ADC121S101EVM

ADC121S101EVM User's Guide User's Guide Literature Number: SNOU131 July 2014 Contents 1 ADC121S101 BoosterPack Components ................................................................................. 4 2 Software Installation ............................................................................................................. 5 2.1 2.2 2.3 3 Graphical User Interface (GUI)............................................................................................. 5 Launchpad Firmware Upgrade ............................................................................................. 6 Update USB Driver .......................................................................................................... 7 ADC121S101 BoosterPack Setup and Operation .................................................................... 10 3.1 3.2 Connections ................................................................................................................. 10 Launching the Software ................................................................................................... 10 4 Board Layout ..................................................................................................................... 14 5 Schematic 6 ......................................................................................................................... 19 Bill Of Materials .................................................................................................................. 20 2 Contents SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com List of Figures 1-1. ADC121S101EVM Evaluation Board...................................................................................... 4 2-1. ADC12xS10x Installation Directory ........................................................................................ 5 2-2. ADC12xS10x Installation Finish 2-3. USB Firmware Upgrade Window .......................................................................................... 7 2-4. Driver Not Installed .......................................................................................................... 8 2-5. Driver Authentication Warning 2-6. Driver Installed ............................................................................................................... 9 3-1. ADC121S101EVM Attached to MSP430 ................................................................................ 10 3-2. Part Select................................................................................................................... 11 3-3. Selectable Fields in GUI ................................................................................................... 12 3-4. Testing the Part ............................................................................................................. 13 4-1. Top Assembly Layer ....................................................................................................... 14 4-2. Top Layer Routing 15 4-3. Power Layer Routing 16 4-4. 4-5. 5-1. ........................................................................................... ............................................................................................. ......................................................................................................... ...................................................................................................... Ground Layer Routing ..................................................................................................... Bottom Layer Routing...................................................................................................... ADC121S101EVM Schematic ............................................................................................ 6 9 17 18 19 List of Tables 1-1. Device and Package Configurations ...................................................................................... 4 6-1. ADC121S101 Bill of Materials ............................................................................................ 20 SNOU131 – July 2014 Submit Documentation Feedback List of Figures Copyright © 2014, Texas Instruments Incorporated 3 Chapter 1 SNOU131 – July 2014 ADC121S101 BoosterPack Components Figure 1-1. ADC121S101EVM Evaluation Board Table 1-1. Device and Package Configurations DEVICE 4 IC PACKAGE U1 LM4120IM5-3.3 SOT-23 U2 ADC121S101CIMF SOT-23 U3 LMT84DCK SC70 U4 LMV612MA SOIC-8 ADC121S101 BoosterPack Components Copyright © 2014, Texas Instruments Incorporated SNOU131 – July 2014 Submit Documentation Feedback Chapter 2 SNOU131 – July 2014 Software Installation 2.1 Graphical User Interface (GUI) To use the ADC121S101EVM, install the ADC12xS10x software: 1. If the ADC121S101EVM came from an FAE, the software GUI is in a .zip file. Otherwise, click on http://www.ti.com/product/adc121s101, scroll down to the Software section, and download the latest evaluation software. 2. Unzip the downloaded file into a known directory, and run the setup.exe file located in [Unzip location]\ADC12xS10x\EVM_GUI\ADC12xS10x_Installer_v11.zip\ADC12xS10x_Installer \Installer\Volume. Follow the pop-screen instructions by clicking the Next button to install the software. Figure 2-1. ADC12xS10x Installation Directory 3. When the installation is finished, click the Finish button. SNOU131 – July 2014 Submit Documentation Feedback Software Installation Copyright © 2014, Texas Instruments Incorporated 5 Launchpad Firmware Upgrade www.ti.com Figure 2-2. ADC12xS10x Installation Finish 2.2 Launchpad Firmware Upgrade This section is only necessary with a brand new Launchpad. If a Launchpad is shipped with an ADC121S101EVM, skip this section. MSP430 Firmware Upgrade Application Installation: 1. Navigate to http://www.ti.com/tool/msp430usbdevpack and click on Get Software. 2. Scroll down to the end of the page to find the USB Collateral Installers section. 3. Click on MSP430_USB_Firmware_Upgrade_Example-x-x-x-Setup.exe to download the tool; the page redirects to a submission form. 4. Complete the information requested and submit the form; if approved, a download button appears. 5. Run the installation file and follow the on-screen instructions until completion. When asked about the setup type, select Application Only. Click Finish when done. Firmware upgrade: 1. If the ADC121S101EVM is from an FAE, the firmware is the text file adc12xs10x_fw-v0.92.txt. 2. Open the MSP430 USB Firmware Upgrade application. By default, the application is launched from Start > Programs > Texas Instruments > MSP430 USB Firmware Upgrade Example. 3. Click Next to proceed on the first prompt; read and accept the license agreement and click Next to continue. 6 Software Installation SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Update USB Driver www.ti.com Figure 2-3. USB Firmware Upgrade Window 4. Enable the Select Firmware button and browse to open the downloaded firmware adc12xs10x_fwv0.92.txt. 5. Press the BSL button on the MSP430 LaunchPad and connect to the PC with a USB cable; if detected, the text on the Firmware Upgrade tool changes from No device connected to Found 1 device. 6. Click on the Upgrade Firmware button to program the LaunchPad. Close the application when done. 2.3 Update USB Driver 1. Before launching the ADC12xS10x software, connect the ADC121S101EVM board to a USB port of the PC. Go to the Device Manager and find MSP43-USB Example. Right click and select Update Driver Software. SNOU131 – July 2014 Submit Documentation Feedback Software Installation Copyright © 2014, Texas Instruments Incorporated 7 Update USB Driver www.ti.com Figure 2-4. Driver Not Installed 2. On the next screen, select the Browse my computer for driver software option and go to the directory of the install files. Select the MSP430_CDC_PID0x094e_ADC_DAC_EVMs.inf file. 3. If prompted with a warning window, select Install this Driver Anyway. Close the installation window when done. The device manager now displays a TI_ADC_DAC_EVMs item followed by a COM port number. 8 Software Installation SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Update USB Driver www.ti.com Figure 2-5. Driver Authentication Warning Figure 2-6. Driver Installed SNOU131 – July 2014 Submit Documentation Feedback Software Installation Copyright © 2014, Texas Instruments Incorporated 9 Chapter 3 SNOU131 – July 2014 ADC121S101 BoosterPack Setup and Operation 3.1 Connections 1. Attach the ADC121S101EVM BoosterPack onto the MSP430 LaunchPad using connectors JA, JB, JC, JD. Align the Launchpad and ADC121S101EVM so that the text “LaunchPad” and “2013 TI” are in the same direction. Figure 3-1. ADC121S101EVM Attached to MSP430 2. Connect the USB cable from the LaunchPad to the PC. 3.2 Launching the Software 1. The ADC12xS10x GUI software runs by clicking on Start > All Program > ADC12xS10x. After running the GUI, select ADC121S101. 10 ADC121S101 BoosterPack Setup and Operation Copyright © 2014, Texas Instruments Incorporated SNOU131 – July 2014 Submit Documentation Feedback Launching the Software www.ti.com Figure 3-2. Part Select 2. GUI Descriptions: • Ref. Voltage: User can define the reference voltage in volts. • Channel #: Option to select channels 0-3 • Output Type: – Decimal is the ADC code – mV is millivolts – Temperature is in Celsius and is only available on channel 3 • Single Read: Read a single conversion. • Continuous Read: Read conversion results continuously. • Zoom Out: – Checked: Graph zooms out. SNOU131 – July 2014 Submit Documentation Feedback ADC121S101 BoosterPack Setup and Operation Copyright © 2014, Texas Instruments Incorporated 11 Launching the Software • • www.ti.com – Unchecked: Graph resolves to LabView default. Burst Mode: – Checked: Graph updates with 1024 ADC conversions. – Unchecked: Graph updates with one ADC conversion. Save Results to File: – Checked: Save continuous read data to a text file. – Unchecked: No data is saved. Figure 3-3. Selectable Fields in GUI 3. Test the ADC121S101 by placing a finger on U3 to observe the temperature change. 12 ADC121S101 BoosterPack Setup and Operation Copyright © 2014, Texas Instruments Incorporated SNOU131 – July 2014 Submit Documentation Feedback Launching the Software www.ti.com Figure 3-4. Testing the Part SNOU131 – July 2014 Submit Documentation Feedback ADC121S101 BoosterPack Setup and Operation Copyright © 2014, Texas Instruments Incorporated 13 Chapter 4 SNOU131 – July 2014 Board Layout Figure 4-1. Top Assembly Layer 14 Board Layout SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Figure 4-2. Top Layer Routing SNOU131 – July 2014 Submit Documentation Feedback Board Layout Copyright © 2014, Texas Instruments Incorporated 15 www.ti.com Figure 4-3. Power Layer Routing 16 Board Layout SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Figure 4-4. Ground Layer Routing SNOU131 – July 2014 Submit Documentation Feedback Board Layout Copyright © 2014, Texas Instruments Incorporated 17 www.ti.com Figure 4-5. Bottom Layer Routing 18 Board Layout SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 5 SNOU131 – July 2014 Schematic Figure 5-1. ADC121S101EVM Schematic SNOU131 – July 2014 Submit Documentation Feedback Schematic Copyright © 2014, Texas Instruments Incorporated 19 Chapter 6 SNOU131 – July 2014 Bill Of Materials Table 6-1. ADC121S101 Bill of Materials 20 Designator Quanti ty !PCB 1 C1 1 C2, C3, C6, C8, C11 Value Description Part Number Manufacturer Printed circuit board SV601025 Any 0.047 uF CAP, CERM, 0.047 uF, 6.3 V, +/-10%, X7R, 0603 GRM188R70J473K A01D Murata 5 0.1 uF CAP, CERM, 0.1 uF, 10 V, +/-10%, X7R, 0603 C0603C104K8RACT U Kemet C4 1 0.01 uF CAP, CERM, 0.01 uF, 25 V, +/-10%, X7R, 0603 GRM188R71E103K A01D Murata C5 1 1000 pF CAP, CERM, 1000 pF, 50 V, +/-5%, C0G/NP0, 0603 C1608C0G1H102J TDK C7 1 10 uF CAP, TA, 10 uF, 10 V, +/-10%, 0.9 ohm, SMD TPSA106K010R090 0 AVX D1 1 20 V Diode, Schottky, 20 V, 0.2 A, SOD-523 SBR0220T5-7-F Diodes Inc. FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or mount. N/A N/A GND 1 Test point, TH, multipurpose, black 5011 Keystone Electronics J1 1 Header, TH, 100 mil, 4x2, gold plated, 230 mil above insulator TSW-104-07-G-D Samtec J2 1 Header, TH, 100 mil, 3x2, gold plated, 230 mil above insulator TSW-103-07-G-D Samtec J3, JVA 2 Header, 100 mil, 3x1, tin plated, TH PEC03SAAN Sullins Connector Solutions JA, JB, JC, JD 4 Connector, receptacle, 100 mil, 10x1, gold plated, TH SSW-110-23-F-S Samtec LBL1 1 Thermal transfer printable labels, 0.650" W x 0.200" H - 10,000 per roll THT-14-423-10 Brady R1, R3 2 100k RES, 100k ohm, 1%, 0.1W, 0603 RC0603FR07100KL Yageo America R2, R5, R8, R9 4 2.20k RES, 2.20k ohm, 1%, 0.1W, 0603 RC0603FR-072K2L Yageo America Vishay-Dale Black R4, R6, R7 3 200 RES, 200 ohm, 1%, 0.1W, 0603 CRCW0603200RFK EA SH-J2_5-6, SHJ3_1-2, SHJVA_2-3 3 1x2 Shunt, 100 mil, gold plated, black 382811-6 AMP U1 1 Precision micropower low dropout voltage reference, 5-pin SOT-23, Pb-free LM4120IM53.3/NOPB Texas Instruments U2 1 Single channel, 0.5 to 1 MSPS, 12-bit A/D converter, 6-pin SOT-23, Pb-free ADC121S101CIMF/ NOPB Texas Instruments U3 1 Analog temperature sensors with Class-AB output, DCK0005A LMT84DCK Texas Instruments U4 1 Dual 1.4 MHz, low power general purpose, 1.8 V, D0008A LMV612MA/NOPB Texas Instruments VA-EXT 1 Test point, TH, multipurpose, red 5010 Keystone Electronics Red Bill Of Materials SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Table 6-1. ADC121S101 Bill of Materials (continued) Designator Quanti ty C9, C10 2 Value Description Part Number Manufacturer CAP, CERM, xxxF, xxV, [TempCo], xx%, [PackageReference] Used in BOM report Used in BOM report SNOU131 – July 2014 Submit Documentation Feedback Bill Of Materials Copyright © 2014, Texas Instruments Incorporated 21 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. 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