MA4P4001F-1091T

MA4P MELF & HIPAX Series High Power PIN Diodes V16 Features           Package Styles High Power Handling Low Loss / Low Distortion Voltage Ratings up to 1000 Volts Passivated Chip for Low Leakage Current Low Theta (θ) Due to Full Face Chip Bonding Leadless Low Inductance MELF Packages Various Package Options Available as Chips Fully RoHS Compliant Non-Magnetic Packages Available for MRI Description The MELF and HIPAX PIN diode series are designed for usage in switch and attenuator applications requiring high power handling and low distortion. These diodes incorporate a fully passivated PIN diode chip resulting in an extremely low reverse bias leakage current. The semiconductor technology utilized in the MELF and HIPAX families draws on MACOM ’s substantial experience in PIN diode design and wafer fabrication. The result is a device which has a thick I-region and long carrier lifetime while maintaining low series resistance and capacitance values. The chips of the MELF and HIPAX PIN diodes are enclosed in a rugged ceramic package and is full face bonded to metal pins on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to symmetrical thermal paths. The parts are offered in either magnetic or non-magnetic, HIPAX (axial leaded) or MELF (Metal Electrode Leadless Faced) surface mount packages for MRI applications. The MELF is a rectangular SMQ, package which is designed for high volume tape and reel assembly. This easy to use package design makes automatic pick and place, indexing and assembly, extremely easy. The parallel flat surfaces are suitable for most key jaw or vacuum pickup techniques. All of the solderable surfaces are tin plated and compatible with industry standard reflow and vapor phase soldering processes. See Application Note M538 for a typical solder reflow profile. Many of MACOM’s HIPAX PIN diodes are also available as chips. Please consult the “Silicon PIN Chip Datasheet” for availability and specifications. 401 & 402 1072 & 1091 Applications HIPAX PIN diodes are designed for use in a wide variety of switch and attenuator applications from HF through UHF frequencies and at power levels above 1 kW, CW. The internal chip as well as each diode assembly has been comprehensively tested and characterized to ensure predictable and repeatable performance. Design Recommendations  Low Distortion Attenuators MA4P4301B  Surface Mount Switches MA4P7101F  Cellular Radio Antenna Switches MA4P1200, MA4P1250 Absolute Maximum Ratings TA = +25°C (Unless Otherwise Noted)1 Parameter Absolute Maximum DC Reverse Voltage (VR) (See Tables) Operating Chip Junction Temperature -55°C to +175°C Storage Temperature -55°C to +200°C Installation Temperature +280°C for 30 Seconds ESD Class 1A, HBM Notes 1. Operation of this device above any one of these parameters may cause permanent damage. 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 MA4P1000 Series Electrical Specifications @ TA = +25°C Part # CT Total Capacitance pF VR Reverse Voltage VDC RS Series Resistance W RP Parallel Resistance kW VR = 50 V, 1 MHz IR = 10 mA IF = 50 mA, 100 MHz VR = 0 V, 100 MHz (NM Indicates NonMagnetic) Typ. Max. MA4P1200 - 401T 1.2 1.5 MA4P1200NM - 401T 1.2 1.5 MA4P1250 -1072T 0.8 1.2 MA4P1250NM -1072T 0.8 1.2 MA4P1450 -1091T 1.8 2.5 Part # Min. Max. Typ. Max. Min. 50 100 0.5 0.75 5 VF Forward Voltage (Max. I Forward @ 1V ≤ TL Carrier Lifetime IF = 50 mA IF = 10 mA, IR = 6 mA (NM Indicates NonMagnetic) Forward Bias Harmonic Distortion R(2a/a) * R(3a/a) Reverse Bias Harmonic Distortion R(2a/a) – R(3a/a) PIN = 30 W, 100 MHz PIN = 0 dBm, VR = 0 V, IF = 50 mA 100 MHz Typ. Max. Min. Typ. Min. Typ. Min. Typ. 0.85 1.0 2 8 80 90 60 70 MA4P1200 - 401T MA4P1200NM - 401T MA4P1250 -1072T MA4P1250NM-1072T MA4P1450 -1091T *Notes: 1.) “NM” in the base part number signifies non-magnetic package. 2.) “T” suffix denotes tape and reel Power Dissipation and Thermal Resistance Ratings @ TA = +25°C Package Style B Axial Lead F MELF Condition MA4P1200(NM)-401T PDISS No Heatsink 1.5 W Lead Length 1/4" 5.5 W θJC 15°C/W MA4P1250(NM)-1072T MA4P1450-1091T PDISS θJC PDISS θJC — — — — — — — — No Heatsink — 6W Infinite Heatsink — 18 W 15°C/W 10 W 30 W 5°C/W 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Typical Performance Curves @ TA = +25°C MA4P1200 Series Capacitance vs. Frequency & Reverse Bias Capacitance Series Resistance Series Resistance @ 100 MHz vs. Forward Current Ω pF MHz Frequency Forward Current Heatsink Temperature vs. Max. Power Dissipation Ω MHz Frequency Watts Maximum Power Dissipation Parallel Resistance Parallel Resistance vs. Frequency & Reverse Bias °C Heatsink Temperature 3 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Typical Performance Curves @ TA = +25°C MA4P1250 Series Capacitance vs. Frequency & Reverse Bias Capacitance Series Resistance Series Resistance @ 100 MHz vs. Forward Current Ω MHz Frequency Forward Current Parallel Resistance vs. Frequency & Reverse Bias Carrier Lifetime vs. Forward Bias Current Carrier Lifetime Parallel Resistance pF Ω MHz Frequency Forward Current 4 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Typical Performance Curves @ TA = +25°C MA4P1450 Series Capacitance vs. Frequency and Reverse Bias Capacitance Series Resistance Series Resistance @ 100 MHz vs. Forward Current Ω pF MHz Forward Current Frequency Parallel Resistance Parallel Resistance vs. Frequency and Reverse Bias Ω MHz Frequency 5 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 MA4P4000 - MA4P7100 Series Electrical Specifications @ TA = +25°C Parameter Symbol Condition MA4P4000 Series MA4P4300 Series MA4P7000 Series MA4P7100 Series Maximum Series Resistance RS IF = 100 mA 0.5 Ω 1.0 Ω 0.9 Ω 0.5 Ω Maximum Total Capacitance CT VR = 100 V 2.2 pF 2.0 pF 0.7 pF 1.0 pF Minimum Parallel Resistance RP VR = 100 V 20 kΩ 50 kΩ 200 kΩ 100 kΩ Minimum Carrier Lifetime TL IF = 10 mA 20 µs 15 µs 5 µs 2.5 µs Maximum Forward Voltage VF IF = 100 mA 1.0 V 1.2 V 1.0 V 1.0 V Maximum Reverse Current IR At max. rated voltage 1 µA 1 µA 1 µA 1 µA Nominal I-Region Width μ — 175 µm 300 µm 175 µm 100 µm Maximum Reverse Voltage Rating ( VR ) Maximum Reverse Voltage Rating MA4P4000 Series MA4P4300 Series MA4P7000 Series MA4P7100 Series 100 V MA4P4001B-402 MA4P4001BNM-402 MA4P4001F-1091T MA4P4301B-402 MA4P4301F-1091T MA4P7001F-1072T MA4P7101B-401T MA4P7101F-1072T 200 V MA4P4002B-402 MA4P4002F-1091T MA4P4302B-402 MA4P7002B-401T MA4P7002F-1072T MA4P7102B-401T MA4P7102F-1072T 400 V — — — MA4P7104B-401T MA4P7104F-1072T 600 V MA4P4006F-1091T MA4P4006B-402 — MA4P7006B-401T MA4P7006F-1072T — *Notes: 1.) “NM” in the base part number signifies non-magnetic package. 2.) “T” suffix denotes tape and reel. Package Style Condition MA4P4000 Series MA4P4300 Series MA4P7000 Series MA4P7100 Series PDISS θJC PDISS θJC PDISS θJC PDISS θJC 1/4” Lead Length 12 W 12.5°C/W 10 W 15°C/W 5W 30°C/W 6W 25°C/W No Heatsink 2.5 W — 2.5 W — 1.5 W — 1.5 W — F MELF Infinite Heatsink 7.5 W 20°C/W 5W 30°C/W 10 W 15°C/W 11.5 W 13°C/W Both B and F Single 1 µs pulse 100 kW — 100 kW — 15 kW — 15 kW — Both B and F Single 100 µs 5 kW 0.03°C/W 5 kW 0.03°C/W 300 W 0.5°C/W 300 W 0.5°C/W B Axial Leaded 6 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Typical Performance Curves @ TAMB = +25°C MA4P4000,MA4P4300, MA4P7000, MA4P7100 Series Series Resistance at 100 MHz vs. Forward Current MA4P7000, MA4P7100 Series Series Resistance Series Resistance Series Resistance at 100 MHz vs. Forward Current MA4P4000, MA4P4300 Series Ω Ω Forward Current Forward Current Carrier Lifetime vs. Forward Bias Current MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series Carrier Lifetime Thermal Resistance Thermal Resistance vs. Pulse Width MA4P4000, MA4P4300, MA4P7000 & MA4P7100 Series °C/W µS Forward Current Pulse Width 7 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Typical Performance Curves @ TAMB = +25°C MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series Capacitance vs. Frequency & Reverse Bias MA4P4300 Series Capacitance Capacitance Capacitance vs. Frequency & Reverse Bias MA4P4000 Series pF pF MHz MHz Frequency Frequency Capacitance vs. Frequency & Reverse Bias MA4P7100 Series Capacitance Capacitance Capacitance vs. Frequency & Reverse Bias MA4P7000 Series pF pF MHz MHz Frequency Frequency 8 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Typical Performance Curves @ TAMB = +25°C MA4P4000, MA4P4300, MA4P7000, MA4P7100 Series Parallel Resistance vs. Reverse Bias & Frequency MA4P4300 Series Parallel Resistance Parallel Resistance Parallel Resistance vs. Reverse Bias & Frequency MA4P4000 Series Ω Ω Volts Reverse Bias Volts Reverse Bias Parallel Resistance vs. Reverse Bias & Frequency MA4P7100 Series Parallel Resistance Parallel Resistance Parallel Resistance vs. Reverse Bias & Frequency MA4P7000 Series Ω Volts Reverse Bias Ω Volts Reverse Bias 9 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Case Styles 401 Axial Leaded Packages 402 Axial Leaded Packages Cathode Band Cathode Band B C Min. Max. Min. Max. A — 0.130 — 3.30 B — 0.090 — 2.29 C 0.975 24.77 — D 0.027 0.029 0.69 0.74 INCHES 1091 MELF Surface Mount Packages 100 pcs/bag Min. MAX Min. Max. A — 0.230 — 5.84 B — 0.140 — 3.56 C 0.975 24.77 — D 0.039 0.041 0.99 1.04 MA4P4001B-402 MA4P4001BNM-402 MA4P4002B-402 MA4P4006B-402 MA4P4301B-402 MA4P4302B-402 INCHES Cathode B A B A Solderable Surfaces A Solderable Surfaces C A C A MA4P1450-1091T MA4P4001F-1091T MA4P4002F-1091T MA4P4006F-1091T MA4P4301F-1091T 1072 Package (tape and reel only) Min. Max. 1500 or 5000 pcs/reel specify when ordering Min. A 0.138 0.155 3.51 3.94 B 0.181 0.191 4.57 4.85 C 0.011 0.026 0.279 0.660 INCHES Max. MA4P1250-1072T MA4P1250NM-1072T MA4P7001F-1072T MA4P7002F-1072T MA4P7006F-1072T MA4P7101F-1072T MA4P7104F-1072T Dimension 500 pcs/reel MM Dimension 1091 Package (tape and reel only) MM 1072 MELF Surface Mount Packages Cathode A C A 402 Package (bulk only) MM D Dimension MA4P1200-401T MA4P1200NM-401T MA4P7002B-401T MA4P7006B-401T MA4P7101B-401T MA4P7102B-401T MA4P7104B-401T Dimension 500 or 1000 pcs/reel specify when ordering C C A 401 Package (tape and reel only) B D INCHES Min. Max. MM Min. A 0.080 0.095 2.032 2.413 B 0.115 0.125 2.921 3.175 C 0.008 0.023 0.203 0.584 10 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support Max. MA4P MELF & HIPAX Series High Power PIN Diodes V16 MELF Assembly Recommendations Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable surfaces of MELF devices are tin plated 50 μm thick to ensure an optimum connection. For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the MACOM website. Circuit Pad Layout for MELF Diodes MELF Internal Construction Package Style Dimension 1072 1091 inches mm inches mm A 0.093 2.36 0.150 3.81 B 0.050 1.27 0.050 1.27 C 0.060 1.52 0.100 2.54 A B C B Ordering Information MELF diodes are available in tape and reel in quantities as shown in table below Package Style Quantity (7” Reel) Bulk Devices Per Bag 1072T 1500 or 5000 N/A 1091T 500 N/A Tape and reel information can be found in application note M513 the MACOM website. 11 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4P MELF & HIPAX Series High Power PIN Diodes V16 Axial Leaded HIPAX Assembly Recommendations Bends on case styles 401 and 402, axially leaded devices, must be made while holding the lead firm and forming the bend no closer than .060 inches from the body of the part. Bending the lead