voltage dt = On time of the N-Channel switch (D x 1/FSW) Table 5-1 contains the recommended range for the input and output capacitor value. TABLE 5-1:  2010-2016 Microchip Technology Inc. CAPACITOR VALUE RANGE CIN COUT Min. 4.7 µF 10 µF Max. — 100 µF DS40001420D-page 15 MCP1623/24 5.5 Inductor Selection 5.6 The MCP1623/24 is designed to be used with small surface-mount inductors; the inductance value can range from 2.2 µH to 10 µH. An inductance value of 4.7 µH is recommended to achieve a good balance between inductor size, converter load transient response and minimized noise. ISAT (A) Part Number DCR (typ) MCP1623/24 RECOMMENDED INDUCTORS Value (µH) TABLE 5-2: Size WxLxH (mm) Thermal Calculations By calculating the power dissipation and applying the package thermal resistance, (JA), the junction temperature is estimated. The maximum continuous junction temperature rating for the MCP1623/24 is +125oC. To quickly estimate the internal power dissipation for the switching boost regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated by Equation 5-3. EQUATION 5-3: Coilcraft ME3220 4.7 0.190 1.5 2.5x3.2x2.0 LPS3015 4.7 0.200 1.2 3.0x3.0x1.5 EPL3012 4.7 0.165 1.0 3.0x3.0x1.3 XPL2010 4.7 0.336 0.75 1.9x2.0x1.0 SD3110 4.7 0.285 0.68 3.1x3.1x1.0 SD3112 4.7 0.246 0.80 3.1x3.1x1.2 SD3114 4.7 0.251 1.14 3.1x3.1x1.4 Coiltronics® Wurth Elektronik® WE-TPC Type TH 4.7 0.200 0.8 2.8x2.8x1.35 WE-TPC Type S 4.7 0.105 0.90 3.8x3.8x1.65 WE-TPC Type M 4.7 0.082 1.65 4.8x4.8x1.8 0.70 2.3x2.3x1.0 Sumida Corporation CMH23 4.7 0.537 CMD4D06 4.7 0.216 0.75 3.5x4.3x0.8 CDRH4D 4.7 0.09 0.800 4.6x4.6x1.5 B82462A2472M000 4.7 0.084 2.00 6.0x6.0x2.5 B82462G4472M 4.7 0.04 1.8 6.3x6.3x3.0 OUT  I OUT V ------------------------------ –  V OUT  I OUT  = P Dis  Efficiency  The difference between the first term, input power, and the second term, power delivered, is the internal MCP1623/24 power dissipation. This is an estimate assuming that most of the power lost is internal to the MCP1623/24 and not CIN, COUT and the inductor. There is some percentage of power lost in the boost inductor, with very little loss in the input and output capacitors. For a more accurate estimation of internal power dissipation, subtract the IINRMS2 x LESR power dissipation. TDK Corporation Several parameters are used to select the correct inductor: maximum rated current, saturation current and copper resistance (ESR). For boost converters, the inductor current can be much higher than the output current. The lower the inductor ESR, the higher the efficiency of the converter, a common trade-off in size versus efficiency. Peak current is the maximum or limit, and saturation current typically specifies a point at which the inductance has rolled off a percentage of the rated value. This can range from a 20% to 40% reduction in inductance. As inductance rolls off, the inductor ripple current increases as does the peak switch current. It is important to keep the inductance from rolling off too much, causing switch current to reach the peak limit. DS40001420D-page 16  2010-2016 Microchip Technology Inc. MCP1623/24 5.7 PCB Layout Information Good printed circuit board layout techniques are important to any switching circuitry and switching power supplies are no different. When wiring the switching high-current paths, short and wide traces should be used. Therefore, it is important that the input and output capacitors be placed as close as possible to the MCP1623/24 to minimize the loop area. The feedback resistors and feedback signal should be routed away from the switching node and the switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. Via to GND Plane RBOT RTOP +VIN +VOUT L CIN MCP1623/24 1 GND FIGURE 5-1: COUT GND Via for Enable MCP1623/24 SOT-23-6 Recommended Layout.  2010-2016 Microchip Technology Inc. DS40001420D-page 17 MCP1623/24 NOTES: DS40001420D-page 18  2010-2016 Microchip Technology Inc. MCP1623/24 6.0 PACKAGING INFORMATION 6.1 Package Marking Information (Not to Scale) 6-Lead SOT-23 Example Part Number Code MCP1623T-I/CHY HUNN MCP1623T-I/CH JANN MCP1623T-I/CH JUNN MCP1624T-I/CHY CJNN MCP1624T-I/CH JTNN 8-Lead DFN (2x3x0.9 mm) Example Part Number Legend: XX...X Y YY WW NNN e3 * Note: CJNN Code MCP1623-I/MC AKH MCP1623T-I/MC AKH MCP1624-I/MC ALH MCP1624T-I/MC ALH AKH 611 25 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC® designator e( 3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2010-2016 Microchip Technology Inc. DS40001420D-page 19 MCP1623/24 6-Lead Plastic Small Outline Transistor (CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging b 4 N E E1 PIN 1 ID BY LASER MARK 1 2 3 e e1 D A A2 c φ L A1 L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 6 Pitch e 0.95 BSC Outside Lead Pitch e1 1.90 BSC Overall Height A 0.90 – Molded Package Thickness A2 0.89 – 1.45 1.30 Standoff A1 0.00 – 0.15 Overall Width E 2.20 – 3.20 Molded Package Width E1 1.30 – 1.80 Overall Length D 2.70 – 3.10 Foot Length L 0.10 – 0.60 Footprint L1 0.35 – 0.80 Foot Angle I 0° – 30° Lead Thickness c 0.08 – 0.26 Lead Width b 0.20 – 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-028B DS40001420D-page 20  2010-2016 Microchip Technology Inc. MCP1623/24 6-Lead Plastic Small Outline Transistor (CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2010-2016 Microchip Technology Inc. DS40001420D-page 21 MCP1623/24      !"##$%&' * J& '!&" & + #*!(  ! ! &  + %&& #& && GKK***' 'K + e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 V&! ' !Z'&! ["') %! ZZ> *  !"# $% &" '()"&'"!&) & #*&& & #   + '  '  $ ! #& )!& #! ; + !!*!"& #  ' !#&   ?@G ?!' !  & $&" !**&"&&  !