LT8708-1
80V Synchronous 4-Switch Buck-Boost DC/DC
Slave Controller for LT8708 Multiphase System
FEATURES
DESCRIPTION
Slave Chip of LT8708 to Deliver Additional Power
n Good Current Matching to the Average Output
Current of LT8708 Through Current Regulation
n Easily Paralleled with LT8708 Through Four Pins
n Synchronized Start-Up with LT8708
n Same Conduction Modes as LT8708
n Synchronous Rectification: Up to 98% Efficiency
n Frequency Range: 100kHz to 400kHz
n Available in 40-Lead (5mm × 8mm) QFN with High
Voltage Pin Spacing and 64-Lead (10mm × 10mm)
eLQFP
n AEC-Q100 in Progress
The LT®8708-1 is a high performance buck-boost
switching regulator controller that is paralleled with the
LT8708 to add power and phases to an LT8708 system.
The LT8708-1 always operates as a slave to the master
LT8708 and has the capability of delivering as much current or power as the master. One or more slaves can be
connected to a single master, proportionally increasing
power and current capability of the system.
n
APPLICATIONS
The LT8708-1 has the same conduction modes as LT8708,
allowing the LT8708-1 to conduct current and power in
the same direction(s) as the master. The master controls
the overall current and voltage limits for an LT8708 multiphase system, and the slaves comply with these limits.
LT8708-1s can be easily paralleled with the LT8708 by
connecting four signals together. Two additional current
limits (forward VIN current and reverse VIN current) are
available on each slave that can be set independently.
High Voltage Buck-Boost Converters
n Bidirectional Charging Systems
n Automotive 48V Systems
n
All registered trademarks and trademarks are the property of their respective owners.
TYPICAL APPLICATION
The LT8708-1 Two-Phase 12V Bidirectional Dual Battery System with FHCM and RHCM
VBAT2
VBAT1
TO DIODE
DB2
TO DIODE
DB1
MASTER
TG1 BOOST1 SW1 BG1 CSP CSN
CSNIN
LD033
LT8708*
SWEN
*REFER TO
LT8708 DATA
SHEET FOR
MASTER SETUP
RVSOFF
CLKOUT
ICP
DIR ICN
RVS (0V) FWD (3V)
POWER TRANSFER
DECISION LOGIC
LD033
LD033
97
96
CSNOUT
EXTVCC
VOUTLOMON
INTVCC
94
LT8708-1
SLAVE
MODE VC
98
95
VBAT2 = 13.5V
VBAT2 CHARGING CURRENT = 30A
10
12
14
VBAT1 (V)
LD033
16
87081 TA01b
GATEVCC
DIR
FBIN
99
GND BG2 SW2 BOOST2 TG2
CSPOUT
CSPIN
VINCHIP
SHDN
SWEN
RVSOFF
SYNC
ICP
ICN
VINHIMON
100
10V TO
16V
BATTERY
EFFICIENCY (%)
10V TO 16V
BATTERY
Efficiency
RT
IMON_OP
IMON_ON
IMON_INP
IMON_INN
SS CLKOUT FBOUT
DB1
DB2
TO
TO
BOOST1 BOOST2
120kHz
87081 TA01a
Rev A
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1
LT8708-1
TABLE OF CONTENTS
Features...................................................... 1
Applications................................................. 1
Typical Application ......................................... 1
Description.................................................. 1
Absolute Maximum Ratings............................... 3
Pin Configuration........................................... 3
Order Information........................................... 4
Electrical Characteristics.................................. 4
Typical Performance Characteristics.................... 8
Pin Functions............................................... 10
Block Diagram.............................................. 13
Operation................................................... 14
Common LT8708-1 and LT8708 Features................ 14
Adding Phases to an LT8708 Application................. 14
Adding Phases: The Master LT8708 ..................... 14
Adding Phases: The Slave LT8708-1 ..................... 16
Start-Up................................................................... 17
Start-Up: SWEN Pin............................................... 17
Start-Up: Soft-Start of Switching Regulator.......... 18
Control Overview..................................................... 18
Power Switch Control ............................................. 19
Unidirectional and Bidirectional Conduction............ 19
Error Amplifiers....................................................... 19
Transfer Function: IOUT(SLAVE) vs IOUT(MASTER)........... 20
Transfer Function: CCM......................................... 21
Transfer Function: DCM, HCM and Burst Mode
Operation................................................................. 21
Current Monitoring and Limiting.............................. 21
Monitoring: IOUT(SLAVE)..................................................... 21
Monitoring and Limiting: IIN(SLAVE) ....................... 21
Multiphase Clocking................................................22
Applications Information................................. 23
Quick-Start Multiphase Setup..................................23
Quick Setup: Design the Master Phase..................23
Quick Setup: Design the Slave Phase(s)................23
Quick Setup: Evaluation.........................................23
Choosing the Total Number of Phases.....................23
Operating Frequency Selection................................ 24
CIN and COUT Selection............................................ 24
CIN and COUT Selection: VIN Capacitance............... 24
CIN and COUT Selection: VOUT Capacitance............25
VINHIMON, VOUTLOMON and RVSOFF ..................25
Configuring the IIN(SLAVE) Current Limits.................26
Regulating IOUT(SLAVE)......................................................... 26
IOUT(SLAVE): Circuit Description..............................26
IOUT(SLAVE): Configuration..................................... 28
Loop Compensation................................................. 28
Voltage Lockouts.....................................................29
Circuit Board Layout Checklist ................................29
Design Example ......................................................29
Typical Applications....................................... 31
Package Description...................................... 35
Revision History........................................... 37
Typical Application........................................ 38
Related Parts............................................... 38
Rev A
2
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LT8708-1
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VCSP – VCSN, VCSPIN – VCSNIN,
VCSPOUT – VCSNOUT................................ –0.3V to 0.3V
CSP, CSN Voltage.......................................... –0.3V to 3V
VC Voltage (Note 2).................................... –0.3V to 2.2V
RT, FBOUT, SS Voltage................................. –0.3V to 5V
IMON_INP, IMON_INN, IMON_OP,
IMON_ON, ICP, ICN Voltage...................... –0.3V to 5V
SYNC Voltage............................................. –0.3V to 5.5V
INTVCC, GATEVCC Voltage............................. –0.3V to 7V
VBOOST1 – VSW1, VBOOST2 – VSW2................. –0.3V to 7V
SWEN, RVSOFF Voltage................................ –0.3V to 7V
SWEN Current........................................................0.5mA
RVSOFF Current........................................................1mA
FBIN, SHDN Voltage ................................... –0.3V to 30V
VINHIMON Voltage...................................... –0.3V to 30V
VOUTLOMON Voltage................................... –0.3V to 5V
DIR, MODE Voltage....................................... –0.3V to 5V
CSNIN, CSPIN, CSPOUT, CSNOUT Voltage....–0.3V to 80V
VINCHIP, EXTVCC Voltage............................. –0.3V to 80V
SW1, SW2 Voltage ...................................... 81V (Note 6)
BOOST1, BOOST2 Voltage.......................... –0.3V to 87V
BG1, BG2, TG1, TG2............................................ (Note 5)
LDO33, CLKOUT................................................. (Note 8)
Operating Junction Temperature Range
LT8708-1E (Notes 3, 8)........................–40°C to 125°C
LT8708-1I (Notes 3, 8).........................–40°C to 125°C
LT8708-1H (Notes 3, 8)........................–40°C to 150°C
Storage Temperature Range....................–65°C to 150°C
PIN CONFIGURATION
TOP VIEW
40 39 38 37 36 35
NC
CLKOUT
LDO33
IMON_ON
IMON_OP
MODE
SWEN
INTVCC
NC
VINCHIP
NC
CSPIN
CSNIN
NC
NC
NC
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
VINCHIP
INTVCC
SWEN
MODE
IMON_OP
IMON_ON
LDO33
TOP VIEW
34
CLKOUT 1
33 CSPIN
SS 2
32 CSNIN
SHDN 3
31 CSNOUT
30 CSPOUT
CSN 4
CSP 5
29 EXTVCC
ICN 6
DIR 7
41
GND
FBIN 8
28 ICP
27 VINHIMON
FBOUT 9
26 VOUTLOMON
VC 10
25 RVSOFF
IMON_INP 11
24 BOOST1
IMON_INN 12
RT 13
23 TG1
NC
SS
SHDN
CSN
CSP
ICN
DIR
FBIN
FBOUT
VC
IMON_INP
IMON_INN
RT
SYNC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
65
GND
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
NC
CSNOUT
CSPOUT
NC
NC
NC
EXTVCC
NC
ICP
VINHIMON
VOUTLOMON
RVSOFF
NC
BOOST1
TG1
SW1
NC
NC
GND
BG1
GATEVCC
BG2
NC
BOOST2
TG2
SW2
NC
NC
NC
NC
NC
NC
SW2
TG2
BOOST2
BG2
GND
GATEVCC
19 20 21
BG1
15 16 17 18
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
22 SW1
SYNC 14
UHG PACKAGE
40-LEAD (5mm × 8mm) PLASTIC QFN
TJMAX = 150°C, θJA = 36°C/W, θJC = 38°C/W
EXPOSED PAD (PIN 41) IS GND, MUST BE SOLDERED TO PCB
LWE PACKAGE
64-LEAD (10mm × 10mm) PLASTIC LQFP
TJMAX = 150°C, θJA = 17°C/W, θJC = 2.5°C/W
EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB
Rev A
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3
LT8708-1
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT8708EUHG-1#PBF
LT8708EUHG-1#TRPBF
87081
40-Lead (5mm × 8mm) Plastic QFN
–40°C to 125°C
LT8708IUHG-1#PBF
LT8708IUHG-1#TRPBF
87081
40-Lead (5mm × 8mm) Plastic QFN
–40°C to 125°C
LT8708HUHG-1#PBF
LT8708HUHG-1#TRPBF
87081
40-Lead (5mm × 8mm) Plastic QFN
–40°C to 150°C
LT8708EUHG-1#WPBF
LT8708EUHG-1#WTRPBF
87081
40-Lead (5mm × 8mm) Plastic QFN
–40°C to 125°C
LT8708IUHG-1#WPBF
LT8708IUHG-1#WTRPBF
87081
40-Lead (5mm × 8mm) Plastic QFN
–40°C to 125°C
LT8708HUHG-1#WPBF
LT8708HUHG-1#WTRPBF
87081
40-Lead (5mm × 8mm) Plastic QFN
–40°C to 150°C
AUTOMOTIVE PRODUCTS**
TRAY
PART MARKING*
PACKAGE DESCRIPTION
LT8708ELWE-1#PBF
LT8708LWE-1
64-Lead (10mm × 10mm) Plastic eLQFP
MSL RATING
3
TEMPERATURE RANGE
–40°C to 125°C
LT8708ILWE-1#PBF
LT8708LWE-1
64-Lead (10mm × 10mm) Plastic eLQFP
3
–40°C to 125°C
LT8708HLWE-1#PBF
LT8708LWE-1
64-Lead (10mm × 10mm) Plastic eLQFP
3
–40°C to 150°C
LT8708ELWE-1#WPBF
LT8708LWE-1
64-Lead (10mm × 10mm) Plastic eLQFP
3
–40°C to 125°C
LT8708ILWE-1#WPBF
LT8708LWE-1
64-Lead (10mm × 10mm) Plastic eLQFP
3
–40°C to 125°C
LT8708HLWE-1#WPBF
LT8708LWE-1
64-Lead (10mm × 10mm) Plastic eLQFP
3
–40°C to 150°C
AUTOMOTIVE PRODUCTS**
Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
**Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These
models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your
local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for
these models.
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VINCHIP =12V, SHDN = 3V, DIR = 3.3V unless otherwise noted. (Note 3).
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Voltage Supplies and Regulators
VINCHIP Operating Voltage Range
EXTVCC = 0V
EXTVCC = 7.5V
VINCHIP Quiescent Current
Not Switching, VEXTVCC = 0
SWEN = 3.3V
SWEN = 0V
VINCHIP Quiescent Current in Shutdown
VSHDN = 0V
EXTVCC Switchover Voltage
IINTVCC = –20mA, VEXTVCC Rising
l
l
l
5.5
2.8
6.15
EXTVCC Switchover Hysteresis
INTVCC Current Limit
80
80
V
V
4.7
2.45
7.5
4.5
mA
mA
0
1
µA
6.4
6.6
V
0.2
V
Max Current Draw from INTVCC and LDO33 Pins
Combined. Regulated from VINCHIP or EXTVCC (12V)
INTVCC = 5.25V
l
INTVCC = 4.4V
l
90
28
127
42
165
55
mA
mA
INTVCC Voltage
Regulated from VINCHIP, IINTVCC = 20mA
Regulated from EXTVCC (12V), IINTVCC = 20mA
6.1
6.1
6.3
6.3
6.5
6.5
V
V
INTVCC Load Regulation
IINTVCC = 0mA to 50mA
–0.5
–1.5
%
INTVCC, GATEVCC Undervoltage Lockout
INTVCC Falling, GATEVCC Connected to INTVCC
4.65
4.85
V
l
l
l
4.45
Rev A
4
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LT8708-1
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VINCHIP =12V, SHDN = 3V, DIR = 3.3V unless otherwise noted. (Note 3).
PARAMETER
CONDITIONS
INTVCC, GATEVCC Undervoltage Lockout Hysteresis
GATEVCC Connected to INTVCC
INTVCC Regulator Dropout Voltage
VINCHIP – VINTVCC, IINTVCC = 20mA
LDO33 Pin Voltage
5mA from LDO33 Pin
LDO33 Pin Load Regulation
ILDO33 = 0.1mA to 5mA
LDO33 Pin Current Limit
SYNC = 3V
LDO33 Pin Undervoltage Lockout
LDO33 Falling
MIN
TYP
MAX
160
mV
245
l
l
3.23
mV
3.295
3.35
V
–0.25
–1
%
mA
12
17.25
22
2.96
3.04
3.12
LDO33 Pin Undervoltage Lockout Hysteresis
UNITS
35
V
mV
Switching Regulator Control
Maximum Current Sense Threshold (VCSP – VCSN)
Boost Mode, Minimum M3 Switch Duty Cycle
l
76
93
Maximum Current Sense Threshold (VCSN – VCSP)
Buck Mode, Minimum M2 Switch Duty Cycle
l
68
Maximum Current Sense Threshold (VCSN – VCSP)
Boost Mode, Minimum M3 Switch Duty Cycle
l
79
Maximum Current Sense Threshold (VCSP – VCSN)
Buck Mode, Minimum M2 Switch Duty Cycle
l
72
Gain from VC to Max Current Sense Voltage
(VCSP – VCSN) (A5 in the Block Diagram)
Boost Mode
Buck Mode
SHDN Input Voltage High
SHDN Rising to Enable the Device
QFN
LWE
SHDN Pin Bias Current
mV
82
97
mV
93
108
mV
84
96
135
–135
l 1.175
l 1.175
SHDN Input Voltage High Hysteresis
SHDN Input Voltage Low
110
1.221 1.275
1.221 1.29
40
Device Disabled, Low Quiescent Current
(LT8708E-1, LT8708I-1)
(LT8708H-1)
l
l
VSHDN = 3V
VSHDN = 12V
0
14
l 1.156
SWEN Rising Threshold Voltage
SWEN Threshold Voltage Hysteresis
mV
mV/V
mV/V
V
V
mV
0.35
0.3
V
V
1
22
µA
µA
1.208 1.256
22
V
mV
ISWEN = 200µA
SHDN = 0V or VINCHIP = 0V
SHDN = 3V
l
l
SHDN = 3V
l
0.75
MODE Pin Continuous Conduction Mode (CCM) Threshold
l
0.4
MODE Pin Hybrid DCM/CCM Mode (HCM) Range
l
0.8
1.2
V
MODE Pin Discontinuous Conduction Mode (DCM) Range
l
1.6
2.0
V
MODE Pin Burst Mode Operation Threshold
l
DIR Pin Forward Operation Threshold
l
DIR Pin Reverse Operation Threshold
l
SWEN Output Voltage Low
SWEN Internal Pull-Down Release Voltage
RVSOFF Output Voltage Low
IRVSOFF = 200µA
RVSOFF Falling Threshold Voltage
0.9
0.2
0.8
V
2.4
V
V
1.2
l
0.08
l 1.155
1.209 1.275
0.5
165
VSS = 0V
VSS = 0.5V
V
V
V
1.6
RVSOFF Threshold Voltage Hysteresis
Soft-Start Charging Current
1.1
0.5
V
V
V
mV
13
21
19
31
25
41
µA
µA
IMON_ON Rising Threshold for FDCM Operation
MODE = 1V (HCM), DIR = 3.3V
l
235
255
280
mV
IMON_ON Falling Threshold for CCM Operation
MODE = 1V (HCM), DIR = 3.3V
l
185
205
235
mV
IMON_INP Rising Threshold for RDCM Operation
MODE = 1V (HCM), DIR = 0V
l
235
255
280
mV
IMON_INP Falling Threshold for CCM Operation
MODE = 1V (HCM), DIR = 0V
l
185
205
235
mV
Rev A
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5
LT8708-1
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VINCHIP =12V, SHDN = 3V, DIR = 3.3V unless otherwise noted. (Note 3).
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
ICP Rising Threshold for Start Switching
l
485
510
536
mV
ICN Rising Threshold for Start Switching
l
485
510
536
mV
ICP Rising Threshold for Enabling Non-CCM Offset Current
l
680
704
730
mV
ICP Falling Threshold for Disabling Non-CCM Offset Current
l
500
530
560
mV
ICN Rising Threshold for Enabling Non-CCM Offset Current
l
680
704
730
mV
ICN Falling Threshold for Disabling Non-CCM Offset Current
l
500
530
560
mV
Voltage Regulation Loops (Refer to Block Diagram to Locate Amplifiers)
Regulation Voltage for FBOUT
Regulate VC to 1.2V
l 1.193
1.207 1.222
V
Regulation Voltage for FBIN
Regulate VC to 1.2V
l 1.184
1.205 1.226
V
0.002 0.005
%/V
Line Regulation for FBOUT and FBIN Error Amp Reference Voltage VINCHIP = 12V to 80V, Not Switching
FBOUT Pin Bias Current
Current Out of Pin
FBOUT Error Amp EA4 gm
FBOUT Error Amp EA4 Voltage Gain
VOUTLOMON Voltage Activation Threshold
Falling
l 1.185
VOUTLOMON Threshold Voltage Hysteresis
15
nA
345
µmho
245
V/V
1.207 1.225
24
VVOUTLOMON = 1.24V, Current Into Pin
VVOUTLOMON = 1.17V, Current Into Pin
VOUTLOMON Pin Bias Current
FBIN Pin Bias Current
l
0.8
Current Out of Pin
0.01
1
V
mV
1.2
µA
µA
10
nA
FBIN Error Amp EA3 gm
235
µmho
FBIN Error Amp EA3 Voltage Gain
150
V/V
VINHIMON Voltage Activation Threshold
Rising
l 1.185
VINHIMON Threshold Voltage Hysteresis
1.207
1.23
24
VVINHIMON = 1.17V, Current Into Pin
VVINHIMON = 1.24V, Current Out of Pin
VINHIMON Pin Bias Current
l
0.8
0.01
1
V
mV
1.2
µA
µA
Current Regulation Loops (Refer to Block Diagram to Locate Amplifiers)
Regulation Voltages for IMON_INP and IMON_OP
VC = 1.2V
l 1.185
1.209 1.231
V
Regulation Voltages for IMON_INN
VC = 1.2V
l 1.185
1.21
1.24
V
Line Regulation for IMON_INP, IMON_INN and IMON_OP Error
Amp Reference Voltage
VINCHIP = 12V to 80V
0.002 0.005
%/V
CSPIN Bias Current
VCSPIN = 12V
VCSPIN = 1.5V
0.01
0.01
µA
µA
CSNIN Bias Current
BOOST Capacitor Charge Control Block Not Active
VSWEN = 3.3V, VCSPIN = VCSNIN = 12V
VSWEN = 3.3V, VCSPIN = VCSNIN = 1.5V
VSWEN = 0V
84
4.25
0.01
µA
µA
µA
CSPIN, CSNIN Common Mode Operating Voltage Range
l
0
80
V
CSPIN, CSNIN Differential Mode Operating Voltage Range
l
–100
100
mV
IMON_INP Output Current
IMON_INN Output Current
VCSPIN – VCSNIN = 50mV, VCSNIN = 5V
VCSPIN – VCSNIN = 50mV, VCSNIN = 5V
VCSPIN – VCSNIN = 5mV, VCSNIN = 5V
VCSPIN – VCSNIN = 5mV, VCSNIN = 5V
VCSNIN – VCSPIN = 50mV, VCSNIN = 5V
VCSNIN – VCSPIN = 50mV, VCSNIN = 5V
VCSNIN – VCSPIN = 5mV, VCSNIN = 5V
VCSNIN – VCSPIN = 5mV, VCSNIN = 5V
l
l
l
l
67
64.5
22.5
20
70
70
25
25
73
75.5
27.5
30
µA
µA
µA
µA
66
65
19
18
70
70
25
25
74
75
30.5
32
µA
µA
µA
µA
Rev A
6
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LT8708-1
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VINCHIP =12V, SHDN = 3V, DIR = 3.3V unless otherwise noted. (Note 3).
PARAMETER
CONDITIONS
MIN
IMON_INP and IMON_INN Max Output Current
l
TYP
MAX
120
µA
190
IMON_INP Error Amp EA5 gm
IMON_INP Error Amp EA5 Voltage Gain
UNITS
µmho
130
V/V
IMON_INN Error Amp EA1 gm
FBIN = 0V, FBOUT = 3.3V
190
µmho
IMON_INN Error Amp EA1 Voltage Gain
FBIN = 0V, FBOUT = 3.3V
130
V/V
CSPOUT Bias Current
VCSPOUT = 12V
VCSPOUT = 1.5V
0.01
0.01
µA
µA
CSNOUT Bias Current
BOOST Capacitor Charge Control Block Not Active
VSWEN = 3.3V, VCSPOUT = VCSNOUT = 12V
VSWEN = 3.3V, VCSPOUT = VCSNOUT = 1.5V
VSWEN = 0V
83
4.25
0.01
µA
µA
µA
CSPOUT, CSNOUT Common Mode Operating Voltage Range
l
0
80
V
CSPOUT, CSNOUT Differential Mode Operating Voltage Range
l
–100
100
mV
73
75
27.5
29
17.5
19.5
µA
µA
µA
µA
µA
µA
VCSNOUT – VCSPOUT = 50mV, VCSNOUT = 5V
VCSNOUT – VCSPOUT = 50mV, VCSNOUT = 5V
VCSNOUT – VCSPOUT = 5mV, VCSNOUT = 5V
VCSNOUT – VCSPOUT = 5mV, VCSNOUT = 5V
VCSNOUT – VCSPOUT = −5mV, VCSNOUT = 5V
VCSNOUT – VCSPOUT = −5mV, VCSNOUT = 5V
IMON_ON Output Current
IMON_ON Max Output Current
Regulate VC to 1.2V
RIMON_OP = 17.4kΩ
VCSNOUT = 12V
CSPOUT–CSNOUT Regulation Voltage
l
67
65
22.5
20.5
12.5
10.5
l
120
l
l
70
70
25
25
15
15
µA
ICP = 1.218V, ICN = 0V l
43
50
55
mV
ICP = 0V, ICN = 1.218V l
–55
–50
–44
mV
ICP = ICN = 0.348V
–6
0
6
mV
l
NMOS Gate Drivers
TG1, TG2 Rise Time
CLOAD = 3300pF (Note 4)
20
ns
TG1, TG2 Fall Time
CLOAD = 3300pF (Note 4)
20
ns
BG1, BG2 Rise Time
CLOAD = 3300pF (Note 4)
20
ns
BG1, BG2 Fall Time
CLOAD = 3300pF (Note 4)
20
ns
TG1 Off to BG1 On Delay
CLOAD = 3300pF Each Driver
90
ns
BG1 Off to TG1 On Delay
CLOAD = 3300pF Each Driver
80
ns
TG2 Off to BG2 On Delay
CLOAD = 3300pF Each Driver
90
ns
BG2 Off to TG2 On Delay
CLOAD = 3300pF Each Driver
80
ns
Min On-Time for Main Switch in Boost Operation (tON(M3,MIN))
Switch M3, CLOAD = 3300pF
200
ns
Min On-Time for Synchronous Switch in Buck Operation (tON(M2,MIN)) Switch M2, CLOAD = 3300pF
200
ns
Switch M3, CLOAD = 3300pF
230
ns
Min Off-Time for Synchronous Switch in Steady-State Buck Operation Switch M2, CLOAD = 3300pF
230
ns
Min Off-Time for Main Switch in Steady-State Boost Operation
Oscillator
Switch Frequency Range
SYNCing or Free Running
Switching Frequency, fOSC
RT = 365k
RT = 215k
RT = 124k
100
l
l
l
102
170
310
SYNC High Level for Synchronization
l
1.3
SYNC Low Level for Synchronization
l
SYNC Clock Pulse Duty Cycle
VSYNC = 0V to 2V
Recommended Min SYNC Ratio fSYNC/fOSC
120
202
350
400
kHz
142
235
400
kHz
kHz
kHz
V
20
0.5
V
80
%
3/4
Rev A
For more information www.analog.com
7
LT8708-1
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VINCHIP =12V, SHDN = 3V, DIR = 3.3V unless otherwise noted. (Note 3).
PARAMETER
CONDITIONS
CLKOUT Output Voltage High
VLDO33 – VCLKOUT, 1mA Out of CLKOUT Pin,
ILDO33 = 0µA
CLKOUT Output Voltage Low
1mA Into CLKOUT Pin
CLKOUT Duty Cycle
TJ = –40°C
TJ = 25°C
TJ = 125°C
CLKOUT Rise Time
CLOAD = 200pF
CLKOUT Fall Time
CLOAD = 200pF
CLKOUT Phase Delay
SYNC Rising to CLKOUT Rising, fOSC = 100kHz
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Do not force voltage on the VC pin.
Note 3: The LT8708E-1 is guaranteed to meet performance specifications
from 0°C to 125°C junction temperature. Specifications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls.
The LT8708I-1 is guaranteed over the full –40°C to 125°C junction
temperature range. The LT8708H-1 is guaranteed over the full –40°C to
150°C operating junction temperature range.
Note 4: Rise and fall times are measured using 10% and 90% levels.
Delay times are measured using 50% levels.
MIN
90
80
80
70
70
70
30
20
10
0
0.01
0.1
1
IOUT (A)
10
60
50
40
VIN = 16V
VOUT = 12V
HCM
DCM
CCM
30
20
10
30
87081 G01
EFFICIENCY (%)
90
80
EFFICIENCY (%)
90
EFFICIENCY (%)
100
VIN = 11.5V
VOUT = 14.5V
HCM
DCM
CCM
0
0.01
0.1
250
mV
25
100
mV
22.7
44.1
77
%
%
%
20
ns
l
160
180
ns
200
Degree
Efficiency vs Output Current
(Buck-Boost Region – Page 32)
100
40
100
TA = 25°C, unless otherwise noted.
100
50
UNITS
Note 5: Do not apply a voltage or current source to these pins. They must be
connected to capacitive loads only, otherwise permanent damage may occur.
Note 6: Negative voltages on the SW1 and SW2 pins are limited, in an
application, by the body diodes of the external NMOS devices, M2 and
M3, or parallel Schottky diodes when present. The SW1 and SW2 pins
are tolerant of these negative voltages in excess of one diode drop below
ground, guaranteed by design.
Note 7: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed the maximum operating junction temperature
when overtemperature protection is active. Continuous operation above
the specified maximum operating junction temperature may impair device
reliability.
Note 8: Do not force voltage or current into these pins.
Efficiency vs Output Current
(Buck Region – Page 32)
60
MAX
20
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs Output Current
(Boost Region – Page 32)
TYP
1
IOUT (A)
10
60
50
40
VIN = 14.5V
VOUT = 14.5V
HCM
DCM
CCM
30
20
10
30
87081 G02
0
0.01
0.1
1
IOUT (A)
10
30
87081 G03
Rev A
8
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LT8708-1
TYPICAL PERFORMANCE CHARACTERISTICS
CSPOUT – CSNOUT Voltages
(ICP = 1.218V, ICN = 0V)
(Five Parts)
CSNOUT – CSPOUT Voltages
(ICP = 1.218V, ICN = 0V)
(Five Parts)
80
70
60
50
40
30
20
–50 –30 –10 10 30 50 70 90 110 130 150
TEMPERATURE (°C)
190
60
50
40
150
110
70
30
30
–10
–150
Maximum and Minimum VC vs SS
(ICP or ICN = 1V)
2.5
TJ = 25°C
MAXIMUM VC
1.5
1.5
0
0
0.25
0.50
0.75
ICP/ICN VOLTAGE (V)
1
VC (V)
1.5
VC (V)
2.0
2.0
1.0
0.5
MINIMUM VC
1.25
0
0.5
87081 G07
1
SS (V)
1.5
1.0
2
0
MINIMUM VC
0
0.25
0.75
1
Load Step (Page 32) VIN = 14.5V
VOUT = 14.5V
LT8708 IL
10A/DIV
LT8708 IL
10A/DIV
LT8708-1 IL
10A/DIV
LT8708-1 IL
10A/DIV
500μs/DIV
87081 G10
VBAT1 = 12V, VBAT2 REGULATED TO 14.5V
LOAD STEP = 10A TO 25A
LOAD APPLIED AT VBAT2 WITH
BATTERY DISCONNECTED
0.50
SS (V)
87081 G09
87081 G08
Load Step (Page 32) VIN = 12V
VOUT = 14.5V
500μs/DIV
MAXIMUM VC
0.5
MINIMUM VC
0
TJ = 25°C
MAXIMUM VC
2.0
0.5
150
87081 G06
Maximum and Minimum VC vs SS
(ICP = ICN =0.348V)
1.0
–75
0
75
CSPOUT–CSNOUT (mV)
87081 G05
2.5
TJ = 25°C
ICP = ICN = 0.348V
70
Maximum and Minimum VC vs
ICP_ICN (SS = 0)
VC (V)
VC = ~1.3V
20
–50 –30 –10 10 30 50 70 90 110 130 150
TEMPERATURE (°C)
87081 G04
2.5
IMON_OP Output Current
230
IMON_OP CURRENT (µA)
VC ≅ 1.3V
CSNOUT–CSPOUT VOLTAGES (mV)
CSPOUT–CSNOUT VOLTAGES (mV)
80
TA = 25°C, unless otherwise noted.
87081 G11
VBAT1 = 14.5V, VBAT2 REGULATED TO 14.5V
LOAD STEP = 10A TO 25A
LOAD APPLIED AT VBAT2 WITH
BATTERY DISCONNECTED
Rev A
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9
LT8708-1
TYPICAL PERFORMANCE CHARACTERISTICS
Load Step (Page 32) VIN = 16V
VOUT = 14.5V
Load Step (Page 33) VIN = 48V
VOUT = 14.5V
LT8708 IL
20A/DIV
LT8708 IL
10A/DIV
PHASE 1
PHASE 2
LT8708-1 IL
20A/DIV
LT8708-1 IL
20A/DIV
LT8708-1 IL
20A/DIV
LT8708-1 IL
10A/DIV
500μs/DIV
PIN FUNCTIONS
PHASE 3
PHASE 4
500μs/DIV
87081 G12
VBAT1 = 16V, VBAT2 REGULATED TO 14.5V
LOAD STEP = 10A TO 25A
LOAD APPLIED AT VBAT2 WITH
BATTERY DISCONNECTED
TA = 25°C, unless otherwise noted.
87081 G13
VBAT1 = 48V, VBAT2 REGULATED TO 14.5V
LOAD STEP = 20A TO 55A
LOAD APPLIED AT VBAT2 WITH
BATTERY DISCONNECTED
(QFN/eLQFP)
CLKOUT (Pin 1/Pin 63): Clock Output Pin. Use this pin to
synchronize one or more compatible switching regulator
ICs. CLKOUT toggles at the same frequency as the internal
oscillator or as the SYNC pin, but is approximately 180°
out of phase. CLKOUT may also be used as a temperature
monitor since the CLKOUT duty cycle varies linearly with
the part’s junction temperature. The CLKOUT pin can drive
capacitive loads up to 200pF.
ICN (Pin 6/Pin 6): Negative VOUT Current Command Pin.
The voltage on this pin determines the negative VOUT
current for LT8708-1 to regulate to. Connect this pin
to the master LT8708’s ICN pin. See the Applications
Information section for more information.
SS (Pin 2/Pin 2): Soft-Start Pin. Place a capacitor from
this pin to ground. A capacitor identical to the SS pin
capacitor used on the master LT8708 is recommended.
Upon start-up, this pin will be charged by an internal
resistor to 3.3V.
DIR (Pin 7/Pin 7): Direction pin when MODE is set for
DCM (discontinuous conduction mode) or HCM (hybrid
conduction mode) operation. Otherwise this pin is
ignored. Connect the pin to GND to process power from
the VOUT to VIN. Connect the pin to LDO33 to process
power from the VIN to VOUT. Drive this pin with the same
control signal, or connect this pin to the same voltages
as the master LT8708.
SHDN (Pin 3/Pin 3): Shutdown Pin. Tie high to enable
chip. Ground to shut down and reduce quiescent current
to a minimum. Do not float this pin.
FBIN (Pin 8/Pin 8): VIN Feedback Pin. This pin is connected to the input of error amplifier EA3. Typically, connect this pin to LDO33 to disable the EA3.
CSN (Pin 4/Pin 4): The (–) Input to the Inductor Current
Sense and DCM Detect Comparator.
FBOUT (Pin 9/Pin 9): VOUT Feedback Pin. This pin is connected to the input of error amplifier EA4. Typically, connect this pin to GND to disable the EA4.
CSP (Pin 5/Pin 5): The (+) Input to the Inductor Current
Sense and DCM Detect Comparator. The VC pin voltage
and built-in offsets between CSP and CSN pins, in conjunction with the RSENSE value, set the inductor current
trip threshold. It is recommended to use the same value
RSENSE as the master LT8708.
VC (Pin 10/Pin 10): Error Amplifier Output Pin. Tie external compensation network to this pin.
IMON_INP (Pin 11/Pin 11): Positive VIN Current Monitor
and Limit Pin. The current out of this pin is 20µA plus a
current proportional to the positive average VIN current.
IMON_INP also connects to error amplifier EA5 and can
Rev A
10
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LT8708-1
PIN FUNCTIONS
(QFN/eLQFP)
be used to limit the maximum positive VIN current. See the
Applications Information section for more information.
IMON_INN (Pin 12/Pin 12): Negative VIN Current Monitor
and Limit Pin. The current out of this pin is 20µA plus a
current proportional to the negative average VIN current.
IMON_INN also connects to error amplifier EA1 and can
be used to limit the maximum negative VIN current. See
the Applications Information section for more information.
RT (Pin 13/Pin 13): Timing Resistor Pin. Adjusts the
switching frequency. Place a resistor from this pin to
ground to set the frequency. It is recommended to use
the same value RT resistor as the master LT8708. Do not
float this pin.
SYNC (Pin 14/Pin 14): To synchronize the switching frequency to an outside clock, simply drive this pin with
a clock. The high voltage level of the clock needs to
exceed 1.3V, and the low level should be less than 0.5V.
In a two-phase system, connect this pin to the master
LT8708’s CLKOUT pin to have a 180° phase shift. See the
Applications Information section for more information.
BG1, BG2 (Pin 16/Pin 20, Pin 18/Pin 22): Bottom Gate
Drive. Drives the gate of the bottom N-channel MOSFETs
between ground and GATEVCC.
GATEVCC (Pin 17/Pin 21): Power supply for bottom gate
drivers. Must be connected to the INTVCC pin. Do not
power from any other supply. Locally bypass to GND. It
is recommended to use the same value bypass cap as the
master LT8708.
BOOST1, BOOST2 (Pin 24/Pin 35, Pin 19/Pin 24):
Boosted Floating Driver Supply. The (+) terminal of the
bootstrap capacitor connects here. The BOOST1 pin
swings from a diode voltage below GATEVCC up to VIN +
GATEVCC. The BOOST2 pin swings from a diode voltage
below GATEVCC up to VOUT + GATEVCC.
TG1, TG2 (Pin 23/Pin 34, Pin 20/Pin 25): Top Gate Drive.
Drives the top N-channel MOSFETs with voltage swings
equal to GATEVCC superimposed on the switch node
voltages.
SW1, SW2 (Pin 22/Pin 33, Pin 21/Pin 26): Switch Nodes.
The (–) terminals of the bootstrap capacitors connect
here.
RVSOFF (Pin 25/Pin 37): Reverse Conduction Disable
Pin. This is an input/output open-drain pin that requires a
pull-up resistor. Pulling this pin low disables reverse current operation. Typically, connect this pin to the LT8708’s
RVSOFF pin. See the Unidirectional and Bidirectional
Conduction section for more information.
VOUTLOMON (Pin 26/Pin 38): VOUT Low Voltage Monitor
Pin. Connect a ±1% resistor divider between VOUT,
VOUTLOMON and GND to set an undervoltage level on
VOUT. When VOUT is lower than this level, reverse conduction is disabled to prevent drawing current from VOUT. See
the Applications Information section for more information.
VINHIMON (Pin 27/Pin 39): VIN High Voltage Monitor Pin.
Connect a ±1% resistor divider between VIN, VINHIMON
and GND in order to set an overvoltage level on VIN. When
VIN is higher than this level, reverse conduction is disabled to prevent current flow into VIN. See the Applications
Information section for more information.
ICP (Pin 28/Pin 40): Positive VOUT Current Command
Pin. The voltage on this pin determines the positive VOUT
current for LT8708-1 to regulate to. Connect this pin to
LT8708’s ICP pin. See the Applications Information section for more information.
EXTVCC (Pin 29/Pin 42): External VCC Input. When EXTVCC
exceeds 6.4V (typical), INTVCC will be powered from this
pin. When EXTVCC is lower than 6.4V, the INTVCC will be
powered from VINCHIP. It is recommended to use the same
value bypass cap as the master LT8708.
CSPOUT (Pin 30/Pin 46): The (+) Input to the VOUT
Current Monitor Amplifier. This pin and the CSNOUT pin
measure the voltage across the sense resistor, RSENSE2,
to provide the VOUT current signals. It is recommended
to use the same value RSENSE2 between the CSPOUT and
CSNOUT pins as the master LT8708. See Applications
Information section for proper use of this pin.
CSNOUT (Pin 31/Pin 47): The (–) Input to the VOUT
Current Monitor Amplifier. See Applications Information
section for proper use of this pin.
CSNIN (Pin 32/Pin 52): The (–) Input to the VIN Current
Monitor Amplifier. This pin and the CSPIN pin measure
the voltage across the sense resistor, RSENSE1, to provide
Rev A
For more information www.analog.com
11
LT8708-1
PIN FUNCTIONS
(QFN/eLQFP)
the VIN current signals. Connect this pin to VIN when not
in use. See Applications Information section for proper
use of this pin.
CSPIN (Pin 33/Pin 53): The (+) Input to the VIN Current
Monitor Amplifier. Connect this pin to VIN when not in
use. See Applications Information section for proper use
of this pin.
VINCHIP (Pin 34/Pin 55): Main Input Supply Pin for the
LT8708‑1. It must be locally bypassed to ground. It is
recommended to use the same value bypass cap as the
master LT8708.
INTVCC (Pin 35/Pin 57): 6.35V Regulator Output. Must be
connected to the GATEVCC pin. INTVCC is powered from
EXTVCC when the EXTVCC voltage is higher than 6.4V,
otherwise INTVCC is powered from VINCHIP. Bypass this
pin to ground with a minimum 4.7µF ceramic capacitor.
It is recommended to use the same value bypass cap as
the master LT8708.
SWEN (Pin 36/Pin 58): Switching Regulator Enable
Pin. Tie high through a resistor to enable the switching.
Ground to disable switching. This pin is pulled down during shutdown, a thermal lockout or when an internal UVLO
(Under Voltage Lockout) is detected. Do not float this pin.
Connect this pin to the LT8708’s SWEN pin for synchronized start-up. See the Start-Up: SWEN Pin section for
more details.
MODE (Pin 37/Pin 59): Conduction Mode Select Pin. The
voltage applied to this pin sets the conduction mode of
the controller. Apply less than 0.4V to enable continuous
conduction mode (CCM). Apply 0.8V to 1.2V to enable the
hybrid conduction mode (HCM). Apply 1.6V to 2.0V to
enable the discontinuous conduction mode (DCM). Apply
more than 2.4V to enable Burst Mode operation. It is recommended to drive this pin with the same control signal,
or connect this pin to the same value resistor dividers or
voltages as the master LT8708.
IMON_OP (Pin 38/Pin 60): Average VOUT Current
Regulation Pin. This pin servos to 1.207V to regulate the
average output current based on the ICP and ICN voltages.
Always connect a 17.4k resistor in parallel with a compensation network from this pin to GND. See the Applications
Information section for more information.
IMON_ON (Pin 39/Pin 61): Negative VOUT Current Monitor
Pin. The current out of this pin is 20µA plus a current proportional to the negative average VOUT current. See the
Applications Information section for more information.
LDO33 (Pin 40/Pin 62): 3.3V Regulator Output. Bypass
this pin to ground with a minimum 0.1µF ceramic capacitor. It is recommended to use the same value bypass cap
as the master LT8708.
GND (Pin 15/Pin 19, Exposed Pad Pin 41/Pin 65):
Ground. Tie directly to local ground plane.
Rev A
12
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LT8708-1
BLOCK DIAGRAM
TO LT8708’s VIN
RSENSE1
RSENSE
TO LT8708’s SWEN
CSN
CSNIN
–
CSPIN
+
SWEN
CSP
+
VINCHIP
TG1
A5
M1
GATEVCC
–
IMON_INN
CB1
SW1
–
A4
DB1
BOOST1
+
+
A3 –
CONTROL
AND
STATE
LOGIC
RVS
D1
(OPT)
D2
(OPT)
M2
BG1
GND
IMON_INP
BOOST CAPACITOR
CHARGE CONTROL
BG2
RT
LDO33
TO
LT8708’s
CLKOUT
OSC
TG2
M4
CB2
SYNC
BOOST2
+
RVSOFF
A2
DIR
–
RVS
VINHIMON
–
LDO33
M3
SW2
CLKOUT
DB2
TO LT8708’s
RRVSOFF
D3
(OPT)
D4
(OPT)
TO LT8708’s VIN
RHIMON1
RHIMON3
1.207V
RHIMON2
A7
+
3.3V
+
MODE
VOUTLOMON
1.207V
RLOMON3
IMON_OP
A6
–
SS
UV_INTVCC
A1
OT
CSPOUT
+
–
+
CSNOUT
–
–
+
TO
LT8708’s ICN
EA8
ICP
TO LT8708’s
ICP
–
SHDN
+
1.221V
–
UV_LDO33
UV_VIN
+
UV_GATEVCC
EA5
RSHDN2
–
TO LT8708’s VIN
–
EN
VIN
EN
6.3V
LDO
REG
LDO
REG
FBIN
+
3.3V
LDO
REG
–
+
INTERNAL
SUPPLY1
LDO33
1.207V
EA4
VC
RFBIN2
1.205V
INTERNAL
SUPPLY2
INTVCC
RFBIN1
EA3
–
1.21V
+
EXTVCC
6.3V
LDO
REG
RLOMON2
IMON_INP
+
6.4V
VOUT
RLOMON1
IMON_ON
1.209V
–
RSHDN1
ICN
+
EA6
START-UP LOGIC
RSENSE2
IMON_INN
EA1
FBOUT
RFBOUT1
RFBOUT2
87081 F01
Figure 1. Block Diagram
Rev A
For more information www.analog.com
13
LT8708-1
OPERATION
The LT8708-1 is a high performance 4-switch buck-boost
slave controller that is paralleled with the master LT8708
to increase power capability. Using LT8708-1(s) with the
LT8708, an application can command power to be delivered from VIN to VOUT or from VOUT to VIN as needed.
Table 1. LT8708 Data Sheet Sections that Apply to the LT8708-1
LT8708 DATA SHEET SECTION
ADDITIONAL INFORMATION
IN THIS DATA SHEET
Operation
Start-Up: SHDN Pin
Power Switch Control
COMMON LT8708-1 AND LT8708 FEATURES
The LT8708-1 and LT8708 share many common functions and features that are already documented in the
LT8708 data sheet. Table 1 lists the LT8708 data sheet
sections that also apply to the LT8708-1. For some of
these features, additional LT8708-1 specific information
is provided in this data sheet, as indicated in Table 1.
The focus of this data sheet is on how to use the
LT8708-1 to increase the number of switching phases
in an LT8708‑based application. As such, functionality
that is identical in both the LT8708 and LT8708-1 will not
necessarily be repeated here. It is assumed that readers
of this data sheet are already familiar with the LT8708.
ADDING PHASES TO AN LT8708 APPLICATION
In a multiphase LT8708 application, a single LT8708 is the
master of the system. One or more LT8708-1s are slaves
that provide additional current as needed. As the master
of the multiphase system, the LT8708 and its respective error amplifiers, determine the current necessary to
regulate the VIN voltage, VOUT voltage, VIN current and
VOUT current. The slave LT8708-1 operates by sensing
the IOUT(MASTER) (see Figure 2) and delivering a proportional amount of IOUT(SLAVE). Again, since IOUT(SLAVE) is
proportional to IOUT(MASTER), the master LT8708 is in
control of setting regulation voltages and current limits
to the system.
Each LT8708 and LT8708-1, connected in parallel, is
hereon referred to as a phase, the master and slave
VIN current is referred to as IIN(MASTER) and IIN(SLAVE),
respectively. For multiphase operation, the LT8708
should be configured according to the LT8708 data sheet.
Configuration of LT8708-1s should follow instructions
in this data sheet. Figure 2 shows a simplified drawing
of a multiphase system with one LT8708 and multiple
Unidirectional and Bidirectional Conduction
Yes
INTVCC/EXTVCC/GATEVCC/LDO33 Power
CLKOUT and Temperature Sensing
Applications Information
Internal Oscillator
SYNC Pin and Clock Synchronization
CLKOUT Pin and Clock Synchronization
Inductor Current Sensing and Slope
Compensation
RSENSE Selection and Maximum Current
RSENSE Filtering
Inductor (L) Selection
Power MOSFET Selection
Schottky Diode (D1, D2, D3, D4) Selection
Topside MOSFET Driver Supply
(CB1, DB1, CB2, DB2)
VINHIMON, VOUTLOMON and RVSOFF
Yes
INTVCC Regulators and EXTVCC Connection
LDO33 Regulator
Voltage Lockouts
Yes
Junction Temperature Measurement
Thermal Shutdown
Efficiency Considerations
Circuit Board Layout Checklist
Yes
LT8708-1s. It illustrates the basic connections needed to
add LT8708-1s to a multiphase system.
Adding Phases: The Master LT8708
The master controls the overall current delivered by the
multiphase system. For example, the LT8708 controls the
VIN and VOUT regulation voltages through its FBIN and
FBOUT pins. Since the slaves primarily duplicate the master’s IOUT(MASTER) current, the slave’s FBIN and FBOUT
pins and related circuitry are typically not used. See the
Error Amplifiers section on how they can affect VC and
how to disable them.
Rev A
14
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LT8708-1
OPERATION
IIN(MASTER)
VIN
IOUT(MASTER)
4-SWITCH BUCK-BOOST
RIN
ROUT
VOUT
CSNIN
CSPOUT
CSPIN
CSNOUT
FBOUT
VINCHIP
LT8708
MASTER
FBIN
LD033
IMON_ON
LD033
IMON_INP
DIR
IMON_INN
SWEN
RVSOFF SYNC
LD033
FWD (>1.6V)/
RVS ( 165°C
data sheet for more details. SWEN is internally pulled
down by the LT8708 and/or LT8708-1(s) when the respective switching regulator is unable or not ready to operate
(see CHIP OFF and SWITCHER OFF 1 states in Figure 3).
In a multiphase system, the SWEN pins are connected
between all phases. Due to the internal SWEN pull-down
on the LT8708 and LT8708-1, the external pull-up for
the common SWEN node should always have a current
limiting resistor. Typically, the common SWEN node is
pulled up, through a resistor, to the LT8708’s LDO33 pin.
In other cases, the common SWEN node can be digitally
driven through a current limiting resistor.
TJUNCTION < 160°C AND SHDN > 1.221V AND VINCHIP > 2.5V AND
((INTVCC AND GATEVCC < 4.65V)
OR LDO33 < 3.04V)
CHIP OFF
SWITCHER OFF 1
• SWITCHER OFF
• LDOs OFF
• SWEN PULLED LOW
• SWITCHER DISABLED
• INTVCC AND LDO33 OUTPUTS ENABLED
• SWEN AND SS PULLED LOW
(INTVCC AND GATEVCC > 4.81V) AND
LDO33 > 3.075V AND SWEN < 0.8V
SWITCHER OFF 2
• SWITCHER DISABLED
• INTVCC AND LDO33 OUTPUTS ENABLED
• SS PULLED LOW
(INTVCC AND GATEVCC > 4.81V) AND
LDO33 > 3.075V AND SWEN > 1.208V
INITIALIZE
• SS PULLED LOW
• VC FORCED TO COMMAND NEAR ZERO
CURRENT LIMIT
SS < 50mV
SOFT-START 1
ICP AND ICN < 510mV
• SS CHARGES UP
ICP OR ICN > 510mV
SOFT-START 2
• SS CHARGES UP
SS > 0.8V
SOFT-START 3
• SS CHARGES UP
• SWITCHER ENABLED
• M1, M4 ON-TIME SOFT-START
• VC IS FREE TO SLEW
SS > 1.8V
NORMAL MODE
• NORMAL OPERATION
87081 F02
Figure 3. Start-Up Sequence (All Values are Typical)
Rev A
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17
LT8708-1
OPERATION
SWEN is used to synchronize the start-up between all
phases of the system. If one or more of the phases is
unable to operate, SWEN is pulled low by those chips,
thus preventing the entire system from starting. After all
phases are ready to operate and SWEN has been pulled
down below 0.8V (typical) SWEN rises, due to the pullup resistor, and start-up proceeds, for all phases, to the
SWITCHER OFF 2 state.
When the common SWEN node rises above 1.208V (typical), all the phases proceed to the INITIALIZE state at the
same time.
Start-Up: Soft-Start of Switching Regulator
The soft-start sequence, described in this section, happens
independently and in parallel for each phase since each
phase has its own SS pin, external capacitor and related
circuitry. The remaining discussion concerns the LT8708-1
soft-start behavior. The LT8708 soft-start differs slightly.
In the INITIALIZE state, the SS pin is pulled low to prepare
for soft-starting the switching regulator. Also, VC is forced
to command near zero current, and IMON_OP is forced to
~1.209V (typical) to improve the transient behavior when
the LT8708-1 subsequently starts switching.
After SS has been discharged to less than 50mV, the
SOFT-START 1 state begins. In this state, an integrated
180k (typical) resistor from 3.3V pulls SS up. The rising
ramp rate of the SS pin voltage is set by this 180k resistor
and the external capacitor connected to this pin.
After SS reaches 0.2V (typical), the LT8708-1’s integrated
pull-up resistor is reduced from 180k to 90k to increase
the rising ramp rate of the SS pin voltage. This ensures
that the slave chip enters the normal mode in Figure 3
before the master chip, preventing saturation of the regulation loop during start-up.
Switching remains disabled until either (1) ICP or ICN
voltage becomes higher than 510mV (typical) (SOFTSTART 3) or (2) SS reaches 0.8V (typical) (SOFT-START 2).
As soon as switching is enabled, VC is free to slew under
the control of the internal error amplifiers (EA1–EA6). This
allows the average IOUT(SLAVE) to quickly follow the average IOUT(MASTER) without saturating the slave’s regulation
loop. During soft-start the LT8708-1 employs the same
switch control mechanism as the LT8708. See the Switch
Control: Soft-Start section of the LT8708 data sheet for
more information.
When SS reaches 1.8V (typical), the LT8708-1 exits
soft-start and enters normal mode. Typical values for the
external soft-start capacitor range from 220nF to 2µF.
It is recommended to use the same brand and value SS
capacitor for all the synchronized LT8708/ LT8708-1(s).
Using a slave SS capacitor value significantly higher than
the master SS capacitor value can result in undesirable
start-up behavior.
CONTROL OVERVIEW
The LT8708-1 is a slave current mode controller that
regulates the average IOUT(SLAVE) based on the master’s ICP and ICN voltages, or equivalently, the average
IOUT(MASTER). The main regulation loop involves EA6 (see
Figure 1). In a simple example of IOUT(SLAVE) regulation,
the CSPOUT–CSNOUT pins receive the IOUT(SLAVE) feedback signal which is summed with the ICP and ICN signals
from the LT8708 to generate the IMON_OP voltage using
A1 (see Figure 1). The IMON_OP voltage is compared to
the internal reference voltage using EA6. Low IMON_OP
voltages raise VC, which causes IOUT(SLAVE) to become
more positive (or less negative) and increases the current
out of the IMON_OP pin. Conversely, higher IMON_OP
voltages reduce VC, which causes IOUT(SLAVE) to become
less positive (or more negative) and reduces the current
flowing out of the IMON_OP pin.
The VC voltage typically has a Min to Max range of about
1.2V. The maximum VC voltage commands the most
positive inductor current, and thus, commands the most
power flow from VIN to VOUT. The minimum VC voltage
commands the most negative inductor current, and thus,
commands the most power flow from VOUT to VIN.
VC is the combined output of five internal error amplifiers
EA1–EA6 as shown in Table 3. In a common application,
IOUT(SLAVE) would be regulated using the main regulation
error amplifier EA6, while error amplifiers EA1 and EA5
are monitoring for excessive input current and EA3 and
EA4 are disabled.
Rev A
18
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LT8708-1
OPERATION
Table 3. Error Amplifiers (EA1–EA6)
AMPLIFIER
NAME
PIN NAME
USED TO LIMIT OR REGULATE
EA1
IMON_INN
Negative IIN(SLAVE)
EA3
FBIN
VIN Voltage
pins together. In addition, the RVSOFF pins of all phases
should be connected together.
Note that the current and power flow can also be restricted
to one direction, as needed, by the selected conduction
mode discussed in the Unidirectional and Bidirectional
Conduction section.
Note that when operating in the forward hybrid conduction
mode (FHCM), the LT8708-1 operation differs slightly from
the LT8708. Instead of measuring the ICN pin voltage for
light load detection, the LT8708-1 measures the IMON_ON
pin. Light load is detected when IMON_ON is above 245mV
(typical). Therefore, FHCM operation requires a 17.4k resistor, and a parallel filter capacitor, from ground to the IMON_
ON pin of the LT8708-1. Reverse hybrid conduction mode
(RHCM) operates identically in the LT8708 and LT8708-1.
See the Unidirectional and Bidirectional Conduction: HCM
section of the LT8708 data sheet for details.
POWER SWITCH CONTROL
ERROR AMPLIFIERS
EA4
FBOUT
VOUT Voltage
EA5
IMON_INP
Positive IIN(SLAVE)
EA6
IMON_OP
IOUT(SLAVE)
The LT8708-1 employs the same power switch control
as the LT8708 (see Power Switch Control section of the
LT8708 data sheet). Figure 4 shows a simplified diagram
of how the four power switches are connected to the
inductor, VIN, VOUT and ground.
VOUT
VIN
TG1
M1
SW1
BG1
L
M4
TG2
SW2
M2
M3
Five internal error amplifiers combine to drive VC according to Table 4, with the highest priority being at the top.
Table 4. Error Amp Priorities
TYPICAL CONDITION
if
IMON_INN > 1.21V
else
if
FBIN < 1.205V or
FBOUT > 1.207V or
BG2
PURPOSE
then VC
Rises
then VC
Falls
IMON_INP > 1.209V or
Figure 4. Simplified Diagram of the Buck-Boost Switches
UNIDIRECTIONAL AND BIDIRECTIONAL CONDUCTION
As with the LT8708, the LT8708-1 has one bidirectional
and three unidirectional current conduction modes (CCM,
HCM, DCM and Burst Mode operation, respectively). The
LT8708-1’s MODE, DIR and RVSOFF pins operate in the
same way as in the LT8708 to select the desired conduction modes. (See the Unidirectional and Bidirectional
Conduction section of the LT8708 data sheet for details).
In general, it is highly recommended to keep all phases
of an LT8708 system in the same conduction mode. This
is done by setting all MODE and DIR pins to the same
states, or shorting all MODE pins together and all DIR
to Reduce Positive IOUT(SLAVE)
or Increase Negative IIN(SLAVE)
to Reduce Positive IOUT(SLAVE)
VC
Rises
else
87081 F03
to Reduce Positive IIN(SLAVE)
or
Increase Negative IIN(SLAVE)
to Reduce Positive IIN(SLAVE)
IMON_OP > 1.209V
RSENSE
to Reduce Negative IIN(SLAVE)
Default
Note that certain error amplifiers are disabled under the
conditions shown in Table 5. A disabled error amplifier is
unable to affect VC and can be treated as if its associated
row is removed from Table 4.
Table 5. Automatically Disabled Error Amp Conditions
ERROR
AMP
PIN NAME
EA1
IMON_INN
EA3
FBIN
EA4
FBOUT
EA5
IMON_INP
EA6
IMON_OP
VOUTLOMON
ASSERTED
VINHIMON
ASSERTED
RDCM or
RHCM
2*
1*
3*
Rev A
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19
LT8708-1
OPERATION
1* This improves transient response when VOUTLOMON
de-asserts.
2* This improves transient response when VINHIMON
de-asserts.
80
60
V(CSPOUT–CSNOUT)S (mV)
A 1* to 3* indicates that the error amplifier listed for that
row is disabled under that column’s condition. The purposes of disabling the respective amplifiers are:
AMPLIFIER
NAME
PIN NAME
TIE TO
DISABLE
EXAMPLE DISABLED
PIN CONNECTION
EA1
IMON_INN
< 0.9V
GND
EA3
FBIN
> 1.5V
LDO33
EA4
FBOUT
EA5
IMON_INP
< 0.9V
GND
TRANSFER FUNCTION: IOUT(SLAVE) VS IOUT(MASTER)
The LT8708-1 regulates IOUT(SLAVE) proportionally to
IOUT(MASTER) following the transfer functions1 shown in
Figure 5 and Figure 6. The currents are measured (sensed)
by the differential CSPOUT–CSNOUT pin voltages for each
phase and the information is sent from the master to the
slaves via the ICP and ICN pins. The transfer functions
are represented by the slave’s current sense voltage
(V(CSPOUT–CSNOUT)S) vs the master’s current sense voltage (V(CSPOUT–CSNOUT)M). To convert the axes of Figure 5
and Figure 6 to IOUT(SLAVE) vs IOUT(MASTER), simply divide
0
–20
–40
–80
–80 –60 –40 –20 0
20 40
V(CSPOUT–CSNOUT)M (mV)
The primary regulation loop for the LT8708-1 involves EA6,
which regulates the average IOUT(SLAVE) based on the ICP
and ICN input voltages. Therefore, the IMON_OP pin must
always have a proper compensation network connected.
See the Loop Compensation section for more information.
60
80
87081 F05
Figure 5. Typical V(CSPOUT–CSNOUT)S vs
V(CSPOUT–CSNOUT)M in CCM1
70
60
V(CSPOUT–CSNOUT)S (mV)
Table 6. Disabling Unused Amplifiers
20
–60
3* Since power can only transfer from VOUT to VIN, this
prevents higher FBOUT/VOUT voltages from interfering with the FBIN/VIN voltage regulation.
The remaining error amplifiers can be disabled or used to
limit their respective voltages or currents. When unused,
the respective input pin(s) should be driven so that they
do not interfere with the operation of the remaining amplifiers. Use Table 6 as a guide.
40
50
40
30
20
10
0
0
10
20 30 40 50 60 70
V(CSPOUT–CSNOUT)M (mV)
80
87081 F06
Figure 6. Typical V(CSPOUT–CSNOUT)S vs V(CSPOUT–CSNOUT)M
in FDCM, FHCM and Burst Mode Operation1
V(CSPOUT–CSNOUT)S and V(CSPOUT–CSNOUT)M by the slave’s
and master’s RSENSE2 values, respectively.
Figure 5 shows that increasing the master’s average
current sense voltage V(CSPOUT–CSNOUT)M above ±60mV
results in no additional current from the slave LT8708‑1.
As such, the average of V(CSPOUT–CSNOUT)M should be
limited to ±50mV by connecting appropriate resistors
from the IMON_OP and IMON_ON pins of the LT8708
to ground (see the IIN and IOUT Current Monitoring and
Limiting section of the LT8708 data sheet).
1. The ICP and ICN pins must be connected between the master and slave
chips. 17.4k resistors and appropriate parallel capacitors are also required
from those pins to ground.
Rev A
20
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LT8708-1
OPERATION
Transfer Function: CCM
Figure 5 shows the transfer function of the slave’s regulated current sense voltage (V(CSPOUT–CSNOUT)S) vs the
master’s current sense voltage (V(CSPOUT–CSNOUT)M)
when the MODE pin is selecting CCM operation.
At light current levels (|V(CSPOUT–CSNOUT)M| 20mV),
IOUT(SLAVE) is regulated to be the same as IOUT(MASTER),
offering good current sharing and thermal balance
between the phases.
Note: If the LT8708-1 is configured to be in CCM while
RVSOFF is being pulled low, use the FDCM transfer function in the next section.
Transfer Function: DCM, HCM and Burst Mode
Operation
Figure 6 shows the transfer function of the slave’s regulated current sense voltage (V(CSPOUT–CSNOUT)S) vs the
master’s current sense voltage (V(CSPOUT–CSNOUT)M) when
the MODE pin is selecting FDCM, FHCM or Burst Mode
operation.
The transfer function, in the non-CCM modes, is shown
in Figure 6 and has three distinct regions:
1. V(CSPOUT–CSNOUT)M < 10mV: In this region, where the
master’s current is relatively small, the slave phases
deliver zero current.
2. 10mV < V(CSPOUT–CSNOUT)M < 20.5mV: In this region,
where the master’s current is moderate, the slave
phases deliver less current than the master. The transfer function is hysteretic in this region. Therefore, the
slave current will operate from 0mV to 13.5mV or
from 6.7mV to 20.5mV if the master’s V(CSPOUT–
CSNOUT)M was most recently below 10mV or above
20.5mV, respectively.
3. V(CSPOUT–CSNOUT)M > 20.5mV: In this region of moderate to high current from the master, the slave delivers the
same current as the master.
The transfer function is a mirror image of Figure 6 when
operating in the RDCM and RHCM conduction modes for
V(CSPOUT–CSNOUT)M < 0mV. Simply multiply the values
on the X and Y axes of Figure 6 by –1 to illustrate the
transfer function.
CURRENT MONITORING AND LIMITING
Monitoring: IOUT(SLAVE)
The LT8708-1 can monitor VOUT current (IOUT(SLAVE)) in
the negative direction. An external resistor is connected
from the IMON_ON pin to ground, and the resulting voltage is linearly proportional to negative IOUT(SLAVE). Unlike
the LT8708’s IMON_ON pin, the LT8708-1’s IMON_ON
pin does not regulate or limit IOUT(SLAVE) in the negative direction. See the IIN and IOUT Current Monitoring
and Limiting section of the LT8708 data sheet for how to
configure the IMON_ON current monitoring.
Monitoring and Limiting: IIN(SLAVE)
The LT8708-1 can monitor VIN current (IIN(SLAVE)) in both
the positive and negative directions by measuring the voltage across a current sense resistor RSENSE1 using the
CSPIN and CSNIN pins. The voltage is amplified and a
proportional current is forced out of the IMON_INP and
IMON_INN pins to allow for monitoring and limiting. This
function is identical to the LT8708 and more information
can be found in the Current Monitoring and Limiting section of the LT8708 data sheet.
As described above, the LT8708-1 has circuitry allowing
for independent input current limiting of each phase. This
per-phase current limiting is intended to be secondary to
the limits imposed by the master. Typically, the master is
configured to limit its own input current (IIN(MASTER)) thus
limiting the command current to the slave. However, since
the slave has its own independent input current sensing
Rev A
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21
LT8708-1
OPERATION
and limiting circuitry, it can be configured with redundant
current limiting. It is recommended to set the slave input
current limit magnitudes to be the same or higher than
those set by the master. See the Applications Information
section for more information about the IIN(SLAVE) current
monitoring and limiting.
As with the LT8708, the LT8708-1 requires a 17.4k
resistor and parallel filter capacitor to be connected from
ground to the IMON_INP pin when using the RHCM conduction mode. If, in this case, it is also desired to set the
LT8708-1’s positive IIN(SLAVE) current limit higher than
the LT8708’s positive IIN(MASTER) limit, reduce the value
of the LT8708-1’s RSENSE1 resistor as compared to the
LT8708’s RSENSE1 value. See Configuring the IIN(SLAVE)
Current Limits section for details.
MULTIPHASE CLOCKING
A multiphase application usually has switching regulators
operating at the same frequency but at different phases to
reduce voltage and current ripple. The SYNC pin can be
used to synchronize the LT8708-1’s switching frequency
at a specific phase relative to the master LT8708 chip. A
separate clock chip, e.g., LTC6902, LTC6909 etc., can be
used to generate the clock signals and drive the SYNC
pins of the LT8708 and LT8708-1(s). If only two phases
are needed for the multiphase application, i.e., 0° and
180°, the LT8708-1’s SYNC pin can be connected to the
LT8708’s CLKOUT pin to obtain the 180° phase shift. The
master LT8708 can be synchronized to an external source
or can be free-running based on the external RT resistor.
It is recommended that the LT8708-1 is always synchronized to the same frequency as the LT8708 through the
SYNC pin.
Rev A
22
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LT8708-1
APPLICATIONS INFORMATION
This Applications Information section provides additional
details for setting up a multiphase application using the
LT8708-1(s) and LT8708. Topics include quick multiphase setup guidelines, choosing the total number of
phases, clock synchronization, and selection of various
external components. In addition, more information is
provided about voltage lockouts, current monitoring,
PCB layout considerations. This section wraps up with
a design example.
QUICK-START MULTIPHASE SETUP
This section provides a step-by-step summary on how
to setup a multiphase system using the LT8708-1(s) and
LT8708.
Quick Setup: Design the Master Phase
Design the LT8708 application circuit according to the
LT8708 data sheet. Make sure the maximum CSPOUT–
CSNOUT current sense voltage is limited to ±50mV by
setting the IMON_OP and IMON_ON resistor values equal
to or higher than 17.4k. This is the master phase.
Quick Setup: Design the Slave Phase(s)
Step 1 – Power Stage: Apply the same power stage design
from the LT8708 application circuit to the LT8708-1 circuit. This includes the inductor, power MOSFETs and
their gate resistors, RSENSE, RSENSE filtering, RSENSE1,
RSENSE2, CSPIN–CSNIN filtering, CSPOUT–CSNOUT filtering, topside MOSFET driver supply (CB1, DB1, CB2, DB2)
and Schottky diodes D1, D2, D3, D4 (if used). See the
CIN and COUT Selection section on how to optimize the
capacitor values.
Step 2 – Peripheral Pins: The following components
should be identical on the LT8708 as the LT8708-1:
• RT resistor
• SS pin capacitor
• INTVCC, GATEVCC, VINCHIP and LDO33 pin bypass
capacitors
Connect identical resistor divider networks on SHDN as
well as on VINHIMON and VOUTLOMON (if used). If not
used, connect VINHIMON to GND and/or VOUTLOMON to
the LT8708-1’s LDO33. Connect the LT8708-1’s FBOUT
pin to GND and the FBIN pin to the LT8708-1’s LDO33
node.
Step 3 – Interconnect: Connect the LT8708-1’s ICP, ICN,
EXTVCC, SWEN and RVSOFF pins to their counterparts on
the LT8708. Connect the same control signals, or connect the same value resistor dividers or voltages to the
MODE pins and the DIR pins of the LT8708 and LT8708‑1,
respectively. Connect the LT8708’s CLKOUT signal or
a clock chip’s phase shifted clock to the LT8708‑1’s
SYNC pin.
Step 4 – Regulation and Limiting: Connect a 17.4k
resistor in parallel with a compensation network from
IMON_OP to GND. Connect a resistor in parallel with a
filter capacitor from IMON_ON to GND for current monitoring. Connect resistors in parallel with filter capacitors
from IMON_INP and IMON_INN to GND, respectively, to
set the magnitudes of the IIN(SLAVE) current limits to be
equal to or higher than their counterparts on the LT8708.
Step 5: Repeat steps 1 through 4 to add any additional
LT8708-1 phases.
Quick Setup: Evaluation
Test and optimize the stability of the multiphase system.
See the Loop Compensation section for more details.
CHOOSING THE TOTAL NUMBER OF PHASES
In general, the number of phases needed is selected to
meet a multiphase system’s total power requirement as
well as each phase’s thermal requirement. In general, for
a given application, the more phases that the system has,
the less power that each phase needs to deliver, and the
better the thermal performance that each phase has. In
many cases, the total number of phases is selected to
optimize the total input or output RMS current ripple.
See the CIN and COUT Selection section for more details.
Rev A
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LT8708-1
APPLICATIONS INFORMATION
OPERATING FREQUENCY SELECTION
0.60
1-PHASE
2-PHASE
3-PHASE
4-PHASE
6-PHASE
0.55
0.50
0.45
0.40
I(IN,RMS)/IOUT
The LT8708-1 uses a constant frequency architecture
operating between 100kHz and 400kHz. The LT8708-1
should be synchronized to the same frequency as the
LT8708 by connecting a clock signal to the SYNC pin.
An appropriate resistor must be placed from the RT pin
to ground. In general, use the same value RT resistor for
all the synchronized LT8708 and LT8708-1(s). See the
Operating Frequency Selection section of the LT8708 data
sheet on how to select the LT8708’s switching frequency.
0.35
0.30
0.25
0.20
0.15
CIN AND COUT SELECTION
VIN and VOUT capacitance is necessary to suppress voltage ripple caused by discontinuous current moving in and
out of the regulator. A parallel combination of capacitors
is typically used to achieve high capacitance and low ESR
(equivalent series resistance). Dry tantalum, special polymer, aluminum electrolytic and ceramic capacitors are all
available in surface mount packages. Capacitors with low
ESR and high ripple current ratings, such as OS-CON and
POSCAP are also available.
Ceramic capacitors should be placed near the regulator
input and output to suppress high frequency switching
spikes. A ceramic capacitor, of at least 1µF at the maximum VINCHIP operating voltage, should also be placed
from VINCHIP to GND as close to the LT8708-1 pins as
possible. Due to their excellent low ESR characteristics,
ceramic capacitors can significantly reduce input ripple
voltage and help reduce power loss in the higher ESR
bulk capacitors. X5R or X7R dielectrics are preferred, as
these materials retain their capacitance over wide voltage and temperature ranges. Many ceramic capacitors,
particularly 0805 or 0603 case sizes, have greatly reduced
capacitance at the desired operating voltage.
0.10
0.05
0
0.1 0.15
0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9
VOUT/VIN
87081 F06
Figure 7. Normalized Total Input RMS Ripple Current vs VOUT/VIN
for One to Six Phases in Buck Operation
The total input RMS ripple current I(IN,RMS) is normalized against the total output current of the multiphase
system (IOUT). The graph can be used in place of tedious
calculations. From the graph, the minimum total input
RMS ripple current can be achieved when the product of
the number of phases (N) and the output voltage VOUT
is approximately equal to integer multiples of the input
voltage VIN or:
VOUT/VIN = n/N
where n = 1, 2,…, N-1
Therefore, the number of phases can be chosen to minimize the input capacitance for given input and output
voltages.
CIN and COUT Selection: VIN Capacitance
Figure 7 also shows the maximum total normalized input
RMS current for one to six phases. Choose an adequate
CIN capacitor network to handle this RMS current.
Discontinuous VIN current is highest in the buck region
due to the M1 switch toggling on and off. Ensure that the
CIN capacitor network has low enough ESR and is sized
to handle the maximum RMS current. Figure 7 shows
the total input capacitor RMS ripple current for one to
six phases with the VOUT to VIN ratios in buck operation.
CIN is also necessary to reduce the VIN voltage ripple
caused by discontinuities and ripple of IIN. The effects of
ESR and the bulk capacitance must be considered when
choosing the correct capacitor for a given VIN ripple. A
low ESR input capacitor sized for the maximum RMS current must be used. Add enough ceramic capacitance to
Rev A
24
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LT8708-1
TYPICAL APPLICATIONS
make sure VIN voltage ripple is adequately low for the
application.
3.5
1–PHASE
2–PHASE
3.0
CIN and COUT Selection: VOUT Capacitance
3–PHASE
4–PHASE
(VOUT – VIN)/VOUT = n/N
6–PHASE
2.5
I (OUT,RMS)/I OUT
Discontinuous VOUT current is highest in the boost region
due to the M4 switch toggling on and off. Make sure that
the COUT capacitor network has low enough ESR and
is sized to handle the maximum RMS current. Figure 8
shows the output capacitor RMS ripple current for one to
six phases with the (VOUT – VIN) to VOUT ratios in boost
operations. The total output RMS ripple current I(OUT,RMS)
is normalized against the total output current of the multiphase system (IOUT). The graph can be used in place
of tedious calculations. From the graph, the minimum
total output RMS ripple current can be achieved when
the product of the number of phases (N) and duty cycle
(VOUT – VIN)/VOUT is approximately equal to integers or:
2.0
1.5
1.0
0.5
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
(VOUT – VIN)/VOUT
87081 F08
Figure 8. Normalized Output RMS Ripple Current vs
(VOUT–VIN)/VIN for One to Six Phases in Boost Operation
where n = 1,2,…, N-1
Therefore, the number of phases be chosen to minimize
the output capacitance for given input and output voltages.
Figure 8 also shows the maximum total normalized output
RMS current for one to six phases. Choose an adequate
COUT capacitor network to handle this RMS current.
COUT is also necessary to reduce the VOUT ripple caused
by discontinuities and ripple of IOUT. The effects of ESR
and the bulk capacitance must be considered when choosing the right capacitor for a given VOUT ripple. A low ESR
input capacitor sized for the maximum RMS current must
be used. Add enough ceramic capacitance to make sure
VOUT voltage ripple is adequate for the application.
Figure 7 and Figure 8 show that the peak total RMS input
current in buck operation and the peak total RMS output
current in boost operation are reduced linearly, inversely
proportional to the number of phases used. It is important
to note that the ESR-related power loss is proportional to
the RMS current squared, and therefore a 3-phase implementation results in 90% less power loss when compared
to a single-phase design. Battery/input protection fuse
resistance (if used) PCB trace and connector resistance
losses are also reduced by the reduction of the ripple
current in a multiphase system. The required amount of
input and output capacitance is further reduced by the
factor, N, due to the effective increase in the frequency of
the current pulses.
VINHIMON, VOUTLOMON AND RVSOFF
VINHIMON and VOUTLOMON offer the identical functions
on the LT8708 and LT8708-1(s). See the VINHIMON,
VOUTLOMON and RVSOFF section of the LT8708 data
sheet for more details. If the VINHIMON and VOUTLOMON
functions are used on the LT8708-1(s) as redundant monitoring functions, in general use the same value resistor dividers as on the LT8708. If the VINHIMON and/or
VOUTLOMON functions are not used on the LT8708-1(s),
tie VINHIMON to GND and/or VOUTLOMON to the respective LT8708-1’s LDO33 pin.
The RVSOFF pin has an internal comparator with a rising threshold of 1.374V (typical) and a falling threshold of 1.209V (typical). A low state on this pin inhibits
reverse current and power flow. It is recommended to
tie the RVSOFF pins of all the synchronized LT8708 and
LT8708-1(s) together. In a multiphase system, if one or
Rev A
For more information www.analog.com
25
LT8708-1
APPLICATIONS INFORMATION
more chips’ VINHIMON or VOUTLOMON comparator is
triggered, the RVSOFF pin is pulled low to prevent the
entire multiphase system from delivering reverse current
and power. The multiphase system will exit the RVSOFF
operation when all the VINHIMON and VOUTLOMON comparators are de-asserted.
CONFIGURING THE IIN(SLAVE) CURRENT LIMITS
As discussed in the Monitoring and Limiting: IIN(SLAVE)
section, the LT8708-1 can monitor and limit the input
current independently of the master. The current limiting
discussed in this section is intended to be secondary, or
redundant, since the master is primarily in control of the
amount of current commanded from the slave.
As shown in Figure 9, the LT8708-1 measures IIN(SLAVE)
with the CSPIN and CSNIN pins and can independently
monitor and limit the current in both positive and negative directions. The operation of the input current monitor circuits is identical to the LT8708. More information
about configuring these circuits can be found in the IIN
and IOUT Current Monitoring and Limiting section of the
LT8708 data sheet.
When setting the IIN(SLAVE) current limits, it is recommended to set them equal to or higher than the magnitudes of the IIN(MASTER) limits. Consider that if the slave
RSENSE1
FROM
SYSTEM
VIN
TO
CONTROLLER
VIN
IIN(SLAVE)
CSPIN
LT8708-1
reaches input current limiting before the master, the slave
can no longer deliver additional current as requested by
the master. With equal IIN(SLAVE) and IIN(MASTER) limits,
slight output current mismatch, and hence slight thermal
imbalance can still happen due to device tolerance. Bench
evaluation should be carried out to ensure the selected
IIN(SLAVE) limits meet the application’s thermal and stability requirements.
REGULATING IOUT(SLAVE)
IOUT(SLAVE): Circuit Description
This section describes the control circuitry in the
LT8708-1 that regulates the output current IOUT(SLAVE).
The master LT8708 sends the ICP and ICN control signals
to the slave LT8708-1 to set IOUT(SLAVE). See the Transfer
Function: IOUT(SLAVE) vs IOUT(MASTER) section for related
information.
Figure 10 shows the primary LT8708-1 circuits involved in
the regulation of IOUT(SLAVE). Additional circuitry is shown
in Figure 1. IOUT(SLAVE) is regulated by a feedback loop
with ICP and ICN setting the desired current. The feedback
loop involves the following sections:
• The VC pin controls the inductor current, thus indirectly controlling IOUT(SLAVE). Higher VC voltage
FROM
CONTROLLER
VOUT
RSENSE2
TO SYSTEM
VOUT
IOUT(SLAVE)
ICP
ICN
FROM
FROM
MASTER MASTER
CSNIN
+
Ω–
gm = 1m
A3
+
–
1.21V
20μA
LT8708-1
+
EA1
–
20μA
1.209V
TO INDUCTOR
CURRENT
CONTROL
CSPOUT
CSNOUT
A1
1.209V
+
EA6
IMON_OP
RIMON_INP
VC
87081 F09
VC
IMON_INP
70μA
87081 F08
CIMON_INN
+
–
–
RIMON_INN
ICN
TO INDUCTOR
CURRENT
CONTROL
+ – +–
EA5
IMON_INN
ICP
CIMON_INP
RIMON_OP
17.4k
Figure 9. IIN(SLAVE) Current Monitor and Limit
CIMON_OP
Figure 10. IOUT(SLAVE) Current Regulation and Monitor
Rev A
26
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LT8708-1
TYPICAL APPLICATIONS
results in higher IOUT(SLAVE) current and vice versa.
VC is driven by error amplifier EA6 during IOUT(SLAVE)
regulation.
• During regulation, the IMON_OP voltage is very
close to the EA6 reference of 1.209V. Small changes
in IMON_OP voltage make large adjustments to VC,
and thus the IOUT(SLAVE) current.
• Resistor RSENSE2 converts the IOUT(SLAVE) current into
a voltage that can be measured by amplifier A1. This
voltage is denoted as V(CSPOUT–CSNOUT)S in Figure 10.
• Transconductance amplifier A1 makes sure that
IOUT(SLAVE) is equal to the current set by the ICP
and ICN signals. If IOUT(SLAVE) becomes higher than
requested by ICP and ICN, additional current is delivered out of A1. This raises IMON_OP which reduces
VC and reduces IOUT(SLAVE). Conversely, if IOUT(SLAVE)
becomes lower than requested by ICP and ICN, the
current out of A1 is reduced. This lowers IMON_OP
which raises VC and increases IOUT(SLAVE).
Figure 11 illustrates, in CCM mode, the typical relationship between the master’s output current IOUT(MASTER),
the resulting ICP and ICN control voltages, and the further resulting IOUT(SLAVE) current. Figure 11 can best be
explained with a few examples.
In these examples, the output current sense resistors are
RSENSE2 = 10mΩ for the master and the slave devices.
First, assume the master’s output current IOUT(MASTER)
is 4A. This results in the master LT8708 measuring a
IOUT(SLAVE) =
10mΩ
IOUT(SLAVE) =
10mΩ
60
1.6
80
60
1.0
50
0.8
40
0.6
30
0.4
20
–60
0.2
10
–80
0
20
0.0
0
–0.4
–20
–0.8
–40
ICP, ICN VOLTAGE (V)
70
1.2
0.4
80
90
1.4
40
60
100
V(CSPOUT–CSNOUT)S
ICN
ICP
87081 F11
Figure 11. IOUT(SLAVE) Control Voltage Relationships (CCM)
0
10
20 30 40 50 60
V(CSPOUT–CSNOUT)M (mV)
70
80
V(CSPOUT–CSNOUT)S (mV)
1.2
V(CSPOUT–CSNOUT)S (mV)
80
–1.6
–80 –60 –40 –20 0
20 40
V(CSPOUT–CSNOUT)M (mV)
= – 2A
Figure 12 illustrates the relationship between IOUT(MASTER),
ICP, ICN and IOUT(SLAVE) in FDCM, FHCM and Burst Mode
operation. Use Figure 12, instead of Figure 11, to understand the control voltage relationships when operating
in FDCM, FHCM or Burst Mode Operation. Figure 12 can
1.6
V(CSPOUT–CSNOUT)S
ICN
ICP
V(CSPOUT – CSNOUT)S
=
R SENSE2
–20mV (from Figure 10)
1.8
–1.2
= 4A
Alternatively, if the master’s output current IOUT(MASTER)
is –2A. Then the master LT8708 will measure a current
sense voltage of V(CSPOUT–VCSNOUT)M = –2A • 10mΩ =
–20mV. Locate –20mV along the X-axis of Figure 11. The
corresponding ICP and ICN voltages are 0V and ~0.7V,
respectively. These ICP and ICN voltages are sent from
the LT8708 to the LT8708-1. As a result, the LT8708-1
regulates IOUT(SLAVE) to:
2.0
0.8
V(CSPOUT – CSNOUT)S
=
R SENSE2
40mV (from Figure 10)
100
2.0
ICP, ICN VOLTAGE (V)
current sense voltage of V(CSPOUT–VCSNOUT)M = 4A • 10mΩ
= 40mV. Locate 40mV along the X-axis of Figure 11. The
corresponding ICP and ICN voltages are ~1V and 0V,
respectively. These ICP and ICN voltages are sent from
the LT8708 to the LT8708-1. As a result, the LT8708-1
regulates IOUT(SLAVE) to:
0
87081 F12
Figure 12. IOUT(SLAVE) Control Voltage Relationships
(FDCM, FHCM and Burst Mode Operation)
Rev A
For more information www.analog.com
27
LT8708-1
APPLICATIONS INFORMATION
also be used to understand RDCM and RHCM operation
by multiplying the V(CSPOUT–CSNOUT)M and the V(CSPOUT–
CSNOUT)S axis values by –1.
As mentioned previously, 17.4k resistors must be connected from the ICP and ICN pins to ground. Proper resistor connections are required to produce the correct ICP
and ICN voltages, and result in the correct IOUT(SLAVE)
currents.
IOUT(SLAVE): Configuration
IOUT(SLAVE) regulation is the main regulation loop for
the LT8708-1 and should always be enabled. Therefore,
always connect a 17.4k resistor in parallel with a compensation network from the IMON_OP pin to ground. Note
that the IMON_OP pin cannot be used for monitoring the
IOUT(SLAVE) current.
Figure 5 and Figure 11 show that increasing the master’s average current sense voltage V(CSPOUT–CSNOUT)M
above ±60mV results in no additional current from the
slave LT8708-1. As such, the target average of V(CSPOUT–
CSNOUT)M should be limited to ±50mV by connecting
appropriate resistors from the IMON_OP and IMON_ON
pins of the LT8708 to ground (see the IIN and IOUT Current
Monitoring and Limiting section of the LT8708 data sheet).
In addition, the instantaneous differential voltage V (CSPOUT–CSNOUT)S should remain between
–100mV and 100mV due to the limited current that
can be driven out of IMON_OP. If the instantaneous
V(CSPOUT–CSNOUT)S exceeds these limits but the average V(CSPOUT–CSNOUT)S is between –50mV and 50mV,
consider including the current sense filter described in
the IIN and IOUT Current Monitoring and Limiting section of the LT8708 data sheet. The filter can reduce the
instantaneous voltage while preserving the average. In
general, use the same value current sense filter for all
the synchronized LT8708 and LT8708-1(s).
Finally, IMON_OP should be compensated and filtered
with capacitor CIMON_OP. At least a few nF of capacitance
is usually necessary.
LOOP COMPENSATION
To compensate a multiphase system of the LT8708 and
LT8708-1(s), most of the initial compensation component
selection can be done by analyzing the individual voltage
regulator and/or current regulator(s) independently of
each other. Use the total input and output bulk capacitance
of the multiphase system in the stability analysis for each
of the following steps.
1. Analyze the stability of the LT8708 as a single phase
without any additional LT8708-1 phases included.
This includes all the regulation loops that will be used
by the master LT8708, such as voltage regulation
(FBOUT, FBIN) and/or current regulation (IMON_INP,
IMON_INN, IMON_OP, IMON_ON). Determine the initial values for the VC pin compensation network, and
the relevant IMON_XX pin capacitors for the master
LT8708. Further adjustment of these values will be
done in Step 4. Adjustment to CIN and COUT may also
be necessary as part of this analysis. See the Loop
Compensation section of the LT8708 data sheet for
more details. LTspice® transient simulation can be
helpful for this step.
2. Analyze the stability of the IOUT(SLAVE) current regulation loop of a standalone LT8708-1 phase. Adjust
the VC and IMON_OP compensation networks of the
LT8708-1 to achieve stability and maximum bandwidth. Bench stability evaluation of a standalone
LT8708-1 can be carried out by driving the ICP and
ICN pins with external voltage sources.
A similar approach to that used for analyzing the
LT8708 in constant-current regulation can be
employed in compensating the standalone LT8708-1
current regulator. An IMON_OP capacitor of at least a
few nF is necessary to maintain IOUT(SLAVE) regulation
loop stability. In addition, adding a resistor of a few
hundred Ohms in series with this capacitor can often
provide additional phase margin.
If any of the IIN(SLAVE) regulation loops, i.e. IMON_INP
and IMON_INN, is used for secondary or redundant
current limiting, carry out the corresponding stability
analysis on the standalone LT8708-1. Use the same
Rev A
28
For more information www.analog.com
LT8708-1
TYPICAL APPLICATIONS
approach that is used for compensating the LT8708’s
input current regulation loops.
3. Complete the multiphase system with the LT8708
and LT8708-1(s). A few nF of capacitance should be
placed on the ICP and ICN pins near the LT8708 for
proper compensation. In addition, adding a few hundred Ohms in series with these capacitors can often
provide extra phase margin to the multiphase system.
See Figure 2 as an example.
4. Perform the loop stability analysis in simulation and/
or on the bench. Primarily, adjust the LT8708’s VC
compensation network for stability. A trim pot and
selectable capacitor bank can be used on the VC pin
to determine the optimal values. Typically, the LT8708
should be adjusted to have lower bandwidth than the
LT8708-1 phases. This can be achieved by increasing
the capacitance and/or reducing the series resistance
of the LT8708’s VC compensation network.
If the LT8708 operates in constant current limit, as
set by one or more of the IMON_xx pins, adjust the
respective LT8708 IMON_xx filter capacitors as well
to achieve optimal loop stability.
CIRCUIT BOARD LAYOUT CHECKLIST
The LT8708’s circuit board layout guidelines also apply
to the LT8708-1(s). Refer to the Circuit Board Layout
Checklist section of the LT8708 data sheet for details.
In addition:
• Route the ICP and ICN traces together with minimum PCB trace spacing from the LT8708 to the
LT8708‑1(s). Avoid having these traces pass through
noisy areas, such as switch nodes.
• Star connect the VIN and VOUT power buses as well
as the power GND bus to each LT8708/ LT8708-1(s).
Minimize the voltage difference between local VIN,
VOUT and power GNDs, respectively.
DESIGN EXAMPLE
In this section, we start with the Design Example in the
LT8708 data sheet, and expand it into a 2-phase regulator. The design requirements from the LT8708 data sheet
are listed below with the total output current (IOUT) and
the total input current (IIN) specifications doubled for two
phases.
VIN = 8V to 25V
VOLTAGE LOCKOUTS
The LT8708-1 offers the same voltage detectors as the
LT8708 to make sure the chip is under proper operating conditions. See the Voltage Lockouts section of the
LT8708 data sheet for more details.
Although allowed with a standalone LT8708, a resistor
divider connected to the SWEN pins should never be
used for undervoltage detection in a multiphase system
(see the Start-Up: SWEN Pin section for proper ways to
connect or drive the SWEN pin in a multiphase system).
Instead, an external comparator chip can be used to monitor undervoltage conditions, and its output drives the
common SWEN node in a multiphase system through a
current limiting resistor.
VIN_FBIN = 12V (VIN regulation voltage set by LT8708
FBIN loop)
VOUT_FBOUT = 12V (VOUT regulation voltage set by
LT8708 FBOUT loop)
IOUT(MAX, FWD) = 10A
IIN(MAX, RVS) = 6A
f =150kHz
This design operates in CCM.
Maximum ambient temperature = 60°C
Use the same RT, RSENSE, RSENSE2 resistors, inductor, external MOSFETs and capacitors from the Design
Example of the LT8708 data sheet for LT8708-1.
SYNC Pin: Since this is a 2-phase system, the slave chip
operates 180° out of phase from the master chip. Connect
the LT8708’s CLKOUT pin to the LT8708-1’s SYNC pin.
Rev A
For more information www.analog.com
29
LT8708-1
APPLICATIONS INFORMATION
MODE Pin: Connect the MODE pin to GND for CCM
operation.
And the maximum slave VIN current in the reverse direction is:
SWEN and RVSOFF Pins: Connect the SWEN and RVSOFF
pins together for the LT8708 and LT8708-1, respectively.
This synchronizes the start-up and operation mode
between the two chips.
ICP and ICN Pins: Connect two 17.4k resistors from the
ICP and ICN pins to GND, respectively. Place them next
to the LT8708 chip and route the ICP and ICN traces to
the LT8708-1’s counterparts, respectively.
RIMON_OP Selection: Connect 17.4k from IMON_OP to
GND for the LT8708-1.
RIMON_ON Selection: LT8708-1’s IMON_ON is only used
to monitor the IOUT(SLAVE) in the reverse direction. A same
value resistor of 24.9k from the LT8708 design example
is selected here to provide an IMON_ON reading on the
same scale as the one on the LT8708.
RSENSE1, RIMON_INP, RIMON_INN selection: IMON_INP
and IMON_INN are used to provide current limits for the
LT8708-1 only. They are set to be equal to the maximum
per phase VIN current in the forward and reverse directions, respectively.
The maximum slave VIN current in the forward direction is:
IIN(MAX,FWD,SLAVE) =
=
6A • 12V
8V
IIN(MAX,RVS,SLAVE) = IIN(IMON_ON,MASTER) = 3.6A
Choose RIMON_INP to be around 17.4k, so that the
LT8708 1’s VCSPIN–CSNIN limit becomes 50mV, and the
RSENSE1 is calculated to be:
R SENSE1 =
50mV
9A
≅ 6mΩ
Using the equation given in the IIN and IOUT Current
Monitoring and Limiting section of the LT8708 data sheet,
RIMON_INP is recalculated to be:
R IMON_INP =
1.209
Ω ≅ 16.2kΩ
A
IIN(MAX, FWD,SLAVE) • 1m • R SENSE2 + 20µA
V
And RIMON_INN is calculated to be:
R IMON_INN =
1.21
Ω ≅ 29.4kΩ
A
IIN(MAX, RVS,SLAVE) • 1m • R SENSE2 + 20µA
V
FBOUT Pin: Connect FBOUT pin to GND to disable the
FBOUT pin.
FBIN Pin: Connect FBIN pin to LDO33 of the LT8708-1 to
disable the FBIN pin.
I(IMON_OP,MASTER) • VOUT
VIN,MIN
= 9A
Rev A
30
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–
+
+
68.1k
For more information www.analog.com
100k
665k
M6
M5
27.4k
CIN5
×2
100k
LD033
1μF
CIN1
1μF
CIN6
12.1k
M7
100k
665k
93.1k
CIN4
×2
LD033
100Ω
2mΩ
20k
100Ω
2mΩ
M1
DIR
CSPIN
VINCHIP
SHDN
FBIN
VINHIMON
M8
4.7μF
VC
1Ω
0.22μF
TO DIODE
DB3
54.9k
CSPIN
VINCHIP
SHDN
VOUTLOMON
FBIN
FBOUT
VINHIMON
SWEN
DIR
1Ω
1nF
10k
1Ω
M9
33nF
VC
470pF
10k
365k
8.2nF
RT
365k
LT8708-1
2mΩ 1Ω 0.22μF
TO DIODE
DB2
1μF
TO DIODE
DB4
1Ω
M11
SS
1μF
COUT5
4.7nF
4.7μF
17.4k
47nF
100Ω
4.7nF
23.7k
2mΩ
47nF
100Ω
COUT1
2mΩ
17.4k
17.4k
100nF
COUT6
COUT7
×2
200Ω
4.7nF
20k
154k
4.7nF
10nF
47nF
COUT4
×2
100k
17.4k
17.4k
100nF
COUT2
M5 - M7: T2N7002AK, TOSHIBA
CIN4, CIN5, COUT4, COUT7: SUNCON, 18μF, 40V,
40HVP18M
120kHz
4.7nF
GATEVCC
IMON_OP
IMON_ON
IMON_INP
IMON_INN
SYNC CLKOUT
INTVCC
CSNOUT
EXTVCC
ICP
ICN
GND BG2 SW2 BOOST2 TG2
CSPOUT
2mΩ 1Ω 0.22μF
SS
CSNOUT
EXTVCC
VOUTLOMON
FBOUT
ICP
ICN
INTVCC
GATEVCC
IMON_OP
IMON_ON
IMON_INP
IMON_INN
SYNC CLKOUT
47nF
1Ω
M4
GND BG2 SW2 BOOST2 TG2
CSPOUT
M10
1nF
10Ω
1nF
10Ω
L2
3.3μH
RT
LT8708
1nF
10Ω
1nF
10Ω
M3
L1
3.3μH
M1 - M4, M8 - M11: INFINEON BSC010N04LS
COUT3, CIN3: 470μF, 50V
CIN2, CIN7, COUT1, COUT5: 10µF, 50V, X7R
CIN1, CIN6, COUT2, COUT6: 10µF, 50V, X7R
54.9k
LD033
LDO33
100k
RVSOFF
MODE
127k
47nF
0.22μF
TG1 BOOST1 SW1 BG1 CSP CSN
CSNIN
100nF
CIN7
4.7μF
SWEN
LD033
LDO33
100k
RVSOFF
MODE
127k
47nF
1Ω
TO DIODE
DB1
M2
TG1 BOOST1 SW1 BG1 CSP CSN
CSNIN
100nF
CIN2
DB1, DB2, DB3, DB4: CENTRAL SEMI CMMR1U-02-LTE
L1, L2: 3.3μH, WURTH 701014330
XOR: DIODES INC. 74AHC1G86SE-7
CIN3
IIN
XOR
220pF
*SEE THE UNI AND
BIDIRECTIONAL
CONDUCTION
SECTION OF THE LT8708
DATA SHEET
DIR_CTRL
RVS (0V) FWD (3V)
POWER TRANSFER
DECISION LOGIC
10V TO 16V
BATTERY
VBAT1
DB1
DB2
3.3Ω
4.7μF
DB3
TO
LT8708-1’S
BOOST1
17.4k
4.7μF
200Ω
DB4
4.7nF
17.4k
87081 TA03a
–
+
COUT3
TO
LT7081’S
BOOST2
3.3Ω
TO
TO
LT8708’S LT8708’S
BOOST1 BOOST2
23.7k
4.7μF
12.1k
133k
+
I
VBAT2 OUT
4.7nF
200Ω
17.4k
10V TO 16V
BATTERY
LT8708-1
TYPICAL APPLICATIONS
2-Phase 12V Bidirectional Dual Battery System with FHCM and RHCM
Rev A
31
LT8708-1
TYPICAL APPLICATIONS
2-Phase 12V Bidirectional Dual Battery System with FHCM and RHCM
Forward Conduction VBAT1 =
~12V, VBAT2 = ~14V, IOUT = ~30A
Reverse Conduction VBAT1 =
~12V, VBAT2 = ~14V, IIN = ~30A
IL1
IL1 AND IL2
10A/DIV
IL1
IL1 AND IL2
10A/DIV
IL2
LT8708 SW1
10V/DIV
LT8708 SW1
10V/DIV
LT8708-1 SW1
10V/DIV
LT8708-1 SW1
10V/DIV
3μs/DIV
87081 TA03b
IL2
3μs/DIV
87081 TA03c
Direction Change with VBAT1 =
~12V, VBAT2 = ~12V
DIR
5V/DIV
IL1
20A/DIV
IL2
20A/DIV
60ms/DIV
87081 TA03d
Rev A
32
For more information www.analog.com
–
+
+
For more information www.analog.com
CLK1
CLK2
CLK3
CLK4
**4-PHASE CLOCK
SIGNALS FROM
CLOCK CHIP
SUCH AS LTC6909
68.1k
20k
340k
M6
100k
LD033
20k
CIN5
×2
M5
16.9k
1μF
CIN1
1μF
CIN6
18.2k
M7
340k
340k
CIN4
×2
LD033
100Ω
5mΩ
20k
100Ω
5mΩ
CIN2
M1
DIR
CSPIN
VINCHIP
SHDN
FBIN
VINHIMON
M8
4.7μF
VC
1Ω
0.22μF
TO DIODE
DB3
54.9k
CSPIN
VINCHIP
SHDN
VOUTLOMON
FBIN
FBOUT
VINHIMON
SWEN
DIR
1Ω
3.3nF
1nF
10k
1Ω
M9
3.3nF
VC
470pF
10k
365k
12nF
RT
365k
LT8708-1
1nF
10Ω
1nF
10Ω
1.5mΩ 1Ω 0.22μF
TO DIODE
DB2
1Ω
M4
1μF
1Ω 0.22μF
TO DIODE
DB4
1Ω
M11
120kHz
47nF
SS
PHASE 4
PHASE 3
1μF
120kHz
2mΩ
COUT1
4.7nF
4.7μF
12.1k
93.1k
COUT7
×2
4.7nF
10nF
200Ω
4.7nF
22nF
200Ω
COUT4
×2
17.8k
17.4k
17.4k
100nF
COUT6
17.4k
13.3k
100nF
COUT2
DB1
DB2
3.3Ω
4.7μF
DB3
TO
LT8708-1’S
BOOST1
17.4k
4.7μF
200Ω
DB4
4.7nF
17.4k
–
+
COUT3
TO
LT7081’S
BOOST2
3.3Ω
TO
TO
LT8708’S LT8708’S
BOOST1 BOOST2
23.7k
4.7μF
12.1k
133k
+
I
VBAT2 OUT
M5-M7: T2N7002AK, TOSHIBA
CIN4, CIN5, COUT4, COUT7: SUNCON, 15μF, 100V, 100HVP15M
17.4k
47nF
100Ω
COUT5
2mΩ
4.7nF
30.1k
47nF
100Ω
PHASE 2
4.7nF
GATEVCC
IMON_OP
IMON_ON
IMON_INP
IMON_INN
SYNC CLKOUT
INTVCC
CSNOUT
EXTVCC
ICP
ICN
GND BG2 SW2 BOOST2 TG2
CSPOUT
1.5mΩ
SS
CSNOUT
EXTVCC
VOUTLOMON
FBOUT
ICP
ICN
INTVCC
GATEVCC
IMON_OP
IMON_ON
IMON_INP
IMON_INN
SYNC CLKOUT
GND BG2 SW2 BOOST2 TG2
CSPOUT
M10
L2, 10μH
68nF
RT
LT8708
1nF
10Ω
1nF
10Ω
M3
L1
10μH
M3, M4, M10, M11: INFINEON BSC010N04LS
COUT3, CIN3: 1500μF, 63V
CIN1, CIN2, CIN6, CIN7, COUT1, COUT2, COUT5, COUT6: 10µF, 100V, X7R
54.9k
LD033
LDO33
100k
RVSOFF
MODE
127k
47nF
0.22μF
TG1 BOOST1 SW1 BG1 CSP CSN
CSNIN
100nF
CIN7
4.7μF
SWEN
LD033
LDO33
100k
RVSOFF
MODE
127k
47nF
1Ω
TO DIODE
DB1
M2
TG1 BOOST1 SW1 BG1CSP CSN
CSNIN
100nF
DB1, DB2, DB3, DB4: CENTRAL SEMI CMMR1U-02-LTE
L1, L2: 10μH, COILCRAFT SER2918H-103KL
XOR: DIODES INC. 74AHC1G86SE-7
M1,M2, M8, M9: INFINEON BSC026N08NS5
CIN3
IIN
XOR
220pF
*SEE THE UNI AND
BIDIRECTIONAL
CONDUCTION
SECTION OF THE LT8708
DATA SHEET
DIR_CTRL
RVS (0V) FWD (3V)
POWER TRANSFER
DECISION LOGIC
24V TO 55V
BATTERY
VBAT1
4.7nF
200Ω
17.4k
10V
TO 16V
BATTERY
87081 TA04a
LT8708-1
TYPICAL APPLICATIONS
4-Phase 48V to 12V Bidirectional Dual Battery System with FHCM and RHCM
Rev A
33
LT8708-1
TYPICAL APPLICATIONS
4-Phase 48V to 12V Bidirectional Dual Battery System with FHCM and RHCM
Direction Change
Phase 1 to 4 Inductor Current
DIR
5V/DIV
PHASE 1 IL
20A/DIV
PHASE 1 TO
PHASE 4 IL
5A/DIV
PHASE 2 IL
20A/DIV
PHASE 3 IL
20A/DIV
56ms/DIV
87081 TA04b
2μs/DIV
87081 TA04c
Rev A
34
For more information www.analog.com
LT8708-1
PACKAGE DESCRIPTION
UHG Package
40-Lead Plastic QFN (5mm × 8mm)
(Reference LTC DWG # 05-08-1528 Rev A)
0.70 ±0.05
5.50 ±0.05
5.85 ±0.10
PACKAGE
OUTLINE
4.10 ±0.05
3.50 REF
3.10 ±0.10
0.25 ±0.05
6.50 REF
7.10 ±0.05
8.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
C 0.35
1.00 TYP
5.00 ±0.10
34
40
0.40 ±0.05
PIN 1
TOP MARK
33
33
1
0.25 ±0.05
0.75 TYP
×4
0.50 BSC
8.00 ±0.10
5.85 ±0.10
3.10 ±0.10
22
0.675
REF
22
14
DETAIL B
21
0.55
REF
DETAIL A
15
21
15
R = 0.125
TYP
BOTTOM VIEW—EXPOSED PAD
0.20 REF
0.00 – 0.05
0.75 ±0.05
1.00 TYP
(UHG) QFN 0417 REV A
DETAIL B
0.08 REF
DETAIL A
0.203 ±0.008
0.203 +0.058, –0.008
TERMINAL THICKNESS
0.31 REF
0.00 – 0.05
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES IN DEGREES.
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
COPLANARITY SHALL NOT EXCEED 0.08MM.
3. WARPAGE SHALL NOT EXCEED 0.10MM.
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTIC(S).
5. REFER JEDEC M0-220.
Rev A
For more information www.analog.com
35
LT8708-1
PACKAGE DESCRIPTION
LWE Package
64-Lead Plastic Exposed Pad LQFP (10mm × 10mm)
(Reference LTC DWG #05-08-1982 Rev A)
10.15 – 10.25
7.50 REF
1
64
49
48
0.50 BSC
5.74 ±0.05
7.50 REF
0.20 – 0.30
10.15 – 10.25
5.74 ±0.05
16
17
PACKAGE OUTLINE
33
32
1.30 MIN
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
12.00 BSC
10.00 BSC
5.74 ±0.10
64
49
SEE NOTE: 3
1
64
49
48
48
1
12.00 BSC
10.00 BSC
A
5.74 ±0.10
A
33
16
33
16
C0.30 – 0.50
17
32
17
BOTTOM OF PACKAGE—EXPOSED PAD (SHADED AREA)
32
11° – 13°
R0.08 – 0.20
1.60
1.35 – 1.45 MAX
GAUGE PLANE
0.25
0° – 7°
LWE64 LQFP 0416 REV A
11° – 13°
0.50
BSC
0.09 – 0.20
1.00 REF
0.17 – 0.27
0.05 – 0.15
SIDE VIEW
0.45 – 0.75
SECTION A – A
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.25mm (10 MILS) BETWEEN THE LEADS AND
MAX 0.50mm (20 MILS) ON ANY SIDE OF THE EXPOSED PAD, MAX 0.77mm
(30 MILS) AT CORNER OF EXPOSED PAD, IF PRESENT
3. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
4. DRAWING IS NOT TO SCALE
Rev A
36
For more information www.analog.com
LT8708-1
REVISION HISTORY
REV
DATE
DESCRIPTION
A
01/20
Added eLQFP package option.
Corrected Block Diagram.
Corrected components information.
PAGE NUMBER
1, 3, 4, 6, 36,
37
13
31, 33, 36
Rev A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For
is granted
implication or
otherwise under any patent or patent rights of Analog Devices.
more by
information
www.analog.com
37
LT8708-1
TYPICAL APPLICATION
4-Phase 48V to 12V Bidirectional Dual Battery System with FHCM and RHCM
IIN
VBAT1
+
+
24V TO 55V
BATTERY
5mΩ
CIN4
×2
CIN3
L1
10μH
M1
M2
CIN1
CIN2
–
1μF
340k
POWER TRANSFER
DECISION LOGIC
DIR_CTRL
*SEE THE UNI AND
BIDIRECTIONAL
CONDUCTION
SECTION OF THE LT8708
DATA SHEET
20k
16.9k
100k
M5
18.2k
M7
M6
VC
54.9k
RT
10k
1nF
SS
365k
68nF
17.8k
47nF
CSNOUT
EXTVCC
VOUTLOMON
FBOUT
ICP
ICN
INTVCC
GATEVCC
IMON_OP
IMON_ON
IMON_INP
IMON_INN
SYNC CLKOUT
1μF
120kHz
10V
TO 16V
BATTERY
100nF
100Ω
LT8708
LD033
LDO33
100k
RVSOFF
MODE
127k
–
GND BG2 SW2 BOOST2 TG2
CSPOUT
SWEN
4.7μF
1Ω
3.3nF
DIR
LD033
COUT3
+
1.5mΩ 1Ω 0.22μF
1nF
10Ω
CSPIN
VINCHIP
SHDN
FBIN
VINHIMON
340k
+
COUT4
×2
TO DIODE
DB2
TG1 BOOST1 SW1 BG1CSP CSN
CSNIN
47nF
COUT2
COUT1
1nF
1Ω
0.22μF
100nF
100Ω
20k
RVS (0V) FWD (3V)
TO DIODE
DB1
1Ω
M3
10Ω
I
VBAT2 OUT
2mΩ
M4
93.1k
133k
12.1k
12.1k
4.7μF
4.7μF
200Ω
4.7nF
30.1k
47nF
17.4k
13.3k
22nF
4.7nF
23.7k
3.3Ω
DB1
DB2
TO
TO
LT8708’S LT8708’S
BOOST1 BOOST2
200Ω
17.4k
200Ω
17.4k
4.7nF
4.7nF
220pF
68.1k
XOR
5mΩ
CIN5
×2
M9
CIN7
1μF
340k
100Ω
100nF
47nF
LD033
1Ω 0.22μF
1.5mΩ
CSPIN
VINCHIP
SHDN
VOUTLOMON
FBIN
FBOUT
VINHIMON
SWEN
DIR
54.9k
RT
10k
470pF
12nF
CLK1
CLK2
CLK3
CLK4
100nF
100Ω
GND BG2 SW2 BOOST2 TG2
CSPOUT
CSNOUT
EXTVCC
ICP
ICN
LT8708-1
VC
INTVCC
GATEVCC
IMON_OP
IMON_ON
IMON_INP
IMON_INN
SYNC CLKOUT
SS
365k
COUT7
×2
1Ω
3.3nF
TG1 BOOST1 SW1 BG1 CSP CSN
CSNIN
LD033
LDO33
100k
RVSOFF
MODE
127k
4.7μF
1nF
10Ω
COUT6
COUT5
TO DIODE
DB4
1nF
1Ω
0.22μF
2mΩ
M11
M10
10Ω
TO DIODE
DB3
1Ω
20k
**4-PHASE CLOCK
SIGNALS FROM
CLOCK CHIP
SUCH AS LTC6909
L2, 10μH
M8
CIN6
1μF
120kHz
4.7nF
47nF
4.7μF
4.7μF
200Ω
4.7nF
17.4k
17.4k
17.4k
4.7nF
10nF
17.4k
DB3
TO
LT8708-1’S
BOOST1
3.3Ω
DB4
TO
LT7081’S
BOOST2
PHASE 2
PHASE 3
PHASE 4
DB1, DB2, DB3, DB4: CENTRAL SEMI CMMR1U-02-LTE
L1, L2: 10μH, COILCRAFT SER2918H-103KL
XOR: DIODES INC. 74AHC1G86SE-7
M1, M2, M8, M9: INFINEON BSC026N08NS5
M3,M4, M10, M11: INFINEON BSC010N04LS
COUT3, CIN3: 1500μF, 63V
CIN1, CIN2, CIN6, CIN7, COUT1, COUT2, COUT5, COUT6:
10µF, 100V, X7R
M5, M6, M7: T2N7002AK, TOSHIBA
CIN4, CIN5, COUT4, COUT7: SUNCON, 15μF, 100V
100HVP15M
SEE MORE DETAILS OF THIS APPLICATION ON PAGE 33.
87081 TA02a
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT8708
80V Synchronous 4-Switch Buck-Boost DC/DC
Controller with Flexible Bidirectional Capability
2.8V (Need EXTVCC > 6.4V) ≤ VIN ≤ 80V, 1.3V ≤ VOUT ≤ 80V, 5mm × 8mm,
QFN-40 and 10mm × 10mm eLQFP-64 Packages.
LT8705A
80V VIN and VOUT Synchronous 4-Switch BuckBoost DC/DC Controller
2.8V ≤ VIN ≤ 80V, Input and Output Current Monitor, 5mm × 7mm QFN-38 and
TSSOP-38 Packages
LTC®3779
150V VIN and VOUT Synchronous 4-Switch BuckBoost Controller
4.5V ≤ VIN ≤ 150V, 1.2V ≤ VOUT ≤ 150V, Up to 99% Efficiency Drives Logic-Level
or STD Threshold MOSFETs, TSSOP-38 Package
LTC3899
60V, Triple Output, Buck/Buck/Boost Synchronous
Controller with 29µA Burst Mode IQ
4.5V (Down to 2.2V after Start-Up) ≤ VIN ≤ 60V, VOUT Up to 60V,
Buck VOUT Range: 0.8V to 60V, Boost VOUT Up to 60V
LTC3895/
LTC7801
150V Low IQ, Synchronous Step-Down
DC/DC Controller with 100% Duty Cycle
4V ≤ VIN ≤ 140V, 150V ABS Max, PLL Fixed Frequency 50kHz to 900kHz,
0.8V ≤ VOUT ≤ 60V, Adjustable 5V to 10V Gate Drive, IQ = 40μA,
4mm × 5mm QFN-24, TSSOP-24, TSSOP-38(31) Packages
LTC3871
Bidirectional Multiphase DC/DC Synchronous Buck
or Boost On-Demand Controller
VIN/VOUT Up to 100V, Ideal for High Power 48V/12V Automotive Battery
Applications
Rev A
38
01/20
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