FEATURES
FUNCTIONAL BLOCK DIAGRAMS
3-wire serial interface
2.7 V to 5.5 V single supply
2.5 Ω on resistance
0.75 Ω on-resistance flatness
100 pA leakage currents
Single 8-to-1 multiplexer ADG738
Dual 4-to-1 multiplexer ADG739
Power-on reset
TTL/CMOS-compatible
Qualified for automotive applications
ADG738
S1
D
S8
INPUT SHIFT
REGISTER
APPLICATIONS
Data acquisition systems
Communication systems
Relay replacement
Audio and video switching
DOUT
10758-001
Data Sheet
CMOS, Low Voltage, 3-Wire
Serially-Controlled, Matrix Switches
ADG738/ADG739
SCLK DIN SYNC RESET
Figure 1.
ADG739
S1A
DA
S4A
S1B
DB
S4B
The ADG738 and ADG739 are CMOS analog matrix switches
with a serially-controlled 3-wire interface. The ADG738 is an
8-channel matrix switch, while the ADG739 is a dual 4-channel
matrix switch. On resistance is closely matched between switches
and very flat over the full signal range.
SCLK DIN SYNC
DOUT
10758-002
INPUT SHIFT
REGISTER
GENERAL DESCRIPTION
Figure 2.
The ADG738 and ADG739 utilize a 3-wire serial interface
that is compatible with SPI™, QSPI™, MICROWIRE®, and some
DSP interface standards. The output of the input shift register,
DOUT, enables a number of these parts to be daisy-chained.
On power-up, the internal input shift register contains all zeros
and all switches are in the off state.
All channels exhibit break-before-make switching action,
preventing momentary shorting when switching channels.
Each switch conducts equally well in both directions when on,
making these parts suitable for both multiplexing and demultiplexing applications. As each switch is turned on or off by a
separate bit, these parts can also be configured as a type of
switch array, where any, all, or none of the eight switches may
be closed at any time. The input signal range extends to the
supply rails.
1.
2.
Rev. A
The ADG738 and ADG739 are available in 16-lead TSSOP
packages.
PRODUCT HIGHLIGHTS
3.
4.
5.
6.
3-Wire Serial Interface.
Single Supply Operation. The ADG738/ADG739 are fully
specified and guaranteed with 3 V and 5 V supply rails.
Low On Resistance, 2.5 Ω typical.
Any configuration of switches may be on or off at any
one time.
Guaranteed Break-Before-Make Switching Action.
Small 16-lead TSSOP Package.
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2000–2012 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADG738/ADG739
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 15
Applications ....................................................................................... 1
Power-On Reset .......................................................................... 15
General Description ......................................................................... 1
Serial Interface ............................................................................ 15
Functional Block Diagrams ............................................................. 1
Microprocessor Interfacing ....................................................... 15
Product Highlights ........................................................................... 1
ADSP-21xx to ADG738/ADG739 ........................................... 15
Revision History ............................................................................... 2
8051 Interface to ADG738/ADG739 ....................................... 16
Specifications..................................................................................... 3
MC68HC11 Interface to ADG738/ADG739 .......................... 16
Timing Characteristics ................................................................ 5
Applications Information .............................................................. 17
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Expand the Number of Selectable Serial Devices Using an
ADG739 ....................................................................................... 17
Pin Configurations and Function Descriptions ........................... 7
Daisy-Chaining Multiple ADG738s ........................................ 17
Typical Performance Characteristics ............................................. 9
Outline Dimensions ....................................................................... 18
Test Circuits ..................................................................................... 12
Ordering Guide .......................................................................... 18
Terminology .................................................................................... 14
Automotive Products ................................................................. 18
REVISION HISTORY
11/12—Rev. 0 to Rev. A
Updated Format .................................................................. Universal
Changes to Features Section............................................................ 1
Added W Version Specifications to Table 1 .................................. 3
Added W Version Specifications to Table 2 .................................. 4
Changes to Table 4 ............................................................................ 6
Changes to Figure 7, Figure 8, and Figure 11 ............................... 9
Changes to Figure 12 ...................................................................... 10
Deleted Figure 22............................................................................ 12
Updated Outline Dimensions ....................................................... 19
Changes to Ordering Guide .......................................................... 19
4/00—Revision 0: Initial Version
Rev. A | Page 2 of 20
Data Sheet
ADG738/ADG739
SPECIFICATIONS
VDD = 5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
25°C
LEAKAGE CURRENTS
Source Off Leakage IS (Off)
Drain Off Leakage ID (Off)
Channel On Leakage ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
5
0.4
6
0.8
1
1.2
1.5
0.75
±0.01
±0.1
±0.01
±0.1
±0.01
±0.1
±0.3
±0.6
±1
±1.3
±1
±1.3
2.4
0.8
0.005
±0.1
CIN, Digital Input Capacitance
DIGITAL OUTPUT
Output Low Voltage
COUT, Digital Output Capacitance
DYNAMIC CHARACTERISTICS 1
tON
tOFF
Break-Before-Make Time Delay, tD
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
−3 dB Bandwidth
ADG738
ADG739
CS (Off)
CD (Off)
ADG738
ADG739
CD, CS (On)
ADG738
ADG739
POWER REQUIREMENTS
IDD
±0.1
3
0.4
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
nA typ
nA max
nA typ
nA max
nA typ
nA max
V min
V max
µA typ
µA max
pF typ
Test Conditions/Comments
VS = 0 V to VDD, IS = 10 mA; see Figure 19
VS = 0 V to VDD, IS = 10 mA
VS = 0 V to VDD, IS = 10 mA
VDD = 5.5 V
VD = 4.5 V/1 V, VS = 1 V/4.5 V; see Figure 20
VD = 4.5 V/1 V, VS = 1 V/4.5 V
VD = VS = 1 V/4.5 V, see Figure 21
VIN = VINL or VINH
max
pF typ
ISINK = 6 mA
RL = 300 Ω, CL = 35 pF, see Figure 22; VS1 = 3 V
±3
−55
−75
−55
−75
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
dB typ
dB typ
65
100
13
MHz typ
MHz typ
pF typ
RL = 50 Ω, CL = 5 pF, see Figure 25
85
42
pF typ
pF typ
96
48
pF typ
pF typ
10
µA typ
µA max
4
20
32
35
17
20
1
1
10
9
20
1
W Version
−40°C to +105°C
0 V to VDD
2.5
4.5
On-Resistance Match Between
Channels (∆RON)
On-Resistance Flatness (RFLAT(ON))
B Version
−40°C to +85°C
20
Guaranteed by design, not subject to production test.
Rev. A | Page 3 of 20
RL = 300 Ω, CL = 35 pF, see Figure 22; VS1 = 3 V
RL = 300 Ω, CL = 35 pF;
VS1 = VS8 = 3 V, see Figure 22
VS = 2.5 V, RS = 0 Ω, CL = 1 nF; see Figure 23
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 25
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 24
VDD = 5.5 V
Digital Inputs = 0 V or 5.5 V
ADG738/ADG739
Data Sheet
VDD = 3 V ± 10%, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
25°C
Drain Off Leakage ID (Off)
Channel On Leakage ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
12
0.4
16
1.2
1.4
3.5
±0.01
±0.1
±0.01
±0.1
±0.01
±0.1
±0.3
±0.6
±1
±1.3
±1
±1.3
2.0
0.4
0.005
±0.1
CIN, Digital Input Capacitance
DIGITAL OUTPUT
Output Low Voltage
COUT, Digital Output Capacitance
DYNAMIC CHARACTERISTICS 1
tON
tOFF
Break-Before-Make Time Delay, tD
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
−3 dB Bandwidth
ADG738
ADG739
CS (Off)
CD (Off)
ADG738
ADG739
CD, CS (On)
ADG738
ADG739
POWER REQUIREMENTS
IDD
±0.1
3
0.4
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
nA typ
nA max
nA typ
nA max
nA typ
nA max
V min
V max
µA typ
µA max
pF typ
Test Conditions/Comments
VS = 0 V to VDD, IS = 10 mA; see Figure 19
VS = 0 V to VDD, IS = 10 mA
VS = 0 V to VDD, IS = 10 mA
VDD = 3.3 V
VS = 3 V/1 V, VD = 1 V/3 V; see Figure 20
VD = 3 V/1 V, VD = 1 V/3 V
VD = VS = 3 V/1 V, see Figure 21
VIN = VINL or VINH
max
pF typ
ISINK = 6 mA
RL = 300 Ω, CL = 35 pF, see Figure 22; VS1 = 2 V
±3
−55
−75
−55
−75
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
dB typ
dB typ
65
100
13
MHz typ
MHz typ
pF typ
85
42
pF typ
pF typ
96
48
pF typ
pF typ
10
µA typ
µA max
4
40
70
75
25
40
1
1
14
12
20
1
W Version
−40°C to +105°C
0 V to VDD
6
11
On-Resistance Match Between
Channels (∆RON)
On-Resistance Flatness (RFLAT(ON))
LEAKAGE CURRENTS
Source Off Leakage IS (Off)
B Version
−40°C to +85°C
20
Guaranteed by design, not subject to production test.
Rev. A | Page 4 of 20
RL = 300 Ω, CL = 35 pF, see Figure 22; VS1 = 2 V
RL = 300 Ω, CL = 35 pF;
VS = 2 V, see Figure 22
VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 23
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 25
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 24
RL = 50 Ω, CL = 5 pF, see Figure 25
VDD = 3.3 V
Digital Inputs = 0 V or 3.3 V
Data Sheet
ADG738/ADG739
TIMING CHARACTERISTICS
VDD = 2.7 V to 5.5 V. All specifications −40°C to +105°C, unless otherwise noted.
Table 3.
Parameter 1, 2
fSCLK
t1
t2
t3
t4
t5
t6
t7
t8
t9 3
Min
Limit at TMIN, TMAX
Max
30
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns min
33
13
13
0
5
4.5
0
33
20
Test Conditions/Comments
SCLK cycle frequency
SCLK cycle time
SCLK high time
SCLK low time
SYNC to SCLK active edge setup time
Data setup time
Data hold time
SCLK falling edge to SYNC rising edge
Minimum SYNC high time
SCLK rising edge to DOUT valid
1
See Figure 3.
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
3
CL = 20 pF, RL = 1 kΩ.
2
t1
SCLK
t2
t8
t3
t7
t4
SYNC
t6
t5
DIN
DB7
DB0
t9
1DATA
DB71
DB01
10758-003
DOUT
FROM LAST WRITE CYCLE.
Figure 3. 3-Wire Serial Interface Timing Diagram
Rev. A | Page 5 of 20
ADG738/ADG739
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Table 4.
Parameter
VDD to GND
Analog, Digital Inputs1
Peak Current, S or D
Continuous Current, Each S
Continuous Current D
ADG739
ADG738
Operating Temperature Range
Industrial (B Version)
Industrial (W Version)
Storage Temperature Range
Junction Temperature
TSSOP Package
θJA Thermal Impedance
θJC Thermal Impedance
Lead Temperature, Soldering
1
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V or
30 mA, Whichever
Occurs First
100 mA
(Pulsed at 1 ms, 10%
Duty Cycle Max)
30 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
80 mA
120 mA
−40°C to +85°C
−40°C to +105°C
−65°C to +150°C
150°C
150.4°C/W
27.6°C/W
As per JEDEC J-STD-020
Overvoltages at IN, S, or D are clamped by internal diodes. Limit current to
the maximum ratings given.
Rev. A | Page 6 of 20
Data Sheet
ADG738/ADG739
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
16 SYNC
SCLK 1
15 DOUT
14 GND
DIN 3
S1 4
ADG738
TOP VIEW
(Not to Scale)
13 VDD
12 S5
S2
5
S3
6
11 S6
S4
7
10 S7
D 8
9
S8
10758-004
RESET
2
Figure 4. ADG738 Pin Configuration
Table 5. ADG738 Pin Function Descriptions
Pin No.
1
Mnemonic
SCLK
2
3
4, 5, 6, 7
8
9, 10, 11, 12
13
14
15
RESET
DIN
S1, S2, S3, S4
D
S8, S7, S6, S5
VDD
GND
DOUT
16
SYNC
Description
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input.
These devices can accommodate serial input rates of up to 30 MHz.
Active Low Control Input. This pin clears the input register and turns all switches to the off condition.
Serial Data Input. Data is clocked into the 8-bit input register on the falling edge of the serial clock input.
Source. May be an input or output.
Drain. May be an input or output.
Source. May be an input or output.
Power Supply Input. These parts can be operated from a supply of 2.7 V to 5.5 V.
Ground Reference.
Data Output. This allows a number a parts to be daisy-chained. Data is clocked out of the input shift
register on the rising edge of SCLK. This is an open drain output, which should be pulled to the supply
with an external resistor.
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low,
it powers on the SCLK and DIN buffers and the input shift register is enabled. Data is transferred on the
falling edges of the following clocks. Taking SYNC high updates the switch conditions.
Rev. A | Page 7 of 20
ADG738/ADG739
Data Sheet
SCLK 1
16
DOUT
2
15
GND
DIN 3
14
VDD
ADG739
13
S1B
TOP VIEW
(Not to Scale)
12
S2B
S3A 6
11
S3B
S4A 7
10
DA 8
9
S1A
4
S2A 5
S4B
DB
10758-005
SYNC
Figure 5. ADG739 Pin Configuration
Table 6. ADG739 Pin Function Descriptions
Pin No.
1
Mnemonic
SCLK
2
SYNC
3
DIN
4, 5, 6, 7
8, 9
10, 11, 12, 13
14
15
16
S1A, S2A, S3A, S4A
DA, DB
S4B, S3B, S2B, S1B
VDD
GND
DOUT
Description
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
input. These devices can accommodate serial input rates of up to 30 MHz.
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC
goes low, it powers on the SCLK and DIN buffers and the input shift register is enabled. Data is
transferred on the falling edges of the following clocks. Taking SYNC high updates the switch
conditions.
Serial Data Input. Data is clocked into the 8-bit input register on the falling edge of the serial
clock input.
Source. May be an input or output.
Drain. May be an input or output.
Source. May be an input or output.
Power Supply Input. These parts can be operated from a supply of 2.7 V to 5.5 V.
Ground Reference.
Data Output. This allows a number a parts to be daisy-chained. Data is clocked out of the input
shift register on the rising edge of SCLK. This is an open drain output, which should be pulled to
the supply with an external resistor.
Rev. A | Page 8 of 20
Data Sheet
ADG738/ADG739
TYPICAL PERFORMANCE CHARACTERISTICS
0.12
8
VDD = 5V
VSS = 0V
TA = 25°C
TA = 25°C
VSS = 0V
7
0.08
VDD = 2.7V
ID (ON)
VDD = 3.3V
5
4
VDD = 4.5V
VDD = 5.5V
3
0.04
CURRENT (nA)
ON RESISTANCE (Ω)
6
0
IS (OFF)
–0.04
2
ID (OFF)
–0.08
0
1
2
3
4
–0.12
10758-006
0
5
VD OR VS – DRAIN OR SOURCE VOLTAGE (V)
1
2
3
4
5
VD [VS] (V)
Figure 6. On Resistance as a Function of VD (VS)
8
0
10758-009
1
Figure 9. Leakage Currents as a Function of VD (VS), VDD = 5 V
0.12
VDD = 5V
VSS = 0V
VDD = 3V
VSS = 0V
TA = 25°C
7
0.08
5
CURRENT (nA)
6
+125°C
4
+25°C
+85°C
3
ID (ON)
0.04
0
IS (OFF)
ID (OFF)
0.04
2
–40°C
0
1
2
3
4
VD OR VS – DRAIN OR SOURCE VOLTAGE (V)
5
0.12
10758-007
0
0.5
1.0
1.5
2.0
2.5
3.0
VD [VS] (V)
Figure 10. Leakage Currents as a Function of VD (VS), VDD = 3 V
Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures,
VDD = 5 V
8
0.35
VDD = 3V
VSS = 0V
7
0
10758-010
0.08
1
VDD = 5V
VSS = 0V
0.30
+125°C
0.25
4
–40°C
3
0.15
ID (OFF)
0.10
+25°C
2
0.20
IS (OFF)
ID (ON)
0.05
1
0
0.5
1.0
1.5
2.0
2.5
VD OR VS – DRAIN OR SOURCE VOLTAGE (V)
3.0
0
10758-008
0
0
20
40
60
80
TEMPERATURE (°C)
Figure 8. On Resistance as a Function of VD (VS) for Different Temperatures,
VDD = 3 V
Rev. A | Page 9 of 20
100
120
10758-011
+85°C
5
CURRENT (nA)
ON RESISTANCE (Ω)
6
Figure 11. Leakage Currents as a Function of Temperature, VDD = 5 V
ADG738/ADG739
Data Sheet
0.35
20
TA = 25°C
VDD = 3V
0.30
10
VDD = 5V
VSS = 0V
0
QINJ (pC)
CURRENT (nA)
0.25
0.20
0.15
ID (ON)
VDD = 3V
VSS = 0V
–10
–20
0.10
ID (OFF)
IS (OFF)
0
20
40
60
100
80
120
TEMPERATURE (°C)
–40
0
2
3
4
5
VOLTAGE (V)
Figure 12. Leakage Currents as a Function of Temperature, VDD = 3 V
10m
1
10758-014
0
–30
10758-012
0.05
Figure 14. Charge Injection vs. Source Voltage
50
TA = 25°C
TON, VDD = 3V
45
40
1m
TON, VDD = 5V
TIME (ns)
100µ
VDD = 3V
30
25
TOFF, VDD = 3V
20
15
10µ
10
5
100k
1M
10M
FREQUENCY (Hz)
100M
Figure 13. Input Currents vs. Switching Frequency
0
–40
TOFF, VDD = 5V
–20
0
20
40
60
TEMPERATURE (°C)
Figure 15. TON/TOFF Times vs. Temperature
Rev. A | Page 10 of 20
80
10758-015
1µ
10k
10758-013
CURRENT (A)
35
VDD = 5V
Data Sheet
ADG738/ADG739
0
0
VDD = 5V
TA = 25°C
ADG738
–20
ADG739
ATTENUATION (dB)
ATTENUATION (dB)
–5
–40
–60
–80
–10
–15
100k
1M
10M
100M
FREQUENCY (Hz)
Figure 16. Off Isolation vs. Frequency
0
VDD = 5V
TA = 25°C
–60
–80
–100
1M
10M
FREQUENCY (Hz)
100M
10758-017
ATTENUATION (dB)
–40
100k
1M
10M
FREQUENCY (Hz)
Figure 18. On Response vs. Frequency
–20
–120
30k
VDD = 5V
TA = 25°C
–20
100k
30k
Figure 17. Crosstalk vs. Frequency
Rev. A | Page 11 of 20
100M
10758-018
–120
30k
10758-016
–100
ADG738/ADG739
Data Sheet
TEST CIRCUITS
S1
NC
D
ID (ON)
A
S2
V
Sn
D
IDS
VS
VD
10758-025
RON = V/IDS
Figure 19. On Resistance
IS (OFF)
A
A
S1
D
NC = NO CONNECT
VD
10758-028
S
Figure 21. IS, ID (On)
ID (OFF)
A
Sn
VD
10758-026
VS
Figure 20. ID (Off), IS (Off)
VDD
VDD
SYNC
ADG738*
S1
SYNC
50%
50%
VS1
S2 THRU S7
VS1
VS8
GND
CL
35pF
RL
300Ω
VOUT
90%
VS1 = VS8
VOUT
80%
80%
VOUT
90%
tOFF
*SIMILAR CONNECTION FOR ADG739.
tOPEN
tON
Figure 22. Switching Times and Break-Before-Make Times
SYNC
VDD
ADG738*
SWITCH ON
RS
VS
S
D
INPUT LOGIC
GND
CL
1nF
VOUT
SWITCH OFF
QINJ = CL × VOUT
∆VOUT
*SIMILAR CONNECTION FOR ADG739.
Figure 23. Charge Injection
Rev. A | Page 12 of 20
10758-029
D
10758-030
S8
Data Sheet
ADG738/ADG739
VDD
VDD
VDD
S1
S8
VS
ADG738*
VDD
ADG738*
50Ω
D
S1
D
RL
50Ω
S2
VS
VOUT
GND
RL
50Ω
VOUT
S8
GND
*SIMILAR CONNECTION FOR ADG739.
S1 IS SWITCHED OFF FOR OFF ISOLATION MEASUREMENTS
AND ON FOR BANDWIDTH MEASUREMENTS
INSERTION LOSS = 20LOG10
Figure 24. Channel-to-Channel Crosstalk
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
Figure 25. Off Isolation and Bandwidth
Rev. A | Page 13 of 20
10758-032
CHANNEL-TO-CHANNEL CROSSTALK = 20LOG 10 (VOUT/VS)
10758-031
OFF ISOLATION = 20LOG10 (VOUT/VS)
*SIMILAR CONNECTION FOR ADG739.
ADG738/ADG739
Data Sheet
TERMINOLOGY
CS (Off)
Off switch source capacitance. Measured with reference to
ground.
VDD
Most positive power supply potential.
IDD
Positive supply current.
CD (Off)
Off switch drain capacitance. Measured with reference to
ground.
GND
Ground (0 V) reference.
CD, CS (On)
On switch capacitance. Measured with reference to ground.
S
Source terminal. May be an input or output.
CIN
Digital input capacitance.
D
Drain terminal. May be an input or output.
tON
Delay time between the 50% and 90% points of the SYNC rising
edge and the switch on condition.
VD (VS)
Analog voltage on Terminal D, Terminal S.
RON
Ohmic resistance between D and S.
∆RON
On resistance match between any two channels, that is, RONmax
− RONmin.
RFLAT(ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
IS (Off)
Source leakage current with the switch off.
ID (Off)
Drain leakage current with the switch off.
ID, IS (On)
Channel leakage current with the switch on.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
tOFF
Delay time between the 50% and 90% points of the SYNC rising
edge and the switch off condition.
tD
Off time measured between the 80% points of both switches
when switching from one switch to another.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal which is coupled through from
one channel to another as a result of parasitic capacitance.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
Rev. A | Page 14 of 20
Data Sheet
ADG738/ADG739
THEORY OF OPERATION
POWER-ON RESET
During device power-up, all switches will be in the off condition and the internal input shift register is filled with zeros and
remains so until a valid write takes place.
SERIAL INTERFACE
S8
S7
S6
S5
S4
S3
S2
S1
DATA BITS
Figure 26. Input Shift Register Contents
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the ADG738/ADG739 is via
a serial bus that uses a standard protocol compatible with
microcontrollers and DSP processors. The communications
channel is a 3-wire (minimum) interface consisting of a
clock signal, a data signal, and a synchronization signal.
The ADG738/ADG739 requires an 8-bit data word with
data valid on the falling edge of SCLK.
Data from the previous write cycle is available on the DOUT
pin. The following sections illustrate simple 3-wire interfaces
with popular microcontrollers and DSPs.
ADSP-21xx TO ADG738/ADG739
An interface between the ADG738/ADG739 and the ADSP21xx is shown in Figure 27. In the interface example shown,
SPORT0 is used to transfer data to the matrix switch. The
SPORT control register should be configured as follows:
internal clock operation, alternate framing mode; active low
framing signal.
Transmission is initiated by writing a word to the Tx register
after the SPORT has been enabled. As the data is clocked out of
the DSP on the rising edge of SCLK, no glue logic is required to
interface the DSP to the matrix switch. The update of each switch
condition takes place automatically when TFS is taken high.
The ADG738 and ADG739 have a 3-wire serial interface
(SYNC, SCLK, and DIN), which is compatible with SPI, QSPI,
MICROWIRE interface standards and most DSPs. Figure 3
shows the timing diagram of a typical write sequence.
Data is written to the 8-bit input shift register via DIN under
the control of the SYNC and SCLK signals. Data may be written
to the input shift register in more or less than eight bits. In each
case, the input shift register retains the last eight bits that were
written.
When SYNC goes low, the input shift register is enabled. Data
from DIN is clocked into the input shift register on each falling
edge of SCLK. Each bit of the 8-bit word corresponds to one of
the eight switches. Figure 26 shows the contents of the input
shift register. Data appears on the DOUT pin on the rising edge
of SCLK suitable for daisy-chaining, delayed, of course, by eight
bits. When all eight bits have been written into the shift register,
the SYNC line is brought high again. The switches are updated
with the new configuration and the input shift register is
disabled. With SYNC held high, any further data or noise
on the DIN line has no effect on the shift register.
Rev. A | Page 15 of 20
TFS
ADSP-21xx*
DT
SCLK
SYNC
DIN
ADG738/
ADG739
SCLK
*ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 27. ADSP-21xx to ADG738/ADG739 Interface
10758-020
When changing the switch conditions, a new 8-bit word is
written to the input shift register. Some of the bits may be the
same as the previous write cycle, as the user may not wish to
change the state of some switches. To minimize glitches on the
output of these switches, the part cleverly compares the state of
switches from the previous write cycle. If the switch is already
in the on condition, and is required to stay on, there will be
minimal glitches on the output of the switch.
DB0 (LSB)
DB7 (MSB)
10758-019
The ADG738 and ADG739 are serially controlled, 8-channel
and dual 4-channel matrix switches, respectively. While providing the normal multiplexing and demultiplexing functions,
these parts also provide the user with more flexibility as to
where their signal may be routed. Each bit of the 8-bit serial
word corresponds to one switch of the part. A Logic 1 in the
particular bit position turns on the switch, while a Logic 0 turns
the switch off. Because each switch is independently controlled
by an individual bit, this provides the option of having any, all,
or none of the switches on. This feature may be particularly
useful in the demultiplexing application where the user may
wish to direct one signal from the drain to a number of outputs
(sources). Take care, however, in the multiplexing situation
where a number of inputs may be shorted together (separated
only by the small on resistance of the switch).
ADG738/ADG739
Data Sheet
8051 INTERFACE TO ADG738/ADG739
MC68HC11 INTERFACE TO ADG738/ADG739
A serial interface between the ADG738/ADG739 and the 8051
is shown in Figure 28. TXD of the 8051 drives SCLK of the
ADG738/ADG739, while RXD drives the serial data line, DIN.
P3.3 is a bit-programmable pin on the serial port and is used to
drive SYNC.
Figure 29 shows an example of a serial interface between the
ADG738/ADG739 and the MC68HC11 microcontroller. SCK
of the 68HC11 drives the SCLK of the matrix switch, while the
MOSI output drives the serial data line, DIN. SYNC is driven
from one of the port lines, in this case PC7.
When data is to be transmitted to the matrix switch, P3.3 is
taken low. Data on RXD is clocked out of the microcontroller
on the rising edge of TXD and is valid on the falling edge. As a
result no glue logic is required between the ADG738/ADG739
and microcontroller interface.
SYNC
RXD
DIN
TXD
SCLK
ADG738/
ADG739
*ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 28. 8051 Interface to ADG738/ADG739
10758-021
80C51/80L51*
P3.3
PC7
MC68HC11*
MOSI
SCK
SYNC
DIN
ADG738/
ADG739
SCLK
*ADDITIONAL PINS OMITTED FOR CLARITY.
10758-022
The 8051 provides the LSB of its SBUF register as the first bit in
the data stream. The user has to ensure that the data in the SBUF
register is arranged correctly as the switch expects MSB first.
Figure 29. MC68HC11 Interface to ADG738/ADG739
The 68HC11 is configured for master mode; MSTR = 1, CPOL
= 0, and CPHA = 1. When data is transferred to the part, PC7 is
taken low, data is transmitted MSB first. Data appearing on the
MOSI output is valid on the falling edge of SCK.
If the user wishes to verify the data previously written to the
input shift register, the DOUT line could be connected to MISO
of the MC68HC11, and with SYNC low, the input shift register
would clock data out on the rising edges of SCLK.
Rev. A | Page 16 of 20
Data Sheet
ADG738/ADG739
APPLICATIONS INFORMATION
EXPAND THE NUMBER OF SELECTABLE SERIAL
DEVICES USING AN ADG739
ADG739
SYNC
DIN
The dual 4-channel ADG739 multiplexer can be used to
multiplex a single chip select line to provide chip selects for
up to four devices on the SPI bus. Figure 30 illustrates the
ADG739 in such a typical configuration. All devices receive
the same serial clock and serial data, but only one device
receives the SYNC signal at any one time. The ADG739 is a
serially controlled device also. One bit programmable pin of
the microcontroller is used to enable the ADG739 via SYNC2,
while another bit programmable pin is used as the chip select
for the other serial devices, SYNC1. Driving SYNC2 low enables
changes to be made to the addressed serial devices. By
bringing SYNC1 low, the selected serial device hanging from
the SPI bus is enabled and data will be clocked into its input
shift register on the falling edges of SCLK. The convenient
design of the matrix switch allows for different combinations of
the four serial devices to be addressed at any one time. If more
devices need to be addressed via one chip select line, the
ADG738 is an 8-channel device and would allow further
expansion of the chip select scheme. There may be some digital
feedthrough from the digital input lines because SCLK and DIN
are permanently connected to each device. Using a burst clock
minimizes the effects of digital feedthrough on the analog
channels.
SCLK
ADG738
VDD
SYNC
1/2 OF
DIN
ADG739
S1A
S2A
SYNC1
DA
S3A
SCLK
DIN
SYNC
SCLK
SYNC
DIN
DIN
SCLK
Figure 30. Addressing Multiple Serial Devices Using an ADG739
DAISY-CHAINING MULTIPLE ADG738S
A number of ADG738 matrix switches may be daisy-chained
simply by using the DOUT pin. DOUT is an open-drain output
that should be pulled to the supply with an external resistor.
Figure 31 shows a typical implementation. The SYNC pin of
all three parts in the example are tied together. When SYNC
is brought low, the input shift registers of all parts are enabled,
data is written to the parts via DIN, and clocked through the
shift registers. When the transfer is complete, SYNC is brought
high and all switches are updated simultaneously. Further shift
registers may be added in series.
R
SYNC
DIN
SYNC
DOUT
SCLK
ADG739
DIN
R
DOUT
SYNC
ADG739
DIN
SYNC
DOUT
TO OTHER
SERIAL DEVICES
10758-024
DIN
10758-023
OTHER SPI
DEVICE
SYNC2
SCLK
ADG739
DIN
SCLK
FROM
MICROCONTROLLER
OR DSP
R
SCLK
OTHER SPI
DEVICE
SYNC
S4A
VDD
SCLK
SCLK
Figure 31. Multiple ADG739 Devices in a Daisy-Chained Configuration
Rev. A | Page 17 of 20
ADG738/ADG739
Data Sheet
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.30
0.19
0.65
BSC
COPLANARITY
0.10
SEATING
PLANE
8°
0°
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 32. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
ADG738BRU
ADG738BRUZ
ADG738BRUZ-REEL
ADG738BRUZ-REEL7
ADG738WBRUZ-REEL
ADG739BRU
ADG739BRU-REEL7
ADG739BRUZ
ADG739BRUZ-REEL
ADG739BRUZ-REEL7
1
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +105°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
Z = RoHS Compliant Part.
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADG738W model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
Rev. A | Page 18 of 20
Data Sheet
ADG738/ADG739
NOTES
Rev. A | Page 19 of 20
ADG738/ADG739
Data Sheet
NOTES
©2000–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10758-0-11/12(A)
Rev. A | Page 20 of 20
工商网监
湘ICP备2023018690号
