TC962
High Current Charge Pump DC-to-DC Converter
Features:
General Description:
•
•
•
•
•
•
•
•
The TC962 is an advanced version of the industry
standard TC7662 high voltage DC-to-DC converter.
Using improved design techniques and CMOS
construction, the TC962 can source as much as 80 mA
versus the 7662’s 20 mA capability.
Pin Compatible With TC7662/ICL7662/SI7661
High Output Current 80 mA
No External Diodes Required
Wide Operating Range 3V to 18V
Low Output Impedance 28 Typ.
No Low Voltage Terminal Required
Application Zener On-Chip
OSC Frequency Doubling Pin Option for Smaller
Output Capacitors
Applications:
•
•
•
•
Laptop Computers
Disk Drives
Process Instrumentation
P-Based Controllers
Device Selection Table
Operating
Temp.
Range
Part
Number
Package
TC962COE
16-Pin SOIC Wide
0°C to +70°C
TC962CPA
8-Pin Plastic DIP
0°C to +70°C
TC962EPA
8-Pin Plastic DIP
-40°C to +85°C
TC962IJA
8-Pin CERDIP
-25°C to +85°C
TC962MJA
8-Pin CERDIP
-55°C to +125°C
As an inverter, the TC962 can put out voltages as high
as 18V and as low as 3V without the need for external
diodes. The output impedance of the device is a low
28 (with the proper capacitors), voltage conversion
efficiency is 99.9%, and power conversion efficiency is
97%.
The low voltage terminal (pin 6) required in some
TC7662 applications has been eliminated. Grounding
this terminal will double the oscillator frequency from 12
kHz to 24 kHz. This will allow the use of smaller
capacitors for the same output current and ripple, in
most applications. Only two external capacitors are
required for inverter applications. In the event an
external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
internal oscillator to sync to the external clock.
Pin 1, which is used as a test pin on the 7662, is a
voltage reference Zener on the TC962. This Zener (6.4V
at 5 mA) has a dynamic impedance of 12 and is
intended for use where the TC962 is supplying current to
external regulator circuitry and a reference is needed for
the regulator circuit. (See Section 3.0 “Applications
Information” Applications Information).
The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.
Package Type
16-Pin SOIC Wide
Zener
Cathode 1
8-Pin DIP
8-Pin CERDIP
Zener
Cathode 1 •
C+ 2 TC962CPA
TC962EPA
GND 3
TC962IJA
C– 4 TC962MJA
2001-2012 Microchip Technology Inc.
8 VDD
7 COSC
6 FREQ x 2
5 VOUT
16 VDD
NC 2
C+ 3
15 NC
NC 4
13 NC
GND 5
14 COSC
TC962COE
12 FREQ x 2
NC 6
11 NC
C– 7
10 VOUT
NC 8
9 NC
DS21484D-page 1
TC962
Functional Block Diagram
8
FREQ x 2
–
OSC/C
Timing
6
I
VDD
I
TC962
7
Level
Shift
Q
+
–
P SW1
2
F/F
C
Q
Level
Shift
Comparator
with Hysteresis
N SW4
CAP +
+
CP
External
3
Zener
Cathode
GND
1
6.4V
VREF
+
Level
Shift
4
Level
Shift
CR
EXT
OUT
N SW2
CAP –
RL
N SW3
5
VOUT
DS21484D-page 2
2001-2012 Microchip Technology Inc.
TC962
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings*
Supply Voltage (VDD to GND) ..............................+18V
Input Voltage Any Pin
......................... (VDD +0.3) to (VSS -0.3) (Note 1)
Current Into Any Pin........................................... 10 mA
ESD Protection ................................................ ±2000V
Output Short Circuit ........... Continuous (at 5.5V Input)
Package Power Dissipation (TA 70°C)
SOIC ....................................................... 760 mW
PDIP........................................................ 730 mW
CERDIP .................................................. 800 mW
Package Thermal Resistance
CERDIP, RJ-A ......................................... 90°C/W
PDIP, RJ-A ............................................ 140°C/W
Operating Temperature Range
CPA, COE ....................................... 0°C to +70°C
IJA ................................................ -25°C to +85°C
EPA .............................................. -40°C to +85°C
MJA ............................................ -55°C to +125°C
Storage Temperature Range ............. -65°C to +150°C
TC962 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure ) unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VDD
Supply Voltage
3
—
18
V
IS
Supply Current
VDD = 15V
—
—
—
—
—
—
—
—
510
560
650
190
210
210
—
700
—
—
—
—
—
A
RL =
TA = +25°C
0 TA 70°C
-55°C TA 125°C
TA = +25°C
0 TA 70°C
-55°C TA 125°C
IL = 20 mA, VDD = 15V
IL = 80 mA, VDD = 15V
IL = 3 mA, VDD = 5V
VDD = 5V
RO
Output Source
Resistance
—
—
—
32
35
—
37
40
50
FOSC
Oscillator Frequency
—
—
12
24
—
—
kHz
PEFF
Power Efficiency
93
—
97
—
—
—
%
RL = 2 k
VDEF
Voltage Efficiency
99
—
96
99.9
—
—
—
—
—
%
RL =
Over temperature range
VZ
Zener Voltage
6.0
6.2
6.4
V
IZ = 5 mA
ZZT
Zener Impedance
—
12
—
IL = 2.5 mA to 7.5 mA
Note
1:
Pin 6 Open
Pin 6 GND
Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no
inputs from sources operating from external supplies be applied prior to “power-up” of the TC962.
2001-2012 Microchip Technology Inc.
DS21484D-page 3
TC962
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin DIP)
(8-Pin CERDIP)
Symbol
1
Zener Cathode
2
C+
3
GND
4
C-
5
VOUT
6
FREQ x 2
7
COSC
8
VDD
Pin No.
(16-Pin SOIC)
Symbol
1
Zener Cathode
2
NC
3
C+
Positive side of external CP capacitor (pump cap).
4
NC
No connect.
5
GND
6
NC
7
C-
Negative side of external CP capacitor (pump cap).
8
NC
No connect.
9
NC
No connect.
10
VOUT
11
NC
12
FREQ x 2
13
NC
Description
Cathode of internal Zener diode.
Positive side of external CP capacitor (pump cap).
Ground terminal.
Negative side of external CP capacitor (pump cap).
Output voltage.
If grounded, frequency doubles.
Capacitor to GND will decrease frequency.
Input voltage.
Description
Cathode of internal Zener diode.
No connect.
Ground terminal.
No connect.
Output voltage.
No connect.
If grounded, frequency doubles.
No connect.
Capacitor to GND will decrease frequency.
14
COSC
15
NC
No connect.
16
VDD
Input voltage.
DS21484D-page 4
2001-2012 Microchip Technology Inc.
TC962
3.0
APPLICATIONS INFORMATION
3.1
Theory of Operation
current source and double the frequency. This will
double the charge current going into the internal
capacitor, as well as any capacitor added to pin 7.
A Zener diode has been added to the TC962 for use as
a reference in building external regulators. This Zener
runs from pin 1 to ground.
The TC962 is a capacitive pump (sometimes called a
switched capacitor circuit), where four MOSFET
switches control the charge and discharge of a
capacitor.
3.2
The functional block diagram shows how the switching
action works. SW1 and SW2 are turned on simultaneously, charging CP to the supply voltage, VIN. This
assumes that the on resistance of the MOSFETs in
series with the capacitor results in a charging time
(3 time constants) that is less than the on time provided
by the oscillator frequency as shown:
Latch-Up
All CMOS structures contain a parasitic SCR. Care
must be taken to prevent any input from going above or
below the supply rail, or latch-up will occur. The result
of latch-up is an effective short between VDD and VSS.
Unless the power supply input has a current limit, this
latch-up phenomena will result in damage to the
device. (See AN763, Latch-up Protection for MOSFET
Drivers.)
3 (RDS(ON) CP) < CP/(0.5 fOSC)
In the next cycle, SW1 and SW2 are turned off and after
a very short interval of all switches being off (this
prevents large currents from occurring due to cross
conduction), SW3 and SW4 are turned on. The charge
in CP is then transferred to CR, but with the polarity
inverted. In this way, a negative voltage is now derived.
690
IS
NC
An oscillator supplies pulses to a flip-flop that is then
fed to a set of level shifters. These level shifters then
drive each set of switches at one-half the oscillator
frequency.
CP
+ 10 μF
1
8
2
7
TC962
3
4
COSC
FIGURE 3-1:
CP2
7
+ 10 μF 3
TC962 6
4
5
+
CP1
+
10 μF
+
Split V+ In Half
V+
8
VOUT
(–5V)
Test Circuit
Combined Negative Converter and Positive Multiplier
1
RL
5
CR
The oscillator has two pins that control the frequency of
oscillation. Pin 7 can have a capacitor added that is
returned to ground. This will lower the frequency of the
oscillator by adding capacitance to the timing capacitor
internal to the TC962. Grounding pin 6 will turn on a
2
IL
V+
(+5V)
V+
VD1
VD2
VOUT = –V +
C R1
+
VOUT =
2V + –2V
1
8
2
+ 10 μF
CP
3
7
D
TC962
4
10 μF
6
5
10 μF
CR
Lowering Output Resistance by Paralleling Devices
+
10 μF
V+
VOUT =
2
Positive Voltage Multiplier
V+
V+
CP1
+ 10 μF
1
8
1
8
1
8
2
7
2
7
2
7
3
TC962 6
3
TC962 6
4
5
4
5
3
TC962 6
4
5
CP2
+ 10 μF
VOUT
CR
+
FIGURE 3-2:
VD1
VD2
CP
+ 10 μF
CP
VOUT =
2V +–2V
+
D
10 μF
10 μF
Typical Applications
2001-2012 Microchip Technology Inc.
DS21484D-page 5
TC962
4.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure , CP = CR = 10 F, CPESR CRESR 1.
Frequency vs. Temperature
Oscillator Frequency vs. C OSC
Supply Current vs. Temperature
20
700
FREQUENCY (Hz)
500
V + = 15V
400
300
200
V + = 15V
COSC = FREQ x 2 = OPEN
18
FREQUENCY (kHz)
1k
100
10
0
-60 -40 -20
12
10
6
10
1
0 20 40 60 80 100 120 140
100
1000
10,000
Output Resistance vs. Temperature
Current vs. Zener Voltage
Power Conversion Efficiency vs. I LOAD
CURRENT (mA)
60
V+ = 5V IL = 3 mA
40
POWER CONVERSION EFFICIENCY (%)
50
70
TA = +25°C
40
30
20
V+ = 15V IL = 20 mA
10
20
10
-60 -40 -20
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
0
4.5
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
80
30
-60 -40 -20
CAPACITANCE (pF)
TEMPERATURE (°C)
OUTPUT RESISTANCE ( Ω)
14
8
100
50
16
TA = +25°C
100
150
135
90
80
EFFICIENCY
120
105
70
SUPPLY
CURRENT
60
90
75
50
40
60
30
45
20
30
10
15
0
0
4.0
5.5
6.0
ZENER VOLTAGE (V)
6.5
7.0
SUPPLY CURRENT (mA)
SUPPLY CURRENT (μA)
TA = +25°C
10k
600
8
16 24 32 40 48 56
64 72
80
LOAD CURRENT (mA)
Output Resistance vs. Input Voltage
110
TA = +25°C
OUTPUT RESISTANCE (Ω)
100
90
80
70
3 μA
60
50
20 μA
40
30
20
10
0
2
4
6 8 10 12 14 16 18
INPUT VOLTAGE (V)
DS21484D-page 6
20
2001-2012 Microchip Technology Inc.
TC962
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 16-Pin SOIC (Wide) Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
16 mm
12 mm
1000
13 in
16-Pin SOIC (W)
5.3
Package Dimensions
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin CDIP (Narrow)
.110 (2.79)
.090 (2.29)
Pin 1
.300 (7.62)
.230 (5.84)
.020 (0.51) Min.
.055 (1.40) Max.
.320 (8.13)
.290 (7.37)
.400 (10.16)
.370 (9.40)
.200 (5.08)
.160 (4.06)
.040 (1.02)
.020 (0.51)
.150 (3.81)
Min.
.200 (5.08)
.125 (3.18)
.015 (0.38)
.008 (0.20)
3° Min.
.400 (10.16)
.320 (8.13)
.065 (1.65) .020 (0.51)
.045 (1.14) .016 (0.41)
Dimensions: inches (mm)
2001-2012 Microchip Technology Inc.
DS21484D-page 7
TC962
Package Dimensions (Continued)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin Plastic DIP
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.015 (0.38)
.008 (0.20)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
3° Min.
.400 (10.16)
.310 (7.87)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
16-Pin SOIC (Wide)
Pin 1
.299 (7.59) .419 (10.65)
.291 (7.40) .398 (10.10)
.413 (10.49)
.398 (10.10)
.104 (2.64)
.097 (2.46)
.050 (1.27) Typ. .019 (0.48)
.014 (0.36)
.012 (0.30)
.004 (0.10)
8°
Max.
.013 (0.33)
.009 (0.23)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21484D-page 8
2001-2012 Microchip Technology Inc.
TC962
6.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
2001-2012 Microchip Technology Inc.
DS21484D-page 9
TC962
NOTES:
DS21484D-page 10
2001-2012 Microchip Technology Inc.
TC962
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2001-2012 Microchip Technology Inc.
DS21484D-page 11
TC962
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Device: TC962
Literature Number: DS21484D
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DS21484D-page 12
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
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•
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
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PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
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GestIC and ULPP are registered trademarks of Microchip
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All other trademarks mentioned herein are property of their
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© 2001-2012, Microchip Technology Incorporated, Printed in
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Printed on recycled paper.
ISBN: 9781620768808
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2001-2012 Microchip Technology Inc.
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DS21484D-page 13
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Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21484D-page 14
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
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