HMC1119LP4METR

0.25 dB LSB, 7-Bit, Silicon Digital Attenuator, 0.1 GHz to 6.0 GHz HMC1119 Data Sheet GND 4 ATTNIN 5 GND 6 D3 D4 D5 D6 20 19 SERIAL/ PARALLEL CONTROL 7-BIT DIGITAL ATTENUATOR GND 7 8 9 10 11 18 SERNIN 17 CLK 16 LE 15 GND 14 ATTNOUT 13 GND 12 PACKAGE BASE GND 12962-001 3 21 GND P/S 22 GND 2 23 GND VDD 24 GND 1 GND D0 D2 FUNCTIONAL BLOCK DIAGRAM Attenuation range: 0.25 dB LSB steps to 31.75 dB Low insertion loss: 1.1 dB at 1.0 GHz 1.3 dB at 2.0 GHz Typical step error: less than ±0.1 dB Excellent attenuation accuracy: less than ±0.2 dB Low phase shift error: 6° phase shift at 1.0 GHz Safe state transitions High linearity 1 dB compression (P1dB): 31 dBm typical Input third-order intercept (IP3): 54 dBm typical RF settling time (0.05 dB final RF output): 250 ns Single supply operation: 3.3 V to 5.0 V ESD rating: Class 2 (2 kV human body model (HBM)) 24-lead, 4 mm × 4 mm LFCSP package: 16 mm2 D1 FEATURES Figure 1. APPLICATIONS Cellular infrastructure Microwave radios and very small aperture terminals (VSATs) Test equipment and sensors IF and RF designs GENERAL DESCRIPTION The HMC1119 is a broadband, highly accurate, 7-bit digital attenuator, operating from 0.1 GHz to 6.0 GHz with 31.5 dB attenuation control range in 0.25 dB steps. The HMC1119 is implemented in a silicon process, offering very fast settling time, low power consumption, and high ESD robustness. The device features safe state transitions and is optimized for excellent step accuracy and high linearity over frequency and temperature range. The RF input and output are internally matched to 50 Ω and do not require any external matching components. The design is bidirectional; therefore, the RF input and output are interchangeable. Rev. C The HMC1119 has an on-chip regulator that can support a wide supply operating range from 3.3 V to 5.0 V with no performance change in electrical characteristics. The HMC1119 incorporates a driver that supports serial (3-wire) and parallel controls of the attenuator. The HMC1119 comes in a RoHS-compliant, compact, 4 mm × 4 mm LFCSP package. A fully populated evaluation board is available. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2016–2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC1119 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Insertion Loss, Return Loss, State Error, Step Error, and Relative Phase ................................................................................8 Functional Block Diagram .............................................................. 1 Input Power Compression and Third-Order Intercept ......... 10 General Description ......................................................................... 1 Theory of Operation ...................................................................... 11 Revision History ............................................................................... 2 Serial Control Interface ............................................................. 11 Specifications..................................................................................... 3 RF Input Output ......................................................................... 11 Electrical Specifications ............................................................... 3 Parallel Control Interface .......................................................... 12 Timing Specifications .................................................................. 4 Power-Up Sequence ................................................................... 12 Absolute Maximum Ratings ....................................................... 5 Applications Information .............................................................. 13 ESD Caution .................................................................................. 5 Evaluation Printed Circuit Board ............................................ 13 Pin Configuration and Function Descriptions ............................. 6 Packaging and Ordering Information ......................................... 15 Interface Schematics..................................................................... 7 Outline Dimensions ................................................................... 15 Typical Performance Characteristics ............................................. 8 Ordering Guide .......................................................................... 15 REVISION HISTORY 4/2018—Rev. B to Rev C Changes to Figure 23 ...................................................................... 12 Change to PCB Description, Table 7............................................ 13 Updated Outline Dimensions ....................................................... 15 9/2017—Rev. A to Rev. B Changed CP-24-16 to HCP-24-3 ................................. Throughout Updated Outline Dimensions ....................................................... 15 Changes to Ordering Guide .......................................................... 15 8/2017—Rev. 0 to Rev. A Added Timing Specifications Section.............................................4 Moved Table 2 ....................................................................................4 Changes to Figure 5 and Figure 6 ....................................................7 Changes to Serial Control Interface Section ............................... 11 Moved Figure 22 and Table 6 ........................................................ 11 Changes to Figure 23...................................................................... 12 Moved Parallel Control Interface Section, Direct Parallel Mode Section, Latched Parallel Mode Section, Power-Up Sequence Section, and Power-Up States Section ......................................... 12 Updated Outline Dimensions ....................................................... 15 9/2016—Revision 0: Initial Version Rev. C | Page 2 of 15 Data Sheet HMC1119 SPECIFICATIONS ELECTRICAL SPECIFICATIONS VDD = 3.3 V to 5.0 V, TA = 25°C, 50 Ω system, unless otherwise noted. Table 1. Parameter FREQUENCY RANGE INSERTION LOSS ATTENUATION Range Accuracy Step Error Overshoot RETURN LOSS ATTNIN, ATTNOUT RELATIVE PHASE SWITCHING CHARACTERISTICS tRISE, tFALL tON, tOFF Settling Time INPUT LINEARITY 0.1 dB Compression (P0.1dB) 1 dB Compression (P1dB) Input Third-Order Intercept (IP3) SUPPLY CURRENT (IDD) CONTROL VOLTAGE THRESHOLD Low High RECOMMENDED OPERATING CONDITIONS Supply Voltage Range (VDD) Digital Control Voltage Range RF Input Power Case Temperature (TCASE) Test Conditions/Comments 0.1 GHz to 1.0 GHz 0.1 GHz to 2.0 GHz 0.1 GHz to 4.0 GHz 0.1 GHz to 6.0 GHz 0.2 GHz to 6.0 GHz Delta between minimum and maximum attenuation states Referenced to insertion loss; all attenuation states Min 0.1 Typ 1.1 1.3 1.6 2.0 Max 6.0 1.8 2.0 2.3 2.8 31.75 −(0.05 + 4% of attenuation setting) Unit GHz dB dB dB dB dB +(0.05 + 4% of attenuation setting) dB All attenuation states Between all attenuation states All attenuation states 1.0 GHz 2.0 GHz 4.0 GHz 6.0 GHz 1.0 GHz 2.0 GHz 4.0 GHz 6.0 GHz ±0.1 ≤0.1 dB dB 23 22 19 17 6 18 38 58 dBm dBm dBm dBm Degrees Degrees Degrees Degrees 10%/90% RF output 50% CTL to 10%/90% RF output 50% CTL to 0.05 dB final RF output 50% CTL to 0.10 dB final RF output All attenuation states, 0.2 GHz to 6 GHz 60 150 250 200 ns ns ns ns 30 31 54 dBm dBm dBm 0.3 0.6 mA mA Two-tone input power = 16 dBm/tone, ∆f = 1 MHz VDD = 3.3 V VDD = 5.0 V