TISP61089M
PROGRAMMABLE OVERVOLTAGE PROTECTOR
DUAL FORWARD-CONDUCTING P-GATE THYRISTOR
TISP61089M SLIC Overvoltage Protector
High 70 A 5/310 Capability
Dual Voltage-Programmable Protector
- Supports Voltages Down to -155 V
- Low 5 mA max. Gate Triggering Current
- High 150 mA min. Holding Current
Additional Information
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Description
CONTACT
Agency Recognition
The TISP61089M is a dual forward-conducting buffered p-gate
over-voltage protector. It is designed to protect monolithic SLICs
(Subscriber Line Interface Circuits) against overvoltages on
the telephone line caused by lightning, a.c. power contact and
induction. The TISP61089M limits voltages that exceed the SLIC
supply rail voltage. The TISP61089M parameters are specified to
allow equipment compliance with Bellcore GR-1089-CORE, ITU-T
K.21 and K.45 and YD/T-950.
Description
UL
File Number: E215609
8 Pin Small-Outline (D008) Package (Top View)
1
8
K1 (Tip)
2
7
A
(Ground)
NC
3
6
A
(Ground)
(Ring) K2
4
5
K2 (Ring)
(Tip)
The SLIC line driver section is typically powered from 0 V (ground)
and a negative voltage in the region of -20 V to -155 V. The
protector gate is connected to this negative supply. This references
the protection (clipping) voltage to the negative supply voltage. As
the protection voltage will then track the negative supply voltage,
the overvoltage stress on the SLIC is minimized.
Positive overvoltages are clipped to ground by diode forward
conduction. Negative overvoltages are initially clipped close to the
SLIC negative supply rail value. If sufficient current is available from
the overvoltage, then the protector will crowbar into a low voltage
on-state condition. As the overvoltage subsides, the high holding
current of the crowbar helps prevent d.c. latchup.
These monolithic protection devices are fabricated in ion-implanted
planar vertical power structures for high reliability and in normal
system operation they are virtually transparent. The TISP61089M
buffered gate design reduces the loading on the SLIC supply
during overvoltages caused by power cross and induction. The
TISP61089M is available in an 8-pin plastic small-outline surface
mount package.
K1
(Gate) G
MD6XANB
NC - No internal connection
Terminal typical application names shown in
parenthesis
Device Symbol
K1
K1
A
G
A
K2
K2
Terminals K1, K2 and A correspond to the alternative
line designators of T, R and G or A, B and C. The
negative protection voltage is controlled by the
voltage, VGG, applied to the G terminal.
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How to Order
Device
Package
TISP61089M
8 Pin Small Outline (D008)
Carrier
Embossed Tape Reeled
Order As
Marking Code
TISP61089MDR-S
1089M
Standard Quantity
2500
SEPTEMBER 2013 – REVISED JULY 2019
WARNING Cancer and Reproductive Harm
www.P65Warnings.ca.gov
*RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of
this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP61089M SLIC Overvoltage Protector
Absolute Maximum Ratings, TJ = 25 °C (Unless Otherwise Noted)
Symbol
Value
Unit
Repetitive peak off-state voltage, I G = 0
Rating
TJ = 25 °C
VDRM
-170
V
Repetitive peak gate-cathode voltage, VKA = 0
TJ = 25 °C
VGKRM
-167
V
ITSP
70
120
0.1 s
11
1s
ITSM
4.5
Non-repetitive peak on-state pulse current (see Notes 1 and 2)
10/1000 μs (Bellcore GR-1089-CORE, Issue 1, November 1994, Section 4)
30
5/310 μs (ITU-T K.20/21/45, YD/T-950, open-circuit voltage wave shape 10/700 μs)
2/10 μs (Bellcore GR-1089-CORE)
A
Non-repetitive peak on-state current, 60 Hz (see Notes 1 and 2 and Figure 2 on Page 4)
5s
A
2.4
300 s
0.95
900 s
0.93
Junction temperature
Storage temperature range
TJ
-40 to +150
°C
Tstg
-40 to +150
°C
NOTES: 1. Initially the protector must be in thermal equilibrium with TJ = 25 °C. The surge may be repeated after the device returns to its
initial conditions.
2. The rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pairs. Additionally, both
terminal pairs may have their rated current values applied simultaneously (in this case the Ground terminal current will be twice
the rated current value of an individual terminal pair).
Recommended Operating Conditions
Min
CG
Gate decoupling capacitor
Typ
Max
100
Unit
nF
Electrical Characteristics, TJ = 25 °C (Unless Otherwise Noted)
Parameter
ID
Off-state current
Test Conditions
Max
Unit
TJ = 25 °C
-5
μA
TJ = 85 °C
-50
μA
-112
V
I F = 5 A, t w = 200 μs
3
V
2/10 μs, I F = 100 A, di/dt = 80 A/μs, R S = 50 Ω, (see Note 4)
10
V
VD = VDRM, VGK = 0
2/10 μs, I TM = -100 A, di/dt = -80 A/μs, RS = 50 Ω, VGG = -100 V,
(see Note 4)
V(BO)
Breakover voltage
VF
Forward voltage
VFRM
Peak forward recovery
voltage
IH
Holding current
IGAS
Gate reverse current
VGG = VGK = VGKRM, VKA = 0
IGT
Gate trigger current
I T = -3 A, t p(g) ≥ 20 μs, VGG = -48 V
VGT
Gate trigger voltage
IT = -3 A, t p(g) ≥ 20 μs, VGG = -48 V
CAK
Min
I T = -1 A, di/dt = 1A/ms, VGG = -100 V
Anode-cathode off-state f = 1 MHz, V = 1 V, I = 0, (see Note 3)
d
G
capacitance
Typ
-150
mA
TJ = 25 °C
-5
μA
TJ = 85 °C
-50
μA
5
mA
2.5
V
VD = -3 V
100
pF
VD = -48 V
50
pF
NOTE: 3. These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured
device terminals are a.c. connected to the guard terminal of the bridge.
NOTE: 4. Voltage measurements should be made with an oscilloscope with limited bandwidth (20 MHz) to avoid high frequency noise.
SEPTEMBER 2013 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP61089M SLIC Overvoltage Protector
Thermal Characteristics
Parameter
RθJA
Junction to free air thermal resistance
Test Conditions
Ptot = 0.8 W, TA = 25 °C
5 cm2, FR4 PCB
Min
Typ
Max
Unit
160
°C/W
Parameter Measurement Information
SEPTEMBER 2013 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP61089M SLIC Overvoltage Protector
Thermal Information
PEAK NON-RECURRING A.C.
vs
CURRENT DURATION
ITSM - Peak Non-Recurrent 60 Hz Current - A
T16LACAa
RING AND TIP CONNECTIONS ITSM applied simultaneously to both
GROUND CONNECTION Return current is twice ITSM
10
VGEN = 600 Vrms
RGEN = 70 to 950 Ω
VG = -48 V, TAMB = 25 °C
1
0.1
1
10
100
1000
t - Current Duration - s
Figure 2. Non-Repetitive Peak On-State Current against Duration
SEPTEMBER 2013 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
TISP61089M SLIC Overvoltage Protector
Applications Information
Typical Applications Circuit
Figure 3 shows a typical TISP61089M SLIC card protection circuit. The incoming line conductors, Ring (R) and Tip (T), connect to the relay
matrix via the series overcurrent protection. Positive temperature coefficient (PTC) resistors can be used for overcurrent protection. Resistors
will reduce the prospective current from the surge generator for both the TISP61089M and the ring/test protector.
OVERCURRENT
PROTECTION
TIP
WIRE
RING
RELAY
SLIC
RELAY
+t°
R1a
55
RING
WIRE
TEST
RELAY
S3a
S1a
SLIC
PROTECTOR
SLIC
Th4
S2a
Th5
+t°
R1b
55
S3b
S1b
TISP61089M
S2b
C1
100 nF
TEST
EQUIPMENT
RING
GENERATOR
VBAT
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Figure 3. Typical Application Circuit
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www.bourns.com
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in the U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
SEPTEMBER 2013 – REVISED JULY 2019
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
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This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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