MCP25612FD
Dual CAN Flexible Data-Rate Transceiver
Features
• Supports both “classic” CAN 2.0 and CAN FD
physical layer requirements
• Optimized for CAN FD (Flexible Data-Rate) at
2, 5 and 8 Mbps Operation:
- Maximum Propagation Delay: 120 ns
- Loop Delay Symmetry: -10%/+10% (2 Mbps)
• Implements ISO-11898-2 and ISO-11898-5
Standard Physical Layer Requirements
• Very Low Standby Current (5 µA per transceiver,
typical)
• Two Fully Independent VDDX and VSSX Pins per CAN
FD Transceiver for Added Flexibility and Reliability:
- Optimal for redundant CAN networks
• Compatible to 5V MCUs
• Functional Behavior Predictable Under All Supply
Conditions:
- Device is in Unpowered mode if VDDX drops
below undervoltage level
- An unpowered node or brown-out event will
not load the CAN bus
• Detection of Ground Fault:
- Permanent dominant detection on TXDX
- Permanent dominant detection on bus
• Power-on Reset and Undervoltage Lock-out on
VDDX Pin
• Protection against Damage due to Short-Circuit
Conditions (positive or negative battery voltage)
• Protection against High-Voltage Transients in
Automotive Environments
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or exceeds Stringent Automotive Design
Requirements, including “Hardware Requirements
for LIN, CAN and FlexRay™ Interfaces in
Automotive Applications”, Version 1.3, May 2012:
- Conducted emissions @ 2 Mbps with
Common-Mode Choke (CMC)
- Direct Power Injection (DPI) @ 2 Mbps with CMC
• Meets SAE J2962/2 “Communication
Transceivers Qualification Requirements – CAN”:
- Passes radiated emissions at 2 Mbps without
a CMC
• High Noise Immunity due to Differential Bus
Implementation
• High ESD Protection on CANHx and CANLx,
Meets IEC61000-4-2, up to ±6 kV
• Available in 14-Lead SOIC
2015 Microchip Technology Inc.
• Temperature Ranges:
- Extended (E): -40°C to +125°C
- High (H): -40°C to +150°C
Description
The MCP25612FD is a second generation, dual CAN
FD transceiver from Microchip Technology Inc. It offers
all of the features from two fully independent
MCP2561FD CAN transceivers, except for the SPLIT
pin. It ensures Loop Delay Symmetry in order to support
the higher data rates required for CAN FD. The maximum propagation delay is improved to support a longer
bus length.
The device meets the automotive requirements for CAN
FD bit rates, low quiescent current, robust
Electromagnetic Compatibility (EMC) and Electrostatic
Discharge (ESD).
Package Types
MCP25612FD
SOIC
TXD1 1
14 STBY1
VSS1 2
13 CANH1
VDD1 3
12 CANL1
RXD1 4
11 STBY2
TXD2 5
10 CANH2
VSS2 6
9 CANL2
VDD2 7
8 RXD2
Typical Applications
Automotive
• Powertrain
• Body Control
• Gateway
• Chassis and Safety
• Infotainment
Industrial
• Factory Automation
• Gateway
• Server Backplanes
• Elevators
• Robotics
DS20005409A-page 1
MCP25612FD
Device Block Diagram
VDD1
Digital I/O
Supply
Thermal
Protection
POR
UVLO
VDD1
Permanent
Dominant Detect
TXD1
CANH1
Driver
and
Slope Control
VDD1
CANL1
Mode
Control
STBY1
Wake-up
Filter
CANH1
LP_RX
CANL1
Receiver
RXD1
CANH1
HS_RX
CANL1
VSS1
VDD2
Digital I/O
Supply
Thermal
Protection
POR
UVLO
VDD2
Permanent
Dominant Detect
TXD2
Driver
and
Slope Control
VDD2
STBY2
CANL2
Mode
Control
Wake-up
Filter
CANH1
LP_RX
(Note 1)
RXD2
CANH2
CANL1
Receiver
CANH1
HS_RX
CANL1
VSS2
Note 1: There is only one receiver implemented. The receiver can operate in either Low-Power or High-Speed mode.
DS20005409A-page 2
2015 Microchip Technology Inc.
MCP25612FD
1.0
1.1.1
DEVICE OVERVIEW
The MCP25612FD is a dual fully independent, CAN
FD transceiver Fault tolerant device that serves as the
interface between a CAN protocol controller and the
physical bus. The MCP25612FD device provides differential transmit and receive capability for the CAN protocol controller, and is fully compatible with the ISO
11898-2 and ISO 11898-5 standards.
The Loop Delay Symmetry is ensured to support data
rates up to 8 Mbps for CAN FD (Flexible Data-Rate).
The maximum propagation delay was improved to
support longer bus length.
Typically, each node in a CAN system must have a
device to convert the digital signals generated by a
CAN controller to signals suitable for transmission over
the bus cabling (differential output). It also provides a
buffer between the CAN controller and the high-voltage
spikes that can be generated on the CAN bus by
outside sources.
1.1
Mode Control Block
The MCP25612FD supports two modes of operation
between the two CAN transceivers independently:
• Normal Mode
• Standby Mode
NORMAL MODE
Normal mode is selected by applying low-level voltage
to the STBYx pin. The driver block is operational and
can drive the bus pins. The slopes of the output signals
on CANHx and CANLx are optimized to produce
minimal Electromagnetic Emissions (EME).
The high-speed differential receiver is active.
1.1.2
STANDBY MODE
The device may be placed in Standby mode by applying a high-level voltage to the STBYx pin. In Standby
mode, the transmitter and the high-speed part of the
receiver are switched off to minimize power consumption. The low-power receiver and the wake-up filter
blocks are enabled to monitor the bus for activity. The
Receive pin (RXDX) will show a delayed representation
of the CAN bus due to the wake-up filter.
The CAN controller gets interrupted by a negative edge
on the RXDX pin (Dominant state on the CAN bus). The
CAN controller must put the MCP25612FD back into
Normal mode, using the STBYx pin, in order to enable
high-speed data communication.
The CAN bus wake-up function requires VDDX to be in
valid range.
These modes are summarized in Table 1-1.
TABLE 1-1:
Mode
MODES OF OPERATION
RXDX Pin
STBYx Pin
Low
High
Normal
Low
Bus is dominant
Bus is recessive
Standby
High
Wake-up request is detected
No wake-up request detected
2015 Microchip Technology Inc.
DS20005409A-page 3
MCP25612FD
1.2
Transmitter Function
The CAN bus has two states:
• Dominant state
• Recessive state
A Dominant state occurs when the differential voltage
between CANHx and CANLx is greater than
VDIFFX(D)(I). A Recessive state occurs when the differential voltage is less than VDIFFX(R)(I). The Dominant
and Recessive states correspond to the Low and High
state of the TXDX input pin, respectively. However, a
Dominant state initiated by another CAN node will
override a Recessive state on the CAN bus.
1.3
Receiver Function
In Normal mode, the RXDX output pin reflects the
differential bus voltage between CANHx and CANLx.
The Low and High states of the RXDX output pin
correspond to the Dominant and Recessive states of
the CAN bus, respectively.
1.4
Internal Protection
CANHx and CANLx are protected against battery short
circuits and electrical transients that can occur on the
CAN bus. This feature prevents destruction of the
transmitter output stage during such a Fault condition.
The device is further protected from excessive current
loading by thermal shutdown circuitry that disables the
output drivers when the junction temperature exceeds
a nominal limit of +175°C. All other parts of the chip
remain operational and the chip temperature is lowered
due to the decreased power dissipation in the transmitter
outputs. This protection is essential to protect against
bus line short-circuit induced damage. The activation of
the internal protection in one of the transceivers will not
affect the other one since these are fully independent.
1.5
In Standby mode, if the MCP25612FD detects an
extended Dominant condition on the bus, it will set the
RXDX pin to the Recessive state. This allows the
attached controller to go to Low-Power mode until the
dominant issue is corrected. RXDX is latched high until
a Recessive state is detected on the bus and the
wake-up function is enabled again.
Both conditions have a time-out of 1.25 ms (typical).
This implies a maximum bit time of 69.44 µs (14.4 kHz),
allowing up to 18 consecutive dominant bits on the bus.
The permanent dominant detection in one of the
transceivers will not affect the other one since these
are fully independent.
1.6
Power-on Reset (POR) and
Undervoltage Detection
The MCP25612FD has undervoltage detection on
the VDDX supply pin. The typical undervoltage
threshold is 4V.
When the device is powered on, CANHx and CANLx
remain in a High-Impedance state until VDDX exceeds
its undervoltage level. Once powered on, CANHx and
CANLx will enter a High-Impedance state if the voltage
level at VDDX drops below the undervoltage level,
providing voltage brown-out protection during normal
operation.
In Normal mode, the receiver output is forced to the
Recessive state during an undervoltage condition on
VDDX. In Standby mode, the low-power receiver is only
enabled when the VDDX supply voltage rises above its
undervoltage threshold. Once the threshold voltage is
reached, the low-power receiver is no longer controlled
by the POR comparator and remains operational down
to about 2.5V on the VDDX supply.
Permanent Dominant Detection
The MCP25612FD device prevents two conditions:
• Permanent dominant condition on TXDX
• Permanent dominant condition on the bus
In Normal mode, if the MCP25612FD detects an
extended Low state on the TXDX input, it will disable the
CANHx and CANLx output drivers in order to prevent
the corruption of data on the CAN bus. The drivers will
remain disabled until TXDX goes to the High state.
DS20005409A-page 4
2015 Microchip Technology Inc.
MCP25612FD
2.0
ELECTRICAL
CHARACTERISTICS
2.1
Absolute Maximum Ratings†
VDDX ...........................................................................................................................................................................7.0V
DC Voltage at TXDX, RXDX, STBYx and VSSX ..................................................................................-0.3V to VDDX + 0.3V
DC Voltage at CANHx and CANLx............................................................................................................... -58V to +58V
Transient Voltage on CANHx, CANLx (ISO-7637) (see Figure 2-4)......................................................... -150V to +100V
Storage Temperature ..............................................................................................................................-55°C to +150°C
Operating Ambient Temperature .............................................................................................................-40°C to +150°C
Virtual Junction Temperature, TVJ (IEC60747-1) ....................................................................................-40°C to +190°C
Soldering Temperature of Leads (10 seconds) ..................................................................................................... +300°C
ESD Protection on CANHx and CANLx Pins (IEC 61000-4-2); 330Ω/150 pF; Unpowered; Contact Discharge...... ±6 kV
ESD Protection on CANHx and CANLx Pins (IEC 801; Human Body Model); 1500Ω/100 pF ................................ ±8 kV
ESD Protection on All Other Pins (IEC 801; Human Body Model); 1500Ω/100 pF.................................................. ±4 kV
ESD Protection on All Pins (IEC 801; Machine Model); 0Ω/200 pF........................................................................±300V
ESD Protection on All Pins (IEC 801; Charge Device Model).................................................................................±750V
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
2.2
Specifications
TABLE 2-1:
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C; High (H): TAMB = -40°C to +150°C;
VDDX = 4.5V to 5.5V, RLX = 60Ω, CLX = 100 pF; unless otherwise specified.
Characteristic
Sym
Min
Typ
Max
Units
VDDX
4.5
—
5.5
Supply Current
(per transceiver)
IDD
—
5
10
—
45
70
Standby Current
(per transceiver)
IDDS
—
5
15
µA
High Level of the POR
Comparator
VPORH
3.8
—
4.3
V
Low Level of the POR
Comparator
VPORL
3.4
—
4.0
V
Hysteresis of the POR
Comparator
VPORD
0.3
—
0.8
V
Conditions
Supply (VDDX Pin)
Voltage Range
Note 1:
2:
mA
Recessive; VTXDX = VDDX
Dominant; VTXDX = 0V
Characterized; not 100% tested.
-12V to 12V is ensured by characterization, tested from -2V to 7V.
2015 Microchip Technology Inc.
DS20005409A-page 5
MCP25612FD
TABLE 2-1:
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C; High (H): TAMB = -40°C to +150°C;
VDDX = 4.5V to 5.5V, RLX = 60Ω, CLX = 100 pF; unless otherwise specified.
Characteristic
Sym
Min
Typ
Max
Units
Conditions
Bus Line Transmitter (CANHx, CANLx)
CANHx, CANLx:
Recessive Bus Output Voltage
VO(R)
2.0
0.5 VDDX
3.0
V
VTXDX = VDDX; no load
CANHx, CANLx:
Bus Output Voltage in Standby
VO(S)
-0.1
0.0
+0.1
V
STBYx = VTXDX = VDDX; no load
Recessive Output Current
IO(R)
-5
—
+5
mA
CANHx: Dominant
Output Voltage
VO(D)
2.75
3.50
4.50
V
0.50
1.50
2.25
CANLx: Dominant
Output Voltage
-24V < VCAN < +24V
TTXDX = 0; RLX = 50 to 65Ω
RLX = 50 to 65Ω
Symmetry of Dominant
Output Voltage
(VDDX – VCANHX – VCANLX)
VO(D)(M)
-400
0
+400
mV
Dominant: Differential
Output Voltage
VO(DIFF)
1.5
2.0
3.0
V
VTXDX = VSSX; RLX = 50 to 65Ω
(see Figure 2-1 and Figure 2-3)
-120
0
12
mV
VTXDX = VDDX
(see Figure 2-1 and Figure 2-3)
-500
0
50
mV
VTXDX = VDDX; no load
(see Figure 2-1 and Figure 2-3)
-120
85
—
mA
VTXDX = VSSX; VCANHX = 0V;
CANLx: Floating
-100
—
—
mA
Same as above, but VDDX = 5V;
TAMB = +25°C (Note 1)
—
75
+120
mA
VTXDX = VSSX; VCANLX = 18V;
CANHx: Floating
—
—
+100
mA
Same as above, but VDDX = 5V;
TAMB = +25°C (Note 1)
-1.0
—
+0.5
V
Normal mode;
-12V < V(CANHX, CANLX) < +12V
(see Figure 2-5) (Note 2)
-1.0
—
+0.4
0.9
—
VDDX
1.0
—
VDDX
Recessive:
Differential Output Voltage
CANHx: Short-Circuit
Output Current
IO(SC)
CANLx: Short-Circuit
Output Current
VTXDX = VSSX (Note 1)
Bus Line Receiver (CANHx, CANLx)
Recessive Differential
Input Voltage
Dominant Differential
Input Voltage
Note 1:
2:
VDIFFX(R)(I)
VDIFFX(D)(I)
Standby mode;
-12V < V(CANHX, CANLX) < +12V
(see Figure 2-5) (Note 2)
V
Normal mode;
-12V < V(CANHX, CANLX) < +12V
(see Figure 2-5) (Note 2)
Standby mode;
-12V < V(CANHX, CANLX) < +12V
(see Figure 2-5) (Note 2)
Characterized; not 100% tested.
-12V to 12V is ensured by characterization, tested from -2V to 7V.
DS20005409A-page 6
2015 Microchip Technology Inc.
MCP25612FD
TABLE 2-1:
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C; High (H): TAMB = -40°C to +150°C;
VDDX = 4.5V to 5.5V, RLX = 60Ω, CLX = 100 pF; unless otherwise specified.
Characteristic
Sym
Min
Typ
Max
Units
0.5
0.7
0.9
V
0.4
—
1.0
Conditions
Bus Line Receiver (CANHx, CANLx) (Continued)
Differential
Receiver Threshold
VTH(DIFF)
Normal mode;
-12V < V(CANHX, CANLX) < +12V
(see Figure 2-5) (Note 2)
Standby mode;
-12V < V(CANHX, CANLX) < +12V
(see Figure 2-5) (Note 2)
Differential
Input Hysteresis
VHYS(DIFF)
50
—
200
mV
Normal mode (see Figure 2-5)
(Note 1)
Common-Mode
Input Resistance
RIN
10
—
30
kΩ
(Note 1)
RIN(M)
-1
0
+1
%
VCANHX = VCANLX (Note 1)
Differential Input Resistance
RIN(DIFF)
10
—
100
kΩ
(Note 1)
Common-Mode
Input Capacitance
CIN(CM)
—
—
20
pF
VTXDX = VDDX (Note 1)
Differential
Input Capacitance
CIN(DIFF)
—
—
10
ILI
-5
—
+5
µA
High-Level Input Voltage
VIH
0.7 VDDX
—
VDDX + 0.3
V
Low-Level Input Voltage
VIL
-0.3
—
0.3 VDDX
V
Common-Mode
Resistance Matching
CANHx, CANLx:
Input Leakage
VTXDX = VDDX (Note 1)
VDDX = VTXDX = VSTBYX = 0V;
VCANHX = VCANLX = 5V
Digital Input Pins (TXDX, STBYx)
High-Level Input Current
IIH
-1
—
+1
µA
TXDX: Low-Level Input Current
IIL(TXDX)
-270
-150
-30
µA
STBYx: Low-Level Input
Current
IIL(STBYX)
-30
—
-1
µA
High-Level Output Voltage
VOHX
VDDX – 0.4
—
—
V
IOH = -2 mA; typical -4 mA
Low-Level Output Voltage
VOLX
—
—
0.4
V
IOL = 4 mA; typical 8 mA
TJ(SD)
165
175
185
°C
-12V < V(CANHX, CANLX) < +12V
(Note 1)
TJ(HYST)
20
—
30
°C
-12V < V(CANHX, CANLX) < +12V
(Note 1)
Receive Data Output (RXDX)
Thermal Shutdown
Shutdown
Junction Temperature
Shutdown
Temperature Hysteresis
Note 1:
2:
Characterized; not 100% tested.
-12V to 12V is ensured by characterization, tested from -2V to 7V.
2015 Microchip Technology Inc.
DS20005409A-page 7
MCP25612FD
Normal Mode
Standby Mode
CANH X, CANL X
CANHX
CANL X
Recessive
Dominant
Recessive
Time
VDDX
CANHX
VDDX/2
Normal
RXDX
Standby
Mode
CANL X
FIGURE 2-1:
DS20005409A-page 8
Physical Bit Representation and Simplified Bias Implementation.
2015 Microchip Technology Inc.
MCP25612FD
TABLE 2-2:
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C; High (H): TAMB = -40°C to +150°C;
VDDX = 4.5V to 5.5V, RLX = 60ΩCLX = 100 pF; unless otherwise specified.
Param.
No.
Sym
1
tBIT
2
fBIT
Characteristic
Min
Typ
Max
Units
Bit Time
0.125
—
69.44
µs
Bit Frequency
14.4
—
8000
kHz
Conditions
3
tTXDX-BUSON Delay TXDX Low to Bus Dominant
—
65
—
ns
(Note 1)
4
—
90
—
ns
(Note 1)
5
tTXDX-BUSOFF Delay TXDX High to Bus Recessive
tBUSON-RXDX Delay Bus Dominant to RXDX
—
60
—
ns
(Note 1)
6
tBUSOFF-RXDX Delay Bus Recessive to RXDX
—
65
—
ns
(Note 1)
7
tTXDX-RXDX Propagation Delay TXDX to RXDX
8a
tBIT(RXDX),2M Recessive Bit Time on RXDX – 2 Mbps,
Loop Delay Symmetry
—
90
120
ns
—
120
180
ns
RLX = 120Ω,
CLX = 200 pF (Note 1)
450
485
550
ns
tBIT(TXDX) = 500 ns
(see Figure 2-10)
400
460
550
ns
tBIT(TXDX) = 500 ns
(see Figure 2-10);
RLX = 120Ω,
CLX = 200 pF (Note 1)
8b
tBIT(RXDX),5M Recessive Bit Time on RXDX – 5 Mbps,
Loop Delay Symmetry
160
185
220
ns
tBIT(TXDX) = 200 ns
(see Figure 2-10)
8c
tBIT(RXDX),8M Recessive Bit Time on RXDX – 8 Mbps,
Loop Delay Symmetry
85
105
140
ns
tBIT(TXDX) = 120 ns
(see Figure 2-10)
(Note 1)
9
tFLTR(WAKE) Delay Bus Dominant to RXDX
(Standby mode)
0.5
1
4
µs
Standby mode
Delay Standby to Normal Mode
5
25
40
µs
Negative edge on STBYx
10
tWAKE
11
tPDT
Permanent Dominant Detect Time
—
1.25
—
ms
TXDX = 0V
12
tPDTR
Permanent Dominant Timer Reset
—
100
—
ns
The shortest Recessive
pulse on TXDX or CAN
bus to reset Permanent
Dominant Timer
Note 1:
Characterized, not 100% tested.
Load Condition 1
Load Condition 2
VDDX/2
RLX
CLX
Pin
VSSX
CLX
Pin
VSSX
RLX = 464Ω
CLX = 50 pF for all digital pins
FIGURE 2-2:
Test Load Conditions.
2015 Microchip Technology Inc.
DS20005409A-page 9
MCP25612FD
0.1 µF
VDDX
CANHx
TXDX
CAN
Transceiver
RXDX
15 pF
FIGURE 2-3:
GNDx
CANLx
STBYx
Test Circuit for Electrical Characteristics.
1000 pF
CANHx
TXDX
RXDX
CAN
Transceiver
RLX
Transient
Generator
(Note 1)
CANLx
1000 pF
STBYx
GNDx
Note 1:
CLX
RLX
The waveforms of the applied transients shall be in accordance with ISO-7637, Part 1,
Test Pulses 1, 2, 3a and 3b.
FIGURE 2-4:
Test Circuit for Automotive Transients.
RXDX (Receive Data
Output Voltage)
VOHX
VDIFFX(R)(I)
VDIFFX(D)(I)
VOLX
VDIFFX(H)(I)
0.5
FIGURE 2-5:
DS20005409A-page 10
VDIFFX (V)
0.9
Hysteresis of the Receiver.
2015 Microchip Technology Inc.
MCP25612FD
2.3
Terms and Definitions
A number of terms are defined in ISO-11898 that are
used to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are
summarized in this section.
2.3.1
2.3.5
DIFFERENTIAL VOLTAGE, VDIFFX
(OF CAN BUS)
Differential voltage of the two-wire CAN bus value:
VDIFFX = VCANHX – VCANLX.
2.3.6
BUS VOLTAGE
INTERNAL CAPACITANCE, CIN
(OF A CAN NODE)
VCANLX and VCANHX denote the voltages of the bus line
wires, CANLx and CANHx, relative to the ground of
each individual CAN node.
Capacitance seen between CANLx (or CANHx) and
ground, during the Recessive state, when the CAN
node is disconnected from the bus (see Figure 2-6).
2.3.2
2.3.7
COMMON-MODE BUS VOLTAGE
RANGE
Boundary voltage levels of VCANLX and VCANHX, with
respect to ground, for which proper operation will occur
if up to the maximum number of CAN nodes are
connected to the bus.
2.3.3
DIFFERENTIAL INTERNAL
CAPACITANCE, CDIFF
(OF A CAN NODE)
Capacitance seen between CANLx and CANHx
during the Recessive state, when the CAN node is
disconnected from the bus (see Figure 2-6).
2.3.4
INTERNAL RESISTANCE, RIN
(OF A CAN NODE)
Resistance seen between CANLx (or CANHx) and
ground, during the Recessive state, when the CAN
node is disconnected from the bus (see Figure 2-6).
ECU
RIN
RIN
DIFFERENTIAL INTERNAL
RESISTANCE, RDIFF
(OF A CAN NODE)
Resistance seen between CANLx and CANHx, during
the Recessive state, when the CAN node is
disconnected from the bus (see Figure 2-6).
2015 Microchip Technology Inc.
CANLx
CDIFF
RDIFF
CIN
CIN
CANHx
GROUND
FIGURE 2-6:
Physical Layer Definitions.
DS20005409A-page 11
MCP25612FD
2.4
Timing Diagrams and Specifications
VDDX
TXDX (Transmit Data
Input Voltage)
0V
VDIFFX (CANHx, CANLx
Differential Voltage)
RXDX (Receive Data
Output Voltage)
FIGURE 2-7:
3
7
5
4
8
6
Timing Diagram for AC Characteristics.
VDDX
VSTBYX
Input Voltage
0V
VDDX/2
VCANHX/VCANLX
0
VTXDX = VDDX
FIGURE 2-8:
10
Timing Diagram for Wake-up from Standby.
Minimum Pulse Width until CAN bus goes to Dominant State after the Falling Edge
TXDX
Driver is Off
VDIFFX (VCANHX – VCANLX)
11
FIGURE 2-9:
DS20005409A-page 12
12
Permanent Dominant Timer Reset Detect.
2015 Microchip Technology Inc.
MCP25612FD
70%
TXDX
30%
5 * tBIT(TXDX)
tBIT(TXDX)
30%
tLOOP
(F)
70%
RXDX
30%
tLOOP(R)
8
tBIT(RXDX)
The bit time of a recessive bit, after five dominant bits, is measured on the RXDX pin. Due to
asymmetry of the loop delay, and the CAN transceiver not being a push-pull driver, the recessive bits
tend to shorten.
Note:
FIGURE 2-10:
TABLE 2-3:
Timing Diagram for Loop Delay Symmetry.
THERMAL SPECIFICATIONS
Parameter
Symbol
Min.
Typ.
Max.
Units
Specified Temperature Range
TA
-40
—
+125
C
-40
—
+150
Operating Temperature Range
TA
-40
—
+150
C
Storage Temperature Range
TA
-55
—
+150
C
JA
—
90.8
—
C/W
Test Conditions
Temperature Ranges
Thermal Package Resistance
Thermal Resistance, 14L-SOIC
2015 Microchip Technology Inc.
DS20005409A-page 13
MCP25612FD
3.0
PIN DESCRIPTIONS
Table 3-1 describes the MCP25612FD device pinout.
TABLE 3-1:
MCP25612FD PIN FUNCTIONS
SOIC
3.1
Pin Name
Pin Type
1
TXD1
I
2
VSS1
Power
Ground
3
VDD1
Power
Transceiver Supply Voltage
4
RXD1
O
TXD2
I
VSS2
Power
Ground
7
VDD2
Power
Transceiver Supply Voltage
8
RXD2
O
Transmit Data Input
Receive Data Output
9
CANL2
I/O
CAN Low-Level Bus Line
10
CANH2
I/O
CAN High-Level Bus Line
11
STBY2
I
12
CANL1
I/O
CAN Low-Level Bus Line
13
CANH1
I/O
CAN High-Level Bus Line
14
STBY1
I
Transmitter Data Input Pin (TXDX)
Ground Supply Pin (VSSX)
Supply Voltage Pin (VDDX)
Positive supply voltage pin. Supplies the transmitter
and receiver, including the wake-up receiver.
3.4
Receive Data Output
6
Ground supply pin.
3.3
Transmit Data Input
5
The CAN transceivers drive the differential output pins,
CANHx and CANLx, according to TXDX. TXDX is usually
connected to the transmitter data output of the CAN
controller device. When TXDX is low, CANHx and
CANLx are in the Dominant state. When TXDX is high,
CANHx and CANLx are in the Recessive state,
provided that another CAN node is not driving the CAN
bus with a Dominant state. TXDX is connected to an
internal pull-up resistor (nominal 33 kΩ) to VDDX.
3.2
Pin Function
Receiver Data Output Pin (RXDX)
Standby Mode Input (active-high)
Standby Mode Input (active-high)
3.5
CAN Low Pin (CANLx)
The CANLx output drives the low side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator. CANLx disconnects from the
bus when MCP25612FD is not powered.
3.6
CAN High Pin (CANHx)
The CANHx output drives the high side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator. CANHx disconnects from the
bus when MCP25612FD is not powered.
3.7
Standby Mode Input Pin (STBYx)
This pin selects between Normal or Standby mode. In
Standby mode, the transmitter and high-speed receiver
are turned off; only the low-power receiver and
wake-up filter are active. STBYx is connected to an
internal MOS pull-up resistor to VDDX. The typical value
is 660 kΩ.
RXDX is a CMOS-compatible output that drives high or
low, depending on the differential signals on the
CANHx and CANLx pins, and is usually connected to
the receiver data input of the CAN controller device.
RXDX is high when the CAN bus is in the Recessive
state and low in the Dominant state. RXDX is supplied
by VDDX.
DS20005409A-page 14
2015 Microchip Technology Inc.
MCP25612FD
4.0
TYPICAL APPLICATIONS
In order to meet some EMC/EMI requirements, a
Common-Mode Choke (CMC) may be needed for data
rates greater than 1 Mbps.
VBAT
5V LDO
0.1 F
0.1 F
0.1 F
VDD
VDD1
CANTX1
TXD1
CANRX1
RXD1
RA1
STBY2
CANTX2
TXD2
CANRX2
RXD2
Vss
FIGURE 4-1:
VDD2
CANH1
CANH1
STBY1
120
MCP25612FD
PIC® MCU
RA0
CANL1
CANL1
CANH2
CANH2
120
CANL2
VSS1
CANL2
VSS2
MCP25612FD Application.
2015 Microchip Technology Inc.
DS20005409A-page 15
MCP25612FD
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
14-Lead SOIC (3.90 mm)
Example
MCP25612FD
E/SL e3
1518256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005409A-page 16
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015 Microchip Technology Inc.
MCP25612FD
5.2
Note:
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015 Microchip Technology Inc.
DS20005409A-page 17
MCP25612FD
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005409A-page 18
2015 Microchip Technology Inc.
MCP25612FD
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWS ZZZPLFURFKLSFRPSDFNDJLQJ
2015 Microchip Technology Inc.
DS20005409A-page 19
MCP25612FD
NOTES:
DS20005409A-page 20
2015 Microchip Technology Inc.
MCP25612FD
APPENDIX A:
REVISION HISTORY
Revision A (June 2015)
Original release of this document.
2015 Microchip Technology Inc.
DS20005409A-page 21
MCP25612FD
NOTES:
DS20005409A-page 22
2015 Microchip Technology Inc.
MCP25612FD
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact the factory or one of the sales offices listed on the back page.
PART NO.
-X
/XX
Device
Temperature
Range
Package
Examples:
a)
b)
Device:
MCP25612FD: Dual CAN FD Transceiver
MCP25612FDT: Dual CAN FD Transceiver
(Tape and Reel)
Temperature
Range:
E = -40°C to +125°C (Extended)
H = -40°C to +150°C (High)
Package:
SL = 14-Lead Plastic Small Outline - Narrow,
3.90 mm Body
2015 Microchip Technology Inc.
c)
d)
MCP25612FD-E/SL: Extended Temperature,
14LD SOIC package
MCP25612FDT-E/SL: Tape and Reel,
Extended Temperature,
14LD SOIC package
MCP25612FD-H/SL: High Temperature,
14LD SOIC package.
MCP25612FDT-H/SL: Tape and Reel,
High Temperature,
14LD SOIC package
DS20005409A-page 23
MCP25612FD
NOTES:
DS20005409A-page 24
2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-484-2
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005409A-page 25
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DS20005409A-page 26
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