User's Guide
SLVU274E – November 2008 – Revised January 2017
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion
and Li-Polymer Charge Management IC EVM
This user’s guide describes the bq24072/3/4/5/9(T) and bq24230/2 (bqTINY-III™) evaluation module
(EVM). The EVM provides a convenient method for evaluating the performance of a charge management
and system power solution for portable applications using the bq24072/3/4/5/9(T) and bq24230/2 product
families. A completely designed and tested module is presented. The charger is designed to deliver up to
1.5 A of continuous current to the system or charger for one-cell Li-ion or Li-polymer applications (see the
data sheet for correct device) using a dc power supply. The charger is programmed from the factory to
deliver 0.9 A of charging current. This EVM was designed as a stand-alone evaluation module, but it also
can be interfaced with the system and host via the connectors and headers.
1
2
3
4
5
6
7
8
Contents
Introduction ................................................................................................................... 2
Considerations When Testing and Using bq24072/3/4/5/9(T) and bq24230/2 ICs ................................. 2
Performance Specification Summary ..................................................................................... 3
Test Summary ................................................................................................................ 4
Schematic ..................................................................................................................... 8
Physical Layouts ............................................................................................................. 9
Bill of Materials ............................................................................................................. 12
References .................................................................................................................. 15
List of Figures
1
Test Diagram ................................................................................................................. 5
2
Modes of Operation Tested in Steps 11 Through 13 ................................................................... 6
3
Charger Profile With EN1 = VSS and EN2 = HI, Programmed by ISET ............................................. 7
4
Charge Enabled, Pulled High, Then Low – Disables Charge .......................................................... 7
5
Schematic ..................................................................................................................... 8
6
Top Assembly View
7
8
......................................................................................................... 9
Board Layout – Top Etch Layer .......................................................................................... 10
Board Layout – Bottom Etch Layer ...................................................................................... 11
List of Tables
........................................................................................................
1
Ordering Information
2
Performance Specification Summary for bq24072/3/4/5/9(T) and bq24230/2 EVMs ............................... 3
3
bq240xx ....................................................................................................................... 4
4
HPA282B Bill of Materials
5
HPA282B Bill of Materials (Continued) .................................................................................. 13
6
HPS252B Bill of Materials ................................................................................................. 14
7
HPA502A Bill of Materials ................................................................................................. 15
................................................................................................
2
12
Trademarks
bqTINY-III is a trademark of Texas Instruments.
SLVU274E – November 2008 – Revised January 2017
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Copyright © 2008–2017, Texas Instruments Incorporated
1
Introduction
1
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Introduction
The bq2407x and bq2432x powers the system while independently charging the battery. This feature
reduces the charge and discharge cycles on the battery, allows for proper charge termination, and allows
the system to run with an absent or defective battery pack. This feature also allows for the system to
instantaneously turn on from an external power source even when using a deeply discharged battery
pack.
This charger has one input and can be programmed to be used with an adapter or USB port as the power
source for the system. In the USB configuration, the host can select from the two preset input maximum
rates of 100 mA and 500 mA. The charger dynamically adjusts the charge rate based on the system load
to stay within the 100-mA or 500-mA maximum limits. An external resistor, RSET1, sets the magnitude of
the charge current. If the charge current exceeds the available input current, the voltage on the OUT pin
drops to the DPPM threshold or the battery voltage, whichever is higher. The charging current is reduced
to what current is available (IBAT = IIN–IOUT).
The integrated circuit (IC) charges the battery in three phases: conditioning, constant current, and
constant voltage. Charge is terminated based on minimum current. A resistor-programmable charge timer
provides a backup safety for charge termination. The charge automatically re-starts if the battery voltage
falls below an internal threshold. Sleep mode is entered when the supply is removed (Vin drops to the
battery voltage).
2
Considerations When Testing and Using bq24072/3/4/5/9(T) and bq24230/2 ICs
Consider the following noteworthy items while testing and using the bq2403x ICs.
The bq24072/3/4/5/9(T) series targets current above a nominal 500 mA (>350 mA) and the difference are
listed in Table 1.
Table 1. Ordering Information
Part Number
VOVP
VBAT
VOUT(REG)
VDPM
Optional
Function
Marking
bq24072RGTR
6.6 V
4.2 V
VBAT + 200 mV
VO(REG) – 100 mV
TD
CKP
bq24072RGTT
6.6 V
4.2 V
VBAT + 200 mV
VO(REG) – 100 mV
TD
CKP
bq24072TRGTR
6.6 V
4.2 V
VBAT + 225 mV
VO(REG) – 100 mV
TD
PAP
bq24072TRGTT
6.6 V
4.2 V
VBAT + 225 mV
VO(REG) – 100 mV
TD
PAP
bq24073RGTR
6.6 V
4.2 V
4.4 V
VO(REG) – 100 mV
TD
CKQ
bq24073RGTT
6.6 V
4.2 V
4.4 V
VO(REG) – 100 mV
TD
CKQ
bq24074RGTR
10.5 V
4.2 V
4.4 V
VO(REG) – 100 mV
ITERM
BZF
bq24074RGTT
10.5 V
4.2 V
4.4 V
VO(REG) – 100 mV
ITERM
BZF
bq24075RGTR
6.6 V
4.2 V
5.5 V
4.3 V
SYSOFF
CDU
bq24075RGTT
6.6 V
4.2 V
5.5 V
4.3 V
SYSOFF
CDU
bq24075TRGTR
6.6 V
4.2 V
5.5 V
4.3 V
SYSOFF
OEC
bq24075TRGTT
6.6 V
4.1 V
5.5 V
4.3 V
SYSOFF
OEC
bq24079RGTR
6.6 V
4.1 V
5.5 V
4.3 V
SYSOFF
ODI
bq24079RGTT
6.6 V
4.1 V
5.5 V
4.3 V
SYSOFF
ODI
bq24079TRGTR
6.6 V
4.1 V
5.5 V
4.3 V
SYSOFF
OED
bq24079TRGTT
6.6 V
4.1 V
5.5 V
4.3 V
SYSOFF
OED
The bq24079(T) ICs are regulated to 4.1 V. The "T" version uses a voltage-based TS bias, which allows
more flexibility in setting the temperature range, whereas the bq24072/3/4/5 ICs use current-biased TS.
The bq24230/2 family is identical to the bq24073/4 ICs except that they are trimmed and their target
current values nominally are at 300 mA (5.5 V) results in excess
power dissipation and reduced performance via thermal regulation. The IC is rated to 28 V, and will not be
damaged with Vin voltages less than this, but any Vin voltage over the overvoltage protection (OVP)
threshold disables the IC. Thus, the recommended operating range for maximum performance is between
4.75 V and 5.5 V, with a preference toward the lower values.
SLVU274E – November 2008 – Revised January 2017
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3
Test Summary
4
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Test Summary
This section covers the setup and tests performed in evaluating the EVM.
4.1
Equipment
•
•
•
4.2
Power supply (+5.25 ±0.25 Vdc), current limit set to 2 A ±0.2 A
Three Fluke 75 DMMs (equivalent or better)
Oscilloscope, Model TDS220 (equivalent or better)
Equipment and EVM Setup
•
•
•
•
•
•
Preset P/S#1 to 5.25 V ±0.25 V, 2 A ±0.25-A current limit, turn off and connect to J1-IN/GND ( + to IN
and – to GND)
Connect a 10-Ω, 10-W resistor to J2-OUT/VSS
Connect a fully discharged (Vbat 5.6 V and equal
to VIN for Vin < 5.6 V.
7. Allow the battery to charge until VBAT is between 3.3 Vdc and 4 Vdc. The charger delivers the
programmed constant current to the battery unless the input cannot source the required current.
8. Verify IBAT is ~88 mV or ~0.9 A (for a 1-kΩ resistor on ISET).
9. Verify VOUT : bq24072 – ~200 mV above the battery voltage.
10. Set JMP5 (EN1) to HI, and verify that the chip has been disabled, D1 (CHG) has turned off, and the
P/S#1 current has dropped to zero. The internal battery FET must be on, connecting the BAT pin to
the OUT pin. Verify that the voltage on the OUT pin is close to the battery voltage. See Figure 2 for
EN1/2 modes of operation.
11. SET JMP4 (EN2) to VSS. Verify that the input current is less than 500 mA (USB 500-mA mode). If the
input current is restricted due to USB mode, or if the adapter is current limiting, the OUT pin drops in
voltage and enters the DPM mode, if the system current is less than the restricted input current. This
IC must be in DPM mode with the system voltage at the DPM
12. Set JMP5 (EN1) to VSS and verify USB 100-mA mode. The system load is more than the allowed 100
mA on the input, so the OUT voltage drops to the battery voltage, and the battery FET is switched on
SLVU274E – November 2008 – Revised January 2017
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5
Test Summary
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and supplements the input current. Verify that Vout has dropped just below the battery voltage and the
battery is supplying Ibat, ~(Vout/10 Ω – 100 mA).
13. Set JMP4 (EN2) to HI to return to the ISET mode where the programmed current is ~0.9 A.
14. Set JMP3 to HI, and verify that the charging is disabled and that the CHG LED (D1) turns off. Verify
that the system is still powered by the input. See Figure 3.
15. Set JMP3 to VSS, and verify that charging continues and that D1 turn on.
16. Record the OUT voltage and battery charge current. Adjust R8 CCW until the input current starts to be
reduced (~2 turns). Note how the OUT voltage drops and the charge current is reduced as the input
current limit loops kicks in and limits the input current. Adjust R8 to its original position
17. On the bq24075 IC, set JMP2 HI, and verify that the BAT FET turns off and allows no charging or
discharging of the battery.
18. Adjust the R16 (TS-Pot) up or down until the TS threshold is reached. Verify that the charging current
is disabled. Return the TS resistance within the normal range and verify the continued charging
operation.
19. Allow the battery to continue to charge until the battery reaches voltage regulation, ~4.2 V ±40 mV for
bq24072/3/4/5/9(T) and 4.1 V ±4 mV for bq24079(T). Verify that the voltage is regulated as the current
tapers over the next one-to-two hours depending on the battery capacity. See Figure 4 for a charge
profile (time in plot is not proportional to actual charge time).
20. Verify that the current tapers to around 90 mA (9 mV on DMM#3) when termination occurs. Note on
the ’72 and ’73 ICs that termination can be disabled by setting the TD pin HI (JMP2). Also note that on
’74, the ITERM resistor (R10) can adjust the termination threshold.
21. Verify that the LED, D1, turns off and the current drops to zero.
22. Turn off P/S#1, and allow the system load to discharge the battery until a refresh charge is initiated.
Verify that the battery voltage dropped to ~4.1 V for bq24072/3/4/5 and to 4.0 V for bq24079(T) prior to
refresh.
23. Verify that the LED, D1, did not turn on for the refresh cycle.
This concludes the procedure for demonstrating the features of this power path charger. See the data
sheet for more detailed explanations and instructive waveforms.
Vin
Vout
Vbat
Normal Mode
DPPM Mode
Suspend
Battery Supplement Mode
BAT Current - Vbat 0.1 W
EN2 ->HI USB 500
Chip Disable
EN ->VSS USB100
t - Time - 1 ms/div
Figure 2. Modes of Operation Tested in Steps 11 Through 13
6
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion and Li-Polymer
Charge Management IC EVM
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Test Summary
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Vin
Vout
Voltage Reg
Vbat
Fast-Charge-CC
OUT ss
BAT Current - Vbat 0.1 W
Pre-Charge
Termination
t - Time - 1 ms/div
Figure 3. Charger Profile With EN1 = VSS and EN2 = HI, Programmed by ISET
Vin
Vout
Vbat
Vbat_0.1 W
CE (Charge Enable) pin toggled
t - Time - 1 ms/div
Figure 4. Charge Enabled, Pulled High, Then Low – Disables Charge
SLVU274E – November 2008 – Revised January 2017
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Charge Management IC EVM
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7
Schematic
5
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Schematic
The bq24072/3/4/5/9(T) and bq24230/2 EVM schematic is shown in Figure 5
Copyright © 2016, Texas Instruments Incorporated
Figure 5. Schematic
8
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion and Li-Polymer
Charge Management IC EVM
SLVU274E – November 2008 – Revised January 2017
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Physical Layouts
www.ti.com
6
Physical Layouts
This section contains the board layout and assembly drawings for the EVM.
6.1
Board Layout
Figure 6 shows the top assembly view of the EVM. Figure 7 shows the top etch layer of the EVM and
Figure 8 shows the bottom etch layer.
Figure 6. Top Assembly View
SLVU274E – November 2008 – Revised January 2017
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9
Physical Layouts
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Figure 7. Board Layout – Top Etch Layer
10
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion and Li-Polymer
Charge Management IC EVM
SLVU274E – November 2008 – Revised January 2017
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Physical Layouts
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Figure 8. Board Layout – Bottom Etch Layer
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11
Bill of Materials
7
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Bill of Materials
Table 4. HPA282B Bill of Materials
-001
-002
-003
-004
RefDes
Value
Description
SIZE
Part Number
MFR
2
2
2
2
C1, C4
10uF
Capacitor, Ceramic, 10-uF, 25-V, X5R, 20%
1206
ECJ-3YB1E106M
Panasonic
2
2
2
2
C2, C3
10uF
Capacitor, Ceramic, 10-uF, 6.3-V, X5R, 20%
0805
ECJ-2FB0J106M
Panasonic
1
1
1
1
D1
Red
Diode, LED, Red, 1.8-V, 20-mA, 20-mcd
0603
LTST-C190CKT
Liteon
1
1
1
1
D2
Green
Diode, LED, Green, 2.1-V, 20-mA, 6-mcd
0603
LTST-C190GKT
Liteon
1
1
1
1
D3
BZX84C6v2T
Diode, Zener, 6.2-V, 350-mW
SOT-23
BZX84C6V2T
Diodes
2
2
2
2
J1, J2, J3, J4*
ED1514
Terminal Block, 2-pin, 6-A, 3.5mm
0.27 x 0.25
ED1514
OST
5
5
5
5
JMP1–JMP5
PEC02SAAN
Header, 3-pin, 100mil spacing
0.100 x 3
PEC02SAAN
Sullins
2
2
2
2
JMP6, JMP7
PEC03SAAN
Header, 2-pin, 100mil spacing
0.100 inch x 2
PEC03SAAN
Sullins
0
0
0
0
R1
732
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
1
0
R10
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-103LF
Bourns
1
1
1
1
R11
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-103LF
Bourns
1
1
1
1
R14
301k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
1
1
R16
50k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-503LF
Bourns
1
1
1
1
R17
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
2
2
2
R18, R20
604
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
0
0
R2
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
0
0
R3
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
1
1
R4
49.9k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
2
2
2
R5, R6
1.5K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
1
0
R21
1.5K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
0
0
R22
23.7K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
0
0
R23
11K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
1
1
R7, R19
0
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
1
1
R8
5k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-502LF
Bourns
1
1
0
1
R9
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
3
3
3
3
R12, R13, R15
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
0
0
U1
BQ24072RGT
QFN-16
BQ24072RGT
TI
0
1
0
0
U1
BQ24073RGT
IC, USB- Friendly Li-Ion Battery Charger and PowerPath Management
QFN-16
BQ24073RGT
TI
0
0
1
0
U1
BQ24074RGT
QFN-16
BQ24074RGT
TI
0
0
0
1
U1
BQ24075RGT
QFN-16
BQ24075RGT
TI
1
1
1
1
--
HPA282
Any
7
7
7
7
Black
3M
Notes: 1.
12
PCB, 1.8 In x 1.7 In x 0.031 In
929950-00
Shunts
100 mill
These assemblies are ESD sensitive, ESD precautions shall be observed.
2.
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4.
Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.
5.
* No substitutions of J1 through J4
6.
Place Shunt as follows: JMP1=TRM:RES, JMP3=CE:VSS, JMP4=EN2:HI, JMP5, EN1:VSS, JMP6=pin1:pin2, JMP7=pin1:pin2
For JMP2=001/002/003=TD:HI, -004=TD:VSS:VSS,
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion and Li-Polymer
Charge Management IC EVM
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Bill of Materials
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Table 5. HPA282B Bill of Materials (Continued)
-005
-006
RefDes
Value
Description
SIZE
Part Number
MFR
2
2
C1, C4
10uF
Capacitor, Ceramic, 10-uF, 25-V, X5R, 20%
1206
ECJ-3YB1E106M
Panasonic
2
2
C2, C3
10uF
Capacitor, Ceramic, 10-uF, 6.3-V, X5R, 20%
0805
ECJ-2FB0J106M
Panasonic
1
1
D1
Red
Diode, LED, Red, 1.8-V, 20-mA, 20-mcd
0603
LTST-C190CKT
Liteon
1
1
D2
Green
Diode, LED, Green, 2.1-V, 20-mA, 6-mcd
0603
LTST-C190GKT
Liteon
1
1
D3
BZX84C6v2T
Diode, Zener, 6.2-V, 350-mW
SOT-23
BZX84C6V2T
Diodes
2
2
J1, J2, J3, J4*
ED1514
Terminal Block, 2-pin, 6-A, 3.5mm
0.27 x 0.25
ED1514
OST
5
5
JMP1– JMP5
PEC02SAAN
Header, 3-pin, 100mil spacing
0.100 x 3
PEC02SAAN
Sullins
2
2
JMP6, JMP7
PEC03SAAN
Header, 2-pin, 100mil spacing
0.100 inch x 2
PEC03SAAN
Sullins
0
0
R1
732
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
R10
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-103LF
Bourns
1
1
R11
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-103LF
Bourns
1
1
R14
301k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R16
50k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-503LF
Bourns
1
1
R17
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
2
R18, R20
604
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
R2
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
R3
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R4
49.9k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
2
R5, R6
1.5K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
R21
1.5K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
R22
23.7K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
R23
11K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R7, R19
0
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R8
5k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-502LF
Bourns
1
0
R9
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
3
3
R12, R13, R15
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
U1
BQ24230RGT
QFN-16
BQ24230RGT
TI
0
1
U1
BQ24232RGT
IC, USB- Friendly LiIon Battery Charger and Power-Path
Management
QFN-16
BQ24232RGT
TI
1
1
--
HPA282
Any
7
7
Black
3M
PCB, 1.8 In x 1.7 In x 0.031 In
929950-00
Notes: 1.
Shunts
100 mill
These assemblies are ESD sensitive, ESD precautions shall be observed.
2.
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4.
Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.
5.
* No substitutions of J1 through J4
6.
Place Shunt as follows: JMP1=TRM:RES, JMP3=CE:VSS, JMP4=EN2:HI, JMP5, EN1:VSS, JMP6=pin1:pin2, JMP7=pin1:pin2
For JMP2=001/002/003=TD:HI, -004=TD:VSS:VSS,
SLVU274E – November 2008 – Revised January 2017
Submit Documentation Feedback
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion and Li-Polymer
Charge Management IC EVM
Copyright © 2008–2017, Texas Instruments Incorporated
13
Bill of Materials
www.ti.com
Table 6. HPS252B Bill of Materials
-007
RefDes
Value
Description
Size
Part Number
MFR
2
C1, C4
10uF
Capacitor, Ceramic, 10-uF, 25-V, X5R, 20%
1206
ECJ-3YB1E106M
Panasonic
2
C2, C3
10uF
Capacitor, Ceramic, 10-uF, 6.3-V, X5R, 20%
0805
ECJ-2FB0J106M
Panasonic
1
D1
Red
Diode, LED, Red, 1.8-V, 20-mA, 20-mcd
0603
LTST-C190CKT
Liteon
1
D2
Green
Diode, LED, Green, 2.1-V, 20-mA, 6-mcd
0603
LTST-C190GKT
Liteon
1
D3
BZX84C6v2T
Diode, Zener, 6.2-V, 350-mW
SOT-23
BZX84C6V2T
Diodes
2
J1, J2, J3, J4*
ED1514
Terminal Block, 2-pin, 6-A, 3.5mm
0.27 x 0.25
ED1514
OST
5
JMP1–JMP5
PEC02SAAN
Header, 3-pin, 100mil spacing
0.100 x 3
PEC02SAAN
Sullins
2
JMP6, JMP7
PEC03SAAN
Header, 2-pin, 100mil spacing
0.100 inch x 2
PEC03SAAN
Sullins
0
R1
732
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
R10
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-103LF
Bourns
1
R11
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-103LF
Bourns
1
R14
301k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R16
50k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-503LF
Bourns
1
R17
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R18, R20
604
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
R2
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
R3
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R4
49.9k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R5, R6
1.5K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
R21
1.5K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R22
23.7K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R23
11K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R7
100k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R19
0
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R8
5k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25x0.17
3266W-502LF
Bourns
1
R9
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
3
R12, R13, R15
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
U1
BQ24075TRGT
IC, USB- Friendly LiIon Battery Charger and Power-Path
Management
QFN-16
BQ24075TRGT
TI
1
--
HPA282
Any
Black
3M
7
Notes: 1.
14
PCB, 1.8 In x 1.7 In x 0.031 In
929950-00
Shunts
100 mill
These assemblies are ESD sensitive, ESD precautions shall be observed.
2.
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4.
Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.
5.
* No substitutions of J1 through J4
6.
Place Shunt as follows: JMP1=TRM:RES, JMP3=CE:VSS, JMP4=EN2:HI, JMP5, EN1:VSS, JMP6=pin1:pin2, JMP7=pin1:pin2
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion and Li-Polymer
Charge Management IC EVM
SLVU274E – November 2008 – Revised January 2017
Submit Documentation Feedback
Copyright © 2008–2017, Texas Instruments Incorporated
References
www.ti.com
Table 7. HPA502A Bill of Materials
-001
-002
RefDes
Value
Description
Size
Part Number
MFR
2
2
C1, C4
10µF
Capacitor, Ceramic, 25-V, X5R, 20%
1206
ECJ-3YB1E106M
Panasonic
2
2
C2, C3
10µF
Capacitor, Ceramic, 6.3-V, X5R, 20%
0805
ECJ-2FB0J106M
Panasonic
1
1
D1
Red
Diode, LED, Red, 1.8-V, 20-mA, 20-mcd
0603
LTST-C190CKT
Liteon
1
1
D2
Green
Diode, LED, Green, 2.1-V, 20-mA, 6-mcd
0603
LTST-C190GKT
Liteon
1
1
D3
BZX84C6v2T
Diode, Zener, 6.2-V, 350-mW
SOT-23
BZX84C6V2T
Diodes
4
4
J1–J4*
ED1514
Terminal Block, 2-pin, 6-A, 3,5mm
0.27 x 0.25
ED1514
OST
5
5
JMP1–JMP5
PEC03SAAN
Header, 3-pin, 100mil spacing
0.100 x 3
PEC03SAAN
Sullins
2
2
JMP6, JMP7
PEC02SAAN
Header, 2-pin, 100mil spacing
0.100 inch x 2
PEC03SAAN
Sullins
0
0
R1
732
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
R10
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25 x 0.17
3266W-1-103LF
Bourns
1
1
R11
10k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25 x 0.17
3266W-1-103LF
Bourns
1
1
R14
301k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R16
50k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25 x 0.17
3266W-503
Bourns
1
1
R17
1k
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
2
2
R18, R20
604
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
0
0
R2
1k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
R3
10k
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
1
1
R4
49.9k
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
2
2
R5, R6
1.5K
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
0
0
R21
1.5K
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
0
1
R22
2.7K
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
0
1
R23
11K
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
0
1
R7
100k
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
1
0
R7
0
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
1
1
R19
0
Resistor, Chip, 1/16-W, 1%
0603
Std
Std
1
1
R8
5k
Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust
0.25 x 0.17
3266W-1-502LF
Bourns
1
0
R9
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
3
3
R12, R13, R15
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
U1
BQ24079RGT
IC, USB- Friendly Li-Ion Battery Charger and Power-Path
Management– Current based TS
QFN-16
BQ24079RGT
TI
0
1
U1
BQ24079TRGT
IC, USB- Friendly Li-Ion Battery Charger and Power-Path
Management – Current based TS
QFN-16
BQ24079TRGT
TI
1
1
–
HPA502
Any
7
7
929950-00
3M
Notes: 1.
8
PCB, 1.8 In x 1.7 In x 0.031 In
929950-00
Shunts
100 mill
These assemblies are ESD sensitive, ESD precautions shall be observed.
2.
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4.
Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.
5.
* No substitutions of J1 through J4
6.
Place Shunt as follows: JMP1=TRM:RES, JMP2=TD:VSS, JMP3=CE:VSS, JMP4=EN2:HI, JMP5, EN1:VSS, JMP6=pin1:pin2, JMP7=pin1:pin2
References
1. bq24072/3/4/5/9(T), 1.2A USB-Friendly Li-Ion Battery Charger and Power-Path Management IC data
sheet SLUS810
2. bq24075T, bq24079T, 1.5A USB-Friendly Li-Ion Battery Charger and Power-Path Management IC data
sheet (SLUS937)
SLVU274E – November 2008 – Revised January 2017
Submit Documentation Feedback
bq24072/3/4/5/9(T) and bq24230/2 1.5-A Single-Chip Li-Ion and Li-Polymer
Charge Management IC EVM
Copyright © 2008–2017, Texas Instruments Incorporated
15
Revision History
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from D Revision (September 2016) to E Revision .......................................................................................... Page
•
Changed From: TMR JMP2 To: TMR JMP1 in Figure 1 ............................................................................. 5
Revision History
Changes from C Revision (May 2010) to D Revision ...................................................................................................... Page
•
Changed the orientation of Figure 6 .................................................................................................... 9
Revision History
Changes from B Revision (February 2010) to C Revision ............................................................................................. Page
•
Added devices bq24072TRGTR and bq24072TRGTT in the Ordering Information table
......................................
2
Revision History
Changes from A Revision (July 2009) to B Revision ..................................................................................................... Page
•
•
•
•
Changed Figure 6 ......................................................................................................................... 9
Changed Figure 7........................................................................................................................ 10
Changed Figure 8........................................................................................................................ 11
Changed the Bill of Materials section ................................................................................................. 12
Revision History
Changes from Original (November 2008) to A Revision ................................................................................................ Page
•
•
16
Changed devices From: bq24079RGTT to bq24079TRGTT in the Ordering Information table ................................ 2
Changed Figure 1 ......................................................................................................................... 5
Revision History
SLVU274E – November 2008 – Revised January 2017
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Copyright © 2008–2017, Texas Instruments Incorporated
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper sytem design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
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TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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