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ADM3485EANZ

ADM3485EANZ

  • 厂商:

    AD(亚德诺)

  • 封装:

    SOICN8_150MIL

  • 描述:

    20M BITS/S, RS-485 TRANSCEIVER

  • 数据手册
  • 价格&库存
ADM3485EANZ 数据手册
ESD-Protected, EMC-Compliant, 3.3 V 20 Mbps, EIA RS-485 Transceiver ADM3485E Operates with 3.3 V supply ESD protection: 8 kV meets IEC1000-4-2 EFT protection: 2 kV meets IEC1000-4-4 EIA RS-422 and RS-485 compliant over full CM range 19 kΩ input impedance Up to 50 transceivers on bus 20 Mbps data rate Short-circuit protection Specified over full temperature range Thermal shutdown Interoperable with 5 V logic 1 mA supply current 2 nA shutdown current 8 ns skew APPLICATIONS Telecommunications DTE-DCE interfaces Packet switching Local area networks Data concentration Data multiplexers Integrated services digital network (ISDN) AppleTalk Industrial controls FUNCTIONAL BLOCK DIAGRAM ADM3485E RO R B RE A DE DI D 03338-001 FEATURES Figure 1. GENERAL DESCRIPTION The ADM3485E is a low power, differential line transceiver that operates with a single 3.3 V power supply. Low power consumption makes it ideal for power-sensitive applications. It is suitable for communication on multipoint bus transmission lines. Internal protection against electrostatic discharge (ESD) and electrical fast transient (EFT) allows operation in electrically harsh environments. It is intended for balanced data transmission and complies with both EIA Standards RS-485 and RS-422. It contains a differential line driver and a differential line receiver, and is suitable for half-duplex data transfer. The input impedance is 19 kΩ following up to 50 transceivers to be connected on the bus. Excessive power dissipation caused by bus contention or by output shorting is prevented by a thermal shutdown circuit. This feature forces the driver output into a high impedance state if, during fault conditions, a significant temperature increase is detected in the internal driver circuitry. The receiver contains a fail-safe feature that results in a logic high output state if the inputs are unconnected (floating). The device is fabricated on BiCMOS, an advanced mixed technology process combining low power CMOS with fast switching bipolar technology. The ADM3485E is fully specified over the industrial temperature range and is available in 8-lead PDIP and SOIC packages. Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved. ADM3485E TABLE OF CONTENTS Specifications..................................................................................... 3 ESD/EFT Transient Protection Scheme .................................. 11 Timing Specifications....................................................................... 4 ESD Testing ................................................................................. 11 Absolute Maximum Ratings............................................................ 5 Fast Transient Burst Immunity (IEC1000-4-4)...................... 12 ESD Caution.................................................................................. 5 Applications Information .............................................................. 13 Pin Configurations and Pin Function Descriptions .................... 6 Differential Data Transmission ................................................ 13 Test Circuits....................................................................................... 7 Cable and Data Rate................................................................... 13 Switching Characteristics ................................................................ 8 Receiver Open-Circuit Fail-Safe............................................... 13 Typical Performance Characteristics ............................................. 9 Outline Dimensions ....................................................................... 14 Standards and Testing .................................................................... 11 Ordering Guide .......................................................................... 14 REVISION HISTORY 10/04—Data Sheet Changed from Rev. A to Rev. B Updated Format..................................................................Universal Changes to Power-Supply Current, Table 1 .................................. 3 Updated Outline Dimensions ....................................................... 14 Changes to Ordering Guide .......................................................... 14 5/00—Data Sheet Changed from Rev. 0 to Rev. A Rev. B | Page 2 of 16 ADM3485E SPECIFICATIONS VCC = +3.3 V ± 0.3 V. All specifications TMIN to TMAX, unless otherwise noted. Table 1. Parameter DRIVER Differential Output Voltage, VOD ∆|VOD| for Complementary Output States Common-Mode Output Voltage VOC ∆|VOC| for Complementary Output States CMOS Input Logic Threshold Low, VINL CMOS Input Logic Threshold High, VINH Logic Input Current (DE, DI, RE) Output Short-Circuit Current RECEIVER Differential Input Threshold Voltage, VTH Input Voltage Hysteresis, ∆VTH Input Resistance Input Current (A, B) Logic Enable Input Current (RE) Output Voltage Low, VOL Output Voltage High, VOH Short-Circuit Output Current Three-State Output Leakage Current POWER-SUPPLY CURRENT ICC Supply Current in Shutdown ESD/EFT IMMUNITY ESD Protection EFT Protection Min Typ Max Unit Test Conditions/Comments 0.2 3 0.2 0.8 V V V V V V V V µA mA RL= 100 Ω, VCC > 3.1 V; see Figure 3 RL= 54 Ω; see Figure 9 RL= 60 Ω, see Figure 4; –7 V < VTST < +12 V R = 54 Ω or 100 Ω; see Figure 3 R = 54 Ω or 100 Ω; see Figure 3 R = 54 Ω or 100 Ω; see Figure 3 −7 V < VCM < +12 V VCM = 0 V −7 V < VCM < +12 V VIN = 12 V VIN = −7 V ±60 ±1.0 V mV kΩ mA mA µA V V mA µA 1.5 1.5 1 mA mA µA Outputs unloaded DE = VCC, RE = 0 V DE = 0 V, RE = 0 V DE = 0 V, RE = VCC kV kV IEC1000-4-2 A, B pins contact discharge IEC1000-4-4, A, B pins 2.0 1.5 1.5 2.0 ±1.0 ±250 −0.2 12 +0.2 50 19 1 −0.8 ±1 0.4 VCC – 0.4 V 1 1 0.002 ±8 ±2 Rev. B | Page 3 of 16 VO = −7 V or +12 V IOUT = +2.5 mA IOUT = −1.5 mA VOUT = GND or VCC VCC = 3.6 V, 0 V < VOUT < VCC ADM3485E TIMING SPECIFICATIONS VCC = 3.3 V, TA = 25°C, unless otherwise noted. Table 2. Parameter DRIVER Differential Output Delay TDD Differential Output Transition Time Propagation Delay Input to Output TPLH, TPHL Driver Output-to-Output TSKEW ENABLE/DISABLE Driver Enable to Output Valid Driver Disable Timing Driver Enable from Shutdown RECEIVER Time to Shutdown Propagation Delay Input to Output TPLH, TPHL Skew TPLH–TPHL Receiver Enable TEN Receiver Disable TDEN Receiver Enable from Shutdown Min Typ Max Unit Test Conditions/Comments 1 1 7 8 22 35 15 35 8 ns ns ns ns RL = 60 Ω, CL1 = CL2 = 15 pF; see Figure 5 RL = 60 Ω, CL1 = CL2 = 15 pF; see Figure 5 RL = 27 Ω, CL1 = CL2 = 15 pF; see Figure 9 RL = 54 Ω, CL1 = CL2 = 15 pF; see Figure 5 45 40 650 90 80 110 ns ns ns RL = 110 Ω, CL = 50 pF; see Figure 4 RL = 110 Ω, CL = 50 pF; see Figure 4 RL = 110 Ω, CL = 15 pF; see Figure 4 190 65 300 90 10 50 45 500 ns ns ns ns ns ns CL = 15 pF; see Figure 10 CL = 15 pF; see Figure 10 CL = 15 pF; see Figure 8 CL = 15 pF; see Figure 8 CL = 15 pF; see Figure 8 80 25 25 25 TIMING SPECIFICATIONS VCC = 3.3 V ± 0.3 V, TA = TMIN to TMAX, unless otherwise noted. Table 3. Parameter DRIVER Differential Output Delay TDD Differential Output Transition Time Propagation Delay Input to Output TPLH, TPHL Driver Output-to-Output TSKEW ENABLE/DISABLE Driver Enable to Output Valid Driver Disable Timing Driver Enable from Shutdown RECEIVER Time to Shutdown Propagation Delay Input to Output TPLH, TPHL Skew TPLH – TPHL Receiver Enable TEN Receiver Disable TDEN Receiver Enable from Shutdown Min Typ Max Unit Test Conditions/Comments 1 2 7 8 22 70 15 70 10 ns ns ns ns RL = 60 Ω, CL1 = CL2 = 15 pF; see Figure 5 RL = 60 Ω, CL1 = CL2 = 15 pF; see Figure 5 RL = 27 Ω, CL1 = CL2 = 15 pF; see Figure 9 RL = 54 Ω, CL1 = CL2 = 15 pF; see Figure 5 45 40 650 110 110 110 ns ns ns RL = 110 Ω, CL = 50 pF; see Figure 4 RL = 110 Ω, CL = 50 pF; see Figure 4 RL = 110 Ω, CL = 15 pF; see Figure 4 190 65 500 115 20 50 50 600 ns ns ns ns ns ns CL = 15 pF, Figure 10 CL = 15 pF, Figure 10 CL = 15 pF, Figure 8 CL = 15 pF, Figure 8 CL = 15 pF, Figure 8 50 25 25 25 Rev. B | Page 4 of 16 ADM3485E ABSOLUTE MAXIMUM RATINGS TA = +25°C, unless otherwise noted. Table 4. Parameter VCC Inputs Driver Input (DI) Control Inputs (DE, RE) Receiver Inputs (A, B) Outputs Driver Outputs Receiver Output Power Dissipation 8-Lead PDIP θJA, Thermal Impedance Power Dissipation 8-Lead SOIC θJA, Thermal Impedance Operating Temperature Range Industrial (A Version) Storage Temperature Range Lead Temperature (Soldering, 10 sec) Vapor Phase (60 sec) Infrared (15 sec) ESD Rating: Air (Human Body Model,All Pins) ESD Rating: IEC1000-4-2 Contact (A, B Pins) EFT Rating: IEC1000-4-4 (A, B Pins) Values 7V −0.3 V to VCC + 0.3 V −0.3 V to VCC + 0.3 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods of time may affect device reliability. −7.5 V to +12.5 V −7.5 V to +12.5 V −0.5 V to VCC + 0.5 V 800 mW 140°C/W 650 mW 115°C/W −40°C to +85°C −65°C to +150°C 300°C 215°C 220°C > 4 kV > 8 kV > 2 kV ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. B | Page 5 of 16 ADM3485E PIN CONFIGURATIONS AND PIN FUNCTION DESCRIPTIONS RE 2 8 ADM3485E VCC B TOP VIEW 6 A (Not to Scale) DI 4 5 GND 7 DE 3 03338-002 RO 1 Figure 2. PDIP/SOIC Pin Configuration Table 5. Pin Function Descriptions Mnemonic RO RE DIP/SOIC 1 2 DE 3 DI 4 GND A B VCC 5 6 7 8 Description Receiver Output. High when A > B by 200 mV or low when A < B by 200 mV. Receiver Output Enable. With RE low, the receiver output RO is enabled. With RE high, the output goes high impedance. If RE is high and DE low, the ADM3485E enters a shutdown state. Driver Output Enable. A high level enables the driver differential outputs A and B. A low level places it in a high impedance state. Driver Input. When the driver is enabled, a logic low on DI forces A low and B high, while a logic high on DI forces A high and B low. Ground Connection, 0 V. Noninverting Receiver Input A/Driver Output A. Inverting Receiver Input B/Driver Output B. Power Supply, 3.3 V ± 0.3 V. Rev. B | Page 6 of 16 ADM3485E TEST CIRCUITS 375Ω R/2 VOC VOD3 375Ω Figure 3. Driver Voltage Measurement Test Circuit Figure 7. Driver Voltage Measurement Test Circuit 2 VCC S1 RL –1.5V S2 CL VOUT DE IN S2 RE 03338-004 S1 DE VCC +1.5V RL 0V OR 3V VTST RL 03338-008 R/2 VCC 03338-007 03338-003 VOD CL VOUT RE IN Figure 4. Driver Enable/Disable Test Circuit Figure 8. Receiver Enable/Disable Test Circuit VOM DI CL1 VOUT CL2 RL IN VOUT S1 DE CL 03338-009 RLDIFF 03338-005 D VCC Figure 9. Driver Propagation Delay Test Circuit CL1 D RLDIFF A B CL2 0V RO 3V VOUT R VID RE 03338-006 DI 1.5V Figure 6. Driver/Receiver Propagation Delay Test Circuit RE CL 03338-010 Figure 5. Driver Differential Output Delay Test Circuit Figure 10. Receiver Propagation Delay Test Circuit Rev. B | Page 7 of 16 ADM3485E SWITCHING CHARACTERISTICS 3V 3V 1.5V 1.5V 0V 1.5V tZL tPLH tLZ 1/2VO 1.5V D A tSKEW tSKEW 90% POINT tZH 90% POINT D 1.5V 03338-011 10% POINT –VO tR tF VOL + 0.25V VOL tHZ 0V 10% POINT O/P LOW VOH O/P HIGH VOH – 0.25V 03338-013 VO VO 1.5V 0V tPLH B DE 0V Figure 13. Driver Enable/Disable Timing Figure 11. Driver Propagation Delay, Rise/Fall Timing 3V A–B 0V RE 0V 1.5V 1.5V 0V tZL tPLH 1.5V R VOH tZH 1.5V VOL + 0.25V VOL tHZ 1.5V VOL 03338-012 RO O/P LOW R 1.5V O/P HIGH VOH VOH – 0.25V 0V Figure 12. Receiver Propagation Delay Figure 14. Receiver Enable/Disable Timing Rev. B | Page 8 of 16 03338-014 tPLH tLZ ADM3485E TYPICAL PERFORMANCE CHARACTERISTICS 12 14 10 OUTPUT CURRENT (mA) 10 8 6 4 6 4 03338-015 0 0 0.5 2.0 1.0 1.5 2.5 OUTPUT LOW VOLTAGE (V) 3.0 0 3.5 0 Figure 15. Output Current vs. Receiver Output Low Voltage 0.7 3.25 RECEIVER O/P HIGH VOLTAGE (V) 3.30 0.6 0.5 0.4 0.3 –10 10 30 50 70 TEMPERATURE (°C) 90 3.0 3.5 3.20 3.15 3.10 3.05 3.00 2.95 03338-016 0.2 –30 1.0 2.0 1.5 2.5 OUTPUT HIGH VOLTAGE (V) 0.5 Figure 18. Output Current vs. Receiver Output High Voltage 0.8 0.1 –50 03338-018 2 2 RECEIVER OUTPUT LOW VOLTAGE (V) 8 2.90 –50 110 Figure 16. Receiver Output Low Voltage vs. Temperature 03338-019 OUTPUT CURRENT (mA) 12 –30 –10 10 30 50 70 TEMPERATURE (°C) 90 110 Figure 19. Receiver Output High Voltage vs. Temperature 2.6 120 2.4 2.3 80 VOD (V) 2.2 60 2.1 2.0 40 1.9 0 0 0.5 2.0 1.5 2.5 1.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 03338-020 1.8 20 03338-017 DRIVER OUTPUT CURRENT (mA) 2.5 100 1.7 1.6 –50 3.0 Figure 17. Driver Output Current vs. Differential Output Voltage –30 –10 70 10 30 50 TEMPERATURE (°C) 90 110 Figure 20. Driver Differential Output Voltage vs. Temperature Rev. B | Page 9 of 16 ADM3485E 1.20 100 1.15 90 1.10 80 70 ICC (mA) DE = VCC, RE = X ICC (nA) 0.95 0.90 60 50 40 ICC (mA) RE = LO, DE = LO 0.85 30 0.80 20 0.75 0.70 –50 –30 –10 70 10 30 50 TEMPERATURE (°C) 90 ICC (mA) 10 0 –40 110 Figure 21. Supply Current vs. Temperature –20 0 20 40 TEMPERATURE (°C) 60 Figure 22. Shutdown Current vs. Temperature Rev. B | Page 10 of 16 03338-022 1.00 03338-021 ICC (mA) 1.05 80 ADM3485E STANDARDS AND TESTING Table 6 compares RS-422 and RS-485 interface standards, while Table 7 and Table 8 show transmitting and receiving truth tables. Table 6. Specification Transmission Type Maximum Data Rate Maximum Cable Length Minimum Driver Output Voltage Driver Load Impedance Receiver Input Resistance Receiver Input Sensitivity Receiver Input Voltage Range No. of Drivers/Receivers Per Line RS-422 Differential 10 MB/s 4000 ft. ±2 V 100 Ω 4 kΩ min ±200 mV −7 V to +7 V 1/10 RS-485 Differential 10 MB/s 4000 ft. ±1.5 V 54 Ω 12 kΩ min ±200 mV −7 V to +12 V 32/32 DI Transmitting Outputs B A X X 0 1 1 0 X X 0 1 Hi-Z Hi-Z 1 1 0 0 I/O lines are particularly vulnerable to ESD damage. Simply touching or plugging in an I/O cable can result in a static discharge that can damage or completely destroy the interface product connected to the I/O port. It is extremely important, therefore, to have high levels of ESD protection on the I/O lines. The ESD discharge could induce latch-up in the device under test, so it is important that ESD testing on the I/O pins be carried out while device power is applied. This type of testing is more representative of a real-world I/O discharge where the equipment is operating normally when the discharge occurs. Table 7. Transmitting Truth Table Transmitting Inputs DE RE Although very little energy is contained within an ESD pulse, the extremely fast rise time, coupled with high voltages, can cause failures in unprotected semiconductors. Catastrophic destruction can occur immediately as a result of arcing or heating. Even if catastrophic failure does not occur immediately, the device may suffer from parametric degradation, which may result in degraded performance. The cumulative effects of continuous exposure can eventually lead to complete failure. 1 0 Hi-Z Hi-Z Table 9. ESD Test Results ESD Test Method IEC1000-4-2: Contact I/O Pins ±8 kV Table 8. Receiving Truth Table Receiving Inputs DE RE Receiving Outputs A–B RO 0 0 0 1 > +0.2 V < –0.2 V Inputs O/C X 90% 1 0 1 Hi-Z IPEAK X X X X 100% 36.8% ESD/EFT TRANSIENT PROTECTION SCHEME The ADM3485E uses protective clamping structures on its inputs and outputs that clamp the voltage to a safe level and dissipate the energy present in ESD (electrostatic) and EFT (electrical fast transients) discharges. This protection structure achieves ESD protection up to 8 kV according to IEC1000-4-2, and EFT protection up to 2 kV on all input/output (I/O) lines. TIME t tDL tRL 03338-023 10% Figure 23. Human Body Model Current Waveform 100% ESD TESTING 10% 0.1 TO 1ns Rev. B | Page 11 of 16 TIME t 30ns 60ns Figure 24. IEC1000-4-2 ESD Current Waveform 03338-024 Two coupling methods are used for ESD testing, contact discharge and air-gap discharge. Contact discharge calls for a direct connection to the unit being tested. Air-gap discharge uses a higher test voltage but does not make direct contact with the unit under test. With air discharge, the discharge gun is moved toward the unit under test, developing an arc across the air gap, hence the term air-discharge. This method is influenced by humidity, temperature, barometric pressure, distance, and rate of closure of the discharge gun. The contact-discharge method, while less realistic, is more repeatable and is gaining acceptance and preference over the air-gap method. IPEAK 90% ADM3485E FAST TRANSIENT BURST IMMUNITY (IEC1000-4-4) IEC1000-4-4 (previously 801-4) covers electrical fast-transientburst (EFT) immunity. Electrical fast transients occur as a result of arcing contacts in switches and relays. The tests simulate the interference generated when, for example, a power relay disconnects an inductive load. A spark is generated due to the wellknown back EMF effect. This spark consists of a burst of sparks as the relay contacts separate. The voltage appearing on the line consists of a burst of extremely fast transient impulses. A similar effect occurs when turning on fluorescent lights. The fast transient burst test, defined in IEC1000-4-4, simulates this arcing and its waveform is illustrated in Figure 25. It consists of a burst of 2.5 kHz to 5 kHz transients repeating at 300 ms intervals. It is specified for both power and data lines. Table 10 shows the peak voltages for each of the environments. Table 10. Peak Voltages Level Well-Protected Protected Typical Industrial Severe Industrial VPEAK (kV) PSU 0.5 1 2 4 VPEAK (kV) I/O 0.25 0.5 1 2 A simplified circuit diagram of the actual EFT generator is illustrated in Figure 26. HIGH VOLTAGE SOURCE RC L CC RM CD 50Ω OUTPUT ZS 03338-026 V Figure 26. EFT Generator t Four severity levels are defined in terms of an open-circuit voltage as a function of the installation environment. The installation environments are defined as These transients are coupled onto the signal lines using an EFT coupling clamp. The clamp is 1 m long and completely surrounds the cable, providing maximum coupling capacitance (50 pF to 200 pF, typ) between the clamp and the cable. High energy transients are capacitively coupled onto the signal lines. Fast rise times (5 ns), as specified by the standard, result in very effective coupling. This test is severe because high voltages are coupled onto the signal lines. The repetitive transients can cause problems, where single pulses do not. Destructive latch-up may be induced due to the high energy content of the transients. Note that this stress is applied while the interface products are powered up and are transmitting data. The EFT test applies hundreds of pulses with higher energy than ESD. The worstcase transient current on an I/O line can be as high as 40 A. • Well-Protected Test results are classified according to the following: • Protected • Normal performance within specification limits. • Typical Industrial • • Severe Industrial Temporary degradation or loss of performance that is self-recoverable. • Temporary degradation or loss of function or performance that requires operator intervention or system reset. • Degradation or loss of function that is not recoverable due to damage. 300ms 16ms V 5ns 50ns 0.2/0.4ms 03338-025 t Figure 25. IEC1000-4-4 Fast Transient Waveform Rev. B | Page 12 of 16 ADM3485E APPLICATIONS INFORMATION DIFFERENTIAL DATA TRANSMISSION Differential data transmission is used to reliably transmit data at high rates over long distances and through noisy environments. Differential transmission nullifies the effects of ground shifts and noise signals that appear as common-mode voltages on the line. The ADM3485E is designed for bidirectional data communications on multipoint transmission lines. A typical application showing a multipoint transmission network is illustrated in Figure 27. Only one driver can transmit at a particular time, but multiple receivers may be enabled simultaneously. Two main standards are approved by the Electronics Industries Association (EIA) which specify the electrical characteristics of transceivers used in differential data transmission. The RS-422 standard specifies data rates up to 10 MBaud and line lengths up to 4000 feet. A single driver can drive a transmission line with up to 10 receivers. As with any transmission line, it is important that reflections are minimized. This may be achieved by terminating the extreme ends of the line using resistors equal to the characteristic impedance of the line. Stub lengths of the main line should also be kept as short as possible. A properly terminated transmission line appears purely resistive to the driver. The RS-485 standard was defined to cater to true multipoint communications. This standard meets or exceeds all the requirements of RS-422, but also allows multiple drivers and receivers to be connected to a single bus. An extended common-mode range of −7 V to +12 V is defined. RECEIVER OPEN-CIRCUIT FAIL-SAFE The most significant difference between RS-422 and RS-485 is the fact that the drivers may be disabled, thereby allowing more than one to be connected to a single line. Only one driver should be enabled at a time, but the RS-485 standard contains additional specifications to guarantee device safety in the event of line contention. Specification Transmission Type Maximum Cable Length Minimum Driver Output Voltage Driver Load Impedance Receiver Input Resistance Receiver Input Sensitivity Receiver Input Voltage Range CABLE AND DATA RATE The receiver input includes a fail-safe feature that guarantees a logic high on the receiver when the inputs are open circuit or floating. Table 11. RS-422 and RS-485 Interface Standards RS-422 Differential 4000 ft. ±2 V 100 Ω 4 kΩ min ±200 mV −7 V to +7 V RS-485 Differential 4000 ft. ±1.5 V 54 Ω 12 kΩ min ±200 mV −7 V to +12 V The transmission line of choice for RS-485 communications is a twisted pair. Twisted-pair cable tends to cancel commonmode noise and also causes cancellation of the magnetic fields generated by the current flowing through each wire, thereby reducing the effective inductance of the pair. ADM3485E ADM3485E R RO A A R RO RE RE DE DE D B B A A B R R D RE DI ADM3485E ADM3485E RO D B DE D RO DI RE DE MAXIMUM NUMBER OF TRANSCEIVERS ON BUS: 50 Figure 27. Multipoint Transmission Network Rev. B | Page 13 of 16 DI 03338-027 DI ADM3485E OUTLINE DIMENSIONS 0.375 (9.53) 0.365 (9.27) 0.355 (9.02) 8 5 1 4 0.295 (7.49) 0.285 (7.24) 0.275 (6.98) 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) 0.100 (2.54) BSC 0.150 (3.81) 0.135 (3.43) 0.120 (3.05) 0.015 (0.38) MIN 0.180 (4.57) MAX 0.150 (3.81) 0.130 (3.30) 0.110 (2.79) 0.022 (0.56) 0.018 (0.46) 0.014 (0.36) 0.015 (0.38) 0.010 (0.25) 0.008 (0.20) SEATING PLANE 0.060 (1.52) 0.050 (1.27) 0.045 (1.14) COMPLIANT TO JEDEC STANDARDS MO-095AA CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Figure 28. 8-Lead Plastic Dual In-Line Package [PDIP] (N-8) Dimensions shown in inches and( millimeters) 5.00 (0.1968) 4.80 (0.1890) 8 5 4.00 (0.1574) 3.80 (0.1497) 1 4 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0040) 6.20 (0.2440) 5.80 (0.2284) 1.75 (0.0688) 1.35 (0.0532) 0.51 (0.0201) COPLANARITY SEATING 0.31 (0.0122) 0.10 PLANE 0.50 (0.0196) × 45° 0.25 (0.0099) 8° 0.25 (0.0098) 0° 1.27 (0.0500) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Figure 29. 8-Lead Standard Small Outline Package [SOIC] Narrow Body (R-8) Dimensions shown in millimeters and (inches) ORDERING GUIDE Model ADM3485EAN ADM3485EAR ADM3485EAR-REEL ADM3485EAR-REEL7 ADM3485EARZ1 ADM3485EARZ-REEL1 ADM3485EARZ-REEL71 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description Plastic DIP Small Outline (SOIC) Small Outline (SOIC) Small Outline (SOIC) Small Outline (SOIC) Small Outline (SOIC) Small Outline (SOIC) Z = Pb-free part. Rev. B | Page 14 of 16 Package Options N-8 R-8 R-8 R-8 R-8 R-8 R-8 ADM3485E NOTES Rev. B | Page 15 of 16 ADM3485E NOTES © 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective companies. C03338–0–11/04(B) Rev. B | Page 16 of 16
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