ADN8830ACPZ

Thermoelectric Cooler Controller ADN8830 FEATURES High Efficiency Small Size: 5 mm ⴛ 5 mm LFCSP Low Noise: 0.707 8 4 2 1.9 1.6 1.5 for ( fCLK > Z 1) (30) VDD R1 for ( fCLK > Z 1) 4 fCLK L1 (31) Here it can be directly seen that increasing the inductor value or clock frequency will reduce the ripple. Choosing a low ESR capacitor will ensure R1 remains low. Operating from a lower supply voltage will also help reduce the output ripple voltage from the L-C filter. With a clock frequency equal to Z1 but presumably greater than fC, the worst-case output voltage ripple is (16R1 C1 f 2 ΔOUT AMAX = VDD 2 2 CLK 32L1C1 fCLK ) for ( f +1 CLK = Z 1) (32) Which, if fCLK < Z1, can be further simplified to Using the recommended values of L1 = 4.7 μH and C1 = 22 μF results in a cutoff frequency of 15.7 kHz. With a TEC resistance of 2 Ω, the damping factor is 0.12. The cutoff frequency can be decreased to lower the output voltage ripple with slower clock frequencies by increasing L1 or C1. Increasing C1 may appear to be a simpler approach as it would not increase the physical size of the inductor, but there is a potential stability danger in lowering the damping factor too far. It is recommended that ζ remain greater than 0.05 to provide a reasonable settling time for the TEC. Increasing ζ also makes finding the proper PID compensation easier as there is less ringing in the L-C output filter. To allow adequate phase and gain margin for the PWM amplifier, Table III should be used to find the lower limit of cutoff frequency for a given damping factor. ␨ L1 fCLK The worst-case voltage ripple occurs when the duty cycle of the PWM output is exactly 50%, or when OUT A = 0.5  VDD. As shown in Equation 31 ΔOUT AMAX = (27) Table III. Minimum L-C Filter Cutoff Frequency vs. Damping Factor (29) VDD D (1 – D) R1 OUT AMAX ≈ This cutoff frequency should be much lower than the clock frequency to achieve adequate filtering of the switched output waveform. Also of importance is the damping factor, , of the L-C filter. Too low a damping factor will result in a longer settling time and could potentially cause stability problems for the temperature control loop. Neglecting R1 and R2 again, the damping factor is simply ζ= (28) With a clock frequency greater than Z1, and presumably greater than fC, the output voltage ripple is Practically speaking, R1 and R2 are several tens of milliohms and are much smaller than the TEC resistance, which can be a few ohms. The cutoff frequency can be roughly approximated as 1 fC = 2π 1 2πR1C1 VDD 32L1C1 fCLK 2 for ( fCLK < Z 1) (33) A typical 100 μF surface-mount electrolytic capacitor can have an ESR of over 100 mΩ, pulling this zero to below 16 kHz, and resulting in an excess of ripple voltage across the TEC. Low ESR capacitors, such as ceramic or polymer aluminum capacitors, are recommended instead. Polymer aluminum capacitors can provide more bulk capacitance per unit area over ceramic ones, saving board space. Table IV shows a limited list of capacitors with their equivalent series resistances. This is by no means a complete list of all capacitor manufacturers or capacitor types that can be used in the application. The 22 μF capacitor recommended has a maximum ESR of 35 mΩ, which puts Z1 at 207 kHz. Using a 3.3 V supply with the recommended inductor and capacitor listed with a 1 MHz clock frequency will yield a worst-case ripple voltage at OUT A of about 6 mV. External FET Requirements External FETs are required for both the PWM and linear amplifiers that drive OUT A and OUT B from the ADN8830. Although it is important to select FETs that can supply the maximum current required to the TEC, they should also have a low enough resistance (rDS, ON) to prevent excessive power dissipation and improve efficiency. Other key requirements from these FET pairs are slightly different for the PWM and linear outputs. –15– ADN8830 The gate drive outputs for the PWM amplifier at P1 (Pin 21) and N1 (Pin 22) have a typical nonoverlap delay of 65 ns. This is done to ensure that one FET is completely off before the other FET is turned on, preventing current from shooting through both simultaneously. Bear in mind that the addition of these capacitors is only for local stabilization. The stability of the entire TEC application may need adjustment, which should be done around the compensation amplifier. This is covered in the Compensation Loop section. The input capacitance (CISS) of the FET should not exceed 5 nF. The P1 and N1 outputs from the ADN8830 have a typical output impedance of 6 Ω. This creates a time constant in combination with CISS of the external FETs equal to 6 Ω  CISS. To ensure shoot-through does not occur through these FETs, this time constant should remain less than 30 ns. There is one additional consideration for selecting both the linear output FETs; they must have a minimum threshold voltage (VT) of 0.6 V. Lower threshold voltages could cause shoot-through current in the linear output transistors. Table V shows the recommended FETs that can be used for the linear output in the ADN8830 application. Table V includes the appropriate external gate-to-drain capacitance (external CGD) and snubber capacitor value (CSNUB) connected from OUT B to ground that should be added to ensure local stability. Table VI shows the recommended PWM output FETs. Although other transistors can be used, these combinations have been tested and are proved stable and reliable for typical applications. The linear output from the ADN8830 uses N2 (Pin 10) and P2 (Pin 11) to drive the gates of the linear side FETs, shown as Q3 and Q4 in Figure 1. Local compensation for the linear amplifier is achieved through the gate-to-drain capacitances (CGD) of Q3 and Q4. The value of CGD, which can be determined from the data sheet, is usually referred to as CRSS, the reverse transfer capacitance. The exact CRSS value should be determined from a graph that shows capacitance versus drain-to-source voltage, using the power supply voltage as the appropriate VDS. Data sheets for these devices can be found at their respective websites: To ensure stability of the linear amplifier, the total CGD of the PMOS device, Q3, should be greater than 2.5 nF and the total CGD of the NMOS should be greater than 150 pF. External capacitance can be added around the FET to increase the effective CGD of the transistor. This is the function of C6 in the typical application schematic shown in Figure 1. If external capacitance must be added, it will generally only be required around the PMOS transistor. In the event of zero output current through the TEC, there will be no current flowing through Q3 and Q4. In this condition, these FETs will not provide any small signal gain and thus no negative feedback for the linear amplifier. This leaves only a feedforward signal path through CGD, which could cause a settling problem at OUT B. This is often seen as a small signal oscillation at OUT B, but only when the TEC is at or very near zero current. The remedy for this potential minor instability is to add capacitance from OUT B to ground. This may need to be determined empirically, but a good starting point is 1.5 times the total CGD. This is the function of C12 in Figure 1. Note that while adding more CGD around Q3 and Q4 will help to ensure stability, it could potentially increase instability in the zero current dead band region, requiring additional capacitance from OUT B to ground. Fairchild – www.fairchildsemi.com Vishay Siliconix – www.vishay.com International Rectifier – www.irf.com Calculating Power Dissipation and Efficiency The total efficiency of the ADN8830 application circuit is simply the ratio of the output power to the TEC divided by the total power delivered from the supply. The idea in minimizing power dissipation is to avoid both drawing additional power and reducing heat generated from the circuit. The dominant sources of power dissipation will include resistive losses, gate charge loss, core loss from the inductor, and the current used by the ADN8830 itself. The on-channel resistance of both the linear and PWM output FETs will affect efficiency primarily at high output currents. Because the linear amplifier operates in a high gain configuration, it will be at either ground or VDD when significant current is flowing through the TEC. In this condition, the power dissipation through the linear output FET will be PFET , LIN = rDS , ON × ITEC 2 (34) using either the rDS, ON for the NMOS or the PMOS depending on the direction of the current flow. In the typical application setup in Figure 2, if the TEC is cooling the target object, the PMOS is sourcing the current. If the TEC is heating the object, the NMOS will be sinking current. Table IV. Partial List of Capacitors and Key Specifications Value (␮F) ESR (m⍀) Voltage Rating (V) Part Number Manufacturer Website 10 22* 22 22 47 68 100 60 35 35 35 25 18 95 6.3 8 8 8 6.3 8 10 NSP100M6.3D2TR ESRD220M08B NSP220M8D5TR EEFFD0K220R NSP470M6.3D2TR ESRD680M08B 594D107X_010C2T NIC Components Cornell Dubilier NIC Components Panasonic NIC Components Cornell Dubilier Vishay www.niccomp.com www.cornell-dubilier.com www.niccomp.com www.maco.panasonic.co.jp www.niccomp.com www.cornell-dubilier.com www.vishay.com *Recommend capacitor in typical application circuit Figure 1. –16– REV. D ADN8830 Although the FETs that drive OUT A alternate between Q1 and Q2 being on, they have an equivalent series resistance that is equal to a weighted average of their rDS, ON values. REQIV = D × rDS , P 1 + (1 – D ) × rDS , N 1 (35) The resistive power loss from the PWM transistors is then PFET , PWM = REQIV × ITEC 2 (36) There is also a power loss from the continuing charging and discharging of the gate capacitances on Q1 and Q2. The power dissipated due to gate charge loss (PGCL) is PGCL = 1 2 CISSVDD fCLK 2 PADN 8830 = VDD × 10 mA (37) (40) There are certainly other minor mechanisms for power dissipation in the circuit. However, a rough estimate of the total power dissipated can be found by summing the preceding power dissipation equations. Efficiency is then found by comparing the power dissipated with the required output power to the load. Efficiency = PLOAD PLOAD + PDISS , TOT (41) where PLOAD = ILOAD ×VLOAD using the appropriate input capacitance (CISS) for the NMOS and PMOS. Both transistors are switching, so PGCL should be calculated for each one and will be added to find the total power dissipated from the circuit. The series resistance of the inductor, R2 from Figure 14, will also exhibit a power dissipation equal to PR2 = R2 × ITEC total current used by the ADN8830. The power dissipated from the device itself is 2 The measured efficiency of the system will likely be less than the calculated efficiency. Measuring the efficiency of the application circuit is fairly simple but must be done in an exact manner to ensure the correct numbers are being measured. Using two high current, low impedance ammeters and two voltmeters, the circuit should be set up as shown in Figure 15. (38) POWER SUPPLY Core loss from the inductor arises as a result of nonidealities of the inductor. Although this is difficult to calculate explicitly, it can be estimated as 80% of PRLS at 1 MHz switching frequencies and 50% of PRL at 100 kHz. Judging conservatively PLOSS = 0.8 × PRL VDD GND A V (39) A Finally, the power dissipated by the ADN8830 is equal to the current used by the device multiplied by the supply voltage. Again, this exact equation is difficult to determine as we have already taken into account some of the current while finding the gate charge loss. A reasonable estimate is to use 40 mA as the ADN8830 V TEC LOAD Figure 15. Measuring Efficiency of the ADN8830 Circuit Table V. Recommended FETs for Linear Output Amplifier Part Number Type CGD (nF) FDW2520C* NMOS PMOS NMOS PMOS NMOS PMOS 0.17 0.15 0.5 2.2 0.23 0.6 IRF7401 IRF7233 FDR6674A FDR840P Ext. CGD (nF) CSNUB (nF) 2.2 3.3 1.0 3.3 1.0 3.3 rDS, ON (m⍀) IMAX (A) Manufacturer 18 35 22 20 9.5 12 6.0 4.5 8.7 9.5 11.5 10 Fairchild Fairchild International Rectifier International Rectifier Fairchild Fairchild *Recommend transistors in typical application circuit Figure 1. Table VI. Recommended FETs for PWM Output Amplifier Part Number Type CISS (nF) rDS,ON (m⍀) Continuous IMAX (A) Manufacturer FDW2520C* NMOS PMOS NMOS PMOS NMOS PMOS 1.33 1.33 1.0 3.5 1.6 1.5 18 35 30 17 22 40 6.0 4.5 5.3 7.3 8.7 6.7 Fairchild Fairchild Vishay Siliconix Vishay Siliconix International Rectifier International Rectifier Si7904DN Si7401DN IRF7401 IRF7404 *Recommend transistors in typical application circuit Figure 1. REV. D –17– ADN8830 The voltmeter to the TEC or output load should include the series ammeter since the power delivered to the ammeter is considered part of the total output power. However, the voltmeter measuring the voltage delivered to the ADN8830 circuit should not include the series ammeter from the power supply. This prevents a false supply voltage power measurement since we are interested only in the supply voltage power delivered to the ADN8830 circuit. Figures 16 and 17 show some efficiency measurements using the typical application circuit shown in Figure 1. POWER SUPPLY VDD AVDD NOISE SENSITIVE SECTION VSY = 3V EFFICIENCY (%) OUTPUT SECTION PVDD TEC OR LOAD The low noise power and ground are referred to as AVDD and AGND, with the output supply and ground paths labeled PVDD and PGND. These pins are labeled on the ADN8830 and should be connected appropriately. Both sets of external FETs should be connected to PVDD and PGND. All output filtering and PVDD supply bypass capacitors should be connected to PGND. 80 VSY = 5V 60 40 20 0 500 PGND Figure 18. Using Star Connections to Minimize Noise Pickup from Switched Output 100 0 AGND GND 1,000 ITEC (mA) 1,500 2,000 Figure 16. Efficiency with fCLK = 1 MHz All remaining connections to ground and power supply should be done through AVDD and AGND. A 4-layer board layout is recommended for best performance with split power and ground planes between the top and bottom layers. This provides the lowest impedance for both supply and ground points. Setting the ADN8830 above the AGND plane will reduce the potential noise injection into the device. Figure 19 shows the top layer of the layout used for the ADN8830 evaluation boards, highlighting the power and ground split planes. 100 VSY = 3V 80 EFFICIENCY (%) VSY = 5V 60 40 20 0 0 500 1,000 ITEC (mA) 1,500 2,000 Figure 17. Efficiency with fCLK = 200 kHz Note that higher efficiency can be achieved using a lower supply voltage or a slower clock frequency. This is due to the fact that the dominant source of power dissipation at high clock frequencies is the gate charge loss on the PWM transistors. Layout Considerations The two key considerations for laying out the board for the ADN8830 are to minimize both the series resistance in the output and the potential noise pickup in the precision input section. The best way to accomplish both of these objectives is to divide the layout into two sections, one for the output components and the other for the remainder of the circuit. These sections should have independent power supply and ground current paths that are each connected together at a single point near the power supply. This is used to minimize power supply and ground voltage bounce on the more sensitive input stages to the ADN8830 caused by the switching of the PWM output. Such a layout technique is referred to as a “star” ground and supply connection. Figure 18 shows a block diagram of the concept. Figure 19. Top Layer Reference Layout for ADN8830 Proper supply voltage bypassing should also be taken into consideration to minimize the ripple voltage on the power supply. A minimum bypass capacitance of 10 μF should be placed in close proximity to each component connected to the power supply. This includes Pins 8 and 20 on the ADN8830 and both external PMOS transistors. An additional 0.1 μF capacitor should be placed in parallel to each 10 μF capacitor to provide bypass for high frequency noise. Using a large bulk capacitor, 100 μF or greater, in parallel with a low ESR capacitor where AVDD and PVDD connect will further improve voltage supply ripple. This is covered in more detail in the Power Supply Ripple section. –18– REV. D ADN8830 Power Supply Ripple Minimizing ripple on the power supply voltage can be an important consideration, particularly in signal source laser applications. If the laser diode is operated from the same supply rail as the TEC controller, ripple on the supply voltage could cause inadvertent modulation of the laser frequency. As most laser diodes are driven from a 5 V supply, it is recommended the ADN8830 be operated from a separate 3.3 V regulated supply unless higher TEC voltages are required. Operation from 3.3 V also improves efficiency, thus minimizing power dissipation. The power supply ripple is primarily a function of the supply bypass capacitance, also called bulk capacitance, and the inductor ripple current. Similar to the L-C filter at the PWM amplifier output, using more capacitance with low equivalent series resistance (ESR) will lower the supply ripple. A larger inductor value will reduce the inductor ripple current, but this may not be practical in the application. A recommended approach is to use a standard electrolytic capacitor in parallel with a low ESR capacitor. A surface-mount 220 μF electrolytic in parallel with a 22 μF polymer aluminum low ESR capacitor can occupy an approximate total board area of only 0.94 square inches or 61 square millimeters. Using these capacitors along with a 4.7 μH inductor can yield a supply ripple of less than 5 mV. High frequency transient spikes may appear on the supply voltage as well. This is due to the fast switching times on the PWM transistors and the sharp edges of their gate voltages. Although these transient spikes can reach several tens of millivolts at their peak, they typically last for less than 20 ns and have a resonance greater than 100 MHz. Additional bulk capacitance will not appreciably affect the level of these spikes as such capacitance is not reactive at these frequencies. Adding 0.01 μF ceramic capacitors on the supply line near the PWM PMOS transistor can reduce this switching noise. Inserting an RF inductor with a High-Q around 100 MHz in series with PVDD will also block this noise from traveling back to the power supply. Setting Maximum Output Current and Short-Circuit Protection Although the maximum output voltage can be programmed through VLIM to protect the TEC from overvoltage damage, the user may wish to protect the ADN8830 circuit from a possible short circuit at the output. Such a short could quickly damage the external FETs or even the power supply since they would attempt to drive excessive current. Figure 20 shows a simple modification that will protect the system from an output short circuit. VS TO FETS AND DECOUPLING CAPS RS 10m⍀ PVDD AVDD A 10 mΩ resistor placed in series with the PVDD supply line creates a voltage drop proportional to the absolute value of the output current. The AD8601 is a CMOS amplifier that is configured as a comparator. As long as the voltage at its inverting input (VS) exceeds the voltage set by the resistor divider at the noninverting input (VX), the gate of Q1 will remain at ground. This leaves Q1 on, effectively connecting D1 to the positive rail and leaving the voltage on C1 at VDD. Should enough current flow through RS to drop VS below VX, Q1 will turn off and C1 will discharge through R2 down to a logic low to activate the ADN8830 shutdown. Once VS returns to a voltage greater than VX, Q1 will turn back on and C1 will charge back to VDD through R1. The shutdown and reactivation time constants are approximately SD = C1 × R1 ON = C1 × R1 (42) The shutdown time constant should be a minimum of 10 clock cycles to ensure high current switching transients do not trigger a false activation. If powered from 5 V, the circuit shown will shut down the ADN8830 should PVDD deliver over 5 A for more than 1 ms. After shutdown, the circuit will reactivate the ADN8830 in about 1 second. The voltage drop across RS is found as 2 VRS = IOUT RL RS ηVDD (43) where RL is the load resistance or resistance of the TEC and  is the efficiency of the system. An estimate of efficiency can be calculated either from the Calculating Power Dissipation and Efficiency section or from Figures 16 and 17. A reasonable approximation is  = 0.85. Although the exact resistance of a TEC varies with temperature, an estimation can be made by dividing the maximum voltage rating of the TEC by its maximum current rating. In addition to providing protection against a short at the output, this circuit will also protect the FETs against shoot-through current. Shoot-through will not occur when using the recommended transistors and additional capacitance shown in Tables V and VI. However, if different transistors are used where their shootthrough potential is unknown, implementing the short-circuit protection circuit will unconditionally protect these transistors. To set a maximum output current limit, use the circuit in Figure 21. This circuit can share the 10 mΩ power supply shunt resistor as the short-circuit protection circuit to sense the output current. In normal operation Q1 is on, pulling the ADN8830 VLIM pin down to the voltage set by VLIMIT. This sets the maximum output voltage limit as described in the Setting the Maximum TEC Voltage and Current section. PVDD R3 1k⍀ Q1 FDV304P OR EQUIVALENT AD8601 R4 100k⍀ VX R1 1M⍀ SD R2 1k⍀ D1 MA116CT-ND OR EQUIVALENT C1 1␮F VSY TO FETS AND DECOUPLING PVDD CAPS R3 178⍀ PVDD AVDD R1 3.48k⍀ AD8605 R4 100k⍀ DENOTES AGND RS 10m⍀ Q1 FDV301N OR EQUIVALENT C1 1nF TO VLIM R2 1.47k⍀ VX DENOTES PGND VLIMIT (0V TO 1.5V) Figure 20. Implementing Output Short-Circuit Protection DENOTES AGND DENOTES PGND Figure 21. Setting a Maximum Output Current Limit REV. D –19– ADN8830 5V IOUTA ADT70 IOUTB +INOA TO THERM_IN = 1V @ 25ⴗC R3 82.5⍀ OUTOA 25mV/ⴗC +INIA RGA INST AMP 4.99k⍀ R3 82.5⍀ RGB –INIA RTD 1k⍀ R3 1k⍀ GND SENSE AGND OUTIA –INOA 1k⍀ 5.11k⍀ NOTE: ADDITIONAL PINS OMITTED FOR CLARITY Figure 22. Using an RTD for Temperature Feedback to the ADN8830 If the voltage at VSY drops below VX, Q1 is turned off and the VLIM pin will be set to 1.5 V, effectively setting the maximum voltage across the outputs to 0 V. The voltage divider for VX is calculated from Equation 43. TO TEC AVDD RS 10m⍀ TO OUT B IL AVDD AVDD R1 3.48k⍀ 200k⍀ VHI TO VLIM R2 1.47k⍀ 1nF 300k⍀ Design Example 5 A maximum output current limit needs to be set at 1.5 A for a TEC with a maximum voltage rating of 2.5 V. The ADN8830 is powered from 5 V. The TEC resistance is estimated at 1.67 Ω and efficiency at 85%. Using Equation 43, the voltage drop across RS will be 8.8 mV when 1.5 A is delivered to the TEC. The trip voltage VX is set to 4.991 V with R3 = 178 Ω and R4 = 100 kΩ as shown in Figure 21. To set the output voltage limit to 2.5 V, the voltage at VLIMIT should be set to 0.875 V according to Equation 17. 8 AD626 VX AD8602 Q1,Q2 FDG6303N OR EQUIVALENT 300k⍀ TO VREF VLO 200k⍀ VLIMIT (0V TO 1.5V) Figure 23. High Accuracy Output Current Limit The C1 capacitor is added to smooth the voltage transitions at VLIM. Once an overcurrent condition is detected, the output voltage will turn down to 0 V within 30 ms. For a more exact measurement of the output current, place a sense resistor in series with the output load, as shown in Figure 23. The AD626 instrumentation amplifier is set for a gain of 100 with a reference voltage of 2.47 V from VREF. The output of the AD626 is equal to 100 × RS × IL and is fed to the AD8602, which is set up as a window comparator. With VX greater than VLO but less than VHI, VLIM will be pulled down to the voltage at VLIMIT. Should VX fall outside the voltage window, VLIM will be pulled to 1.5 V as in Figure 21. The trip points should be set according to VHI = VREF + 100 × RS I LIMIT + VLO = VREF – 100 × RS I LIMIT – AVDD The upper and lower trip point voltages can be set independently, allowing different maximum output current limits depending on the direction of the current. The resistor divider for VHI and VLO is tapped to VREF to maintain window accuracy with any changes in VREF. Using the values from Figure 23 with a 5 V supply, the output current will not exceed 1.5 A in either direction. Adding the current sensing resistor will slightly reduce efficiency. The power dissipated by this resistor is D × ITEC2 × RS if the TEC is heating, or (1–D) × ITEC2 × RS if the TEC is cooling. Include this when calculating efficiency as described in the Calculating Power Dissipation and Efficiency section. (44) –20– REV. D ADN8830 PVDD Using an RTD for Temperature Sensing The ADN8830 can be used with a resistive temperature device (RTD) as the temperature feedback sensor. The resistance of an RTD is linear with respect to temperature, offering an advantage over thermistors that have an exponential relationship to temperature. A constant current applied through an RTD will yield a voltage proportional to temperature. However, this voltage could be on the order of only 0.5 mV/°C, thus requiring the use of additional amplification to achieve a usable signal level. The ADT70 from Analog Devices can be used to bias and amplify the voltage across an RTD, which can then be fed directly to the THERMIN pin on the ADN8830 to provide temperature feedback for the TEC controller. The ADT70 uses a 0.9 mA current source to drive the RTD and an instrumentation amplifier with adjustable gain to boost the RTD voltage. Application notes and typical schematics for this device can be found in the ADT70 Data Sheet. Most RTDs have a positive temperature coefficient, also called tempco, as opposed to thermistors, which have a negative tempco. For the OUT A output to drive the TEC– input as shown in Figure 1, the signal from an RTD must be conditioned to create a negative tempco. This can be easily done using an inverting amplifier. Alternately, OUT A can be connected to drive TEC+ with OUT B driving TEC– with a positive tempco at THERMIN. This is highlighted in the Output Driver Amplifiers section. For the ADN8830, proper operation care should be taken to ensure the voltage at THERMIN remains within 0.4 V and 2.0 V. Using a 1 kΩ RTD with the ADT70 will yield a THERMIN voltage of 0.9 V at 25°C. Using the application circuit shown in Figure 22 will provide a nominal output voltage of 1.0 V at 25°C and a total gain of 66.7 mV/Ω. Using an RTD with a temperature coefficient of 0.375 Ω/°C will give a THERMIN voltage swing from 1.5 V at 5°C to 0.5 V at 45°C, well within the input range of the ADN8830. OUT A Q1 P1 L1 RL OUT B Q2 N1 C1 Q3 N2 NO CONNECTION TO P2 REQUIRED Figure 24. Using the ADN8830 to Drive a Heating Element Current is delivered from the PWM amplifier through Q3 when the voltage at THERMIN is lower than TEMPSET. If the object temperature is greater than the target temperature, Q3 will turn off and the current through the load goes to zero, allowing the object to cool back toward the ambient temperature. As the target temperature is approached, a steady output current should be reached. Naturally, a proper compensation network must be found to ensure stability and adequate temperature settling time. The P2 output from the ADN8830 should be left unconnected. Suggested Pad Layout for CP-32 Package Figure 25 shows the dimensions for the PC board pad layout for the ADN8830, which is a 5  5, 32-lead lead frame chipscale package. This package has a metallic heat slug that should be soldered to a copper pad on the PC board. Although the package slug is electrically connected to the substrate of the IC, the copper pad should be left electrically floating. This prevents potential noise injection into the substrate while maintaining good thermal conduction to the PC board. 0.69 (0.0272) 0.10 (0.0039) Using a Resistive Load as a Heating Element The ADN8830 can be used in applications that do not necessarily drive a TEC but require only a high current output into a load resistance. Such applications generally only require heating above ambient temperature and simply use the power dissipated by the load element to accomplish this. Because the power dissipated by such an element is proportional to the square of the output voltage, the ADN8830 application circuit must be modified. Figure 24 shows the preferred method for driving a heating element load. 5.36 (0.2110) 0.28 (0.0110) 3.78 (0.1488) 0.50 (0.0197) 3.68 (0.1449) PACKAGE OUTLINE CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN THERMAL PAD SHOULD BE SOLDERED TO AN ELECTRICALLY FLOATING PAD ON THE PC BOARD Figure 25. Suggested PC Board Layout for CP-32 Pad Landing REV. D –21– ADN8830 OUTLINE DIMENSIONS 0.30 0.25 0.18 32 25 0.50 BSC 1 24 TOP VIEW 0.80 0.75 0.70 8 16 9 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE 3.25 3.10 SQ 2.95 EXPOSED PAD 17 0.50 0.40 0.30 PIN 1 INDICATOR 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WHHD. 112408-A PIN 1 INDICATOR 5.10 5.00 SQ 4.90 Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very Very Thin Quad (CP-32-7) Dimensions shown in millimeters ORDERING GUIDE Model1 ADN8830ACPZ ADN8830ACPZ-REEL ADN8830ACPZ-REEL7 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] Package Option CP-32-7 CP-32-7 CP-32-7 Z = RoHS Compliant Part. REVISION HISTORY 3/12—Rev. C to Rev. D 8/03—Rev. A to Rev. B Added EPAD Notation ..................................................................... 3 Updated Outline Dimensions ........................................................22 Changes to Ordering Guide ...........................................................22 Updated Ordering Guide ................................................................. 3 Updated Thermal Setup Section ..................................................... 8 Updated Outline Dimensions........................................................ 23 11/03—Rev. B to Rev. C 2/03—Rev. 0 to Rev. A Changes to Ordering Guide ............................................................. 3 Deleted Figure 24 ............................................................................21 Deleted Boosting the Output Voltage section .............................22 Deleted Figure 26 ............................................................................22 Deleted Equations 45, 46 and 47 ...................................................22 Updated Outline Dimensions ........................................................23 Renumbered Figures .......................................................... Universal Changes to Thermistor Setup Section ............................................ 8 Changes to Figure 14 ...................................................................... 15 Changes to Figure 23 ...................................................................... 20 Changes to Figure 25 ...................................................................... 21 Updated Outline Dimensions........................................................ 23 ©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D02793-0-3/12(B) –22– REV. D