0ZCM0002FF2G

Surface Mount PTC 0ZCM Series 0ZCM Series – 0603 Chip RoHS 2 Compliant Product Features - 0603 Chip Size, Fast Trip Time, Low DCR Resistance - AEC-Q Compliant - Meets Bel automotive qualification* * - Largely based on internal AEC-Q test plan Operating (Hold Current) Range 10mA – 200mA Maximum Voltage 9 – 60V (per table) Temperature Range -40° C to 85° C Agency Approval TUV (Std. EN/IEC 60738-1-1 and EN/IEC 60730-1, Cert. R50102117) UL Recognized Component (Std. UL1434, File E305051) AEC-Q Compliant LEAD FREE = HALOGEN FREE = Electrical Characteristics (23 Part Number ) Hold Current Trip Current Rated Voltage Maximum Current Typical Power IH, A IT, A Vmax, Vdc Imax, A Max Time to Trip Resistance Tolerance Current Time Rmin R1max Pd, W A Sec Ohms Ohms Agency Approvals New Rating A 0ZCM0001FF2G 0.01 0.03 60 40 0.5 0.20 1.00 15.00 100.00 Y Y New Rating B 0ZCM0002FF2G 0.02 0.06 60 40 0.5 0.20 1.00 12.00 70.00 Y Y New Rating C 0ZCM0003FF2G 0.03 0.09 30 40 0.5 0.20 1.00 6.00 50.00 Y Y New Rating D 0ZCM0004FF2G 0.04 0.12 24 40 0.5 0.20 1.00 4.00 40.00 Y Y E 0ZCM0005FF2G 0.05 0.15 15 40 0.5 0.50 0.10 3.80 30.00 Y Y 0ZCM0008FF2G 0.08 0.20 15 40 0.5 0.60 0.10 2.80 14.00 Y Y 0ZCM0008FA2G 0.08 0.20 15 40 0.5 0.60 0.10 2.80 14.00 Y G 0ZCM0010FF2G 0.10 0.25 15 40 0.5 0.70 0.10 0.90 8.00 Y Y H 0ZCM0012FF2G 0.12 0.30 9 40 0.5 0.80 0.10 1.10 5.80 Y Y I 0ZCM0016FF2G 0.16 0.40 9 40 0.5 1.00 0.10 1.00 4.20 Y Y J 0ZCM0020FF2G 0.20 0.45 9 40 0.5 2.00 0.10 0.55 3.50 Y Y F IH Hold Current- The maximum current at which the device will not trip in still air at 23° C. IT Trip current- The minimum current at which the device will trip in still air at 23° C. Vmax Maximum voltage device can withstand at its rated current without suffering dam age. Imax Maximum fault current device can withstand at rated voltage (Vmax) without damage. Pd Typical power dissipated by device when in tripped state in 23° C still air environment. Rmin Minimum device resistance at 23° C in initial un-soldered state. R1max Maximum device resistance at 23° C, 1 hour after initial device trip, or after being soldered to PCB in end application. Specifications subject to change without notice belfuse.com/circuit-protection Type 0ZCM Series 2/4 PTC’s – Basic Theory of Operation / “Tripped” Resistance Explanation A Bel PTC consists of a block of polymeric material containing conductive carbon granules which is sandwiched between two conductive metal plates. When this polymer block reaches approximately 125C, either due to current passing through it via conductive chains of carbon particles or due to an external heat source; it swells volumetrically. This expansion breaks apart a majority of the chains of carbon granules that run randomly between the two conductive plates. This behavior results in a sharp increase in resistance across the two plates which all but eliminates current flow through the device, allowing just enough residual current flow to maintain the block’s internal temperature at 125C. Once this “tripped” state current is cut off, the polymer brick cools and shrinks to its original size, thereby allowing its broken carbon chains to reestablish themselves and permit the part to return to its low resistance state. Once cooled to room ambient, the PTC will once again exhibit a resistance less than its “R1max” rating. At currents below the device IHOLD rating, AND at temperatures below 100C, the PTC maintains a resistance value below its R1 MAX rating. The catalog data for each device specifies a "Typical Power" value. This is the power required to exactly match the heat lost by the tripped device to its ambient surroundings at 23C. By Ohm's Law, power can be stated as: W = E²/R. Thus the approximate resistance of a “Tripped” PTC can be determined by: R = E²/W, where "E" is the voltage appearing across the PTC (usually the supply's open circuit voltage), and "W" is the Typical Power value for the particular PTC. Since the PPTC acts to maintain a constant internal temperature, its apparent resistance will change based upon applied voltage and, to a lesser degree, ambient conditions. Consider the following example.... A PTC with a Typical Power of 1 watt protecting a circuit using a 60V supply will demonstrate an apparent, tripped resistance "R" of: R = 60²/1 = 3,600 ohms This same tripped device when used to protect a 12V circuit would now present an apparent resistance of: R = 12²/1 = 144 ohms The value for Typical Power is "typical" because any physical factors that affect heat loss (such as ambient temperature or air convection) will somewhat alter the level of power that the PTC needs to maintain its internal temperature. In short, PTCs do not exhibit a constant, quantifiable tripped resistance value. Average Time Current Characteristic Curve at 23°C The Average Time Current Characteristic Curve and Temperature Rerating Curve are affected by a number of variables and these curves are provided for guidance only. Specifications subject to change without notice Bel Fuse Inc. 206 Van Vorst Street Jersey City, NJ 07302 USA +1 201.432.0463 Bel.US.CS@belf.com belfuse.com/circuit-protection © 2019 Bel Fuse, Inc. Rev. 0ZCM Sep2019 Type 0ZCM Series 3/4 Pad Layout Termination Pad Materials The dimensions in the table below provide the recommended pad layout. Matte Tin – Plated Copper P S W Nominal Nominal Nominal mm Inch mm Inch mm Inch 0.80 0.031 0.60 0.024 0.80 0.031 All dimensions in mm. Mechanical Dimensions and Marking Dimensions Part Number Marking Code C Min Max 0ZCM0001FF2G 0.35 0.85 0ZCM0002FF2G 0.35 0.85 0ZCM0003FF2G 0.35 0.75 0ZCM0004FF2G 0.35 0.75 0ZCM0005FF2G 0.35 0.75 0ZCM0008FF2G 0.35 0.75 0ZCM0008FA2G 0.40 0.60 0ZCM0010FF2G 0.35 0.75 0ZCM0012FF2G 0.35 0.75 0ZCM0016FF2G 0.35 0.75 0ZCM0020FF2G 0.35 0.75 IH code n w h k u x x d y z f Temperature Derating Table Temperature Derating I Hold Value 0ZCM -40 -20 0 23 30 40 50 60 70 85 163% 143% 123% 100% 95% 88% 80% 72% 66% 56% Thermal Derating Curve Cautionary Notes Temperature Derating Curve Percent of Hold and Trip Current 180% 160% 140% 120% 100% 80% 60% 40% 20% 0% -40 -20 0 20 40 Temperature(° C) 60 80 1. Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. 2. These Polymer PTC (PPTC) devices are intended for protection against occasional overcurrent/overtemperature fault conditions and may not be suitable for use in applications where repeated and/or prolonged fault conditions are anticipated. 3. Avoid contact of PTC device with chemical solvent. Prolonged contact may adversely impact the PTC performance. 4. These PTC devices may not be suitable for use in circuits with a large inductance, as the PTC trip can generate circuit voltage spikes above the PTC rated voltage. 5. These devices may be used in both DC and AC circuits provided that peak-to-peak line voltage when carrying AC does not exceed the PTC’s Vmax rating. As PTCs are essentially thermal devices, the RMS value of AC current carried by a PTC will produce tripping parameters and times-to-trip similar to those of a DC voltage of the same magnitude. 6. If potting is mandated, avoid rigid potting compounds as they will encase the PTC and prevent it from volumetrically expanding to properly respond to a trip event. 7. MSL: 2a (According to IPC J-Std-020). Specifications subject to change without notice Bel Fuse Inc. 206 Van Vorst Street Jersey City, NJ 07302 USA +1 201.432.0463 Bel.US.CS@belf.com belfuse.com/circuit-protection © 2019 Bel Fuse, Inc. Rev. 0ZCM Sep2019 Type 0ZCM Series 4/4 Environmental Specifications Temperature cycling JESD22 Method JA-104 Biased humidity MIL-STD-202 Method 103 Operational life MIL-STD-202 Method 108 Resistance to solvents MIL-STD-202 Method 215 Mechanical shock MIL-STD-202 Method 213 Vibration MIL-STD-202 Method 204 Resistance to soldering heat MIL-STD-202 Method 210 Thermal shock MIL-STD-202 Method 107 Solderability ANSI/J-STD-002 Board flex(SMD) AEC-Q200-005 Terminal strength AEC-Q200-006 Solder Reflow and Rework Recommendations Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3° C/second max Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature(TL ) Time (tL) 150° C 200° C 60-180 seconds 217° C 60-150 seconds Peak/Classification Temperature(Tp) : 260° C Time within 5° C of actual Peak : Temperature (tp) 20-40 seconds Ramp-Down Rate : 6° C/second max. Time 25° C to Peak Temperature : 8 minutes max Solder Reflow Due to “lead free / RoHS 2 ” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ” zone of the reflow profile are greater than those used for non-RoHS devices. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. Not Recommended For Wave Solder / Direct Immersion. 3. Recommended paste thickness range – 0.20 – 0.25mm. 4. Devices are compatible with standard industry cleaning solvents and methods. 5. MSL: 2a (According to IPC J-Std-020). Caution If reflow temperature / dwell times exceed the recommended profile, the electrical performance of the PTC may be affected. Rework: MIL-STD-202G Method 210F, Test Condition A. Standard Packaging P/N Explanation and Ordering Information Part Number Tape/Reel Qty 0ZCM0001FF2G Thu 0ZCM0020FF2G 4,000 4000 fuses in 7 inches dia. Reel, 8mm wide tape, 4mm pitch, per EIA-481(equivalent IEC-286 part 3). Specifications subject to change without notice Bel Fuse Inc. 206 Van Vorst Street Jersey City, NJ 07302 USA +1 201.432.0463 Bel.US.CS@belf.com belfuse.com/circuit-protection © 2019 Bel Fuse, Inc. Rev. 0ZCM Sep2019