AD9239BCPZ-210

FEATURES FUNCTIONAL BLOCK DIAGRAM AVDD PDWN DRGND DRVDD AD9239 VIN + A VIN – A BUF SHA BUF SHA BUF SHA BUF SHA DOUT + A PIPELINE ADC 12 PIPELINE ADC 12 PIPELINE ADC 12 PIPELINE ADC 12 VCM A VIN + B VIN – B VCM B VIN + C VIN – C VCM C VIN + D VIN – D CHANNEL A DOUT – A DOUT + B CHANNEL B DOUT – B DOUT + C CHANNEL C DOUT – C DOUT + D CHANNEL D DOUT – D VCM D PGM3 REFERENCE PGM2 RBIAS DATA RATE MULTIPLIER SERIAL PORT TEMPOUT PGM1 PGM0 RESET SCLK APPLICATIONS SDI/ SDIO SDO CSB CLK+ CLK– 06980-001 4 ADCs in 1 package Coded serial digital outputs with ECC per channel On-chip temperature sensor −95 dB channel-to-channel crosstalk SNR = 65 dBFS with AIN = 85 MHz at 250 MSPS SFDR = 77 dBc with AIN = 85 MHz at 250 MSPS Excellent linearity DNL = ±0.3 LSB (typical) INL = ±0.7 LSB (typical) 780 MHz full power analog bandwidth Power dissipation = 380 mW per channel at 250 MSPS 1.25 V p-p input voltage range, adjustable up to 1.5 V p-p 1.8 V supply operation Clock duty cycle stabilizer Serial port interface features Power-down modes Digital test pattern enable Programmable header Programmable pin functions (PGMx, PDWN) DATA SERIALIZER, ENCODER, AND CML DRIVERS Data Sheet Quad, 12-Bit, 170 MSPS/210 MSPS/250 MSPS Serial Output 1.8 V ADC AD9239 Figure 1. Communication receivers Cable head end equipment/M-CMTS Broadband radios Wireless infrastructure transceivers Radar/military-aerospace subsystems Test equipment GENERAL DESCRIPTION The AD9239 is a quad, 12-bit, 250 MSPS analog-to-digital converter (ADC) with an on-chip temperature sensor and a high speed serial interface. It is designed to support digitizing high frequency, wide dynamic range signals with an input bandwidth up to 780 MHz. The output data are serialized and presented in packet format, consisting of channel-specific information, coded samples, and error correction code. The ADC requires a single 1.8 V power supply and the input clock may be driven differentially with a sine wave, LVPECL, TTL, or LVDS. A clock duty cycle stabilizer allows high performance at full speed with a wide range of clock duty cycles. The on-chip reference eliminates the need for external decoupling and can be adjusted by means of SPI control. Various power-down and standby modes are supported. The ADC typically consumes 145 mW per channel with the digital link still in operation when standby operation is enabled. Rev. E Fabricated on an advanced CMOS process, the AD9239 is available in a Pb-free/RoHS-compliant, 72-lead LFCSP package. It is specified over the industrial temperature range of −40°C to +85°C. PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. 6. Four ADCs are contained in a small, space-saving package. An on-chip PLL allows users to provide a single ADC sampling clock, and the PLL distributes and multiplies up to produce the corresponding data rate clock. Coded data rate supports up to 4.0 Gbps per channel. Coding includes scrambling to ensure proper dc common mode, embedded clock, and error correction. The AD9239 operates from a single 1.8 V power supply. Flexible synchronization schemes and programmable mode pins. On-chip temperature sensor. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2008–2014 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD9239 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ........................................... 11 Applications ....................................................................................... 1 Equivalent Circuits ......................................................................... 17 Functional Block Diagram .............................................................. 1 Theory of Operation ...................................................................... 19 General Description ......................................................................... 1 Analog Input Considerations ................................................... 19 Product Highlights ........................................................................... 1 Clock Input Considerations ...................................................... 21 Revision History ............................................................................... 2 Serial Port Interface (SPI) .............................................................. 31 Specifications..................................................................................... 3 Hardware Interface ..................................................................... 31 AC Specifications.......................................................................... 4 Memory Map .................................................................................. 33 Digital Specifications ................................................................... 5 Reading the Memory Map Table .............................................. 33 Switching Specifications .............................................................. 6 Reserved Locations .................................................................... 33 Timing Diagram ........................................................................... 7 Default Values ............................................................................. 33 Absolute Maximum Ratings ............................................................ 8 Logic Levels ................................................................................. 33 Thermal Resistance ...................................................................... 8 Outline Dimensions ....................................................................... 38 ESD Caution .................................................................................. 8 Ordering Guide .......................................................................... 38 Pin Configuration and Function Description .............................. 9 REVISION HISTORY 7/14—Rev. D to Rev. E Changes to Digital Start-Up Sequence Section .......................... 23 Added Minimize Skew and Time Misalignment (Optional) Section, Link Initialization (Required) Section, and Table 9; Renumbered Sequentially.............................................................. 23 Changes to Table 16 ........................................................................ 34 5/14—Rev. C to Rev. D Changes to Digital Outputs and Timing Section ....................... 25 Changes to Table 15 ........................................................................ 35 6/13—Rev. B to Rev. C Changed Temperature Sensor Output Current Drive from 10 µA to 50 µA; Table 1 .................................................................... 3 Changes to Digital Outputs and Timing Section ....................... 24 Updated Outline Dimensions ....................................................... 38 5/10—Rev. A to Rev. B Changes to Table 15 ................................................................. 35, 36 2/10—Rev. 0 to Rev. A Changes to Analog Inputs, Differential Input Voltage Range Parameter and Endnote 3, Table 1 ..................................................3 Changes to Table 8.............................................................................9 Changes to Clock Duty Cycle Considerations Section ............. 21 Changes to Digital Outputs and Timing Section ....................... 23 Changes to Table 15 ....................................................................... 34 10/08—Revision 0: Initial Version Rev. E | Page 2 of 40 Data Sheet AD9239 SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, 1.25 V p-p differential input, AIN = −1.0 dBFS, DCS enabled, unless otherwise noted. Table 1. Parameter 1 RESOLUTION ACCURACY No Missing Codes Offset Error Offset Matching Gain Error Gain Matching Differential Nonlinearity (DNL) Integral Nonlinearity (INL) ANALOG INPUTS Differential Input Voltage Range 2 Common-Mode Voltage Input Capacitance Input Resistance Analog Bandwidth, Full Power Voltage Common Mode (VCMx) Voltage Output Current Drive Temperature Sensor Output Voltage Output Current Drive POWER SUPPLY AVDD DRVDD IAVDD IDRVDD Total Power Dissipation (Including Output Drivers) Power-Down Dissipation Standby Dissipation2 CROSSTALK Overrange Condition 3 Temp AD9239BCPZ-170 Min Typ Max 12 Full 25°C 25°C 25°C 25°C Full Full Guaranteed −2 ±12 4 12 −2.8 +1 +4.7 0.9 2.7 ±0.28 ±0.6 ±0.45 ±0.9 −2.8 Full Full 25°C Full Full 1.0 1.0 Full Full 1.25 1.4 2 4.3 780 1.5 1.4 1.44 1 −1.12 739 50 1.5 1.7 1.7 1.8 1.8 535 98 1.139 1.9 1.9 570 105 1.215 Full Full Full Full Full Full Full Full Full Full Full Min 12 AD9239BCPZ-210 Typ Max Guaranteed −2 4 +1 0.9 ±0.28 ±0.7 ±12 12 +4.7 2.7 ±0.6 ±1.3 Min −2.8 Guaranteed −2 4 +1 0.9 ±0.3 ±0.7 Unit Bits ±12 12 +4.7 2.7 ±0.6 ±1.3 mV mV % FS % FS LSB LSB 1.25 1.4 2 4.3 780 1.5 V p-p V pF 1.25 1.4 2 4.3 780 1.5 1.4 1.44 1 −1.12 737 50 1.5 1.4 1.44 1 −1.12 734 50 1.5 V mA mV/°C mV µA 1.7 1.7 1.8 1.8 610 111 1.298 1.9 1.9 650 120 1.386 1.7 1.7 1.8 1.8 725 123 1.526 1.9 1.9 775 133 1.634 V V mA mA W 3 152 −95 −90 3 173 −95 −90 1.0 AD9239BCPZ-250 Typ Max kΩ MHz 3 195 −95 −90 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed. AVDD/DRVDD, with link established. 3 Overrange condition is specified as 6 dB above the full-scale input range. 1 2 Rev. E | Page 3 of 40 mW mW dB dB AD9239 Data Sheet AC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, 1.25 V p-p differential input, AIN = −1.0 dBFS, DCS enabled, unless otherwise noted. Table 2. Parameter 1 SIGNAL-TO-NOISE RATIO (SNR) fIN = 9.7 MHz fIN = 84.3 MHz fIN = 170.3 MHz fIN = 240.3 MHz SIGNAL-TO-NOISE RATIO (SINAD) fIN = 9.7 MHz fIN = 84.3 MHz fIN = 170.3 MHz fIN = 240.3 MHz EFFECTIVE NUMBER OF BITS (ENOB) fIN = 9.7 MHz fIN = 84.3 MHz Temp fIN = 170.3 MHz fIN = 240.3 MHz WORST HARMONIC (SECOND) fIN = 9.7 MHz fIN = 84.3 MHz fIN = 170.3 MHz fIN = 240.3 MHz WORST HARMONIC (THIRD) fIN = 9.7 MHz fIN = 84.3 MHz fIN = 170.3 MHz fIN = 240.3 MHz WORST OTHER (EXCLUDING SECOND OR THIRD) fIN = 9.7 MHz fIN = 84.3 MHz fIN = 170.3 MHz fIN = 240.3 MHz TWO-TONE INTERMOD DISTORTION (IMD) fIN1 = 140.2 MHz, fIN2 = 141.3 MHz, AIN1 and AIN2 = −7.0 dBFS fIN1 = 170.2 MHz, fIN2 = 171.3 MHz, AIN1 and AIN2 = −7.0 dBFS 2 25°C 25°C 1 2 25°C Full 25°C 25°C 25°C Full 25°C 25°C 25°C Full 25°C Full 25°C 25°C 25°C Full 25°C 25°C 25°C Full 25°C 25°C 25°C AD9239BCPZ-170 Min Typ Max AD9239BCPZ-210 Min Typ Max AD9239BCPZ-250 Min Typ Max 63.5 63.2 63.1 64.5 64.1 63.3 63.2 64.4 62.8 63.9 10.2 10.1 10.3 62.8 10.3 10.1 4 10.2 78.6 82 79 63.9 63 10.4 87.5 64.2 86 77 80 74 84 76 72.6 77 Unit 64.5 64.1 63.9 63.3 dB dB dB dB 64.2 63.8 63.1 63.1 dB dB dB dB 10.4 10.3 Bits Bits 10.2 10.2 Bits Bits 90 86 76 82 78 76 74 80 74.5 72.5 dBc dBc dBc dBc dBc dBc dBc dBc 88 88 85 94 85 85 78 77 76 dBc 77 76 dBc 96 25°C 86 90 83.7 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed. Tested at 210 MSPS and 250 MSPS only. Rev. E | Page 4 of 40 83.6 dBc dBc dBc dBc Data Sheet AD9239 DIGITAL SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, 1.25 V p-p differential input, AIN = −1.0 dBFS, DCS enabled, unless otherwise noted. Table 3. AD9239BCPZ-170 Typ Max AD9239BCPZ-210 Typ Max AD9239BCPZ-250 Typ Max Parameter 1 CLOCK INPUTS (CLK+, CLK–) Logic Compliance Differential Input Voltage Input Voltage Range Temp Min Full Full Full Internal Common-Mode Bias Input Common-Mode Voltage High Level Input Voltage (VIH) Low Level Input Voltage (VIL) High Level Input Current (IIH) Low Level Input Current (IIL) Differential Input Resistance Input Capacitance LOGIC INPUTS (PDWN, CSB, SDI/ SDIO, SCLK, RESET, PGMx) 2 Logic 1 Voltage Full Full Full Full Full Full 25°C 25°C LVPECL/LVDS/CMOS 0.2 6 AVDD − AVDD + 0.3 1.6 1.2 1.1 AVDD 1.2 3.6 0 0.8 −10 +10 −10 +10 16 20 24 4 LVPECL/LVDS/CMOS 0.2 6 AVDD − AVDD + 0.3 1.6 1.2 1.1 AVDD 1.2 3.6 0 0.8 −10 +10 −10 +10 16 20 24 4 LVPECL/LVDS/CMOS 0.2 6 AVDD − AVDD + 0.3 1.6 1.2 1.1 AVDD 1.2 3.6 0 0.8 −10 +10 −10 +10 16 20 24 4 0.8 × AVDD 0.8 × AVDD 0.8 × AVDD Logic 0 Voltage Full Min 0.2 × AVDD Full Min Unit V p-p V V V V V µA µA kΩ pF V 0.2 × AVDD 0.2 × AVDD V Logic 1 Input Current (CSB) Logic 0 Input Current (CSB) Logic 1 Input Current (SCLK, PDWN, SDI/SDIO, RESET, PGMx) Logic 0 Input Current (SCLK, PDWN, SDI/SDIO, RESET, PGMx) Input Resistance Input Capacitance LOGIC OUTPUTS (SDO) Logic 1 Voltage Full Full Full 0 −60 55 0 −60 55 0 −60 55 µA µA µA Full 0 0 0 µA 25°C 25°C 30 4 30 4 30 4 kΩ pF Full 1.2 Logic 0 Voltage DIGITAL OUTPUTS (DOUT + x, DOUT − x) Logic Compliance Full 0 Differential Output Voltage Common-Mode Level 1 2 Full Full AVDD + 0.3 0.3 AVDD + 0.3 0.3 1.2 0 Current mode logic 0.8 DRVDD/2 Current mode logic 0.8 DRVDD/2 AVDD + 0.3 0.3 1.2 0 Current mode logic 0.8 DRVDD/2 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed. Specified for 13 SDI/SDIO pins sharing the same connection. Rev. E | Page 5 of 40 V V V V AD9239 Data Sheet SWITCHING SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, 1.25 V p-p differential input, AIN = –1.0 dBFS, DCS enabled, unless otherwise noted. Table 4. Parameter 1 CLOCK Clock Rate Clock Pulse Width High (tEH) Clock Pulse Width Low (tEL) DATA OUTPUT PARAMETERS Data Output Period or UI (DOUT + x, DOUT − x) Data Output Duty Cycle Data Valid Time PLL Lock Time (tLOCK) Wake-Up Time (Standby) Wake-Up Time (Power-Down) 2 Pipeline Latency Data Rate per Channel (NRZ) Deterministic Jitter Random Jitter Channel-to-Channel Bit Skew Channel-to-Channel Packet Skew 3 Output Rise/Fall Time TERMINATION CHARACTERISTICS Differential Termination Resistance APERTURE Aperture Delay (tA) Aperture Uncertainty (Jitter) OUT-OF-RANGE RECOVERY TIME Temp Min Full Full Full 170 2.65 2.65 AD9239BCPZ-170 Typ Max 100 2.9 2.9 Min 210 2.15 2.15 AD9239BCPZ-210 Typ Max 100 2.4 2.4 Min 250 1.8 1.8 AD9239BCPZ-250 Typ Max 100 Unit 2.0 2.0 MSPS ns ns Full 1/(16 × fCLK) 1/(16 × fCLK) 1/(16 × fCLK) sec 25°C 25°C 25°C 25°C 25°C Full 25°C 25°C 25°C 25°C 25°C 25°C 50 0.8 4 250 50 50 0.8 4 250 50 50 0.8 4 250 50 2.72 10 6 0 +1 50 3.36 10 6 0 +1 50 4.0 10 6 0 +1 50 % UI µs ns μs CLK cycles Gbps ps max ps rms sec CLK cycles ps 25°C 100 100 100 Ω 25°C 25°C 25°C 1.2 0.2 1 1.2 0.2 1 1.2 0.2 1 ns ps rms CLK cycles 40 40 40 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and details on how these tests were completed. Receiver dependent. 3 See the Digital Start-Up Sequence section. 1 2 Rev. E | Page 6 of 40 Data Sheet AD9239 TIMING DIAGRAM SAMPLE N+1 N N – 40 ANALOG INPUT SIGNAL N – 39 N – 38 N – 37 SAMPLE RATE CLOCK ... SAMPLE RATE CLOCK ... SERIAL CODED SAMPLES: N – 40, N – 39, N – 38, N – 37 ... SERIAL DATA OUT ... ... ... ... ... ... 8-BIT HEADER CHANNEL ID 48-BIT ADC DATA-WORD 8-BIT ERROR CORRECTION 06980-002 DATA PACKET 1 (64 BITS) Figure 2. Timing Diagram Table 5. Packet Protocol Bits[64:57] Header (8 bits MSB first) Bits[56:45] Data 1 (12 bits MSB first) Bits[44:33] Data 2 (12 bits MSB first) Bits[32:21] Data 3 (12 bits MSB first) Rev. E | Page 7 of 40 Bits[20:9] Data 4 (12 bits MSB first) Bits[8:1] ECC (8 bits MSB first) AD9239 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 6. Parameter Electrical AVDD to AGND DRVDD to DRGND AGND to DRGND AVDD to DRVDD DOUT ± x to DRGND SDO, SDI/SDIO, CLK± , VIN ± x, VCMx, TEMPOUT, RBIAS to AGND SCLK, CSB, PGMx, RESET, PDWN to AGND Environmental Storage Temperature Range Operating Temperature Range Lead Temperature (Soldering 10 sec) Junction Temperature Rating −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to +0.3 V −2.0 V to +2.0 V −0.3 V to DRVDD + 0.3 V −0.3 V to AVDD + 0.3 V The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 7. Thermal Resistance Package Type 72-Lead LFCSP (CP-72-3) θJA 16.2 θJB 7.9 θJC 0.6 Unit °C/W Typical θJA, θJB, and θJC values are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces and through holes, ground, and power planes reduces the θJA. −0.3 V to AVDD + 0.3 V −65°C to +125°C −40°C to +85°C 300°C ESD CAUTION 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. E | Page 8 of 40 Data Sheet AD9239 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 NC AVDD VCM C AVDD VIN – C VIN + C AVDD AVDD AVDD NC AVDD AVDD AVDD VIN + B VIN – B AVDD VCM B AVDD PIN CONFIGURATION AND FUNCTION DESCRIPTION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 PIN 1 INDICATOR PIN 0 = EPAD = AGND AD9239 TOP VIEW (Not to Scale) 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 NC PGM0 PGM1 PGM2 PGM3 NC AVDD VCM A AVDD VIN – A VIN + A AVDD AVDD AVDD CSB SCLK SDI/SDIO SDO NOTES 1. NC = NO CONNECT. 2. THE EXPOSED PADDLE MUST BE SOLDERED TO THE GROUND PLANE FOR THE LFCSP PACKAGE. SOLDERING THE EXPOSED PADDLE TO THE CUSTOMER BOARD INCREASES THE RELIABILITY OF THE SOLDER JOINTS, MAXIMIZING THE THERMAL CAPABILITY OF THE PACKAGE. 06980-004 NC AVDD AVDD RESET DRGND DRVDD DOUT + D DOUT – D DOUT + C DOUT – C DOUT + B DOUT – B DOUT + A DOUT – A DRVDD DRGND PDWN NC 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 NC TEMPOUT RBIAS AVDD NC NC AVDD VCM D AVDD VIN – D VIN + D AVDD AVDD AVDD AVDD CLK– CLK+ AVDD Figure 3. Pin Configuration Table 8. Pin Function Descriptions Pin No. 0 23, 34 4, 7, 9, 12, 13, 14, 15, 18, 20, 21, 41, 42, 43, 46, 48, 55, 57, 60, 61, 62, 64, 65, 66, 69, 71 24, 33 2 3 8 10 11 16 17 22 25 26 27 28 29 30 31 32 35 Mnemonic AGND DRGND AVDD Description Analog Ground (Exposed Paddle). Digital Output Driver Ground. 1.8 V Analog Supply. DRVDD TEMPOUT RBIAS VCM D VIN − D VIN + D CLK− CLK+ RESET DOUT + D DOUT − D DOUT + C DOUT − C DOUT + B DOUT − B DOUT + A DOUT − A PDWN 1.8 V Digital Output Driver Supply. Output Voltage to Monitor Temperature. External Resistor to Set the Internal ADC Core Bias Current. Common-Mode Output Voltage Reference. ADC D Analog Complement. ADC D Analog True. Input Clock Complement. Input Clock True. Digital Output Timing Reset. ADC D True Digital Output. ADC D Complement Digital Output. ADC C True Digital Output. ADC C Complement Digital Output. ADC B True Digital Output. ADC B Complement Digital Output. ADC A True Digital Output. ADC A Complement Digital Output. Power-Down. Rev. E | Page 9 of 40 AD9239 Pin No. 37 38 39 40 44 45 47 50 51 52 53 56 58 59 67 68 70 1, 5, 6, 19, 36, 49, 54, 63, 72 Data Sheet Mnemonic SDO SDI/SDIO SCLK CSB VIN + A VIN − A VCM A PGM3 PGM2 PGM1 PGM0 VCM B VIN − B VIN + B VIN + C VIN − C VCM C NC Description Serial Data Output. Used for 4-wire SPI interface. Serial Data Input/Serial Data IO for 3-Wire SPI Interface. Serial Clock. Chip Select Bar. ADC A Analog Input True. ADC A Analog Input Complement. Common-Mode Output Voltage Reference. Optional Pin to be Programmed by Customer. Optional Pin to be Programmed by Customer. Optional Pin to be Programmed by Customer. Optional Pin to be Programmed by Customer. Common-Mode Output Voltage Reference. ADC B Analog Input Complement. ADC B Analog Input True. ADC C Analog Input True. ADC C Analog Input Complement. Common-Mode Output Voltage Reference. No Connection. Rev. E | Page 10 of 40 Data Sheet AD9239 TYPICAL PERFORMANCE CHARACTERISTICS 0 0 AIN = –1.0dBFS SNR = 64.88dB ENOB = 10.49 BITS SFDR = 77.57dBc –20 AMPLITUDE (dBFS) –40 –60 –80 10 20 30 40 50 FREQUENCY (MHz) 60 70 80 –120 06980-059 0 0 Figure 4. Single-Tone 32k FFT with fIN = 84.3 MHz, fSAMPLE = 170 MSPS 20 40 60 FREQUENCY (MHz) 80 100 Figure 7. Single-Tone 32k FFT with fIN = 240.3 MHz, fSAMPLE = 210 MSPS 0 0 AIN = –1.0dBFS SNR = 63.95dB ENOB = 10.33 BITS SFDR = 78.90dBc AIN = –1.0dBFS SNR = 64.62dB ENOB = 10.44 BITS SFDR = 75.48dBc –20 AMPLITUDE (dBFS) –20 –40 –60 –80 –100 –40 –60 –80 –100 0 10 20 30 40 50 FREQUENCY (MHz) 60 70 80 –120 06980-060 –120 0 Figure 5. Single-Tone 32k FFT with fIN = 240.3 MHz, fSAMPLE = 170 MSPS 20 40 80 60 FREQUENCY (MHz) 100 120 06980-063 AMPLITUDE (dBFS) –80 –100 –120 Figure 8. Single-Tone 32k FFT with fIN = 10.3 MHz, fSAMPLE = 250 MSPS 0 0 AIN = –1.0dBFS SNR = 64.65dB ENOB = 10.44 BITS SFDR = 77.54dBc AIN = –1.0dBFS SNR = 64.50dB ENOB = 10.42 BITS SFDR = 77.97dBc –20 AMPLITUDE (dBFS) –20 AMPLITUDE (dBFS) –60 06980-062 –100 –40 –40 –60 –80 –100 –40 –60 –80 –100 0 20 40 60 FREQUENCY (MHz) 80 100 –120 06980-061 –120 0 Figure 6. Single-Tone 32k FFT with fIN = 84.3 MHz, fSAMPLE = 210 MSPS 20 40 60 80 FREQUENCY (MHz) 100 120 06980-064 AMPLITUDE (dBFS) –20 AIN = –1.0dBFS SNR = 63.13dB ENOB = 10.19 BITS SFDR = 76.07dBc Figure 9. Single-Tone 32k FFT with fIN = 84.3 MHz, fSAMPLE = 250 MSPS Rev. E | Page 11 of 40 AD9239 Data Sheet 90 0 AIN = –1.0dBFS SNR = 63.90dB ENOB = 10.32 BITS SFDR = 73.10dBc 88 86 84 –40 SFDR (dBFS) AMPLITUDE (dBFS) –20 –60 –80 82 170MSPS 250MSPS 80 78 76 74 210MSPS –100 0 20 40 60 80 FREQUENCY (MHz) 100 120 70 50 06980-065 –120 Figure 10. Single-Tone 32k FFT with fIN = 171.3 MHz, fSAMPLE = 250 MSPS 90 110 130 150 170 ENCODE (MSPS) 190 210 230 250 –10 0 Figure 13. SFDR vs. Encode, fIN = 84.3 MHz 0 100 AIN = –1.0dBFS SNR = 63.41dB ENOB = 10.24 BITS SFDR = 77.49dBc –20 90 SFDR (dBFS) 80 SNR (dBFS) 70 –40 SNR/SFDR (dB) AMPLITUDE (dBFS) 70 06980-068 72 –60 –80 60 50 SFDR (dB) 40 30 SNR (dB) 20 –100 20 40 60 80 FREQUENCY (MHz) 100 120 0 –90 06980-066 0 Figure 11. Single-Tone 32k FFT with fIN = 240.3 MHz, fSAMPLE = 250 MSPS 100 69 90 68 80 250MSPS SNR/SFDR (dB) 65 64 210MSPS SNR (dBFS) 60 50 SFDR (dB) 40 63 30 62 20 61 10 60 50 70 90 110 130 150 170 ENCODE (MSPS) 190 210 Figure 12. SNR vs. Encode, fIN = 84.3 MHz 230 250 0 –90 –80 –70 –60 –50 –40 –30 –20 ANALOG INPUT LEVEL (dBFS) –10 0 06980-070 SNR (dB) 06980-067 SNR (dBFS) –60 –50 –40 –30 –20 ANALOG INPUT LEVEL (dBFS) SFDR (dBFS) 70 66 170MSPS –70 Figure 14. SNR/SFDR vs. Analog Input Level, fIN = 84.3 MHz, fSAMPLE = 170 MSPS 70 67 –80 06980-069 10 –120 Figure 15. SNR/SFDR vs. Analog Input Level, fIN = 84.3 MHz, fSAMPLE = 210 MSPS Rev. E | Page 12 of 40 Data Sheet AD9239 0 100 AIN1 AND AIN2 = –7.0dBFS SFDR = 76.88dBc IMD2 = –78.75dBc IMD3 = –78.68dBc 90 SFDR (dBFS) –20 80 SNR/SFDR (dB) AMPLITUDE (dBFS) SNR (dBFS) 70 60 50 SFDR (dB) 40 30 –40 –60 –80 SNR (dB) 20 –100 –80 –70 –60 –50 –40 –30 –20 ANALOG INPUT LEVEL (dBFS) –10 0 –120 06980-071 0 –90 0 Figure 16. SNR/SFDR vs. Analog Input Level, fIN = 84.3 MHz, fSAMPLE = 250 MSPS 100 0 AIN1 AND AIN2 = –7.0dBFS SFDR = 77.26dBc IMD2 = –86.55dBc IMD3 = –77.26dBc AIN1 AND AIN2 = –7.0dBFS SFDR = 74.48dBc IMD2 = –76.10dBc IMD3 = –74.48dBc –20 AMPLITUDE (dBFS) –20 –40 –60 –80 –100 –40 –60 –80 0 10 20 30 40 50 FREQUENCY (MHz) 60 70 80 –120 06980-072 –120 0 Figure 17. Two-Tone 32k FFT with fIN1 = 140.2 MHz and fIN2 = 141.3 MHz, fSAMPLE = 170 MSPS 20 40 60 80 FREQUENCY (MHz) 100 120 06980-075 –100 Figure 20. Two-Tone 32k FFT with fIN1 = 140.2 MHz and fIN2 = 141.3 MHz, fSAMPLE = 250 MSPS 0 0 AIN1 AND AIN2 = –7.0dBFS SFDR = 75.44dBc IMD2 = –78.34dBc IMD3 = –75.44dBc –20 AIN1 AND AIN2 = –7.0dBFS SFDR = 74.29dBc IMD2 = –76.51dBc IMD3 = –74.30dBc –20 AMPLITUDE (dBFS) –40 –60 –80 –100 –40 –60 –80 –120 0 20 40 60 FREQUENCY (MHz) 80 100 06980-073 –100 –120 0 Figure 18. Two-Tone 32k FFT with fIN1 = 140.2 MHz and fIN2 = 141.3 MHz, fSAMPLE = 210 MSPS 20 40 60 80 FREQUENCY (MHz) 100 120 06980-076 AMPLITUDE (dBFS) 80 Figure 19. Two-Tone 32k FFT with fIN1 = 170.2 MHz and fIN2 = 171.3 MHz, fSAMPLE = 2 10 MSPS 0 AMPLITUDE (dBFS) 60 40 FREQUENCY (MHz) 20 06980-074 10 Figure 21. Two-Tone 32k FFT with fIN1 = 170.2 MHz and fIN2 = 171.3 MHz, fSAMPLE = 250 MSPS Rev. E | Page 13 of 40 Data Sheet 95 70 90 69 85 68 67 80 SNR, 170MSPS SFDR (dB) 70 65 SNR, 210MSPS 66 65 64 SNR (dB) SNR, 250MSPS 63 60 55 62 50 61 45 0 50 100 150 200 250 300 350 AIN FREQUENCY (MHz) 400 450 500 60 –40 Figure 22. SNR/SFDR Amplitude vs. AIN Frequency, fSAMPLE = 170 MSPS 0 –20 60 20 40 TEMPERATURE (°C) 80 06980-080 SNR (dB) 75 06980-077 AMPLITUDE (dBFS) AD9239 Figure 25. SNR vs. Temperature, fIN = 84.3 MHz 90 95 90 85 85 SFDR, 250MSPS 80 SFDR (dB) 75 SFDR (dB) AMPLITUDE (dBFS) SFDR, 210MSPS 80 70 65 SNR (dB) 75 SFDR, 170MSPS 70 60 55 65 0 50 100 150 200 250 300 350 AIN FREQUENCY (MHz) 400 450 500 60 –40 06980-078 45 1.0 90 0.8 85 0.6 80 0.4 INL (LSB) 75 SFDR (dB) 70 65 0 20 40 TEMPERATURE (°C) 60 80 Figure 26. SFDR vs. Temperature, fIN = 84.3 MHz 95 0.2 0 –0.2 60 –0.4 55 –0.6 50 –0.8 45 0 50 100 150 200 250 300 350 AIN FREQUENCY (MHz) 400 450 500 –1.0 0 Figure 24. SNR/SFDR Amplitude vs. AIN Frequency, fSAMPLE = 250 MSPS Rev. E | Page 14 of 40 500 1000 1500 2000 2500 CODE 3000 3500 Figure 27. INL, fIN = 9.7 MHz, fSAMPLE = 250 MSPS 4000 06980-082 SNR (dB) 06980-079 AMPLITUDE (dBFS) Figure 23. SNR/SFDR Amplitude vs. AIN Frequency, fSAMPLE = 210 MSPS –20 06980-081 50 Data Sheet AD9239 0.5 40000 INPUT REFERRED NOISE: 0.71 LSB 0.4 35000 0.3 30000 NUMBER OF HITS DNL (LSB) 0.2 0.1 0 –0.1 25000 20000 15000 –0.2 10000 –0.3 0 500 1000 1500 2000 2500 CODE 3000 3500 4000 0 06980-083 –0.5 N–3 N–2 N–1 N N+1 Figure 28. DNL, fIN = 9.7 MHz, fSAMPLE = 250 MSPS N+3 MORE Figure 31. Input-Referred Noise Histogram, fSAMPLE = 250 MSPS 0 40000 INPUT REFERRED NOISE: 0.72 LSB 35000 NPR = 52dB NOTCH = 18.9MHz NOTCH WIDTH = 1MHz –20 30000 –40 AMPLITUDE (dBFS) NUMBER OF HITS N+2 BIN 06980-108 5000 –0.4 25000 20000 15000 –60 –80 –100 10000 N–3 N–2 N–1 N N+1 N+2 N+3 MORE BIN –140 06980-106 0 0 20 40 60 80 FREQUENCY (Hz) 100 120 06980-109 –120 5000 Figure 32. Noise Power Ratio (NPR), fSAMPLE = 250 MSPS Figure 29. Input-Referred Noise Histogram, fSAMPLE = 170 MSPS 40000 90 INPUT REFERRED NOISE: 0.70 LSB 85 35000 SFDR (dBc) 80 75 SNR/SFDR (dB) 25000 20000 15000 70 65 SNR (dB) 60 55 10000 50 5000 N–3 N–2 N–1 N N+1 N+2 N+3 MORE BIN Figure 30. Input-Referred Noise Histogram, fSAMPLE = 210 MSPS 40 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 ANALOG INPUT COMMON-MODE VOLTAGE (V) 1.8 Figure 33. SNR/SFDR vs. Analog Input Common-Mode Voltage, fIN = 84.3 MHz, fSAMPLE = 250 MSPS Rev. E | Page 15 of 40 06980-087 45 0 06980-107 NUMBER OF HITS 30000 AD9239 Data Sheet 0 –1 –3dB CUTOFF = 780MHz AMPLITUDE (dBFS) –2 –3 –4 –5 –6 –7 –8 10M 100M AIN FREQUENCY (Hz) 1G 10G 06980-088 –9 –10 1M Figure 34. Full-Power Bandwidth Amplitude vs. AIN Frequency, fSAMPLE = 250 MSPS Rev. E | Page 16 of 40 Data Sheet AD9239 EQUIVALENT CIRCUITS AVDD AVDD AVDD 1.2V 10kΩ CLK+ 10kΩ CLK– 250Ω SDI/SDIO 06980-009 06980-005 30kΩ Figure 35. CLK± Inputs Figure 39. Equivalent SDI/SDIO Input Circuit AVDD VIN + x AVDD BUF 2kΩ AVDD AVDD BUF ~1.4V 2kΩ TEMPOUT VIN – x 06980-006 06980-010 BUF Figure 40. Equivalent TEMPOUT Output Circuit Figure 36. Analog Inputs 100Ω 175Ω RBIAS 175Ω 30kΩ 06980-011 06980-007 SCLK, PDWN, PGMx, RESET Figure 37. Equivalent SCLK, PDWN, PGMx, RESET Input Circuit Figure 41. Equivalent RBIAS Input/Output Circuit AVDD VCMx 26kΩ 175Ω 1kΩ 06980-008 06980-012 CSB Figure 42. Equivalent VCMx Output Circuit Figure 38. Equivalent CSB Input Circuit Rev. E | Page 17 of 40 AD9239 Data Sheet AVDD SDO DRVDD RTERM VCM DOUT + x DOUT – x 345Ω 4mA 06980-089 4mA AVDD 4mA 06980-030 4mA Figure 44. Equivalent SDO Output Circuit Figure 43. Equivalent Digital Output Circuit Rev. E | Page 18 of 40 Data Sheet AD9239 THEORY OF OPERATION series with each input can help reduce the peak transient current injected from the output stage of the driving source. The AD9239 architecture consists of a differential input buffer, front-end sample-and-hold amplifier (SHA) followed by a pipelined switched capacitor ADC. The quantized outputs from each stage are combined into a final 12-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample, while the remaining stages operate on preceding samples. Sampling occurs on the rising edge of the clock. In addition, low-Q inductors or ferrite beads can be placed on each leg of the input to reduce high differential capacitance at the analog inputs and therefore achieve the maximum bandwidth of the ADC. Such use of low-Q inductors or ferrite beads is required when driving the converter front end at high intermediate frequency (IF). Either a shunt capacitor or two single-ended capacitors can be placed on the inputs to provide a matching passive network. This ultimately creates a low-pass filter at the input to limit unwanted broadband noise. See the AN-827 Application Note and the Analog Dialogue article “Transformer-Coupled Front-End for Wideband A/D Converters” (Volume 39, April 2005) for more information on this subject. In general, the precise values depend on the application. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor DAC and interstage residue amplifier (for example, a multiplying digital-to-analog converter (MDAC)). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. Maximum SNR performance is achieved by setting the ADC to the largest span in a differential configuration. In the case of the AD9239, the default input span is 1.25 V p-p. To configure the ADC for a different input span, see Register 18. For the best performance, an input span of 1.25 V p-p or greater should be used (see Table 16 for details). The input stage contains a differential SHA that can be ac- or dc-coupled in differential or single-ended mode. The output of the pipeline ADC is put into its final serial format by the data serializer, encoder, and CML drivers block. The data rate multiplier creates the clock used to output the high speed serial data at the CML outputs. Differential Input Configurations There are several ways to drive the AD9239 either actively or passively; in either case, optimum performance is achieved by driving the analog input differentially. For example, using the ADA4937 differential amplifier to drive the AD9239 provides excellent performance and a flexible interface to the ADC (see Figure 45 and Figure 46) for baseband and second Nyquist (~100 MHz IF) applications. In either application, 1% resistors should be used for good gain matching. It should also be noted that the dc-coupled configuration will show some degradation in spurious performance. For further reference, consult the ADA4937 data sheet. ANALOG INPUT CONSIDERATIONS The analog input to the AD9239 is a differential buffer. This input is optimized to provide superior wideband performance and requires that the analog inputs be driven differentially. SNR and SINAD performance degrades if the analog input is driven with a single-ended signal. For best dynamic performance, the source impedances driving VIN + x and VIN − x should be matched such that commonmode settling errors are symmetrical. These errors are reduced by the common-mode rejection of the ADC. A small resistor in 3.3V 1.8V 1.8V AVDD DRVDD 205Ω 200Ω 62Ω SIGNAL GENERATOR 10kΩ 10kΩ 0.1µF 1.65V VOCM 24Ω ADA4937 C R –VS 24Ω 27Ω VIN + x OPTIONAL C G = UNITY 200Ω 33Ω +VS 0.1µF 33Ω AD9239 ADC INPUT IMPEDANCE VIN – x 06980-090 1.25V p-p 0.1µF 205Ω Figure 45. Differential Amplifier Configuration for AC-Coupled Baseband Applications 3.3V 205Ω 62Ω 0.1µF 33Ω VIN + x 1.8V AVDD DRVDD +VS VOCM 200Ω ADA4937 G = UNITY AD9239 OPTIONAL C R –VS 24Ω 27Ω 33Ω VIN – x C ADC INPUT IMPEDANCE VCMx 205Ω 1.4V Figure 46. Differential Amplifier Configuration for DC-Coupled Baseband Applications Rev. E | Page 19 of 40 06980-091 SIGNAL GENERATOR 24Ω 200Ω 1.25V p-p 1.8V AD9239 Data Sheet For applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration (see Figure 47 to Figure 49), to achieve the true performance of the AD9239. 1.25V p-p BALUN 1:1 Z 66Ω 0.1µF 06980-013 ADT1-1WT 1:1 Z RATIO L 33Ω VIN + x 65Ω 06980-017 Single-Ended Input Configuration AGND VIN – x C Figure 47. Differential Transformer-Coupled Configuration for Baseband Applications 0.1μF 250Ω L 2.2pF 33Ω ADC AD9239 VIN – x 06980-014 0.1μF A single-ended input may provide adequate performance in cost-sensitive applications. In this configuration, SFDR and distortion performance can degrade due to input common-mode swing mismatch. If the application requires a single-ended input configuration, ensure that the source impedances on each input are well matched in order to achieve the best possible performance. A full-scale input of 1.25 V p-p can be applied to the ADC’s VIN + x pin while the VIN − x pin is terminated. Figure 51 details a typical single-ended input configuration. C Figure 48. Differential Transformer-Coupled Configuration for Wideband IF Applications 1.25V p-p 0.1μF ADT1-1WT 1:1 Z RATIO VIN – x Figure 50. Differential Balun-Coupled Configuration for Wideband IF Applications ADC AD9239 *CDIFF IS OPTIONAL L 33Ω ADC AD9239 BALUN 1:1 Z VIN + x 33Ω 1.25V p-p 4.7pF C *CDIFF 0.1μF VIN + x 33Ω 1.25V p-p 49.9Ω VIN + x 0.1µF *CDIFF 33Ω VIN + x L 33Ω 25Ω ADC AD9239 0.1µF VIN – x 0.1μF 06980-015 250Ω Figure 49. Differential Transformer-Coupled Configuration for Narrow-Band IF Applications Rev. E | Page 20 of 40 33Ω ADC AD9239 VIN – x C *CDIFF IS OPTIONAL Figure 51. Single-Ended Input Configuration 06980-016 50Ω 1.25V p-p 0.1µF 33Ω 33Ω 0.1µF Regardless of the configuration, the value of the shunt capacitor, C, is dependent on the input frequency and may need to be reduced or removed. ADT1-1WT 1:1 Z RATIO 0.1µF Data Sheet AD9239 0.1µF CLK+ Figure 52 shows a preferred method for clocking the AD9239. The low jitter clock source is converted from a single-ended signal to a differential signal using an RF transformer. The back-toback Schottky diodes across the secondary transformer limit clock excursions into the AD9239 to approximately 0.8 V p-p differential. This helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9239, and it preserves the fast rise and fall times of the signal, which are critical to low jitter performance. CLK+ Mini-Circuits® ADT1-1WT, 1:1Z 0.1µF 0.1µF XFMR 50Ω CLK 50Ω* CMOS DRIVER CLK Figure 55. Single-Ended 1.8 V CMOS Sample Clock 06980-018 0.1µF 100Ω PECL DRIVER CLK– 0.1µF ADC AD9239 240Ω 06980-019 240Ω 50Ω* *50Ω RESISTORS ARE OPTIONAL. Figure 53. Differential PECL Sample Clock AD9510/AD9511/ AD9512/AD9513/ AD9514/AD9515/ AD9516/AD9518 0.1µF CLK+ 0.1µF CLK+ CLK 0.1µF CLK– LVDS DRIVER 100Ω 0.1µF CLK ADC AD9239 CLK– 50Ω* *50Ω RESISTORS ARE OPTIONAL. 06980-020 50Ω* ADC AD9239 *50Ω RESISTOR IS OPTIONAL. CLK– CLK 50Ω* 0.1µF CLK+ CLK– CLK+ 0.1µF OPTIONAL 100Ω CLK 0.1µF CLK CMOS DRIVER 0.1µF Another option is to ac-couple a differential PECL signal to the sample clock input pins as shown in Figure 53. The AD9510/ AD9511/AD9512/AD9513/AD9514/AD9515/AD9516/AD9518 family of clock drivers offers excellent jitter performance. 0.1µF AD9510/AD9511/ AD9512/AD9513/ AD9514/AD9515/ AD9516/AD9518 CLK 50Ω* Figure 52. Transformer-Coupled Differential Clock CLK+ 39kΩ *50Ω RESISTOR IS OPTIONAL. CLK– AD9510/AD9511/ AD9512/AD9513/ AD9514/AD9515/ AD9516/AD9518 ADC AD9239 CLK– 0.1µF ADC AD9239 SCHOTTKY DIODES: HSM2812 CLK+ 0.1µF CLK+ CLK+ OPTIONAL 100Ω 0.1µF 0.1µF 0.1µF 0.1µF AD9510/AD9511/ AD9512/AD9513/ AD9514/AD9515/ AD9516/AD9518 06980-021 For optimum performance, the AD9239 sample clock inputs (CLK+ and CLK−) should be clocked with a differential signal. This signal is typically ac-coupled to the CLK+ and CLK− pins via a transformer or capacitors. These pins are biased internally to 1.2 V and require no additional biasing. CLK+ input circuit supply is AVDD (1.8 V), this input is designed to withstand input voltages of up to 3.3 V and therefore offers several selections for the drive logic voltage. Figure 54. Differential LVDS Sample Clock In some applications, it is acceptable to drive the sample clock inputs with a single-ended CMOS signal. In such applications, CLK+ should be driven directly from a CMOS gate, and the CLK− pin should be bypassed to ground with a 0.1 μF capacitor in parallel with a 39 kΩ resistor (see Figure 55). Although the 06980-022 CLOCK INPUT CONSIDERATIONS Figure 56. Single-Ended 3.3 V CMOS Sample Clock Clock Duty Cycle Considerations Typical high speed ADCs use both clock edges to generate a variety of internal timing signals. As a result, these ADCs may be sensitive to the clock duty cycle. Commonly, a 5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. The AD9239 contains a duty cycle stabilizer (DCS) that retimes the nonsampling edge, providing an internal clock signal with a nominal 50% duty cycle. This allows a wide range of clock input duty cycles without affecting the performance of the AD9239. When the DCS is on (default), noise and distortion performance are nearly flat for a wide range of duty cycles. However, some applications may require the DCS function to be off. If so, keep in mind that the dynamic range performance may be affected when operated in this mode. See the Memory Map section for more details on using this feature. Jitter in the rising edge of the input is an important concern, and it is not reduced by the internal stabilization circuit. The duty cycle control loop does not function for clock rates of less than 50 MHz nominal. It is not recommended that this ADC clock be dynamic in nature. Moving the clock around dynamically requires long wait times for the back end serial capture to retime and resynchronize to the receiving logic. This long time constant far exceeds the time it takes for the DCS and PLL to lock and stabilize. Only in rare applications would it be necessary to disable the DCS circuitry of Register 9 (see Table 16). Keeping the DCS circuit enabled is recommended to maximize ac performance. Rev. E | Page 21 of 40 AD9239 Data Sheet Clock Jitter Considerations 2.0 High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (fA) due only to aperture jitter (tJ) can be calculated by 1.8 Refer to the AN-501 Application Note, the AN-756 Application Note, and the Analog Dialogue article “Analog-to-Digital Converter Clock Optimization: A Test Engineering Perspective” (Volume 42, Number 2, February 2008) for more in-depth information about jitter performance as it relates to ADCs (visit www.analog.com). POWER 1.0 0.4 0.8 0.3 0.6 0.2 0.4 IDRVDD 0 50 90 70 110 130 ENCODE (MSPS) 0 170 150 Figure 58. Supply Current vs. Encode for fIN = 84.3 MHz, fSAMPLE = 170 MSPS 2.0 0.8 1.8 0.7 1.6 IAVDD 0.6 1.4 0.5 1.2 POWER 1.0 0.4 0.8 0.3 0.6 0.2 RMS CLOCK JITTER REQUIREMENT 0.4 IDRVDD 0.1 0.2 110 100 16 BITS 90 14 BITS 0 50 90 70 110 130 150 ENCODE (MSPS) 170 190 0 210 Figure 59. Supply Current vs. Encode for fIN = 84.3 MHz, fSAMPLE = 210 MSPS 12 BITS 2.0 0.8 70 1.8 10 BITS IAVDD 60 0.125 ps 0.25 ps 0.5 ps 1.0 ps 2.0 ps 0.6 1.4 30 1 10 100 ANALOG INPUT FREQUENCY (MHz) 1000 Figure 57. Ideal SNR vs. Input Frequency and Jitter POWER (W) 40 06980-024 50 0.7 1.6 0.5 POWER 1.2 1.0 0.4 0.8 0.3 CURRENT (mA) SNR (dB) 0.1 06980-056 0.2 120 80 CURRENT (mA) 0.5 1.2 06980-057 130 IAVDD CURRENT (mA) The clock input should be treated as an analog signal in cases where aperture jitter may affect the dynamic range of the AD9239. Power supplies for clock drivers should be separated from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal-controlled oscillators are the best clock sources. If the clock is generated from another type of source (by gating, dividing, or another method), it should be retimed by the original clock during the last step. 0.6 1.4 POWER (W) In this equation, the rms aperture jitter represents the root mean square of all jitter sources, including the clock input, analog input signal, and ADC aperture jitter. IF undersampling applications are particularly sensitive to jitter (see Figure 57). 0.7 1.6 POWER (W) SNR Degradation = 20 × log 10(1/2 × π × fA × tJ) 0.8 0.6 Power Dissipation 0.2 0.4 0.1 0.2 0 50 70 90 110 130 150 170 ENCODE (MSPS) 190 210 230 0 250 06980-058 As shown in Figure 58 to Figure 60, the power dissipated by the AD9239 is proportional to its clock rate. The digital power dissipation does not vary significantly because it is determined primarily by the DRVDD supply and bias current of the digital output drivers. IDRVDD Figure 60. Supply Current vs. Encode for fIN = 84.3 MHz, fSAMPLE = 250 MSPS Rev. E | Page 22 of 40 Data Sheet AD9239 Digital Start-Up Sequence Digital Outputs and Timing The output digital data from the AD9239 is coded and packetized, which requires the device to have a certain start-up sequence. A specific set of procedures must be initialized by the user to capture coherent data at the receiving logic and optionally minimize skew and time misalignment. The AD9239 has differential digital outputs that power up on default. The driver current is derived on chip and sets the output current at each output equal to a nominal 4 mA. Each output presents a 100 Ω dynamic internal termination to reduce unwanted reflections. Minimize Skew and Time Misalignment (Optional) A 100 Ω differential termination resistor should be placed at each receiver input to result in a nominal 400 mV p-p swing at the receiver. Alternatively, single-ended 50 Ω termination can be used. When single-ended termination is used, the termination voltage should be DRVDD/2; otherwise, ac coupling capacitors can be used to terminate to any single-ended voltage. 1. 2. 3. Power down the device fully through the external PDWN pin. Perform a chip reset via the external RESET pin. Power up the device by releasing the external PDWN pin. Link Initialization (Required) 1. 2. 3. 4. 5. Initialize a soft reset via Bit 5 of Register 0 (see Table 16). All PGMx pins are automatically initialized as sync pins by default. Use these pins to lock the FPGA timing and data capture during initial startup. These pins are respective to each channel (PGM3 = Channel A). Each sync pin is held low until its respective PGMx pin receives a high signal input from the receiver, during which time the ADC outputs a training pattern. The training pattern values are shown in Table 9. These values can also be read back via the SPI in Register 19 through Register 20. When the receiver finds the frame boundary, the sync identification is deasserted high via the sync pin or via an SPI write. The ADC outputs the valid data on the next packet boundary. The time necessary for sync establishment is highly dependent on the receiver logic processing. Refer to the Switching Specifications section; the switching timing is directly related to the ADC channel. When the device reaches steady state operation, the PGMx pins can each be assigned to be a standby option by using Register 53 (see Table 16). All other pins act as universal sync pins. The AD9239 digital outputs can interface with custom applicationspecific integrated circuits (ASICs) and field-programmable gate array (FPGA) receivers, providing superior switching performance in noisy environments. Single point-to-point net topologies are recommended with a single differential 100 Ω termination resistor placed as close to the receiver logic as possible. The common mode of the digital output automatically biases itself to half the supply of DRVDD if dc-coupled connecting is used. For receiver logic that is not within the bounds of the DRVDD supply, an ac-coupled connection should be used. Simply place a 0.1 μF capacitor on each output pin and derive a 100 Ω differential termination close to the receiver side. If there is no far-end receiver termination or there is poor differential trace routing, timing errors may result. To avoid such timing errors, it is recommended that the trace length be less than 6 inches and that the differential output traces be close together and at equal lengths. 100Ω DIFFERENTIAL TRACE PAIR DRVDD DOUT + x RECEIVER 100Ω DOUT – x VCM = DRVDD/2 OUTPUT SWING = 400mV p-p 06980-092 To minimize skew and time misalignment between each channel of the digital outputs, take the following actions to ensure that each channel data packet is within ±1 clock cycle of its specified switching time. For some receiver logic, this is not required. Figure 61. DC-Coupled Digital Output Termination Example VRXCM Table 9. Training Pattern for Link Initialization Pattern LSB 0xA5 0x53 0xBB 0xAA Pattern MSB 0x66 0x35 0xDD 0xCC DRVDD 100Ω DIFFERENTIAL 0.1µF TRACE PAIR DOUT + x 100Ω DOUT – x OR RECEIVER 0.1µF OUTPUT SWING = 400mV p-p VCM = Rx VCM Figure 62. AC-Coupled Digital Output Termination Example Rev. E | Page 23 of 40 06980-093 Training Pattern 1 2 3 4 AD9239 Data Sheet HEIGHT1: EYE DIAGRAM 600 TIE1: HISTOGRAM (y1) –375.023m (y2) +409.847m (Δy) +784.671m 1 600 1 + TJ@BERI: BATHTUB 2 3 + + 0.01 500 400 –200 200 –400 –600 1E–6 300 1E–10 100 1E–12 EYE: ALL BITS OFFSET: 0.015 ULS: 5000: 40044, TOTAL: 12000: 80091 –200 –100 100 0 TIME (ps) 0 200 1E–8 10 –10 TIME (ps) –30 1E–14 –0.5 30 0 ULS 06980-094 0 BER HITS VOLTAGE (mV) 0.0001 400 200 0.5 Figure 63. Digital Outputs Data Eye with Trace Lengths Less than 6 Inches on Standard FR-4, External 100 Ω Terminations at Receiver TIE1: HISTOGRAM HEIGHT1: EYE DIAGRAM 600 (y1) –402.016m (y2) +398.373m (Δy) +800.389m 300 1 1 2 + + 3 + 0.01 250 400 TJ@BERI: BATHTUB 0 –200 1E–6 BER HITS VOLTAGE (mV) 0.0001 200 200 150 1E–8 100 1E–10 –600 50 1E–12 EYE: ALL BITS OFFSET: 0.015 ULS: 5000: 40044, TOTAL 8000: 40044 –200 –100 0 100 TIME (ps) 200 0 –50 0 TIME (ps) 50 1E–14 –0.5 0 ULS 0.5 06980-095 –400 Figure 64. Digital Outputs Data Eye with Trace Lengths Greater than 12 Inches on Standard FR-4, External 100 Ω Terminations at Receiver An example of the digital output (default) data eye and a time interval error (TIE) jitter histogram with trace lengths less than 6 inches on standard FR-4 material is shown in Figure 63. Figure 64 shows an example of trace lengths exceeding 12 inches on standard FR-4 material. Notice that the TIE jitter histogram reflects the decrease of the data eye opening as the edge deviates from the ideal position. It is the user’s responsibility to determine if the waveforms meet the timing budget of the design when the trace lengths exceed 6 inches. Additional SPI options allow the user to further increase the output driver voltage swing of all four outputs in order to drive longer trace lengths (see Register 15 in Table 16). Even though this produces sharper rise and fall times on the data edges and is less prone to bit errors, the power dissipation of the DRVDD supply increases when this option is used. See the Memory Map section for more details. The format of the output data is offset binary by default. An example of the output coding format can be found in Table 10. To change the output data format to twos complement or gray code, see the Memory Map section. Table 10. Digital Output Coding Code 4095 2048 2047 0 (VIN + x) − (VIN − x), Input Span = 1.25 V p-p (V) +0.625 0.00 −0.000305 −0.625 Digital Output Offset Binary (D11 ... D0) 1111 1111 1111 1000 0000 0000 0111 1111 1111 0000 0000 0000 Data from each ADC is serialized and provided on a separate channel. The data rate for each serial stream is equal to N bits times the sample clock rate, in addition to some amount of overhead to account for the 8-bit header and error correction, for a maximum of 3.36 Gbps (that is, 12 bits × 210 MSPS × 64/48 = 3.36 Gbps). The lowest typical clock rate is 100 MSPS. For clock rates slower than 100 MSPS, refer to Register 21 in the SPI Memory Map. This option allows the user to adjust the PLL loop bandwidth in order to use clock rates as low as 50 MSPS. Rev. E | Page 24 of 40 Data Sheet AD9239 Table 11. Flexible Output Test Modes Output Test Mode Bit Sequence 0000 0001 0010 Pattern Name Off (default) Midscale short +Full-scale short Digital Output Word 1 N/A 1000 0000 0000 1111 1111 1111 Digital Output Word 2 N/A Same Same Subject to Data Format Select Yes Yes Yes 0011 0100 0101 0110 0111 −Full-scale short Checkerboard PN sequence long 1 PN sequence short1 One-/zero-word toggle 0000 0000 0000 1010 1010 1010 N/A N/A 1111 1111 1111 Same 0101 0101 0101 N/A N/A 0000 0000 0000 Yes No Yes Yes No 1 All test mode options except PN sequence short and PN sequence long can support 8- to 14-bit word lengths in order to verify data capture to the receiver. Register 14 allows the user to invert the digital outputs from their nominal state. This is not to be confused with inverting the serial stream to an LSB-first mode. In default mode, as shown in Figure 2, the MSB is first in the data output serial stream. However, this can be inverted so that the LSB is first in the data output serial stream. There are eight digital output test pattern options available that can be initiated through the SPI. This feature is useful when validating receiver capture and timing. Refer to Table 11 for the output bit sequencing options available. Some test patterns have two serial sequential words and can be alternated in various ways, depending on the test pattern chosen. It should be noted that some patterns do not adhere to the data format select option. The PN sequence short pattern produces a pseudorandom bit sequence that repeats itself every 29 − 1 or 511 bits. A description of the PN sequence and how it is generated can be found in Section 5.1 of the ITU-T 0.150 (05/96) standard. The only difference is that the starting value must be a specific value instead of all 1s (see Table 12 for the initial values). The PN sequence long pattern produces a pseudorandom bit sequence that repeats itself every 223 − 1 or 8,388,607 bits. A description of the PN sequence and how it is generated can be found in Section 5.6 of the ITU-T 0.150 (05/96) standard. The only differences are that the starting value must be a specific value instead of all 1s (see Table 12 for the initial values) and the AD9239 inverts the bit stream with relation to the ITU standard. Digital Output Scrambler and Error Code Correction The data from the AD9239 is sent serially in packets of 64 bits. These numbers are derived from the necessity to have the output data streaming at 16× the encode clock. The data packets consist of a header, data, and error correction code (that is, 8 Bits of Header + 48 Bits of Data (4 Conv.) + 8 Bits of ECC = 64 Bits). The 12-bit protocol is shown in Figure 2 and Table 5. Error Correction Code The error correction code (ECC) is a Hamming code due to the ease of implementation. Seven bits are used for the ECC to correct one error or detect one or two errors during transmission. The MSB of the ECC is always 0 and is not used to detect an error. The six LSBs of the ECC are the result of the XORs of the given bits (see Figure 68 to Figure 75). These bits allow for a parity check for any bit in the header and data field. The seventh parity bit is applied to the entire packet after the Hamming parity bits are calculated. This parity check allows correction of an error in the data or in the ECC bits. In the general implementation, the parity bits are located in the power of 2 positions, but are pulled from these locations and placed together at the end of the packet. Figure 68 to Figure 75 show which header and data bits are associated with the parity bits. In the receiver, these parity checks are performed and the receiver parity bits are calculated. The difference between the received parity bits and the calculated parity bits indicate which bit was in error. Table 12. PN Sequence Sequence PN Sequence Short PN Sequence Long Initial Value 0x0df 0x29b80a First Three Output Samples (MSB First) 0xdf9, 0x353, 0x301 0x591, 0xfd7, 0x0a3 Consult the Memory Map section for information on how to change these additional digital output timing features through the SPI. Rev. E | Page 25 of 40 AD9239 Data Sheet Scramblers is balanced based on an overranged condition. If each packet is balanced, the bit stream should be balanced. Instead of a random sequence that changes from packet to packet, certain inverts are set at predetermined bit positions within the packet. This allows the decoding to be done in the receiver end. Figure 67 shows the inverters in the packet for the 12-bit data case and the inverter order in the header. There are three scramblers on the AD9239. The scramblers are an Ethernet scrambler (x58 + x39 + 1), a SONET scrambler (x7 + x6 + 1), and a static inverter scrambler (inverts bits at set locations in the packet). The scramblers are used to help balance the number of 1s and 0s in the packet. The Ethernet and SONET scramblers work on scrambling the whole packet (64 bits), the header and the data (56 bits), or just the data (48 bits). The scrambler is self-synchronizing on the descramble end or receive end and does not require an additional sync bit. For a copy of either the Ethernet or SONET scrambler code, send an email to highspeed.converters@analog.com. Figure 65 and Figure 66 show the serial implementation of the Ethernet and SONET scramblers. The parallel implementation allows the scrambler and descrambler to run at a slower clock rate and can be implemented in the fabric of a receiver. The serial implementations of the Ethernet and SONET scramblers more easily show what is being done. The parallel implementation must be derived from the serial implementation. The end product depends on how many bits need to be processed in parallel. For the scrambler, 64 bits are processed even in the 56- and 48-bit cases. To achieve this for 56 bits and 48 bits, a portion of two samples is used to fill the rest of the input word. Inverter Balance Example The inverter implementation uses predetermined bit positions to balance the packet in an overrange condition (all 1s or all 0s) in the converter. The inversions are present in all conditions, not just the overrange condition. Table 13 shows the average value of the packet for various conditions. Table 13. Average of 1s and 0s in Overrange Conditions Assuming Header Bits are All 0 No Scramble (Data = 0) No Scramble (Data = 1) Average of Negative and Positive Overrange Scramble Only Data (Data = 0) Scramble Only Data (Data = 1) Average of Negative and Positive Overrange Scramble Data and Header (Data = 0) Scramble Data and Header (Data = 1) Average of Negative and Positive Overrange 12-Bit 0 0.844 0.422 ECC 00000000 00111111 0.375 0.469 0.422 00000000 00111111 0.437 0.531 0.484 00000000 00111111 If the analog signal is out of range, there should be about the same number of out-of-range positive and out-of-range negative values. The average for no scrambling and for scrambling just the data is about the same. If the header is used to indicate out of range, the balance improves for the 12-bit case. The descrambler can be based off any number of bits the user chooses to process. In the inverter-based scrambler, the packet Rev. E | Page 26 of 40 Data Sheet AD9239 POLYNOMIAL = 1 + x39 + x58 D58 S57 S56 S19 S18 S1 S0 S57 S56 S19 S18 S1 S0 S58 06980-025 S58 D58 Figure 65. Serial Implementation of Ethernet Scrambler POLYNOMIAL = 1 + x6 + x7 D7 S6 S5 S4 S3 S2 S1 S0 S6 S5 S4 S3 S2 S1 S0 S7 06980-026 S7 D7 Figure 66. Serial Implementation of SONET Scrambler h7 h6 h5 h4 h1 h0 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D4 D4 D4 D4 D4 D4 D4 D4 D4 D4 0 p7 p6 p5 p1 D4 h2 p4 p3 p2 06980-105 D4 h3 = INVERTED BIT Figure 67. Scrambler Inverters for 64-Bit Packet: 12-Bit Case Rev. E | Page 27 of 40 AD9239 Data Sheet Calculating the Parity Bits for the Hamming Code is just the inversion. A separate document will show the proper way to correct an error in the transmission. The Hamming bits are defined as follows. The definition is shown in the charts for a 12-bit example. The Hamming parity bits are shown interleaved in the data. This makes it easier to see the numeric relationship. The decoding on the receive side h7 h6 h5 h4 h1 h0 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D4 D4 D4 D4 D4 D4 D4 D4 D4 D4 0 p7 p6 p5 D4 D4 h3 h2 p4 p3 p2 p1 06980-096 The p8 bit (MSB of the parity bits) will always be 0. The p7 bit is a parity bit for the entire packet after the other parity bits are calculated. h1 h0 D1 D1 D1 D1 D1 D1 D1 D2 D2 D2 D1 D2 D2 D2 D2 D2 D2 D2 D2 D3 D3 D3 D3 D3 D3 D3 D4 D4 D3 D4 D4 p4 D4 D4 D4 p3 h7 h6 h5 D1 D1 D1 D1 p6 D3 D3 D3 D2 D3 p5 D4 D4 D4 D4 D4 h4 h3 p7 h2 0 p2 p1 06980-097 Figure 68. 64-Bit Packet: 12-Bit Case h7 h5 h3 h1 D1 D1 D1 D1 D1 D1 D2 D2 D2 D2 D2 D2 D2 D3 D3 D3 D3 D3 D3 D4 D4 D4 D4 D4 D4 D4 0 p1 p1 = h7^h5^h3^h1^d1^d1^d1^d1^d1^d1^d2^d2^d2^d2^d2^d2^d2 ^d3^d3^d3^d3^d3^d3^d4^d4^d4^d4^d4^d4^d4^0 06980-098 Figure 69. 64-Bit Packet Hamming Template for 12-Bit Case Figure 70. p1 Bit for 64-Bit Packet: 12-Bit Case D1 D1 D1 D1 D2 D2 D2 D2 D2 D2 D2 D3 D3 D3 D3 D3 D3 D4 D4 D4 D4 D4 D4 h6 D1 D1 D4 h3 h2 0 p2 p2 = h7^h6^h3^h2^d1^d1^d1^d1^d1^d1^d2^d2^d2^d2^d2^d2^ d2^d3^d3^d3^d3^d3^d3^d4^d4^d4^d4^d4^d4^d4^0 Figure 71. p2 Bit for 64-Bit Packet: 12-Bit Case Rev. E | Page 28 of 40 06980-099 h7 AD9239 D1 D1 D1 D1 D1 D2 D2 D2 D2 D2 D3 D3 D3 D3 D3 D3 D3 D4 D4 D4 D4 p3 h7 h6 h5 h4 D1 D1 D1 D4 D4 D4 p3 = h7^h6^h5^h4^d1^d1^d1^d1^d1^d1^d1^d1^d2^d2^d2^d2^d2^ d3^d3^d3^d3^d3^d3^d3^d4^d4^d4^d4^d4^d4^d4 06980-100 Data Sheet h7 h6 h5 D1 D1 D1 h1 h0 D2 D2 D1 D2 D2 h4 h3 h2 D3 D3 D3 D2 D3 D3 D3 D3 D4 D4 D4 D4 p4 D4 D4 D4 p4 = h7^h6^h5^h4^h3^h2^h1^h0^d1^d1^d1^d1^d2^d2^d2^d2^d2^d3^ d3^d3^d3^d3^d3^d3^d4^d4^d4^d4^d4^d4^d4 06980-101 Figure 72. p3 Bit for 64-Bit Packet: 12-Bit Case Figure 73. p4 Bit for 64-Bit Packet: 12-Bit Case h4 h3 h2 h1 h0 D1 D1 D1 D1 D1 D2 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D4 D4 h7 h6 h5 D1 D1 D1 D3 D3 06980-102 p5 p5 = h7^h6^h5^h4^h3^h2^h1^h0^d1^d1^d1^d1^d1^d1^d1^d1^d2^d3^ d3^d3^d3^d3^d3^d3^d3^d3^d3^d3^d3^d4^d4 Figure 74. p5 Bit for 64-Bit Packet: 12-Bit Case D1 h7 h6 h5 D1 D1 D1 h1 h0 D1 D1 D1 D1 D1 D1 D1 D1 D2 D2 D2 D2 D2 D2 D2 D2 D2 h4 h3 h2 D2 D2 p6 = h7^h6^h5^h4^h3^h2^h1^h0^d1^d1^d1^d1^d1^d1^d1^d1^d1^d1^d1^ d1^d2^d2^d2^d2^d2^d2^d2^d2^d2^d2^d2 Figure 75. p6 Bit for 64-Bit Packet: 12-Bit Case Rev. E | Page 29 of 40 06980-103 p6 AD9239 Data Sheet TEMPOUT Pin The TEMPOUT pin can be used as a course temperature sensor to monitor the internal die temperature of the device. This pin typical has a 734 mV output with a clock rate of 250 MSPS and a negative temperature going coefficient of −1.12 mV/C. The voltage response of this pin is characterized in Figure 76. SDO Pin 0.79 The SDO pin is for use in applications that require a 4-wire SPI mode operation. For normal operation, it should be tied low to AGND through a 10 kΩ resistor. Alternatively, the device pin can be left open, and the 345 Ω internal pull-down resistor pulls this pin low. This pin adheres to only 1.8 V logic. 0.77 SDI/SDIO Pin 0.85 0.83 TEMPOUT PIN VOLTAGE (V) the power-down feature is enabled, the chip continues to function after PDWN is pulled low without requiring a reset. The AD9239 returns to normal operating mode when the PDWN pin is pulled low. This pin is only 1.8 V tolerant. 0.81 The SDI/SDIO pin is for use in applications that require either a 4- or 3-wire SPI mode operation. For normal operation, it should be tied low to AGND through a 10 kΩ resistor. Alternatively, the device pin can be left open, and the 30 kΩ internal pulldown resistor pulls this pin low. This pin is only 1.8 V tolerant. 0.75 0.73 0.71 0.69 0.67 SCLK Pin 0 10 20 30 40 TEMPERATURE (°C) 50 60 70 80 06980-055 0.65 –40 –30 –20 –10 For normal operation, the SCLK pin should be tied to AGND through a 10 kΩ resistor. Alternatively, the device pin can be left open, and the 30 kΩ internal pull-down resistor pulls this pin low. This pin is only 1.8 V tolerant. Figure 76. TEMPOUT Pin Voltage vs. Temperature RBIAS Pin To set the internal core bias current of the ADC, place a resistor (nominally equal to 10.0 kΩ) between ground and the RBIAS pin. The resistor current is derived on chip and sets the AVDD current of the ADC to a nominal 725 mA at 250 MSPS. Therefore, it is imperative that a 1% or less tolerance on this resistor be used to achieve consistent performance. VCMx Pins The common-mode output pins can be enabled through the SPI to provide an external reference bias voltage of 1.4 V for driving the VIN + x/VIN − x analog inputs. These pins may be required when connecting external devices, such as an amplifier or transformer, to interface to the analog inputs. RESET Pin The RESET pin sets all SPI registers to their default values and the datapath. Using this pin requires the user to resync the digital outputs. This pin is only 1.8 V tolerant. PDWN Pin When asserted high, the PDWN pin turns off all the ADC channels, including the output drivers. This function can be changed to a standby function. See Register 8 in Table 16. Using this feature allows the user to put all channels into standby mode. The output drivers transmit pseudorandom data until the outputs are disabled using Register 14. By asserting the PDWN pin high, the AD9239 is placed into power-down mode, shutting down the reference, reference buffer, PLL, and biasing networks. In this state, the ADC typically dissipates 3 mW. If any of the SPI features are changed before CSB Pin For normal operation, the CSB pin should be tied high to AVDD through a 10 kΩ resistor. Alternatively, the device pin can be left open, and the 26 kΩ internal pull-up resistor pulls this pin high. By tying the CSB pin to AVDD, all SCLK and SDI/SDIO information is ignored. In comparison, by tying the CSB pin low, all information on the SDO and SDI/SDIO pins are written to the device. This feature allows the user to reduce the number of traces to the device if necessary. This pin is only 1.8 V tolerant. PGMx Pins All PGMx pins are automatically initialized as a sync pin by default. These pins are used to lock the FPGA timing and data capture during initial startup. These pins are respective to each channel (PGM3 = Channel A). The sync pin should be pulled low until this pin receives a high signal input from the receiver, during which time the ADC outputs a training word. The training word defaults to the values implemented by the user in Register 19 through Register 20. When the receiver finds the frame boundary, the sync identification is deasserted high and the ADC outputs the valid data on the next packet boundary. Once steady state operation for the device has occurred, these pins can be assigned as a standby option using Register 53 in Table 16. All other pins change to a global sync pin. This pin is only 1.8 V tolerant. Rev. E | Page 30 of 40 Data Sheet AD9239 SERIAL PORT INTERFACE (SPI) The AD9239 serial port interface allows the user to configure the converter for specific functions or operations through a structured register space provided in the ADC. This may provide the user with additional flexibility and customization, depending on the application. Addresses are accessed via the serial port and can be written to or read from via the port. Memory is organized into bytes that can be further divided into fields, as documented in the Memory Map section. Detailed operational information can be found in the Analog Devices, Inc., AN-877 Application Note, Interfacing to High Speed ADCs via SPI. Four pins define the SPI: SCLK, SDI/SDIO, SDO, and CSB (see Table 14). The SCLK pin is used to synchronize the read and write data presented to the ADC. The SDI/SDIO pin is a dualpurpose pin that allows data to be sent to and read from the internal ADC memory map registers. The CSB pin is an active low control that enables or disables the read and write cycles. Table 14. Serial Port Pins Pin SCLK SDI/SDIO SDO CSB Function Serial Clock. The serial shift clock input. SCLK is used to synchronize serial interface reads and writes. Serial Data Input/Output. A dual-purpose pin that typically serves as an input or output, depending on the SPI wire mode and instruction sent and the relative position in the timing frame. Serial Data Output is used only in 4-wire SPI mode. When set, the SDO pin becomes active. When cleared, the SDO pin remains in tristate, and all read data is routed to the SDI/SDIO pin. Chip Select Bar (Active Low). This control gates the read and write cycles. The falling edge of the CSB in conjunction with the rising edge of the SCLK determines the start of the framing sequence. During an instruction phase, a 16-bit instruction is transmitted, followed by one or more data bytes, which is determined by Bit Field W0 and Bit Field W1. An example of the serial timing and its definitions can be found in Figure 78 and Table 15. During normal operation, CSB is used to signal to the device that SPI commands are to be received and processed. When CSB is brought low, the device processes SCLK and SDI/SDIO to execute instructions. Normally, CSB remains low until the communication cycle is complete. However, if connected to a slow device, CSB can be brought high between bytes, allowing older microcontrollers enough time to transfer data into shift registers. CSB can be stalled when transferring one, two, or three bytes of data. When W0 and W1 are set to 11, the device enters streaming mode and continues to process data, either reading or writing, until CSB is taken high to end the communication cycle. This allows complete memory transfers without requiring additional instructions. Regardless of the mode, if CSB is taken high in the middle of a byte transfer, the SPI state machine is reset and the device waits for a new instruction. In addition to the operation modes, the SPI port configuration influences how the AD9239 operates. For applications that do not require a control port, the CSB line can be tied and held high. This places the SDI/SDIO pin into its secondary mode, as defined in the SDI/SDIO Pin section. CSB can also be tied low to enable 2-wire mode. When CSB is tied low, SCLK and SDI/SDIO are the only pins required for communication. Although the device is synchronized during power-up, the user should ensure that the serial port remains synchronized with the CSB line when using this mode. When operating in 2-wire mode, it is recommended to use a 1-, 2-, or 3-byte transfer exclusively. Without an active CSB line, streaming mode can be entered but not exited. In addition to word length, the instruction phase determines if the serial frame is a read or write operation, allowing the serial port to be used to both program the chip and read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the SDI/SDIO pin to change from an input to an output at the appropriate point in the serial frame. Data can be sent in MSB- or LSB-first mode. MSB-first mode is the default at power-up and can be changed by adjusting the configuration register. For more information about this and other features, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. HARDWARE INTERFACE The pins described in Table 14 constitute the physical interface between the user’s programming device and the serial port of the AD9239. The SDO, SCLK and CSB pins function as inputs when using the SPI. The SDI/SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. If multiple SDI/SDIO pins share a common connection, care should be taken to ensure that proper VOH levels are met. Assuming the same load for each AD9239, Figure 77 shows the number of SDI/SDIO pins that can be connected together and the resulting VOH level. This interface is flexible enough to be controlled by either serial PROMS or PIC mirocontrollers, providing the user with an alternative method, other than a full SPI controller, to program the ADC (see the AN-812 Application Note). For users who wish to operate the ADC without using the SPI, remove any connections from the CSB, SCLK, SDO, and SDI/SDIO pins. By disconnecting these pins from the control bus, the ADC can function in its most basic operation. Each of these pins has an internal termination that floats to its respective level. Rev. E | Page 31 of 40 1.800 1.795 1.790 1.785 1.780 1.775 1.770 1.765 1.760 1.755 1.750 1.745 1.740 1.735 1.730 1.725 1.720 1.715 0 10 20 30 40 50 60 70 80 90 100 NUMBER OF SDI/SDIO PINS CONNECTED TOGETHER 06980-104 Data Sheet VOH (V) AD9239 Figure 77. SDI/SDIO Pin Loading tDS tS tHI tCLK tDH tH tLO CSB DON’T CARE SDIO DON’T CARE DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0 DON’T CARE Figure 78. Serial Timing Details Table 15. Serial Timing Definitions Parameter tDS tDH tCLK tS tH tHI tLO tEN_SDI/SDIO Timing (Minimum, ns) 5 2 40 5 2 16 16 10 tDIS_SDI/SDIO 10 Description Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the clock Setup time between CSB and SCLK Hold time between CSB and SCLK Minimum period that SCLK should be in a logic high state Minimum period that SCLK should be in a logic low state Minimum time for the SDI/SDIO pin to switch from an input to an output relative to the SCLK falling edge (not shown in Figure 78) Minimum time for the SDI/SDIO pin to switch from an output to an input relative to the SCLK rising edge (not shown in Figure 78) Rev. E | Page 32 of 40 06980-028 SCLK Data Sheet AD9239 MEMORY MAP READING THE MEMORY MAP TABLE RESERVED LOCATIONS Each row in the memory map register table (Table 16) has eight bit locations. The memory map is divided into three sections: the chip configuration registers (Address 0x00 to Address 0x02), the device index and transfer registers (Address 0x05 and Address 0xFF), and the ADC functions registers (Address 0x08 to Address 0x53). Undefined memory locations should not be written to except when writing the default values suggested in this data sheet. Addresses that have values marked as 0 should be considered reserved and have a 0 written into their registers during power-up. The leftmost column of the memory map indicates the register address number, and the default value is shown in the second rightmost column. The Bit 7 column is the start of the default hexadecimal value given. For example, Address 0x09, the clock register, has a default value of 0x01, meaning that Bit 7 = 0, Bit 6 = 0, Bit 5 = 0, Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or 0000 0001 in binary. This setting is the default for the duty cycle stabilizer in the on condition. By writing a 0 to Bit 0 of this address, followed by a 0x01 in Register 0xFF (transfer bit), the duty cycle stabilizer turns off. It is important to follow each writing sequence with a transfer bit to update the SPI registers. For more information on this and other functions, consult the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. DEFAULT VALUES When the AD9239 comes out of a reset, critical registers are preloaded with default values. These values are indicated in Table 16, where an X refers to an undefined feature. LOGIC LEVELS An explanation of various registers follows: “bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” Similarly, “clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Rev. E | Page 33 of 40 AD9239 Data Sheet Table 16. Memory Map Register Addr. Register (MSB) (Hex) Name Bit 7 Chip Configuration Registers SDO active chip_port_ 00 (not config (local, required, master) ignored if not used) chip_id 01 (global) chip_grade 02 (global) Bit 6 Bit 5 LSB first Soft reset Bit 4 ADC A device_ update (local, master) ADC Functions Registers modes 08 (local) 09 Clock (global) 0D test_io (local) 0E test_bist (local) Bit 2 Bit 1 16 bit address (default mode for ADCs) 8-bit Chip ID Bits[2:0] 0x0B – AD9239 – 12-bit quad Speed grade 010 = 170 100 = 210 101 = 250 Device Index and Transfer Registers device_ 05 index_A (global) FF Bit 3 (LSB) Bit 0 External PDWN pin function 00 = full PDWN (default) 01 = standby Reset PN long gen 1 = on 0 = off (default) Reset PN short gen 1 = on 0 = off (default) Rev. E | Page 34 of 40 Default Value (Hex) Default Notes/ Comments 0x18 Read only Read only ADC B ADC C Bits are set to determine which device on chip receives the next write command. The default is all devices on chip. Synchronously transfers data from the master shift register to the slave. ADC D 0x0F SW transfer 1 = on 0 = off (default) 0x00 00 = chip run (default) 01 = full power-down 10 = standby 11 = reserved 0x00 Determines various generic modes of chip operation. Duty cycle stabilize 1 = on (default) 0 = off 0x01 Turns the internal duty cycle stabilizer on and off. Flex output test mode 0000 = off (normal operation) 0001 = midscale short 0010 = +FS short 0011 = −FS short 0100 = checkerboard output 0101 = PN 23 sequence 0110 = PN 9 sequence 0111 = one/zero word toggle BIST init BIST 1 = on enable 0 = off 1 = on (default) 0 = off (default) 0x00 When set, the test data is placed on the output pins in place of normal data. 0x00 When Bit 0 is set, the built-in selftest function is initiated. Data Sheet Addr. (Hex) 0F Register Name adc_input (local) 10 offset (local) 14 output_mode (local/global) 15 output_adjust (global) 18 vref (global) 19 Training Pattern 1 LSB Training Pattern 1 MSB Training Pattern 2 LSB Training Pattern 2 MSB Training Pattern 3 LSB Training Pattern 3 MSB Training Pattern 4 LSB Training Pattern 4 MSB 1A 1B 1C 1D 1E 1F 20 AD9239 (MSB) Bit 7 Bit 6 Bit 5 Bit 4 (LSB) Bit 0 Bit 3 Default Value (Hex) 0x00 Default Notes/ Comments 0x00 Device offset trim. 0x00 Configures the outputs and the format of the data. 0x00 VCM output adjustments. 0x00 Select adjustments for VREF. 0xA5 Read only. B7 B6 B5 Bit 2 Bit 1 VCM Analog disconnect enable 1 = on enable 0 = off 1 = on (default) 0 = off (default) 6-bit Device Offset Adjustment[5:0] 011111 = +31 LSB 011110 = +30 LSB 011101 = +29 LSB … 000010 = +2 LSB 000001 = +1 LSB 000000 = 0 LSB 111111 = −1 LSB 111110 = −2 LSB 111101 = −3 LSB … 100001 = −31 LSB 100000 = −32 LSB Data format select Output Output (global) invert enable bar 00 = offset binary (global) (local) (default) enable 1 = off 01 = twos 1 = on 0 = on complement 0 = off (default) 10 = gray code (default) Output Drive Current[1:0] 00 = 400 mV (default) 01 = 500 mV 10 = 440 mV 11 = 320 mV Ref_Vfs[4:0] Reference full-scale adjust 10000 = 0.98 V p-p 10001 = 1.00 V p-p 10010 = 1.02 V p-p 10011 = 1.04 V p-p … 11111 = 1.23 V p-p 00000 = 1.25 V p-p (default) 00001 = 1.27 V p-p … 01110 = 1.48 V p-p 01111 = 1.5 V p-p B4 B3 B2 B1 B0 B15 B14 B13 B12 B11 B10 B9 B8 0x66 Read only. B7 B6 B5 B4 B3 B2 B1 B0 0x53 Read only. B15 B14 B13 B12 B11 B10 B9 B8 0x35 Read only. B7 B6 B5 B4 B3 B2 B1 B0 0xBB Read only. B15 B14 B13 B12 B11 B10 B9 B8 0xDD Read only. B7 B6 B5 B4 B3 B2 B1 B0 0xAA Read only. B15 B14 B13 B12 B11 B10 B9 B8 0xCC Read only. Rev. E | Page 35 of 40 AD9239 Data Sheet Addr. (Hex) 21 Register Name serial_control (global) (MSB) Bit 7 Bit 6 Bit 5 Bit 4 24 misr_lsb (local) B7 B6 B5 25 misr_msb (local) B15 B14 B13 32 adi_link_ options (global) 34 Channel ID (local) Dynamic pgm pins (global) 53 pgm_3 00 = sync 01 = standby A 10 = standby A and D 11 = standby A and B Default Notes/ Comments Serial stream control. Least significant byte of MISR. Read only. Most significant byte of MISR. Read only. Default is 56-bit SONET scrambler with over range in the header bits. Bit 2 Bit 1 B4 Bit 3 PLL high encode rate mode (global) 0 = low rate 1 = high rate (default) B3 B2 B1 B0 0x00 B12 B11 B10 B9 B8 0x00 Scramble Scramble options OverData flow enable range in 00 = inverted order 1 = on 01 = SONET (default) header 0= (default) 10 = Ethernet 1 = on ECC last 0 = off (default) (default) 0 = off 1= Scrambler last (Override 0x032[5]) Channel ID (Only Bits[3:0] used if overrange is included in header) pgm_0 pgm_1 pgm_2 00 = sync 00 = sync 00 = sync 01 = standby D 01 = standby C 01 = standby B 10 = standby D and A 10 = standby C and B 10 = standby B and C 11 = standby D and C 11 = standby C and D 11 = standby B and A Hamming enable 1 = on (default) 0 = off Default Value (Hex) 0x08 (LSB) Bit 0 Scramble data only 0= scramble header and data (default) 1= scramble data only Rev. E | Page 36 of 40 0x4B 0x00 0x00 Standby = ADC core off, PN23 enabled, serial channel enabled. Data Sheet AD9239 Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations When connecting power to the AD9239, it is recommended that two separate 1.8 V supplies be used: one for analog (AVDD) and one for digital (DRVDD). If only one supply is available, it should be routed to the AVDD first and then tapped off and isolated with a ferrite bead or a filter choke preceded by decoupling capacitors for the DRVDD. The user can employ several different decoupling capacitors to cover both high and low frequencies. These should be located close to the point of entry at the printed circuit board (PCB) level and close to the parts, with minimal trace lengths. It is required that the exposed paddle on the underside of the ADC is connected to analog ground (AGND) to achieve the best electrical and thermal performance of the AD9239. An exposed continuous copper plane on the PCB should mate to the AD9239 exposed paddle, Pin 0. The copper plane should have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. These vias should be solder-filled or plugged with nonconductive epoxy. A single PCB ground plane should be sufficient when using the AD9239. With proper decoupling and smart partitioning of the analog, digital, and clock sections of the PCB, optimum performance can easily be achieved. To maximize the coverage and adhesion between the ADC and PCB, partition the continuous copper plane by overlaying a silkscreen on the PCB into several uniform sections. This provides several tie points between the ADC and PCB during the reflow process, whereas using one continuous plane with no partitions guarantees only one tie point. See Figure 79 for a PCB layout example. For detailed information on packaging and the PCB layout of chip scale packages, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), at www.analog.com. 06980-029 SILKSCREEN PARTITION PIN 1 INDICATOR Figure 79. Typical PCB Layout Rev. E | Page 37 of 40 AD9239 Data Sheet OUTLINE DIMENSIONS 10.10 10.00 SQ 9.90 0.60 0.42 0.24 0.60 0.42 0.24 0.30 0.23 0.18 72 55 54 PIN 1 INDICATOR 1 PIN 1 INDICATOR 9.85 9.75 SQ 9.65 0.50 BSC 0.50 0.40 0.30 18 37 BOTTOM VIEW 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE 0.25 MIN 8.50 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4 06-25-2012-A 1.00 0.85 0.80 19 36 TOP VIEW 12° MAX 8.35 8.20 SQ 8.05 EXPOSED PAD Figure 80. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 10 mm × 10 mm Body, Very Thin Quad (CP-72-3) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD9239BCPZ-170 AD9239BCPZ-210 AD9239BCPZ-250 AD9239-250KITZ 1 Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C Package Description 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board Z = RoHS Compliant Part. Rev. E | Page 38 of 40 Package Option CP-72-3 CP-72-3 CP-72-3 Data Sheet AD9239 NOTES Rev. E | Page 39 of 40 AD9239 Data Sheet NOTES ©2008–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06980-0-7/14(E) Rev. E | Page 40 of 40