Table of Contents
www.ti.com
User’s Guide
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1
Evaluation Modules
Taylor Vogt
ABSTRACT
The BQ79616-Q1 and BQ75614-Q1 Evaluation Modules user's guide describes the general features, theory of
operation, hardware setup, and use of the BQ79616EVM and BQ75614EVM. Throughout this user's guide, the
abbreviations BMS021, EVM, and the term evaluation module are synonymous with the two different variants of
BMS021, BQ79616-Q1 Evaluation Module and BQ75614-Q1 Evaluation Module, unless otherwise noted. When
a difference is noted between the two variants, each variant will be differentiated as BQ79616EVM for the
BQ79616-Q1 Evaluation Module, and the BQ75614EVM for the BQ75614-Q1 Evaluation Module. These EVMs
are evaluation boards for the BQ79616-Q1 and BQ75614-Q1 devices for use in large format lithium-ion battery
pack applications to provide monitoring, protecting, balancing, and communications.
Table of Contents
1 General Description................................................................................................................................................................6
1.1 Key Features......................................................................................................................................................................6
1.2 Key Electrical Parameters..................................................................................................................................................6
2 Theory of Operation - Stackable BQ79616EVM................................................................................................................... 7
2.1 Single Board.......................................................................................................................................................................8
2.2 Stacked Systems............................................................................................................................................................... 8
2.3 Configuring the BQ79616-Q1 EVM to be used for Lower Cell Count Applications............................................................8
3 Theory of Operation - Standalone BQ75614EVM.................................................................................................................9
4 Connectors............................................................................................................................................................................ 11
4.1 Primary Input and Output Connectors.............................................................................................................................. 11
5 Quick Start Guide..................................................................................................................................................................15
5.1 Required Devices for using the Example Code............................................................................................................... 15
5.2 Power Connections.......................................................................................................................................................... 15
5.3 Connecting the EVM to TMS570 LaunchPad.................................................................................................................. 16
5.4 Stacking BQ79616EVMs..................................................................................................................................................16
5.5 Software........................................................................................................................................................................... 16
5.6 GUI...................................................................................................................................................................................17
6 Physical Dimensions............................................................................................................................................................18
6.1 Board Dimensions............................................................................................................................................................18
6.2 Board Mounting................................................................................................................................................................18
7 BQ79616EVM Schematic, Assembly, Layout, and BOM................................................................................................... 19
7.1 Schematic........................................................................................................................................................................ 19
7.2 Assembly..........................................................................................................................................................................23
7.3 Layout.............................................................................................................................................................................. 25
7.4 BQ79616EVM-021 Bill of Materials (BOM)...................................................................................................................... 33
8 BQ75614EVM Schematic, Assembly, Layout, and BOM................................................................................................... 40
8.1 Schematic........................................................................................................................................................................ 40
8.2 Assembly..........................................................................................................................................................................44
8.3 Layout.............................................................................................................................................................................. 45
8.4 BQ75614EVM Bill of Materials (BOM)............................................................................................................................. 46
9 BQ79656EVM Schematic, Assembly, Layout, and BOM................................................................................................... 52
9.1 Schematic........................................................................................................................................................................ 52
9.2 Assembly..........................................................................................................................................................................56
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
1
Trademarks
www.ti.com
9.3 Layout.............................................................................................................................................................................. 57
9.4 BQ79656EVM Bill of Materials (BOM)............................................................................................................................. 57
10 Revision History................................................................................................................................................................. 64
Trademarks
LaunchPad™ and Code Composer Studio™ are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
2
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
WARNING
Warning: To minimize risk of fire hazard, always verify and follow any specific safety instructions and
application considerations related to the batteries being used in conjunction with this EVM.
Always follow TI’s set-up and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help ensure
your personal safety and the safety of those working around you. Contact TI’s Product Information Center http://
support/ti./com for further information.
Save all warnings and instructions for future reference.
Failure to follow warnings and instructions may result in personal injury, property damage, or death due
to electrical shock and/or burn hazards.
The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed printedcircuit-board assembly. It is intended strictly for use in development laboratory environments, solely for qualified
professional users having training, expertise, and knowledge of electrical safety risks in development and
application of high-voltage electrical circuits. Any other use or application are strictly prohibited by Texas
Instruments. If you are not suitably qualified, you should immediately stop from further use of the HV EVM.
1. Work Area Safety:
a. Keep work area clean and orderly.
b. Qualified observer(s) must be present any time circuits are energized.
c. Effective barriers and signage must be present in the area where the TI HV EVM and its interface
electronics are energized, indicating operation of accessible high voltages may be present, for the
purpose of protecting inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other related
apparatus used in a development environment exceeding 50 VRMS or 75 VDC must be electrically located
within a protected Emergency Power Off (EPO) protected power strip.
e. Use a stable and non-conductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No freehand
testing whenever possible.
2. Electrical Safety:As a precautionary measure, it is always a good engineering practice to assume that the
entire EVM may have fully accessible and active high voltages.
a. De-energize the TI HV EVM and all its inputs, outputs, and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely deenergized.
b. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring,
measurement equipment hook-ups and other application needs, while still assuming the EVM circuit and
measuring instruments are electrically live.
c. Once EVM readiness is complete, energize the EVM as intended.
WARNING
WARNING: while the EVM is energized, never touch the EVM or its electrical circuits as
they could be at high voltages capable of causing electrical shock hazard.
3. Personal Safety:
a. Wear personal protective equipment, for example, latex gloves or safety glasses with side shields or
protect EVM in an adequate lucent plastic box with interlocks from accidental touch.
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
3
General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
www.ti.com
4. Limitation for Safe Use:
a. EVMs are not to be used as all or part of a production unit.
4
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
www.ti.com
The following warnings and cautions are noted for the safety of anyone using or working close to the BQ79616
EVM. Observe all safety precautions.
Caution
Do not leave EVM powered when unattended.
Danger High
Voltage
The BQ79616EVM is rated as a high voltage EVM, but it is not required to operate this EVM at high
voltage. If you apply high voltage to this board, all terminals should be considered high voltage.
spacer
Electric shock is possible when connecting the board to live wire. The board should be handled
with care by a professional.
spacer
For safety, use of isolated test equipment with overvoltage and overcurrent protection is highly
recommended.
!
CAUTION
The circuit module has signal traces, components, and component leads on the bottom of the board.
This may result in exposed voltages, hot surfaces, or sharp edges. Do not reach under the board
during operation.
CAUTION
The circuit module may be damaged by overtemperature. To avoid damage, monitor the temperature
during evaluation and provide cooling, as needed, for your system environment.
CAUTION
Some power supplies can be damaged by application of external voltages. If using more than 1
power supply, check your equipment requirements and use blocking diodes or other isolation
techniques, as needed, to prevent damage to your equipment.
CAUTION
The communication interface is not isolated on the EVM. Be sure no ground potential exists between
the computer and the EVM. Also be aware that the computer will be referenced to the Batterypotential of the EVM.
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
5
General Description
www.ti.com
1 General Description
TI's BMS021 Battery Management System (BMS) is an evaluation board for the BQ7961X-Q1 family of devices
for use in large format lithium-ion battery pack applications to provide monitoring, protecting, balancing, and
communications. There are two variants of the evaluation board, the BQ79616EVM and the BQ75614EVM.
Each BQ79616EVM can manage up to 16 cells (80-V max) for Li-ion battery applications. Up to 35
BQ79616EVM modules can be stacked, for packs up to 560 series cells.
Each BQ75614EVM can manage 14 or 16 cells (80-V max) for Li-ion battery applications. The standalone
BQ75614EVM module includes integrated current sense.
Each system provides fast cell balancing, diagnostics, and module to controller communication. Independent
protection circuitry is also provided. Please see the BQ79616-Q1 or BQ75614-Q1 data sheet for more details on
each respective part.
Each EVM is equipped with precision measurement and synchronous communication to enable a master
controller to perform State of Charge (SOC) and State of Health (SOH) estimation. Highly-accurate cell voltages
and a fast sampling time for the entire battery pack allows more efficient operation of battery modules and more
accurate SOC and SOH calculations. Communication with stacked BQ79616EVMs is via an isolated daisy-chain
differential bus. For the standalone BQ75614EVM, SOC and SOH are further assisted by an integrated current
sense ADC.
Control a single EVM or multiple stacked EVMs using a PC-hosted GUI. Communication between the PC and
the base device in a stack of BQ79616EVM (or a single standalone BQ75614EVM device) is via a USB2ANY
UART interface. For a stack of BQ79616EVM devices, communication between all other EVMs in the stack
occurs via the isolated, daisy-chain differential communication bus. The PC GUI allows configuration of the
EVMs to monitor cells and other analog data channels, control balancing, and monitor details of any faults.
1.1 Key Features
This EVM includes the following features:
•
•
•
•
•
•
•
•
•
•
Internal passive cell balancing
Isolated differential daisy chain communications with optional ring architecture
Flexible architecture for 6 to 16 cell applications
UART interface
High-accuracy cell voltage measurement
Diagnostics
8 multipurpose GPIOs
Resistor ladder to simulate cell voltages
Supports Bus Bar Connection/Measurement
High-accuracy current sense measurement (only available on the BQ75614EVM).
1.2 Key Electrical Parameters
The following table identifies the key electrical parameters:
6
Parameter
Value
Maximum battery pack voltage (stacked EVMs)
2400 V
Maximum operating voltage
80 V (depends on series R3, R4 value)
Minimum operating voltage
9 V (depends on series R3, R4 value, by default use at least 18V)
Maximum cell open circuit voltage
5V
Ambient temperature
–40 °C to 105 °C
Nominal operating temperature
–20 °C to 60 °C
Cell balancing current
Approximately 200 mA @ 80 °C
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Theory of Operation - Stackable BQ79616EVM
www.ti.com
2 Theory of Operation - Stackable BQ79616EVM
Figure 2-1 shows the system stack diagram.
Figure 2-1. System Block Diagram - BQ79616
The BMS system is designed to prolong the useful life of lithium-ion cells in battery packs through passive
balancing. The battery pack is broken into a series of modules, each of which contains up to 16 cells. This
system will monitor voltages of individual battery cells and dissapate individual cell voltages through the use of
internal CB FETs. The BMS allows battery-powered electric machines to use smaller battery packs and use
fewer charging cycles to perform the same amount of work. It also improves the overall lifetime of Li-ion battery
packs by preventing under- and overvoltage damage from occurring.
The typical BMS system with stacked modules has three main sub-systems, as shown in Figure 2-1:
• Host controller - in this case a TMS570 LaunchPad™
• A BQ79616-Q1 configured as an isolated communication bridge device - a BQ79600EVM or another
BQ79616EVM can support this
• BQ79616EVM based modules attached to cells - these can be stacked up to35 total (including the bridge
device)
All commands and data are communicated with a host via either a UART or daisy-chain communication
connection. The BQ79616 will remain idle until a command is received from the host. The BQ79616 can support
a host PC or microcontroller (via the UART connection header) or a daisy-chain interface from a BQ79616-Q1
implemented as a communication bridge.
The typical flow is for the host to go through the following simplified sequence:
1. Wakeup the BQ79616EVM board by sending a WAKEUP pulse when using the UART interface, or sending a
WAKE tone when using the BQ79616EVM in a stack of other BQ79616EVM boards for a large battery pack
or a BQ79616-Q1 configured as a bridge. Initialize the BQ79616-Q1 to be ready for use.
2. Send a sample command to the BQ79616-Q1 to read the cell measurement results.
3. The host will use the cell measurement data to calculate an average and determine the highest or lowest
cells and determine the cells that should be balanced.
4. If no stop command is sent, the BQ79616-Q1 has a built-in timeout (set by the user), after which time the
discharge will be stopped automatically.
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
7
Theory of Operation - Stackable BQ79616EVM
www.ti.com
5. The host can then decide to repeat the process (back to step 2) or send commands to shutdown the
BQ79616EVM and return later.
2.1 Single Board
As a single board the BMS can passively balance up to 16 cells, up to 80 V of total voltage. Communication to
the BQ79616EVM is handled by the daisy-chain communications bus from another BQ79616-Q1 or the UART
host interface.
2.2 Stacked Systems
The boards may be stacked in daisy chain to accomodate larger battery packs than the 16 channels provide on
a single board. Communication to the BQ79616EVM is handled by the daisy-chain communications bus from
another BQ79616-Q1.
2.3 Configuring the BQ79616-Q1 EVM to be used for Lower Cell Count Applications
The BQ79616-Q1 EVM can be configured to support lower cell count applications, especially for users designing
with the BQ79614-Q1/BQ79612-Q1 devices. For these cases, the EVM comes fitted with placeholder 0 ohm
resistors for shorting together the VC and CB pins of the topmost cells. These can be found in the schematic at
the bottom of this user guide, with a note "Resistors for Lower Cell Count Applications". The user will need to
populate the 0 ohm resistors depending the use of 12 or 14 cells. For 14, the user would populate only R24,
R28, R22, and R26 whereas for 12 the user would populate all 8 of the resistors (R24, R28, R22, R26, R21,
R23, R25, R27). The GUI is also implemented with a feature to change the active cell configuration. Navigate to
the cell monitor page to "View Poll Settings" and then select their desired active cell configuration by using the
dropdown selection below the "No. of cells" column.
8
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Theory of Operation - Standalone BQ75614EVM
www.ti.com
3 Theory of Operation - Standalone BQ75614EVM
Figure 3-1 shows the system block diagram.
Figure 3-1. System Block Diagram - BQ75614
The BMS system is designed to prolong the useful life of lithium-ion cells in battery packs through passive
balancing, and provide enhanced SOC and SOH measurements using integrated current sense measurement.
The device can monitor a battery pack which contains up to 16 cells, or up to 14 cells with the ability to measure
fuse and relay voltages. This system will monitor voltages of individual battery cells and dissapate individual cell
voltages through the use of internal CB FETs. The BMS allows battery-powered electric machines to use smaller
battery packs and use fewer charging cycles to perform the same amount of work. It also improves the overall
lifetime of Li-ion battery packs by preventing under- and overvoltage damage from occurring.
The typical BMS system with integrated current sense has two main sub-systems, as shown in Figure 3-1:
• Host controller - in this case a TMS570 LaunchPad™
• BQ75614EVM module attached to cells, and communicating with the host
• Optional: a digital isolator between the host domain and the BQ75614EVM domain
All commands and data are communicated with a host via UART. The BQ75614-Q1 will remain idle until a
command is received from the host. The BQ75614EVM can support a host PC or microcontroller (via the UART
connection header).
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
9
Theory of Operation - Standalone BQ75614EVM
www.ti.com
The typical flow is for the host to go through the following simplified sequence:
1. Wakeup the BQ75614EVM board by sending a WAKEUP pulse when using the UART interface.
2. Send a sample command to the BQ75614-Q1 to read the cell measurement results and current
measurement results.
3. The host will use the cell measurement data to calculate an average and determine the highest or lowest
cells and determine the cells that should be balanced. The host will use the current measurement data to
estimate SOC and SOH.
4. If no stop command is sent, the BQ75614-Q1 has a built-in timeout (set by the user), after which time the
discharge will be stopped automatically.
5. The host can then decide to repeat the process (back to step 2) or send commands to shutdown the
BQ75614EVM and return later.
As a single standalone board, the BQ75614EVM can passively balance up to 16 cells, up to 80 V of total
voltage. Communication to the BQ75614EVM is handled by the UART host interface.
10
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
Connectors
4 Connectors
4.1 Primary Input and Output Connectors
4.1.1 Jumper Placements
Below is a table explaining each of the jumpers available for the user's flexibility.
Pinheader
Contacts
Jumper Connection
Populated by Default?
J1
1-2
Rx direct connection to CVDD
No
J2
1-2
NFAULT connection to Digital
Isolator
Yes
J4
1-2
GPIO1 connection to 10k pullup
and thermistor
Yes
J5
1-2
TSREF pullup to GPIOs
Yes
J6
1-2
LED connection on AVDD to
indicate the device is awake
Yes
J14
1-2
PWR/BAT connection to CELL16 Yes
J16
1-2
CELL0 connection to GND
Yes
J18
1-2
CVDD connection to Digital
Isolator
Yes
J21
1-2
RX to Dig Isolator Connection
Yes
4.1.2 Battery Connector
The live battery cell connections are made from connector J15. Cell voltage measurements and balancing
currents use these connections. Alternatively, the user can simulate cell voltages using the on board resistor
ladder across each of the cells which can be utilized by closing switches S1 and S2 and applying a DC voltage
across the VSTACK test point and GND. Short unused channels to the top cell connection in the wiring harness
to support fewer than 16 cells. At the minimum, the user must support 6 cells.
Figure 4-1. Molex 50-57-9422 (Reference Image Only)
Table 4-1. Connector Information
Designator
J15
Manufacturer
Part Number
Mating Connector
Molex
Manufacturer:0705550056
Digi-Key: 0705550056-ND
Manufacturer:50-57-9422
Digi-Key:WM2920-ND
Table 4-2. Pin Description
Pin
Name
1
CELL0/GND
2
CELL16
Comments
Negative terminal of CELL1, Connected directly to AVSS GND of device
Positive terminal of CELL16, Direct connection to BAT, LDOIN
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
11
Connectors
www.ti.com
Table 4-2. Pin Description (continued)
Pin
Name
Comments
3
CELL0
Negative terminal of CELL1, Connected directly to AVSS GND of device
4
CELL0S
5
CELL1
Positive terminal of CELL1, negative terminal of CELL2
6
CELL2
Positive terminal of CELL2, negative terminal of CELL3
7
CELL3
Positive terminal of CELL3, negative terminal of CELL4
8
CELL4
Positive terminal of CELL4, negative terminal of CELL5
9
CELL5
Positive terminal of CELL5, negative terminal of CELL6
10
CELL6
Positive terminal of CELL6, negative terminal of CELL7
11
CELL7
Positive terminal of CELL7, negative terminal of CELL8
12
CELL8
Positive terminal of CELL8, negative terminal of CELL9
13
CELL9
Positive terminal of CELL9, negative terminal of CELL10
14
CELL10
Positive terminal of CELL10, negative terminal of CELL11
15
CELL11
Positive terminal of CELL11, negative terminal of CELL12
16
CELL12
Positive terminal of CELL12, negative terminal of CELL13
17
CELL13
Positive terminal of CELL13, negative terminal of CELL14
18
CELL14
Positive terminal of CELL14, negative terminal of CELL15
19
CELL15
Positive terminal of CELL15, negative terminal of CELL16
20
CELL16S
21
CELL16
22
CELL0/GND
Negative terminal of CELL1, Actual sense connnection for VC0 path
Positive terminal of CELL16, actual sense connection to VC16 path
Positive terminal of CELL16, Direct connection to BAT, LDOIN
Negative terminal of CELL1, Connected directly to AVSS GND of device
4.1.3 Host Interface
The 10-pin J17 - Serial connector is used to connect the EVM to a PC running the GUI or to a host controller.
Texas Instruments recommends using the USB2ANY that is available to order through TI.com,which includes the
proper 10 pin cable.
Figure 4-2. Samtec Inc. TSW-105-08-L-D-RA (Reference Image Only)
Table 4-3. Connector Information
Designator
J17
12
Manufacturer
Part Number
Mating Connector
Samtec Inc.
Manufacturer: TSW-105-08-LD-RA
10 pin ribbon connector packaged with USB2ANY
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
Connectors
Table 4-4. Pin Description
Pin
Name
1
NC
2
NC
3
nFAULT signal from BQ79616-Q1 or BQ75614-Q1
4
NC
5
GND
6
USB2ANY 3.3V
7
USB2ANY TX ( RX of BQ79616-Q1 or BQ75614-Q1 )
8
USB2ANY RX ( TX of BQ79616-Q1 or BQ75614-Q1 )
9
NC
10
NC
4.1.4 GPIO or Thermistor Inputs
There are 8 GPIO pins which can either be floated, connected to a thermistor and 10k pullup, or be forced to
certain voltage for a measurement. This can be determined by using the J4 header as shown below. Insert a
shunt from pins 1 and 2 to connect GPIO1 to the thermistor, pins 3 and 4 to connect GPIO2 and so on for the
other GPIOs. Jumper J5 must also be connected to pull the GPIOs up to the TSREF reference voltage for
ratiometric NTC measurements.
Figure 4-3. Sullins Connector Solutions PEC08DAAN (Reference Image Only)
Table 4-5. Connector Information
Designator
Manufacturer
Part Number
Mating Connector
J4
Sullins Connector
Solutions
Manufacturer: PEC08DAAN
N/A
Pin
Name
Comments
1
GPIO1
GPIO1 Pin of BQ79616-Q1 or BQ75614-Q1
2
GPIO1_R
Table 4-6. Pin Description - J4
3
GPIO2
4
GPIO2_R
5
GPIO3
6
GPIO3_R
7
GPIO4
8
GPIO4_R
9
GPIO5
10
GPIO5_R
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Connection for GPIO1 to 10k pullup and thermistor
GPIO2 Pin of BQ79616-Q1 or BQ75614-Q1
Connection for GPIO2 to 10k pullup and thermistor
GPIO3 Pin of BQ79616-Q1 or BQ75614-Q1
Connection for GPIO3 to 10k pullup and thermistor
GPIO4 Pin of BQ79616-Q1 or BQ75614-Q1
Connection for GPIO4 to 10k pullup and thermistor
GPIO5 Pin of BQ79616-Q1 or BQ75614-Q1
Connection for GPIO5 to 10k pullup and thermistor
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
13
Connectors
www.ti.com
Table 4-6. Pin Description - J4 (continued)
Pin
Name
Comments
11
GPIO6
GPIO6 Pin of BQ79616-Q1 or BQ75614-Q1
12
GPIO6_R
13
GPIO7
14
GPIO7_R
15
GPIO8
16
GPIO8_R
Connection for GPIO6 to 10k pullup and thermistor
GPIO7 Pin of BQ79616-Q1 or BQ75614-Q1
Connection for GPIO7 to 10k pullup and thermistor
GPIO8 Pin of BQ79616-Q1 or BQ75614-Q1
Connection for GPIO8 to 10k pullup and thermistor
4.1.5 High-Side and Low-Side Communications
There are two sets of 4-position molex connectors available on each BQ79616EVM board. These are not
available on the BQ75614EVM. These provide high-side (J11) and low-side (J10) communications between
stacked EVM devices.
Table 4-7. Connector Information
Designator
Manufacturer
Part Number
Mating Connector
J10/J11
Molex
Manufacturer:
Manufacturer:
0705510038
0050579404
Digi-Key: WM14059-ND
Digi-Key: WM2902-ND
Table 4-8. Pin Description - J10
Pin
Name
Comments
1
COML_N
COM lowside negative
2
COML_P
COM lowside positive
3
N/A
Unused
4
N/A
Unused
Pin
Name
Comments
1
N/A
Unused
2
N/A
Unused
3
COMH_P
COM highside positive
4
COMH_N
COM highside negative
Table 4-9. Pin Description - J11
14
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Quick Start Guide
www.ti.com
5 Quick Start Guide
This section includes hardware setup instructions, connection procedures, and software and GUI instructions.
Figure 5-1. Basic EVM Setup using DC Voltage with Resistor Ladder
5.1 Required Devices for using the Example Code
The system example code is implemented using the TMS570LS12 LaunchPad™ board (TMS570LS1224 MCU)
and the BMS021 via Code Composer Studio.
The part numbers of the evaluation modules are LAUNCHXL2-TMS57012 and BQ79616EVM-021 (for
BQ79616-Q1 evaluation) or BQ75614EVM-021 (for BQ75614-Q1 evaluation). These boards are available from
the TI eStore (https://estore.ti.com/) or from your local TI sales representative. For more details and information
related to the LaunchPad modules, see the specific module user's guide.
5.2 Power Connections
If powering the EVM using the included resistor ladder as cells, simply ensure that the power supply positive
terminal is connected to the "VSTACK" or "PWR" testpoints provided on the board, and the power supply
negative terminal is connected to the "GND" or "Cell0" testpoints provided on the board, or any "GND" standoff
provided.
If not using the resistor ladder, the power supply positive terminal must be connected to the "PWR" testpoint, and
the power supply negative terminal must be connected to the "Cell0" testpoint.
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
15
www.ti.com
Quick Start Guide
Also ensure that headers J16 and J14 are both jumpered, to allow for power and ground to be supplied from the
"battery stack" (resistor ladder).
5.2.1 On-Board Resistor Ladder - Power Supply
Each EVM utilizes an on-board resistor ladder to simplify the evaluation process. Each of the sixteen resistors is
nominally 100 Ω, resulting in roughly one-sixteenth of the module voltage at each cell connection. For the
BQ75614EVM, this will instead be one-fourteenth the module voltage as the board does not use the top two
cells. By default, all actuators of S1, S2 are positioned closest to the IC, which is the "ON" or "closed" state. In
this state, all of the resistors are connected to the EVM sense and balance connections and allow easy start up
with a DC voltage connection across VSTACK and GND.
To simulate connected cells to the sense and balance connections (using a power supply), ALL switch actuators
on S1, S2 must be moved away from the module connector J15 if not already done. Moving the actuators in this
manner connects the EVM to the resistor ladder, and allows for simulated cell measurements.
5.2.2 Using Actual Battery Cells
When using actual battery cells, disconnect the resistor ladder by moving ALL switch actuators on S1, S2 to the
"OFF" or open position (away from the IC and towards J15).
5.3 Connecting the EVM to TMS570 LaunchPad
The EVMs are connected using a standard wire jumper; Table 5-1 shows the connections between the two
EVMs. By default, the TMS570 LaunchPad is powered by the USB port on the host computer.
Table 5-1. *Connections Between EVM and TMS570 LaunchPad
Connection Name
EVM
TMS570 LaunchPad
TX
J17 Pin
J2 pin 3 (UARX)
RX
J17
J2 pin 4 (UATX)
nFAULT
J17
J2 pin 5 (PA7)
GND
J17
J3 pin 2 (GND)
5.4 Stacking BQ79616EVMs
Note
NOTE: This section does not apply to BQ75614EVMs.
The BQ79616EVMs are connected using 4-position Molex connectors. There is a high side (J11) and low side
(J10) communication connector available on each device. By default the isolation filters for the vertical interface
are set to cap only configuration. The user may change this by populating/depopulating components. For
example, the user can depopulate resistors R69, R79, R72, and R74 to use the on board choke in series with
the capacitors. There are also footprints to populate a transformer on the bottom of the pcb board. More details
can be found in the schematic near the bottom of this user guide.
Table 5-2. Connections Between High-Side/Low-Side BQ79616EVMs
Connection Name
BQ79616EVM High Side
BQ79616EVM Low Side
COMH_N/COML_N
J11 pin 4
J10 pin 1
COMH_P/COML_P
J11 pin 3
J10 pin 2
5.5 Software
The software provides a command API and drivers that are capable of implementing the examples provided in
BQ79616-Q1 Software Design Reference.
The example code only provides a control interface to the BQ79616-Q1 and does not provide any other
communications interface to the outside world. The customer is expected to develop their own communication
implementation. Examples of communications interfaces available to the TMS570 are SPI, CAN, or UART. For
16
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Quick Start Guide
www.ti.com
the TMS570 example code, UART is the communication protocol used between the microcontroller and
BQ79616-Q1 device.
This firmware provided with this application note provides source code examples of the command sequences
described in the BQ79616-Q1 Software Design Reference.
Importing a project into Code Composer Studio™:
1. Launch the provided file: BQ79616-Q1 Example Code 0.1 Installer.exe and extract files to the default path
provided ( C:\ti\bq79616-Q1 Example Code 0.1 ).
2. Launch Code Composer Studio (CCS):
Start → Programs → Texas Instruments → Code Composer Studio v8 → Code Composer Studio v8
3. When it launches, CCS requests a workspace is selected, choose “C:\myWorkspace”. Once CCS loads, go
to:
Project → Import CSS Projects... → Select search-directory
4. In Select search-directory, browse to the folder:
C:\ti\bq79616-Q1 Example Code 0.1
5. In Discovered projects:, check BQ79616-Q1 example code
5.6 GUI
For initial evaluation, it may be more beneficial to use the graphical user's interface (GUI), which provides a
"point and click" interface to become familiar with the BQ79616-Q1 or BQ75614-Q1. During the initial sampling
phase, please contact your local TI FAE to get the latest GUI version.
To get started with the GUI, please refer to the BQ79616 GUI User Guide (SLUUC36) document.
5.6.1 GUI UART Connection
The physical setup for the GUI is the same as for the microcontroller, but will instead use an USB2ANY interface
and 10 pin cable for the UART connections on J17. The USB2ANY has a USB Mini-B connector on the right
side. Plug the provided USB cable (or any USB cable with a Mini-B connector) into the USB2ANY. Plug the other
end of the cable (USB ‘A’) into the computer. Then connect the10 pin connector cable to J4 of the USB2ANY
(middle most connector) and must have the key side facing upwards when connecting to the EVM header J17.
Please refer to the picture below and this is explained in more detail in the USB2ANY user guide: http://
www.ti.com/lit/ug/snau228/snau228.pdf and the BQ79616-Q1 GUI User Guide (SLUUC36).
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
17
www.ti.com
Physical Dimensions
6 Physical Dimensions
6.1 Board Dimensions
Board dimensions: 4.400 in × 5.500 in
Board height:
• Top - Tallest component (GPIO, Shunts) is 0.35 in (8.8 mm) above PCB.
• Bottom - Tallest component if populated (Transformers) is 0.41 in (10.5 mm) above PCB (Depopulated by
default).
6.2 Board Mounting
Figure 6-1 illustrates the EVM dimension drawing.
Figure 6-1. Board Dimensions
18
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
7 BQ79616EVM Schematic, Assembly, Layout, and BOM
Provided are the BQ79616EVM schematic, assembly, layout and BOM in their respective sections.
7.1 Schematic
Cell Simulator
BMS021E3_CellSimulator.SchDoc
Battery Connector
BMS021E3_VC_CB.SchDoc
bq79616
BMS021E3_bq79616.SchDoc
PWR
Daisy Chain Isolation
BMS021E3_Communications.SchDoc
PWR
BBP_CELL
BBN_CELL
BBP_CELL
BBN_CELL
VSTACK
VSTACK
CELL16S
CELL16S
CELL15
CELL15
CELL14
CELL14
CELL13
CELL13
CELL12
CELL12
CELL11
CELL11
CELL10
CELL10
CELL9
CELL9
CELL8
CELL8
CELL7
CELL7
CELL6
CELL6
CELL5
CELL5
CELL4
CELL4
CELL3
CELL3
CELL2
CELL2
CELL1
CELL1
CELL0
CELL0
VC16
CB16
VC15
CB15
VC14
CB14
VC13
CB13
VC12
CB12
VC11
CB11
VC10
CB10
VC9
CB9
VC8
CB8
VC7
CB7
VC6
CB6
VC5
CB5
VC4
CB4
VC3
CB3
VC2
CB2
VC1
CB1
VC0
CB0
VC16
CB16
VC15
CB15
VC14
CB14
VC13
CB13
VC12
CB12
VC11
CB11
VC10
CB10
VC9
CB9
VC8
CB8
VC7
CB7
VC6
CB6
VC5
CB5
VC4
CB4
VC3
CB3
VC2
CB2
VC1
CB1
VC0
CB0
COMHP
COMHN
COMLP
COMLN
COMHP
COMHN
COMLP
COMLN
Hardware
BMS021E3_EVM_Hardware.SchDoc
Figure 7-1. BQ79616EVM Schematic Block Diagram
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
19
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
UART Communication
Test Points
U2
TP4
0.1uF
NPNB
R123 GND_ISO
100k
USB2ANY_TX_3.3
VCC2
16
INA
OUTA
14
INB
OUTB
13
NPNB
NPN Power Supply
USB2ANY_3.3V
7
EN1
2
8
GND1
GND1
TP8
LDOIN
BAT
GND_ISO
3
3
J1
BBN
1
2
R3
R4
100
200
PWR
RX
TP43
C1
NFAULT
J3 Pin Desc ription
0.22µF
5 TX - to microcontroller UART RX
4 RX - to microcontroller UART TX
2 FAULTn - to microcontroller GP IO
1 GND - shared GND with microcontroller
GND
BBP
BBN
NFAULT
CVDD
R120
100k
R2
100k
NF_J
GND_ISO
NFAULT_C
NFAULT
R119
CVDD
C4
0.1uF
100
GND
J17A
CVDD_CO
J17 Pin Des cription
8 TX - to microcontroller UART RX
7 RX - to microcontroller UART TX
3 FAULTn - to microcontroller GP IO
5 GND - shared GND with microcontroller
6 USB2ANY 3.3V
GND
6
5
4
3
2
1
DVDD
J18
GND
USB2ANY_RX_3.3
BBP
DNP
2,4
BAT
TP11
1
DVDD
TX
REFHP
TP10
TX
RX_C
TP9
GND
NPNB
1
2
AVDD
CVDD
10
9
15
Q2
NPNB
1
TP42
IND
EN2
GND2
GND2
ISO7342CQDWRQ1
1
2
Q1
J2
OUTD
0.1uF
J21
USB2ANY_3.3V
REFHP
RX
11 NF_J
RX
8
TP7
AVDD
6
12 TX
1
2
10
NEG5V
TP6
CVDD
NFAULT_C
C58
INC
2
LDOIN
TP5
OUTC
CVDD_CO
RX_CO
4
TSREF
TP12
TX
VCC1
4
USB2ANY_RX_3.3 5
GND
RX
1
3
6
NEG5V
LDOIN
C57
USB2ANY_TX_3.3
TSREF
TP3
7
TP2
9
GND
GND
3
GND
TP1
TP14
GND
5
TP13
GND
1
2
USB2ANY_3.3V
TP15
J17B
J3
U1
0.1uF
C59
0.1uF
GND
PWR
PWR
R5
GND
44
NEG5V
LDOIN
47
LDOIN
NPNB
48
NPNB
BAT
30.0
1
REFHP
C5
10nF
C6
1µF
GND
C7
4.7µF
GND
C8
1µF
R121
1
51
NEG5V
GND
1.0k
C9
D1
1µF
2
Green
GND
J6
2
1
GND
GND
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
GND tied to CELL0
at connector via a
thick trace.
37
AVDD
CVDD
DVDD
38
45
49
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
BBP
BBN
64
63
RX
TX
52
53
NFAULT
62
BBP/BBN Bus Bar
TSREF
BAT
REFHP
AVDD
CVDD
DVDD
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
BBP
BBN
RX
TX
FAULT
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
61
60
59
58
57
56
55
54
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
COMHP
COMHN
43
42
COMHP
COMHN
COMLP
COMLN
40
41
COMLP
COMLN
PAD
65
REFHM
36
AVSS
CVSS
DVSS
39
46
50
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
BBN_CELL
BBP_CELL
2
1
402
C10
R12
402
0.47uF
R10
DNP
0
BBP
R13
DNP
0
BBN
TSREF
PULLUP
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
Jumpers to connect GPIOs to
resistor divider and thermistor for
temperature measurements.
J4
GPIO1_C
1
2
GPIO2_R
3
4
GPIO3_R
5
6
GPIO4_R
7
8
GPIO5_R
9
10
GPIO6_R
11
12
GPIO7_R
13
14
GPIO8_R
15
16
GPIO8_R
RT1
GPIO7_R
10k
RT2
GPIO6_R
10k
RT3
GPIO5_R
10k
RT4
10.0k
COMLP
COMLN
R8
10.0k
R11
R14
R15
GPIO4_R
10k
RT5
GPIO3_R
10k
RT6
GPIO2_R
10k
RT7
GPIO1_R
10k
RT8
10.0k
R18
VC15
VC16
VC13
VC14
VC12
CB16
CB15
CB14
CB13
CB12
R19
10.0k
BBN
°
°
t
°
t
°
GND
t
10.0k
DNPC11
0.47uF
GPIO1_R
D3
24V
t°
10.0k
10.0k
R17
SRN_S
DN0
P
TP19
GPIO1_R
t
10.0k
SRP/SRN
Current Sense
BBP
1.0k
t
Low side NTC circuit.
R16
SRP_S
TP18
TP44
R128
C60
1uF
GND
R7
GND
R9
TP17
J5
PULLUP
TP16
BBN_CELL
Jumpers to connect TSREF to
ratiometric circuit.
COMHP
COMHN
BQ79616PAPQ1
BBP_CELL
GPIOs
2
GND
TSREF
1
C3
3
C2
1µF
ALL DECOUPLING
CAPS ARE AS
CLOSE TO THE
CHIP AS POSSIBLE
°
t°
10k
°t
DNP
C12
1uF
R21
DNP
0
R25
DNP
0
R22
DNP
0
R26
DNP
0
R27
DNP
0
Resistors for Lower Cell Count
Applications (614, 612)
R23
DNP
0
R20
DNP
100k
R24
DNP
0
R28
DNP
0
Figure 7-2. BQ79616EVM Schematic Part 1
20
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
PWR
R122
DNP
0
CELL14
J14
2
1
TP28
R80
CELL8
R81
CELL16S
CELL16S
VC7
CB16
VC7
CELL15
R85
VC15
C28
0.47uF
CB15
0
C29
0.47uF
TP26
R89
CELL6
CELL6
CELL6
CELL11
CB11
VC2
VC2
CELL10
VC1
VC1
CELL0S
R114
10.0
100
VC0
CELL6
11
CELL7
12
CELL8
13
CELL9
14
CELL10
15
CELL11
16
CELL12
17
CELL13
18
CELL14
19
CELL15
20
CELL16S
21
CELL16
22
CELL0
CELL16
VC10
D4
75V
CELL0
CELL0
R110
VC9
VC9
100
C52
0.47uF
CB9
CB8
R113
CELL0S
CELL5
10
C50
0.47uF
CELL9
CB9
CELL4
9
DNP
R112
10.0
C53
0.47uF
VC10
C48
0.47uF
CB10
CELL9
C51
0.47uF
CB1
CELL9
CELL3
8
100
R108
10.0
100
R111
10.0
PWR
R106
TP29
R109
CELL2
7
VC11
C46
0.47uF
CELL10
CB10
CELL1
6
C44
0.47uF
CB11
CELL10
C47
0.47uF
VC11
CELL0S
5
100
R104
10.0
C49
0.47uF
TP20
R102
TP30
CB2
CELL1
C42
0.47uF
CELL11
100
TP21
CB0
VC3
C40
0.47uF
CB12
CELL0
4
VC12
100
CELL11
R105
CELL1
CELL0
CB12
C43
0.47uF
R107
10.0
2
1
VC3
VC12
R100
10.0
C45
0.47uF
CELL2
R98
CELL12
100
TP22
C38
0.47uF
TP31
CB3
CELL2
J16
CELL12
C39
0.47uF
R103
10.0
CB1
VC4
CELL16
3
VC13
C36
0.47uF
CB13
CELL12
R101
CB2
CB13
C41
0.47uF
CELL3
CELL1
VC4
VC13
100
TP32
CB4
CELL3
R94
R96
10.0
100
TP23
C34
0.47uF
CELL13
C37
0.47uF
R99
10.0
CELL2
CELL13
C32
0.47uF
CB14
CELL0
VC14
100
CELL13
R97
CB3
VC5
C35
0.47uF
CB5
CELL4
CB4
CB14
100
CELL4
CELL3
VC5
VC14
R92
10.0
TP33
R95
10.0
TP24
R90
CELL14
CELL14
R93
CELL5
CELL4
CELL14
C33
0.47uF
CELL5
CB5
VC6
C31
0.47uF
CB6
TP25
CELL5
VC6
100
R91
10.0
CB6
C30
0.47uF
TP34
1
2
VC15
100
R87
10.0
CB15
J15
C26
0.47uF
CELL15
C27
0.47uF
R88
VC16
C24
0.47uF
CB16
CELL15
100
R86
10.0
VC16
100
R83
10.0
TP35
R84
CELL7
CB7
CELL16S
C25
0.47uF
CELL7
CB7
VC8
C23
0.47uF
CB8
TP27
CELL7
VC8
100
R82
10.0
CB8
PWR
VSTACK
TP36
CELL8
CELL8
TP37
C54
0.47uF
VC8
VC0
C55
0.47uF
CB0
C56
0.47uF
GND
GND
Figure 7-3. BQ79616EVM Schematic Part 2
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
21
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
TP40
VSTACK
VSTACK
R29
100
R30
100
S1
C16_L 1
C15_L2
C14_L 3
C13_L4
C12_L5
C11_L 6
C10_L7
C9_L 8
R31
100
R32
100
16
15
14
13
12
11
10
9
C16_R
C15_R
C14_R
C13_R
C12_R
C11_R
C10_R
C9_R
CELL16S
CELL15
CELL14
CELL13
CELL12
CELL11
CELL10
CELL9
16
15
14
13
12
11
10
9
C8_R
C7_R
C6_R
C5_R
C4_R
C3_R
C2_R
C1_R
CELL8
CELL7
CELL6
CELL5
CELL4
CELL3
CELL2
CELL1
CELL16S
CELL15
CELL14
CELL13
CELL12
CELL11
CELL10
CELL9
R33
100
R34
100
R35
100
R36
100
R37
100
BBP_CELL
R39
0.1
R38
DNP
0
R40
0
R41
DNP
0
BBN_CELL
R42
100
S2
C8_L
C7_L
C6_L
C5_L
C4_L
C3_L
C2_L
C1_L
R43
100
R44
100
1
2
3
4
5
6
7
8
CELL8
CELL7
CELL6
CELL5
CELL4
CELL3
CELL2
CELL1
R45
100
R46
100
R47
100
R48
100
TP39
CELL0
CELL0
CELL0
TP38
R49
CELL0
GND
0
GND
J7
J8
C5_R
C4_R
C3_R
C2_R
C1_R
1
2
3
4
5
6
J9
C11_R
C10_R
C9_R
C8_R
C7_R
C6_R
1
2
3
4
5
6
1
2
3
4
5
6
C16_R
C15_R
C14_R
C13_R
C12_R
Figure 7-4. BQ79616EVM Schematic Part 3
5
2
DNP
R54
R52
COMMH_P_OPT
GND
1
COMMH_N2
COMMH_P 3
4
3
HMU1228NL
R55
GND
1
COMML_N 2
COMML_P 3
COMML_N_OPT
R56
COMMH_N_OPT
R58
R59
0
51
COMML_P
COMLP
R115
DN499
P
R62
1.00k
51
COMML_N
10nF
GND
COMLN
51
0
COMMH_N
COMHN
R66
R67
51
0
COMMH_N_OPT
C17
220pF
C18
220pF
GND
COMMH_P_OPT
COMML_P_OPT
0
2 ISO_COMML_N
1 ISO_COMML_P
L2
3
2
470uH
0
J11
1
2
3
4
TP41
GND
C21
R78
2200pF
R75
R70
0
J10
J12
4
3
2
1
ISO_COMMH_N
ISO_COMMH_P
R71
0
2200pF
ISO_COMMH_P
0
L1
470uH
1
2
GND
COMMH_N_OPT R76
COMML_N_OPT
GND
0
R69
C19
J13
4
R73
ISO_COMMH_N
0
3
C16
220pF
3
2200pF
4
1
0
R57
R63
1.00k
GND
C20
3
HMU1228NL
COMMH_P_OPT
R68
0
4
D5
24V
C15
220pF
0
2
DNP
R118
DN499
P
D2
24V
R74
5
ISO_COMMH_P
0
R116
DN499
P
DNP
10nF
R61
1
R65
C62
R60
2
R64
0
1
COMML_N_OPT
COMMH_P
COMHP
C61
DNP
R117
DN499
P
ISO_COMML_N
1
0
COMML_P_OPT
ISO_COMML_P
6 T2
C14
100pF
GND
0
0
R72
R53
0
J20
C13
100pF
GND
ISO_COMML_N
J19
COMML_P_OPT
0
2
1
3
R51
6 T1
2
0
1
R50
ISO_COMML_P
0
C22
R77
R79
2200pF
ISO_COMMH_N
0
0
Figure 7-5. BQ79616EVM Schematic Part 4
22
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
7.2 Assembly
Figure 7-6. BQ79616EVM Assembly Top
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
23
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Figure 7-7. BQ79616EVM Assembly Bottom
24
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
7.3 Layout
Figure 7-8. BQ79616EVM Top Overlay
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
25
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Figure 7-9. BQ79616EVM Bottom Overlay
26
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Figure 7-10. BQ79616EVM Top Solder
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
27
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Figure 7-11. BQ79616EVM Top Layer
28
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Figure 7-12. BQ79616EVM Internal Signal Layer 1 - GND Plane
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
29
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Figure 7-13. BQ79616EVM Internal Signal Layer 2
30
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Figure 7-14. BQ79616EVM Bottom Layer
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
31
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Figure 7-15. BQ79616EVM Bottom Solder
32
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Figure 7-16. BQ79616EVM Drill Drawing
7.4 BQ79616EVM-021 Bill of Materials (BOM)
Table 7-1. BQ79616EVM-021 BOM
Designator
Quantity
Value
!PCB1
1
Printed Circuit
Board
BMS021
C1
1
Multilayer
1206
Ceramic
Capacitors
MLCC SMD/SMT
1206 0.22uF
100volts X7R
+/-10%
GCM31MR72 Murata
A224KA37L
C2, C6, C8,
C9
4
CAP CER
0603 (1608
0603 1UF
Metric)
10V X7R 10%
C0603C105K KEMET
8RACAUTO
C3, C4, C57,
C58, C59
5
CAP, CERM, 0402
0.1 uF, 10 V,
+/- 10%, X7R,
AEC-Q200
Grade 1,
0402
GCM155R71
A104KA55D
0.1uF
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Description
Package
Reference
Part Number Manufacturer Alternate
Alternate
Manufacturer
Any
MuRata
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
33
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Table 7-1. BQ79616EVM-021 BOM (continued)
Designator
Quantity
Value
Description
Package
Reference
Part Number Manufacturer Alternate
C5
1
0.01uF
CAP, CERM,
0.01 µF, 100
V,+/- 10%,
X7R, AECQ200 Grade
1, 0603
0603
GCM188R72
A103KA37J
C7
1
4.7uF
CAP, CERM, 0805
4.7 uF, 10 V,
+/- 20%, X7R,
0805
C2012X7R1A TDK
475M125AC
C10, C23,
C24, C25,
C26, C27,
C28, C29,
C30, C31,
C32, C33,
C34, C35,
C36, C37,
C38, C39,
C40, C41,
C42, C43,
C44, C45,
C46, C47,
C48, C49,
C50, C51,
C52, C53,
C54, C55,
C56
35
0.47uF
CAP, CERM, 0603
0.47 uF, 16 V,
+/- 10%, X7R,
AEC-Q200
Grade 1,
0603
GCM188R71
C474KA55D
MuRata
C13, C14
2
100pF
CAP, CERM,
100 pF, 50
V,+/- 5%,
C0G/NP0,
AEC-Q200
Grade 1,
0603
0603
GCM1885C1
H101JA16J
MuRata
C15, C16,
C17, C18
4
220pF
CAP, CERM,
220 pF, 50
V,+/- 5%,
X7R, 0603
0603
CL10B221JB
8NNNC
Samsung
ElectroMechanics
C19, C20,
C21, C22
4
2200pF
CAP, CERM, 1206
2200 pF, 2000
V,+/- 10%,
X7R, AECQ200 Grade
1, 1206
1206J2K0022 Knowles
2KXR
Capacitors
C60
1
1uF
CAP, CERM, 0603
1 uF, 16 V, +/10%, X7R,
AEC-Q200
Grade 1,
0603
GCM188R71
C105KA64D
MuRata
D1
1
Green
LED, Green,
SMD
LED_0805
LTSTC170KGKT
Lite-On
D2, D3, D5
3
24V
Diode, TVS,
Bi, 24 V, 70
Vc, AECQ101,
SOT-23
SOT-23
PESD1CAN,2 NXP
15
Semiconducto
r
34
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
Alternate
Manufacturer
MuRata
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Table 7-1. BQ79616EVM-021 BOM (continued)
Designator
Quantity
Value
Description
Package
Reference
Part Number Manufacturer Alternate
FID1, FID2,
FID3, FID4,
FID5, FID6
6
Fiducial mark. N/A
There is
nothing to buy
or mount.
N/A
N/A
H1, H2, H3,
H4
4
Machine
Screw
Screw,
Round, #4-40
x 1/4, Nylon,
Philips
panhead
NY PMS 440
0025 PH
B&F Fastener
Supply
H5, H6, H7,
H8
4
Standoff, Hex, Standoff
0.5"L #4-40
Nylon
1902C
Keystone
H9
1
CONN
HOUSING
22POS .100
W / LATCH
50-57-9422
Molex
H11, H12
2
Rectangular
Housing
Connector, 4
Pos, 2.54mm
50-57-9404
Molex
J1, J2, J5, J6, 6
J18, J21
Header,
Header,
PEC01DAAN Sullins
2.54mm, 1x2, 2.54mm, 2x1,
Connector
Tin, Black, TH TH
Solutions
J3
1
Header,
Header,
0.5mm, 6x1, 0.5mm, 6x1,
R/A, Gold, TH R/A, TH
22-12-4062
J4
1
Header, 2.54 Header, 2.54
mm, 8x2, Tin, mm, 8x2, TH
Vertical, TH
PEC08DAAN Sullins
Connector
Solutions
J7, J8, J9
3
Header,
100mil, 6x1,
Tin, TH
TH, 6-Leads,
Body
608x100mil,
Pitch 100mil
PEC06SAAN
J10, J11
2
Header(shrou
ded),
2.54mm, 4x1,
R/A, Gold, TH
Header(shrou 70551-0038
ded),
2.54mm, 4x1,
R/A, TH
Molex
J12, J13, J14, 4
J16
Header,
100mil, 2x1,
Tin, TH
Header, 2
PIN, 100mil,
Tin
PEC02SAAN
Sullins
Connector
Solutions
J15
1
Connector
HDR22
Header
Through Hole,
Right Angle
22 position
0.100"
(2.54mm)
705550056
Molex
J17
1
CONN
HEADER
10POS .100
DL R/A AU
HDR10
TSW-105-08- Samtec
L-D-RA
J19, J20
2
Header,
100mil, 3x1,
Tin, TH
Header, 3
PIN, 100mil,
Tin
PEC03SAAN
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Alternate
Manufacturer
Molex
Sullins
Connector
Solutions
Sullins
Connector
Solutions
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
35
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Table 7-1. BQ79616EVM-021 BOM (continued)
Designator
Quantity
Value
Description
Package
Reference
Part Number Manufacturer Alternate
L1, L2
2
470uH
Coupled
inductor, 470
uH, 0.4 A,
0.35 ohm,
SMD
5x3.3mm
744242471
LBL1
1
Q1
1
150 V
Transistor,
DPAK
NPN, 150 V, 1
A, AEC-Q101,
DPAK
ZXTN4004KT Diodes Inc.
C
R2, R120,
R123
3
100k
RES, 100 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
00KJNEA
Vishay-Dale
R3
1
100
RES, 100,
1%, 0.75 W,
AEC-Q200
Grade 0,
2010
2010
CRCW20101
00RFKEF
Vishay-Dale
R4
1
200
RES, 200,
1%, 0.75 W,
AEC-Q200
Grade 0,
2010
2010
CRCW20102
00RFKEF
Vishay-Dale
R5
1
30.0
RES, 30.0,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
ERJ-3EKF30
R0V
Panasonic
R7, R8, R11,
R14, R15,
R16, R18,
R19
8
10.0k
RES, 10.0 k,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
0K0FKEA
Vishay-Dale
R9, R12
2
402
RES, 402,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06034
02RFKEA
Vishay-Dale
R29, R30,
R31, R32,
R33, R34,
R35, R36,
R37, R42,
R43, R44,
R45, R46,
R47, R48
16
100
RES, 100,
1%, 1 W,
AEC-Q200
Grade 0,
2512
2512
CRCW25121
00RFKEG
Vishay-Dale
R39
1
0.1
RES, 0.1, 5%, 0603
0.1 W, 0603
36
Alternate
Manufacturer
Wurth
Elektronik
Thermal
PCB Label
THT-14-423-1 Brady
Transfer
0.650 x 0.200 0
Printable
inch
Labels, 0.650"
W x 0.200" H
- 10,000 per
roll
CRL0603-JW- Bourns
R100ELF
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Table 7-1. BQ79616EVM-021 BOM (continued)
Designator
Quantity
Value
Description
R40, R49
2
0
RES, 0, 5%, 1206
0.25 W, AECQ200 Grade
0, 1206
ERJ-8GEY0R Panasonic
00V
R50, R51,
R52, R53,
R54, R55,
R56, R57,
R68, R69,
R70, R71,
R72, R73,
R74, R75,
R76, R77,
R78, R79
20
0
RES, 0, 5%,
0.333 W,
AEC-Q200
Grade 0,
0805
0805
CRCW08050
000Z0EAHP
R58, R61,
R64, R67
4
0
RES, 0, 5%,
0.1 W, 0603
0603
RC0603JR-07 Yageo
0RL
R59, R60,
R65, R66
4
51
RES, 51, 5%, 0603
0.1 W, AECQ200 Grade
0, 0603
CRCW06035
1R0JNEA
Vishay-Dale
R62, R63
2
1.00k
RES, 1.00 k,
1%, 0.1 W,
0603
0603
ERJ-3EKF10
01V
Panasonic
R80, R81,
R84, R85,
R89, R90,
R93, R94,
R97, R98,
R101, R102,
R105, R106,
R109, R110,
R113
17
100
RES, 100,
0.1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
ERA-3AEB10 Panasonic
1V
R82, R83,
R86, R87,
R91, R92,
R95, R96,
R99, R100,
R103, R104,
R107, R108,
R111, R112,
R114
17
10.0
RES, 10.0,
1%, 0.75 W,
AEC-Q200
Grade 0,
1210
1210
CRCW12101
0R0FKEAHP
Vishay-Dale
R88
1
0
RES, 0, 5%,
0.1 W, AECQ200 Grade
0, 0603
0603
CRCW06030
000Z0EA
Vishay-Dale
R119
1
100
RES, 100,
5%, 0.25 W,
AEC-Q200
Grade 0,
0603
0603
ESR03EZPJ1 Rohm
01
R121, R128
2
1.0k
RES, 1.0 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
K00JNEA
Vishay-Dale
RT1, RT2,
RT3, RT4,
RT5, RT6,
RT7, RT8
8
10k
Thermistor
NTC, 10k
ohm, 2%,
0603
0603
ERTJ1VG103GA
Panasonic
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Package
Reference
Part Number Manufacturer Alternate
Alternate
Manufacturer
Vishay-Dale
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
37
BQ79616EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Table 7-1. BQ79616EVM-021 BOM (continued)
Designator
Quantity
S1, S2
2
Switch, SPST 9.65X8X22.4
8Pos, Rocker, mm
TH
76SB08ST
Grayhill
SH1, SH2,
SH3, SH4,
SH5, SH6,
SH7, SH8
8
Shunt,
100mil, Gold
plated, Black
881545-2
TE
Connectivity
TP1, TP2,
TP3, TP4,
TP5, TP6,
TP7, TP8,
TP9, TP10,
TP11, TP12,
TP16, TP17,
TP18, TP19,
TP21, TP22,
TP23, TP24,
TP25, TP26,
TP27, TP28,
TP29, TP30,
TP31, TP32,
TP33, TP34,
TP35, TP36,
TP42, TP43,
TP44
35
Test Point,
White
Multipurpose, Multipurpose
White, TH
Testpoint
5012
Keystone
TP13, TP14,
TP15
3
Terminal,
Turret, TH,
Triple
1598-2
Keystone
TP20, TP38,
TP39
3
Test Point,
Black
Multipurpose, Multipurpose
Black, TH
Testpoint
5011
Keystone
TP37, TP40
2
Test Point,
Red
Multipurpose, Multipurpose
Red, TH
Testpoint
5010
Keystone
U1
1
SafeTI™
PAP0064F
Precision
Monitor With
Integrated
Hardware
Protector for
Lithium-Ion,
Lithium
Phosphate,
Lithium
Titanate
Battery Pack,
PAP0064F
(HTQFP-64)
BQ79616PAP Texas
Q1
Instruments
Texas
Instruments
U2
1
Automotive,
Low Power,
QuadChannel 2/2
Digital
Isolator,
DW0016B
(SOIC-16)
ISO7342CQD Texas
WRQ1
Instruments
ISO7342CQD Texas
WQ1
Instruments
38
Value
Description
Package
Reference
Shunt 2 pos.
100 mil
Keystone159
8-2
DW0016B
Part Number Manufacturer Alternate
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
Alternate
Manufacturer
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ79616EVM Schematic, Assembly, Layout, and BOM
Table 7-1. BQ79616EVM-021 BOM (continued)
Designator
Quantity
Value
Description
C11
0
0.47uF
CAP, CERM, 0603
0.47 uF, 16 V,
+/- 10%, X7R,
AEC-Q200
Grade 1,
0603
GCM188R71
C474KA55D
MuRata
C12
0
1uF
CAP, CERM, 0603
1 uF, 16 V, +/10%, X7R,
AEC-Q200
Grade 1,
0603
GCM188R71
C105KA64D
MuRata
C61, C62
0
0.01uF
CAP, CERM, 0603
0.01 uF, 50 V,
+/- 10%, X7R,
0603
CL10B103KB Samsung
8NCNC
ElectroMechanics
D4
0
75V
Diode, TVS,
SMA
Uni, 75 V, 121
Vc, 400 W,
3.3 A, SMA
SMAJ75A
Littelfuse
Q2
0
80 V
Transistor,
SOT-223
NPN, 80 V, 1
A, AEC-Q101,
SOT-223
BCP56T1G
ON
Semiconducto
r
R10, R13,
R17, R122
0
0
RES, 0, 5%, 1206
0.25 W, AECQ200 Grade
0, 1206
ERJ-8GEY0R Panasonic
00V
R20
0
100k
RES, 100 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
00KJNEA
Vishay-Dale
R21, R22,
R23, R24,
R25, R26,
R27, R28,
R38, R41
0
0
RES, 0, 5%,
0.1 W, AECQ200 Grade
0, 0603
0603
CRCW06030
000Z0EA
Vishay-Dale
R115, R116,
R117, R118
0
499
RES, 499,
1%, 0.1 W,
0603
0603
RC0603FR-0
7499RL
Yageo
T1, T2
0
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Package
Reference
Part Number Manufacturer Alternate
BMS
SMT_TRANS HMU1228NL
TRANSFORM FORMER_8M
ER
M89_10MM0
9
Alternate
Manufacturer
Pulse
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
39
www.ti.com
BQ75614EVM Schematic, Assembly, Layout, and BOM
8 BQ75614EVM Schematic, Assembly, Layout, and BOM
Provided are the BQ75614EVM schematic, assembly, layout and BOM in their respective sections.
8.1 Schematic
Test Points
TP13
TP14
TP1
TP2
TP3
USB2ANY_3.3V
TP4
UART Communication
LDOIN
NEG5V
R1
100k
NPNB
U2
Q2
NPNB
R119
R4
100
200
TX
RX_C
R3
PWR
BBN
BBP
NFAULT
8
1
2
RX_C
TX
2
1
B1
B2
GND
TXB0102DCUR
GND
J18
R2
100k
GND
NFAULT
100
J17 Pin Description
C4
0.1uF
GND
1
C1
DVDD
VCCA
VCCB
6
1
DNP
OE
A1
A2
3
7
8 TX - to microcontrolle r UART RX
7 RX - to microcontrolle r UART TX
3 FAULTn - to microcontrolle r GPIO
5 GND - shared GND with microcontrolle r
6 USB2ANY 3.3V
6
5
4
3
2
1
NFAULT
CVDD
R120
100k
2
NPNB
1
TP12
BBN
2,4
TP11
BBP
2
TP10
DVDD
5 TX - to microcontrolle r UART RX
4 RX - to microcontrolle r UART TX
2 FAULTn - to microcontrolle r GPIO
1 GND - shared GND with microcontrolle r
6
5
4
US B2ANY_3.3V
J3 Pin Description
Q1
TP9
GND
NPN Power Supply
BAT
3
REFHP
3
AVDD
4
BAT
LDOIN
CVDD
J2
US B2ANY_TX_3.3
REFHP
J1
USB2ANY_3.3V
CVDD
9
AVDD
TP8
7
CVDD
TP7
3
GND
TP6
R6
DNP
100k
NPNB
5
TP5
NEG5V
1
2
GND
LDOIN
1
2
TSREF
RX
TP15
US B2ANY_RX_3.3
TSREF
8
GND
GND
GND
0.22µF
J17A
J3
GND
10
GND
GND
J17B
U1
C2
1µF
ALL DECOUPLING
CAPS ARE AS
CLOSE TO THE
CHIP AS POSSIBLE
TSREF
51
TSREF
NEG5V
44
NEG5V
C59
LDOIN
47
LDOIN
0.1uF
NPNB
48
NPNB
C3
GND
0.1uF
GND
PWR
PWR
R5
GND
BAT
30.0
C5
10nF
C6
1µF
GND
GND
C7
1µF
1
R121
GND
1.0k
C9
D1
GND
1µF
2
Green
C8
1µF
J6
2
1
GND
GND
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
GND tied to CELL0
at connector via a
thick trace.
1
BAT
REFHP
37
REFHP
AVDD
CVDD
DVDD
38
45
49
AVDD
CVDD
DVDD
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
BBP
BBN
64
63
SRP
SRN
RX
TX
52
53
RX
TX
NFAULT
62
BBP/BBN Bus Bar
GP IO1
GP IO2
GP IO3
GP IO4
GP IO5
GP IO6
GP IO7
GP IO8
61
60
59
58
57
56
55
54
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
COMHP
COMHN
43
42
COMHP
COMHN
COMLP
COMLN
40
41
COMLP
COMLN
FAULT
65
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
GPIOs
J5
2
1
36
REFHM
AVSS
CVSS
DVSS
39
46
50
AVSS
CVSS
DVSS
R9
TP17
BBN_CELL
402
C10
R12
402
0.47uF
R10
DNP
0
BBP
R13
DNP
0
BBN
TSREF
PULLUP
R7
COMHP
COMHN
Jumpers to connect GPIOs to
res is tor divider and thermis tor for
temperature measurements.
J4
1
2
GPIO1_R
3
4
GPIO2_R
5
6
GPIO3_R
7
8
GPIO4_R
9
10
GPIO5_R
11
12
GPIO6_R
13
14
GPIO7_R
15
16
GPIO8_R
GPIO8_R
RT1
GPIO7_R
10k
RT2
GPIO6_R
10k
RT3
t°
10.0k
COMLP
COMLN
Low side NTC circuit.
R8
t°
10.0k
GND
REFHM
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
Jumpers to connect TSREF to
ratiometric circuit.
R11
t°
10.0k
GND
PULLUP
R14
GPIO5_R
10k
RT4
GPIO4_R
10k
RT5
t°
10.0k
TP16
BBP _CELL
BBP_CELL
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
PAD
BQ75614PAPRQ1
BBN_CELL
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
R15
t°
10.0k
R16
GPIO3_R
10k
RT6
GPIO2_R
10k
RT7
SRP/SRN
Current Sense
R18
GPIO1_R
10k
RT8
VC15
VC16
VC14
VC13
CB16
VC12
CB15
CB14
CB13
C11
0.47uF
CB12
BBP
R17
SRN_S DNP
0
TP19
t°
10.0k
SRP_S
TP18
R19
10.0k
BBN
10k
C12
R21
DNP
0
R25
DNP
0
R22
DNP
0
R26
DNP
0
R27
DNP
0
Resis tors for Lower Cell Count
Applications (614, 612)
R23
DNP
0
GND
t°
10.0k
t°
DNP
1uF
R20
DNP
100k
R24
DNP
0
R28
DNP
0
Figure 8-1. BQ75614EVM Schematic Part 1
40
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ75614EVM Schematic, Assembly, Layout, and BOM
www.ti.com
TP28
CELL8
C25
0.47uF
CELL7
CELL7
CB7
R84
C29
0.47uF
CELL6
R89
C33
0.47uF
CELL5
C37
0.47uF
CELL4
R97
C41
0.47uF
CELL3
R101
C45
0.47uF
TP22
CELL2
100
C49
0.47uF
CELL1
CELL1
R109
C53
0.47uF
CB0
R114
10.0
CELL14
CELL14
CELL14
100
VC0
VC14
100
CB14
C34
0.47uF
VC5
CELL13
CELL13
CELL13
R94
VC13
100
R96
10.0
CB13
VC4
CELL12
CELL12
CELL12
R98
VC12
100
R100
10.0
CB12
VC3
CELL11
CELL11
CELL11
R102
VC11
100
R104
10.0
CB11
VC2
CELL10
CELL10
CELL10
VC10
100
VC1
CELL9
CELL9
CELL9
CELL0S
5
CELL1
6
CELL2
7
CELL3
8
CELL4
9
CELL5
10
CELL6
11
CELL7
12
CELL8
13
CELL9
14
CELL10
15
CELL11
16
CELL12
17
CELL13
18
CELL14
19
CELL15
20
CELL16S
21
CELL16
22
CELL0
CELL16
D4
75V
R110
VC9
100
CELL0
CELL0
VC9
C52
0.47uF
CB9
C54
0.47uF
CELL0
4
DNP
R112
10.0
CB9
CELL16
VC10
C48
0.47uF
CB10
C50
0.47uF
CELL0
3
VC11
PWR
R106
R108
10.0
CB10
VC12
1
2
C44
0.47uF
CB11
C46
0.47uF
VC13
C40
0.47uF
CB12
C42
0.47uF
VC14
C36
0.47uF
CB13
C38
0.47uF
VC15
C32
0.47uF
CB14
CB8
R113
R90
R92
10.0
C51
0.47uF
CB1
TP20
CELL0
VC1
100
CELL0S
C30
0.47uF
J15
C28
0.47uF
CB15
TP29
R111
10.0
CELL0S
VC6
C47
0.47uF
CB2
TP21
CB1
VC2
VC15
100
TP30
R105
R107
10.0
2
1
CB15
C43
0.47uF
CB3
CELL2
CB2
VC3
100
R85
R87
10.0
TP31
R103
10.0
J16
CELL15
C39
0.47uF
CB4
CELL3
CB3
VC4
100
TP23
CELL1
CELL15
TP32
R99
10.0
CELL2
VC7
CELL15
C35
0.47uF
CB5
CELL4
CB4
VC5
100
TP24
C26
0.47uF
VC16
C24
0.47uF
CB16
TP33
R93
R95
10.0
CELL3
CB16
C31
0.47uF
CB6
CELL5
CB5
VC6
VC16
100
R83
10.0
TP34
100
TP25
CELL4
CELL16S
C27
0.47uF
R91
10.0
CB6
R81
CELL16S
0
CELL6
CELL5
VC7
100
TP26
CELL6
CELL16S
TP35
R86
10.0
R88
VC8
C23
0.47uF
CB8
TP27
CB7
VC8
100
R82
10.0
CELL7
PWR
VSTACK
TP36
R80
CELL8
CB8
TP37
0
2
1
CELL8
PWR
R122
CELL14
J14
VC8
VC0
C55
0.47uF
CB0
C56
0.47uF
GND
GND
Figure 8-2. BQ75614EVM Schematic Part 2
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
41
www.ti.com
BQ75614EVM Schematic, Assembly, Layout, and BOM
TP40
VSTACK
VSTACK
R29
DNP
100
R30
DNP
100
S1
C16_L 1
C15_L 2
C14_L 3
C13_L 4
C12_L 5
C11_L 6
C10_L 7
C9_L 8
R31
100
R32
100
16
15
14
13
12
11
10
9
C16_R
C15_R
C14_R
C13_R
C12_R
C11_R
C10_R
C9_R
CELL16S
CELL15
CELL14
CELL13
CELL12
CELL11
CELL10
CELL9
CELL16S
CELL15
CELL14
CELL13
CELL12
CELL11
CELL10
CELL9
16
15
14
13
12
11
10
9
C8_R
C7_R
C6_R
C5_R
C4_R
C3_R
C2_R
C1_R
CELL8
CELL7
CELL6
CELL5
CELL4
CELL3
CELL2
CELL1
CELL8
CELL7
CELL6
CELL5
CELL4
CELL3
CELL2
CELL1
R33
100
R34
100
R35
100
R36
100
BBP _CELL
R39
0.1
BBN_CELL
R38
DNP
0
R41
DNP
0
R37
100
R40
0
R42
100
S2
C8_L
C7_L
C6_L
C5_L
C4_L
C3_L
C2_L
C1_L
R43
100
R44
100
1
2
3
4
5
6
7
8
R45
100
R46
100
R47
100
R48
100
TP39
CELL0
CELL0
CELL0
TP38
CELL0
R49
0
GND
GND
J7
J8
C5_R
C4_R
C3_R
C2_R
C1_R
1
2
3
4
5
6
J9
1
2
3
4
5
6
C11_R
C10_R
C9_R
C8_R
C7_R
C6_R
1
2
3
4
5
6
C16_R
C15_R
C14_R
C13_R
C12_R
GND
Figure 8-3. BQ75614EVM Schematic Part 3
42
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ75614EVM Schematic, Assembly, Layout, and BOM
www.ti.com
6
DNP
2
7
GND
ISO_COMML_N
R54
DNP
0
1
8
COMML_P_OPT
COMMH_P_OPT
J19
1
GND
COMMH_N 2 DNP
COMMH_P 3
J20
1
GND
COMML_N 2 DNP
COMML_P 3
DNPC13
220pF
R55
DNP
0
COMML_N_OPT
R58
DNP
10
R59
DNP
43
COMML_P
COMLP
R62
DNP
10.0k
R115
DNP
499
R117
DNP
499
R65
DNP
43
COMML_N
COMMH_N_OPT
COMMH_P
COMHP
C57
DNP
DNP
10nF
10nF
R116
DNP
499
C58
4
1
2200pF
R73
DNP
0
COMMH_N
COMHN
R67
DNP
10
COMMH_N_OPT
R74
DNP
0
R78
DNP
0
R75
DNP
0
D3
24V
GND
COMML_P_OPT
J10
J12
J11
1
2
3 DNP
4
4
3
DNP2
1
TP41
GND
2200pF
ISO_COMMH_N
3
DNPC17 DNPC18
220pF
220pF
COMMH_P_OPT
470uH
3
2
ISO_COMML_N
R57
DNP
0
7
8
R66
DNP
43
DNP
2 ISO_COMML_N
DNP1 ISO_COMML_P
C21
DNP
ISO_COMMH_P
R63
DNP
10.0k
DNPC15 DNPC16
220pF
220pF
L2
DNP
R56 1
DNP
0
COMMH_P_OPT
GND
C20
DNP
DNP
2
R61
DNP
10
1
D2
24V
R53
DNP
0
6
R60
DNP
43
3
DNP
R72
DNP
0
5
R118
DNP
499
GND
COMLN
DNPC14
220pF
GND
2
R64
DNP
10
1
COMML_N_OPT
ISO_COMML_P
T2
3
COMML_P_OPT
R68
DNP
0
R52 4
DNP
0
R70
DNP
0
J13
ISO_COMMH_N
ISO_COMMH_P
R69
DNP
0
C19
DNP
2200pF
1
2 DNP
COMMH_N_OPT R76
DNP
0
COMML_N_OPT
GND
C22
DNP
2200pF
ISO_COMMH_P
R77
DNP
0
ISO_COMMH_N
L1
470uH
DNP
GND
R71
DNP
0
2
3
R51
DNP
0
3
5
1
T1
4
4
R50
DNP
0
2
ISO_COMML_P
R79
DNP
0
Figure 8-4. BQ75614EVM Schematic Part 4
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
43
www.ti.com
BQ75614EVM Schematic, Assembly, Layout, and BOM
8.2 Assembly
Figure 8-5. BQ75614EVM Assembly Top
44
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ75614EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Figure 8-6. BQ75614EVM Assembly Bottom
8.3 Layout
See section 7.3 for same drawings as for BQ79616.
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
45
BQ75614EVM Schematic, Assembly, Layout, and BOM
www.ti.com
8.4 BQ75614EVM Bill of Materials (BOM)
Designator
Quantity
!PCB1
1
Printed Circuit
Board
BMS021
C1
1
Multilayer
1206
Ceramic
Capacitors
MLCC SMD/SMT
1206 0.22uF
100volts X7R
+/-10%
GCM31MR72 Murata
A224KA37L
C2, C6, C8,
C9
4
CAP CER
0603 (1608
0603 1UF
Metric)
10V X7R 10%
C0603C105K KEMET
8RACAUTO
C3, C4, C57,
C58, C59
5
0.1uF
CAP, CERM, 0402
0.1 uF, 10 V,
+/- 10%, X7R,
AEC-Q200
Grade 1,
0402
GCM155R71
A104KA55D
MuRata
C5
1
0.01uF
CAP, CERM,
0.01 µF, 100
V,+/- 10%,
X7R, AECQ200 Grade
1, 0603
GCM188R72
A103KA37J
MuRata
C7
1
4.7uF
CAP, CERM, 0805
4.7 uF, 10 V,
+/- 20%, X7R,
0805
C2012X7R1A TDK
475M125AC
C10, C11,
C23, C24,
C25, C26,
C27, C28,
C29, C30,
C31, C32,
C33, C34,
C35, C36,
C37, C38,
C39, C40,
C41, C42,
C43, C44,
C45, C46,
C47, C48,
C49, C50,
C51, C52,
C53, C54,
C55, C56
36
0.47uF
CAP, CERM, 0603
0.47 uF, 16 V,
+/- 10%, X7R,
AEC-Q200
Grade 1,
0603
GCM188R71
C474KA55D
MuRata
C12, C60
2
1uF
CAP, CERM, 0603
1 uF, 16 V, +/10%, X7R,
AEC-Q200
Grade 1,
0603
GCM188R71
C105KA64D
MuRata
D1
1
Green
LED, Green,
SMD
LTSTC170KGKT
Lite-On
46
Value
Description
PackageRefe PartNumber
rence
0603
LED_0805
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
Manufacturer Alternate
PartNumber
Alternate
Manufacturer
Any
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ75614EVM Schematic, Assembly, Layout, and BOM
Designator
Quantity
Value
Description
PackageRefe PartNumber
rence
Manufacturer Alternate
PartNumber
D3
1
24V
Diode, TVS,
Bi, 24 V, 70
Vc, AECQ101,
SOT-23
SOT-23
FID1, FID2,
FID3, FID4,
FID5, FID6
6
Fiducial mark. N/A
There is
nothing to buy
or mount.
N/A
N/A
H1, H2, H3,
H4
4
Machine
Screw
Screw,
Round, #4-40
x 1/4, Nylon,
Philips
panhead
NY PMS 440
0025 PH
B&F Fastener
Supply
H5, H6, H7,
H8
4
Standoff, Hex, Standoff
0.5"L #4-40
Nylon
1902C
Keystone
H9
1
CONN
HOUSING
22POS .100
W / LATCH
50-57-9422
Molex
H11, H12
2
Rectangular
Housing
Connector, 4
Pos, 2.54mm
50-57-9404
Molex
PESD1CAN,2 NXP
15
Semiconducto
r
J1, J2, J5, J6, 6
J18, J21
Header,
Header,
PEC01DAAN Sullins
2.54mm, 1x2, 2.54mm, 2x1,
Connector
Tin, Black, TH TH
Solutions
J3
1
Header,
Header,
0.5mm, 6x1, 0.5mm, 6x1,
R/A, Gold, TH R/A, TH
22-12-4062
J4
1
Header, 2.54 Header, 2.54
mm, 8x2, Tin, mm, 8x2, TH
Vertical, TH
PEC08DAAN Sullins
Connector
Solutions
J7, J8, J9
3
Header,
100mil, 6x1,
Tin, TH
TH, 6-Leads,
Body
608x100mil,
Pitch 100mil
PEC06SAAN
Sullins
Connector
Solutions
J14, J16
2
Header,
100mil, 2x1,
Tin, TH
Header, 2
PIN, 100mil,
Tin
PEC02SAAN
Sullins
Connector
Solutions
J15
1
Connector
HDR22
Header
Through Hole,
Right Angle
22 position
0.100"
(2.54mm)
705550056
Molex
J17
1
CONN
HEADER
10POS .100
DL R/A AU
TSW-105-08- Samtec
L-D-RA
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
HDR10
Alternate
Manufacturer
Molex
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
47
BQ75614EVM Schematic, Assembly, Layout, and BOM
Designator
Quantity
LBL1
1
Q1
1
150 V
Transistor,
DPAK
NPN, 150 V, 1
A, AEC-Q101,
DPAK
ZXTN4004KT Diodes Inc.
C
R2, R120,
R123
3
100k
RES, 100 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
00KJNEA
Vishay-Dale
R3
1
100
RES, 100,
1%, 0.75 W,
AEC-Q200
Grade 0,
2010
2010
CRCW20101
00RFKEF
Vishay-Dale
R4
1
200
RES, 200,
1%, 0.75 W,
AEC-Q200
Grade 0,
2010
2010
CRCW20102
00RFKEF
Vishay-Dale
R5
1
30.0
RES, 30.0,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
ERJ-3EKF30
R0V
Panasonic
R7, R8, R11,
R14, R15,
R16, R18,
R19
8
10.0k
RES, 10.0 k,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
0K0FKEA
Vishay-Dale
R9, R12
2
402
RES, 402,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06034
02RFKEA
Vishay-Dale
R31, R32,
R33, R34,
R35, R36,
R37, R42,
R43, R44,
R45, R46,
R47, R48
14
100
RES, 100,
1%, 1 W,
AEC-Q200
Grade 0,
2512
2512
CRCW25121
00RFKEG
Vishay-Dale
R39
1
0.1
RES, 0.1, 5%, 0603
0.1 W, 0603
CRL0603-JW- Bourns
R100ELF
R40, R49,
R122
3
0
RES, 0, 5%, 1206
0.25 W, AECQ200 Grade
0, 1206
ERJ-8GEY0R Panasonic
00V
48
Value
Description
www.ti.com
PackageRefe PartNumber
rence
Manufacturer Alternate
PartNumber
Alternate
Manufacturer
Thermal
PCB Label
THT-14-423-1 Brady
Transfer
0.650 x 0.200 0
Printable
inch
Labels, 0.650"
W x 0.200" H
- 10,000 per
roll
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ75614EVM Schematic, Assembly, Layout, and BOM
Designator
Quantity
Value
Description
PackageRefe PartNumber
rence
R80, R81,
R84, R85,
R89, R90,
R93, R94,
R97, R98,
R101, R102,
R105, R106,
R109, R110,
R113
17
100
RES, 100,
0.1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
ERA-3AEB10 Panasonic
1V
R82, R83,
R86, R87,
R91, R92,
R95, R96,
R99, R100,
R103, R104,
R107, R108,
R111, R112,
R114
17
10.0
RES, 10.0,
1%, 0.75 W,
AEC-Q200
Grade 0,
1210
1210
CRCW12101
0R0FKEAHP
Vishay-Dale
R88
1
0
RES, 0, 5%,
0.1 W, AECQ200 Grade
0, 0603
0603
CRCW06030
000Z0EA
Vishay-Dale
R119
1
100
RES, 100,
5%, 0.25 W,
AEC-Q200
Grade 0,
0603
0603
ESR03EZPJ1 Rohm
01
R121, R128
2
1.0k
RES, 1.0 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
K00JNEA
Vishay-Dale
RT1, RT2,
RT3, RT4,
RT5, RT6,
RT7, RT8
8
10k
Thermistor
NTC, 10k
ohm, 2%,
0603
0603
ERTJ1VG103GA
Panasonic
S1, S2
2
Switch, SPST 9.65X8X22.4
8Pos, Rocker, mm
TH
76SB08ST
Grayhill
SH1, SH2,
SH3, SH4,
SH5, SH6,
SH7, SH8
8
Shunt,
100mil, Gold
plated, Black
881545-2
TE
Connectivity
TP1, TP2,
TP3, TP4,
TP5, TP6,
TP7, TP8,
TP9, TP10,
TP11, TP12,
TP16, TP17,
TP18, TP19,
TP21, TP22,
TP23, TP24,
TP25, TP26,
TP27, TP28,
TP29, TP30,
TP31, TP32,
TP33, TP34,
TP35, TP36,
TP42, TP43,
TP44
35
Test Point,
White
Multipurpose, Multipurpose
White, TH
Testpoint
5012
Keystone
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Shunt 2 pos.
100 mil
Manufacturer Alternate
PartNumber
Alternate
Manufacturer
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
49
BQ75614EVM Schematic, Assembly, Layout, and BOM
Designator
Quantity
TP13, TP14,
TP15
Description
PackageRefe PartNumber
rence
Manufacturer Alternate
PartNumber
3
Terminal,
Turret, TH,
Triple
Keystone159
8-2
1598-2
Keystone
TP20, TP38,
TP39
3
Test Point,
Black
Multipurpose, Multipurpose
Black, TH
Testpoint
5011
Keystone
TP37, TP40
2
Test Point,
Red
Multipurpose, Multipurpose
Red, TH
Testpoint
5010
Keystone
U1
1
BQ75614-Q1, PAP0064F
PAP0064F
(HTQFP-64)
BQ75614PAP Texas
RQ1
Instruments
Texas
Instruments
U2
1
Automotive,
Low Power,
QuadChannel 2/2
Digital
Isolator,
DW0016B
(SOIC-16)
DW0016B
ISO7342CQD Texas
WRQ1
Instruments
ISO7342CQD Texas
WQ1
Instruments
C13, C14
0
100pF
CAP, CERM,
100 pF, 50
V,+/- 5%,
C0G/NP0,
AEC-Q200
Grade 1,
0603
0603
GCM1885C1
H101JA16J
MuRata
C15, C16,
C17, C18
0
220pF
CAP, CERM,
220 pF, 50
V,+/- 5%,
X7R, 0603
0603
CL10B221JB
8NNNC
Samsung
ElectroMechanics
C19, C20,
C21, C22
0
2200pF
CAP, CERM, 1206
2200 pF, 2000
V,+/- 10%,
X7R, AECQ200 Grade
1, 1206
1206J2K0022 Knowles
2KXR
Capacitors
C61, C62
0
0.01uF
CAP, CERM, 0603
0.01 uF, 50 V,
+/- 10%, X7R,
0603
CL10B103KB Samsung
8NCNC
ElectroMechanics
D2, D5
0
24V
Diode, TVS,
Bi, 24 V, 70
Vc, AECQ101,
SOT-23
PESD1CAN,2 NXP
15
Semiconducto
r
D4
0
75V
Diode, TVS,
SMA
Uni, 75 V, 121
Vc, 400 W,
3.3 A, SMA
J10, J11
0
Header(shrou
ded),
2.54mm, 4x1,
R/A, Gold, TH
Header(shrou 70551-0038
ded),
2.54mm, 4x1,
R/A, TH
Molex
J12, J13
0
Header,
100mil, 2x1,
Tin, TH
Header, 2
PIN, 100mil,
Tin
Sullins
Connector
Solutions
50
Value
www.ti.com
SOT-23
SMAJ75A
PEC02SAAN
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
Alternate
Manufacturer
Littelfuse
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ75614EVM Schematic, Assembly, Layout, and BOM
Designator
Quantity
J19, J20
0
L1, L2
0
Q2
Value
Description
PackageRefe PartNumber
rence
Manufacturer Alternate
PartNumber
Header,
100mil, 3x1,
Tin, TH
Header, 3
PIN, 100mil,
Tin
PEC03SAAN
Sullins
Connector
Solutions
470uH
Coupled
inductor, 470
uH, 0.4 A,
0.35 ohm,
SMD
5x3.3mm
744242471
Wurth
Elektronik
0
80 V
Transistor,
SOT-223
NPN, 80 V, 1
A, AEC-Q101,
SOT-223
BCP56T1G
ON
Semiconducto
r
R10, R13,
R17
0
0
RES, 0, 5%, 1206
0.25 W, AECQ200 Grade
0, 1206
ERJ-8GEY0R Panasonic
00V
R20
0
100k
RES, 100 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
00KJNEA
Vishay-Dale
R21, R22,
R23, R24,
R25, R26,
R27, R28,
R38, R41
0
0
RES, 0, 5%,
0.1 W, AECQ200 Grade
0, 0603
0603
CRCW06030
000Z0EA
Vishay-Dale
R29, R30
0
100
RES, 100,
1%, 1 W,
AEC-Q200
Grade 0,
2512
2512
CRCW25121
00RFKEG
Vishay-Dale
R50, R51,
R52, R53,
R54, R55,
R56, R57,
R68, R69,
R70, R71,
R72, R73,
R74, R75,
R76, R77,
R78, R79
0
0
RES, 0, 5%,
0.333 W,
AEC-Q200
Grade 0,
0805
0805
CRCW08050
000Z0EAHP
Vishay-Dale
R58, R61,
R64, R67
0
0
RES, 0, 5%,
0.1 W, 0603
0603
RC0603JR-07 Yageo
0RL
R59, R60,
R65, R66
0
51
RES, 51, 5%, 0603
0.1 W, AECQ200 Grade
0, 0603
CRCW06035
1R0JNEA
Vishay-Dale
R62, R63
0
1.00k
RES, 1.00 k,
1%, 0.1 W,
0603
0603
ERJ-3EKF10
01V
Panasonic
R115, R116,
R117, R118
0
499
RES, 499,
1%, 0.1 W,
0603
0603
RC0603FR-0
7499RL
Yageo
T1, T2
0
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BMS
SMT_TRANS HMU1228NL
TRANSFORM FORMER_8M
ER
M89_10MM0
9
Alternate
Manufacturer
Pulse
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
51
www.ti.com
BQ79656EVM Schematic, Assembly, Layout, and BOM
9 BQ79656EVM Schematic, Assembly, Layout, and BOM
Provided are the BQ79656EVM schematic, assembly, and BOM in their respective sections.
9.1 Schematic
Cell Simulator
BMS021E3_CellSimulator.SchDoc
Battery Connector
BMS021E3_VC_CB.SchDoc
bq79616
BMS021E3_bq79616.SchDoc
PWR
Daisy Chain Isolation
BMS021E3_Communications.SchDoc
PWR
BBP_CELL
BBN_CELL
BBP_CELL
BBN_CELL
VSTACK
VSTACK
CELL16S
CELL16S
CELL15
CELL15
CELL14
CELL14
CELL13
CELL13
CELL12
CELL12
CELL11
CELL11
CELL10
CELL10
CELL9
CELL9
CELL8
CELL8
CELL7
CELL7
CELL6
CELL6
CELL5
CELL5
CELL4
CELL4
CELL3
CELL3
CELL2
CELL2
CELL1
CELL1
CELL0
CELL0
VC16
CB16
VC15
CB15
VC14
CB14
VC13
CB13
VC12
CB12
VC11
CB11
VC10
CB10
VC9
CB9
VC8
CB8
VC7
CB7
VC6
CB6
VC5
CB5
VC4
CB4
VC3
CB3
VC2
CB2
VC1
CB1
VC0
CB0
VC16
CB16
VC15
CB15
VC14
CB14
VC13
CB13
VC12
CB12
VC11
CB11
VC10
CB10
VC9
CB9
VC8
CB8
VC7
CB7
VC6
CB6
VC5
CB5
VC4
CB4
VC3
CB3
VC2
CB2
VC1
CB1
VC0
CB0
COMHP
COMHN
COMLP
COMLN
COMHP
COMHN
COMLP
COMLN
Hardware
BMS021E3_EVM_Hardware.SchDoc
Figure 9-1. BQ79656EVM Schematic Block Diagram
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
2
52
3
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
4
Orderable: EVM_orderable
TID #:
N/A
Number: BMS021
Rev: E3
SVN Rev: Version control disabled
Drawn By:
Engineer: Taylor Vogt
Designed for: TI Confidential - NDA RestrM
Project Title: bq7961x EVM
Sheet Title:
Assembly Variant: 003
File: BMS021E3_CoverSheet.SchDoc
Contact: http://www.ti.com/support
5
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
1
2
3
4
5
6
BQ79656EVM Schematic, Assembly, Layout, and BOM
www.ti.com
UART Communication
Test Points
U2
0.1uF
NPNB
VCC2
16
INA
OUTA
14
INB
OUTB
13
NPN Power Supply
AVDD
INC
12 TX
NFAULT_C
6
OUTD
IND
11 NF_J
USB2ANY_3.3V
7
EN1
EN2
10
2
8
GND1
GND1
GND2
GND2
9
15
TP8
REFHP
LDOIN
BAT
GND_ISO
BBN
1
2
R3
R4
100
200
J3 Pin Description
0.22µF
5 TX - to microcontroller UART RX
4 RX - to microcontroller UART TX
2 FAULTn - to microcontroller GPIO
1 GND - shared GND with microcontroller
GND
BBP
BBN
J18
GND
NFAULT
GND_ISO
R2
100k
NF_J
NFAULT_C
NFAULT
100
CVDD
C4
0.1uF
GND
J17A
CVDD_CO
J17 Pin Description
8 TX - to microcontroller UART RX
7 RX - to microcontroller UART TX
3 FAULTn - to microcontroller GPIO
5 GND - shared GND with microcontroller
6 USB2ANY 3.3V
GND
6
5
4
3
2
1
DVDD
R119
CVDD
R120
100k
PWR
C1
NFAULT
J21
GND
ISO7342CQDWRQ1
1
BBP
TP43
RX
DVDD
BAT
TP11
TX
RX_C
TX
REFHP
TP10
2,4
AVDD
TP9
RX
NPNB
1
DNP
2
CVDD
J2
Q2
NPNB
1
2
Q1
1
TP42
J1
3
3
RX
OUTC
USB2ANY_RX_3.3
CVDD
NPNB
TP7
0.1uF
USB2ANY_3.3V
NEG5V
TP6
A
C58
1
2
8
LDOIN
TP5
CVDD_CO
RX_CO
10
TSREF
TX
VCC1
4
USB2ANY_RX_3.3 5
GND
TP12
RX
1
3
2
NEG5V
R123 GND_ISO
100k
USB2ANY_TX_3.3
6
LDOIN
C57
4
TSREF
TP4
USB2ANY_TX_3.3
GND
GND
TP3
9
GND
GND
TP2
7
GND
TP1
TP14
3
TP13
1
2
USB2ANY_3.3V
TP15
5
A
J17B
J3
B
B
U1
C59
0.1uF
GND
PWR
PWR
R5
GND
TSREF
44
NEG5V
LDOIN
47
NPNB
48
1
REFHP
C5
10nF
C6
1µF
GND
C7
4.7µF
GND
C8
1µF
R121
1
51
NEG5V
BAT
30.0
GND
1.0k
C9
D1
GND
1µF
2
Green
TSREF
J6
2
1
GND
GND
C
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
GND tied to CELL0
at connector via a
thick trace.
LDOIN
NPNB
BAT
37
REFHP
AVDD
CVDD
DVDD
38
45
49
AVDD
CVDD
DVDD
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
BBP
BBN
64
63
SRP
SRN
RX
TX
52
53
RX
TX
NFAULT
62
FAULT
BBP/BBN Bus Bar
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
61
60
59
58
57
56
55
54
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
COMHP
COMHN
43
42
COMHP
COMHN
COMLP
COMLN
40
41
COMLP
COMLN
PAD
65
REFHM
36
AVSS
CVSS
DVSS
39
46
50
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
GPIOs
J5
2
1
BBP_CELL
R9
TP17
402
C10
R12
BBN_CELL
402
0.47uF
R10
DNP
0
BBP
R13
DNP
0
BBN
Jumpers to connect GPIOs to
resistor divider and thermistor for
temperature measurements.
J4
GPIO1_C
1
2
GPIO2_R
3
4
GPIO3_R
5
6
GPIO4_R
7
8
GPIO5_R
9
10
GPIO6_R
11
12
GPIO7_R
13
14
GPIO8_R
15
16
GPIO8_R
RT1
GPIO7_R
10k
RT2
Low side NTC circuit.
R8
R11
R14
PULLUP
R16
R18
GPIO5_R
10k
RT4
GPIO4_R
10k
RT5
GPIO3_R
10k
RT6
t°
t°
10k
RT7
GPIO2_R
t°
VC15
VC16
VC14
VC13
VC12
CB16
CB15
CB14
CB13
CB12
10k
RT8
GPIO1_R
10.0k
BBN
10k
C12
R21
DNP
0
R22
DNP
0
R23
DNP
0
GND
t°
10.0k
R19
C
t°
10.0k
SRP/SRN
Current Sense
C11
0.47uF
GPIO1_R
D3
24V
10k
RT3
GPIO6_R
10.0k
10.0k
BBP
GPIO1_R
t°
10.0k
10.0k
R17
SRN_S
DNP
0
TP19
1.0k
t°
10.0k
COMLP
COMLN
R15
SRP_S
TP18
TP44
R128
C60
1uF
GND
R7
GND
TP16
BBP_CELL
TSREF
PULLUP
COMHP
COMHN
BQ79656PAPQ1
BBN_CELL
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
Jumpers to connect TSREF to
ratiometric circuit.
2
0.1uF
1
C3
GND
3
C2
1µF
ALL DECOUPLING
CAPS ARE AS
CLOSE TO THE
CHIP AS POSSIBLE
t°
1uF
R20
DNP
100k
R24
DNP
0
D
D
R25
DNP
0
R26
DNP
0
R27
DNP
0
Resistors for Lower Cell Count
Applications (614, 612)
R28
DNP
0
2
Orderable: EVM_orderable
TID #:
N/A
Number: BMS021
Rev: E3
SVN Rev: Version control disabled
Drawn By:
Engineer: Taylor Vogt
Designed for: TI Confidential - NDA Restrictions
Mod. Date: 3/13/2020
Project Title: bq7961x EVM
Sheet Title:
Assembly Variant: 003
Sheet: 2 of 6
File: BMS021E3_bq79616.SchDoc
Size: B
Contact: http://www.ti.com/support
Figure 9-2. BQ79656EVM Schematic Part 1
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
1
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
3
4
5
http://www.ti.com
© Texas Instruments 2019
6
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
53
www.ti.com
BQ79656EVM Schematic, Assembly, Layout, and BOM
2
1
TP28
CELL8
C25
0.47uF
CELL7
CELL7
CB7
CB7
R86
10.0
C29
0.47uF
CELL6
CELL6
C33
0.47uF
CELL5
TP24
CELL4
CB4
C41
0.47uF
CELL3
R101
C45
0.47uF
TP22
CELL2
100
C49
0.47uF
CELL1
CELL1
R109
C53
0.47uF
CELL0S
R114
10.0
VC6
CELL14
CELL14
CELL14
100
VC0
VC14
100
CB14
C34
0.47uF
VC5
CELL13
CELL13
CELL13
R94
VC13
100
R96
10.0
CB13
VC4
CELL12
CELL12
CELL12
R98
VC12
100
R100
10.0
CB12
VC3
CELL11
CELL11
CELL11
R102
VC2
CELL10
C46
0.47uF
CELL10
VC1
CELL9
CELL0
4
CELL0S
5
CELL1
6
CELL2
7
CELL3
8
CELL4
9
CELL5
10
CELL6
11
CELL7
12
CELL8
13
CELL9
14
CELL10
15
CELL11
16
CELL12
17
CELL13
18
CELL14
19
CELL15
20
CELL16S
21
CELL16
22
CELL0
CELL16
DNP
D4
75V
R110
VC9
100
R112
10.0
CELL0
CELL0
VC9
C52
0.47uF
CB9
C54
0.47uF
CELL16
3
VC10
C48
0.47uF
CB10
CELL9
CB9
VC10
100
CELL9
CELL0
VC11
PWR
R106
R108
10.0
C50
0.47uF
VC12
1
2
C44
0.47uF
CB11
CELL10
CB10
VC11
100
R104
10.0
CB11
VC13
C40
0.47uF
CB12
C42
0.47uF
VC14
C36
0.47uF
CB13
C38
0.47uF
VC15
C32
0.47uF
CB14
CB8
R113
R90
R92
10.0
C51
0.47uF
CB1
CELL0S
CB0
VC1
100
TP20
C30
0.47uF
J15
C28
0.47uF
CB15
TP29
R111
10.0
CELL0
CB15
C47
0.47uF
CB2
TP21
CB1
VC2
VC15
100
TP30
R105
R85
R87
10.0
C43
0.47uF
R107
10.0
CB2
VC3
100
CB3
CELL2
2
1
CELL15
TP31
R103
10.0
J16
CELL15
C39
0.47uF
CB4
CELL3
CELL1
CELL15
TP32
VC4
100
TP23
CB3
VC5
R97
R99
10.0
CELL2
VC7
C35
0.47uF
CB5
C37
0.47uF
C26
0.47uF
VC16
C24
0.47uF
CB16
TP33
R93
100
CELL4
CELL3
CB16
C31
0.47uF
R95
10.0
CB5
VC6
VC16
100
R83
10.0
TP34
R89
CB6
CELL5
CELL4
VC7
100
TP25
CELL5
CELL16S
C27
0.47uF
R91
10.0
CB6
R81
CELL16S
0
TP26
CELL6
CELL16S
TP35
R84
100
R88
VC8
C23
0.47uF
CB8
TP27
CELL7
VC8
100
R82
10.0
CB8
TP37
PWR
VSTACK
TP36
R80
CELL8
CELL8
PWR
R122
DNP
0
CELL14
J14
VC8
VC0
C55
0.47uF
CB0
C56
0.47uF
GND
GND
Figure 9-3. BQ79656EVM Schematic Part 2
54
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79656EVM Schematic, Assembly, Layout, and BOM
www.ti.com
TP40
VSTACK
VSTACK
R29
100
R30
100
S1
C16_L 1
C15_L2
C14_L 3
C13_L4
C12_L5
C11_L6
C10_L7
C9_L 8
R31
100
R32
100
16
15
14
13
12
11
10
9
C16_R
C15_R
C14_R
C13_R
C12_R
C11_R
C10_R
C9_R
CELL16S
CELL15
CELL14
CELL13
CELL12
CELL11
CELL10
CELL9
16
15
14
13
12
11
10
9
C8_R
C7_R
C6_R
C5_R
C4_R
C3_R
C2_R
C1_R
CELL8
CELL7
CELL6
CELL5
CELL4
CELL3
CELL2
CELL1
CELL16S
CELL15
CELL14
CELL13
CELL12
CELL11
CELL10
CELL9
R33
100
R34
100
R35
100
R36
100
BBP_CELL
R39
0.1
BBN_CELL
R37
100
R38
DNP
0
R40
0
R41
DNP
0
R42
100
S2
C8_L
C7_L
C6_L
C5_L
C4_L
C3_L
C2_L
C1_L
R43
100
R44
100
1
2
3
4
5
6
7
8
CELL8
CELL7
CELL6
CELL5
CELL4
CELL3
CELL2
CELL1
R45
100
R46
100
R47
100
R48
100
TP39
CELL0
CELL0
CELL0
TP38
R49
CELL0
GND
0
GND
J7
J8
J9
C5_R
C4_R
C3_R
C2_R
C1_R
1
2
3
4
5
6
C11_R
C10_R
C9_R
C8_R
C7_R
C6_R
1
2
3
4
5
6
1
2
3
4
5
6
C16_R
C15_R
C14_R
C13_R
C12_R
GND
1
2
3
4
5
6
Figure 9-4. BQ79656EVM Schematic Part 3
1
5
2
COMML_P_OPT
J19
DNP
R54
0
4
3
HMU1228NL
R55
R58
R59
0
51
COMML_P
COMLP
R115
DNP
499
R62
1.00k
R117
DNP
499
R65
0
51
COMML_N
COMMH_P
COMHP
C61
C62
DNP
DNP
10nF
10nF
GND
COMLN
R60
R61
51
0
R56
COMMH_N
COMHN
R66
R67
51
0
C16
220pF
C17
220pF
COMMH_N_OPT
3
B
GND
COMMH_P_OPT
COMML_P_OPT
3
2
R74
2 ISO_COMML_N
1 ISO_COMML_P
J11
1
2
3
4
TP41
GND
C21
R78
0
J10
J12
L2
0
2200pF
R75
R70
0
0
470uH
ISO_COMML_N
ISO_COMMH_N
0
4
3
2
1
L1
470uH
GND
COMMH_N_OPT R76
GND
ISO_COMMH_P
0
1
2
COMML_N_OPT
0
R71
0
2200pF
J13
ISO_COMMH_N
ISO_COMMH_P
R69
C19
4
4
1
2200pF
R57
D5
24V
C18
220pF
GND
R73
3
HMU1228NL
COMMH_P_OPT
R68
0
4
R118
DNP
499
3
C15
220pF
DNP
R63
1.00k
1
D2
24V
B
0
2
ISO_COMMH_P
0
R116
DNP
499
2
R64
1
COMML_N_OPT
R72
5
0
COMML_P_OPT
ISO_COMML_P
1
C14
100pF
GND
COMMH_N_OPT
0
C20
6 T2
A
GND
1
COMML_N 2
COMML_P 3
COMML_N_OPT
R53
0
J20
C13
100pF
GND
ISO_COMML_N
R52
COMMH_P_OPT
GND
1
COMMH_N2
COMMH_P 3
0
2
R51
6 T1
3
0
1
R50
2
ISO_COMML_P
A
0
C22
R77
R79
2200pF
ISO_COMMH_N
0
0
C
C
Figure 9-5. BQ79656EVM Schematic Part 4
D
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
55
D
Copyright © 2020 Texas Instruments Incorporated
Orderable: EVM_orderable
N/A
Number: BMS021
Rev: E3
Designed for: TI Confidential - NDA Restrictions
Mod. Date: 1/25/2020
Project Title: bq7961x EVM
Sheet Title:
www.ti.com
BQ79656EVM Schematic, Assembly, Layout, and BOM
9.2 Assembly
Components marked 'DNP' should not be populated.
Figure 9-6. BQ79656EVM Assembly Top
56
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ79656EVM Schematic, Assembly, Layout, and BOM
Components marked 'DNP' should not be populated.
Figure 9-7. BQ79656EVM Assembly Bottom
9.3 Layout
See section 7.3 for same drawings as for BQ79616.
9.4 BQ79656EVM Bill of Materials (BOM)
Table 9-1. BQ79656EVM BOM
Quantity
!PCB1
1
Printed Circuit
Board
BMS021
1
Multilayer
Ceramic
Capacitors
MLCC 1206
SMD/SMT
1206 0.22uF
100volts X7R
+/-10%
GCM31MR72
Murata
A224KA37L
C1
Value
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Description
PackageRefe
Alternate
PartNumber Manufacturer
rence
PartNumber
Designator
Alternate
Manufacturer
Any
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
57
BQ79656EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Table 9-1. BQ79656EVM BOM (continued)
Quantity
C2, C6, C8,
C9
4
CAP CER
0603 (1608
0603 1UF
Metric)
10V X7R 10%
C0603C105K
KEMET
8RACAUTO
5
0.1uF
CAP, CERM,
0.1 uF, 10 V,
+/- 10%, X7R,
0402
AEC-Q200
Grade 1,
0402
GCM155R71
A104KA55D
MuRata
GCM188R72
A103KA37J
MuRata
C3, C4, C57,
C58, C59
Description
C5
1
0.01uF
CAP, CERM,
0.01 µF, 100
V,+/- 10%,
X7R, AECQ200 Grade
1, 0603
C7
1
4.7uF
CAP, CERM,
4.7 uF, 10 V,
0805
+/- 20%, X7R,
0805
C2012X7R1A
TDK
475M125AC
0.47uF
CAP, CERM,
0.47 uF, 16 V,
+/- 10%, X7R,
0603
AEC-Q200
Grade 1,
0603
GCM188R71
C474KA55D
MuRata
1uF
CAP, CERM,
1 uF, 16 V, +/10%, X7R,
0603
AEC-Q200
Grade 1,
0603
GCM188R71
C105KA64D
MuRata
100pF
CAP, CERM,
100 pF, 50
V,+/- 5%,
C0G/NP0,
AEC-Q200
Grade 1,
0603
0603
GCM1885C1
H101JA16J
MuRata
220pF
CAP, CERM,
220 pF, 50
V,+/- 5%,
X7R, 0603
0603
CL10B221JB
8NNNC
Samsung
ElectroMechanics
2200pF
CAP, CERM,
2200 pF, 2000
V,+/- 10%,
1206
X7R, AECQ200 Grade
1, 1206
C10, C11,
C23, C24,
C25, C26,
C27, C28,
C29, C30,
C31, C32,
C33, C34,
C35, C36,
C37, C38,
C39, C40,
C41, C42,
C43, C44,
C45, C46,
C47, C48,
C49, C50,
C51, C52,
C53, C54,
C55, C56
C12, C60
C13, C14
C15, C16,
C17, C18
C19, C20,
C21, C22
58
Value
PackageRefe
Alternate
PartNumber Manufacturer
rence
PartNumber
Designator
36
2
2
4
4
0603
Alternate
Manufacturer
1206J2K0022 Knowles
2KXR
Capacitors
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ79656EVM Schematic, Assembly, Layout, and BOM
Table 9-1. BQ79656EVM BOM (continued)
Designator
Quantity
D1
1
D2, D3, D5
3
Value
Description
PackageRefe
Alternate
PartNumber Manufacturer
rence
PartNumber
Green
LED, Green,
SMD
LED_0805
LTSTC170KGKT
24V
Diode, TVS,
Bi, 24 V, 70
Vc, AECQ101,
SOT-23
SOT-23
NXP
PESD1CAN,2
Semiconducto
15
r
Lite-On
6
Fiducial mark.
There is
N/A
nothing to buy
or mount.
N/A
N/A
H1, H2, H3,
H4
4
Machine
Screw,
Round, #4-40
Screw
x 1/4, Nylon,
Philips
panhead
NY PMS 440
0025 PH
B&F Fastener
Supply
H5, H6, H7,
H8
4
Standoff, Hex,
0.5"L #4-40
Standoff
Nylon
1902C
Keystone
H9
1
CONN
HOUSING
22POS .100
W / LATCH
50-57-9422
Molex
H11, H12
2
Rectangular
Housing
Connector, 4
Pos, 2.54mm
50-57-9404
Molex
J1, J2, J5, J6,
J18, J21
6
Header,
Header,
Sullins
2.54mm, 1x2, 2.54mm, 2x1, PEC01DAAN Connector
Tin, Black, TH TH
Solutions
J3
1
Header,
Header,
0.5mm, 6x1, 0.5mm, 6x1,
R/A, Gold, TH R/A, TH
22-12-4062
J4
1
Header, 2.54
Header, 2.54
mm, 8x2, Tin,
mm, 8x2, TH
Vertical, TH
Sullins
PEC08DAAN Connector
Solutions
J7, J8, J9
3
Header,
100mil, 6x1,
Tin, TH
TH, 6-Leads,
Body
608x100mil,
Pitch 100mil
J10, J11
2
Header(shrou
ded),
2.54mm, 4x1,
R/A, Gold, TH
Header(shrou
ded),
70551-0038
2.54mm, 4x1,
R/A, TH
Molex
J12, J13, J14,
J16
4
Header,
100mil, 2x1,
Tin, TH
Header, 2
PIN, 100mil,
Tin
PEC02SAAN
Sullins
Connector
Solutions
1
Connector
Header
Through Hole,
Right Angle
HDR22
22 position
0.100"
(2.54mm)
705550056
Molex
FID1, FID2,
FID3, FID4,
FID5, FID6
J15
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
PEC06SAAN
Alternate
Manufacturer
Molex
Sullins
Connector
Solutions
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
59
BQ79656EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Table 9-1. BQ79656EVM BOM (continued)
Designator
Value
Description
PackageRefe
Alternate
PartNumber Manufacturer
rence
PartNumber
J17
1
CONN
HEADER
10POS .100
DL R/A AU
J19, J20
2
Header,
100mil, 3x1,
Tin, TH
Header, 3
PIN, 100mil,
Tin
PEC03SAAN
Sullins
Connector
Solutions
2
Coupled
inductor, 470
uH, 0.4 A,
0.35 ohm,
SMD
5x3.3mm
744242471
Wurth
Elektronik
L1, L2
LBL1
Q1
R2, R120,
R123
R3
R4
R5
R7, R8, R11,
R14, R15,
R16, R18,
R19
R9, R12
60
Quantity
470uH
HDR10
TSW-105-08Samtec
L-D-RA
1
Thermal
Transfer
Printable
PCB Label
THT-14-423-1
Labels, 0.650" 0.650 x 0.200
Brady
0
W x 0.200" H inch
- 10,000 per
roll
1
150 V
Transistor,
NPN, 150 V, 1
DPAK
A, AEC-Q101,
DPAK
ZXTN4004KT
Diodes Inc.
C
100k
RES, 100 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
00KJNEA
Vishay-Dale
100
RES, 100,
1%, 0.75 W,
AEC-Q200
Grade 0,
2010
2010
CRCW20101
00RFKEF
Vishay-Dale
200
RES, 200,
1%, 0.75 W,
AEC-Q200
Grade 0,
2010
2010
CRCW20102
00RFKEF
Vishay-Dale
30.0
RES, 30.0,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
ERJ-3EKF30
R0V
Panasonic
10.0k
RES, 10.0 k,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06031
0K0FKEA
Vishay-Dale
402
RES, 402,
1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
CRCW06034
02RFKEA
Vishay-Dale
3
1
1
1
8
2
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
Alternate
Manufacturer
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
www.ti.com
BQ79656EVM Schematic, Assembly, Layout, and BOM
Table 9-1. BQ79656EVM BOM (continued)
Designator
Quantity
Value
Description
PackageRefe
Alternate
PartNumber Manufacturer
rence
PartNumber
R29, R30,
R31, R32,
R33, R34,
R35, R36,
R37, R42,
R43, R44,
R45, R46,
R47, R48
16
100
RES, 100,
1%, 1 W,
AEC-Q200
Grade 0,
2512
R39
1
0.1
RES, 0.1, 5%,
0603
0.1 W, 0603
CRL0603-JWBourns
R100ELF
R40, R49
2
0
RES, 0, 5%,
0.25 W, AEC1206
Q200 Grade
0, 1206
ERJ-8GEY0R
Panasonic
00V
0805
CRCW08050
000Z0EAHP
0603
RC0603JR-07
Yageo
0RL
2512
CRCW25121
00RFKEG
Vishay-Dale
R50, R51,
R52, R53,
R54, R55,
R56, R57,
R68, R69,
R70, R71,
R72, R73,
R74, R75,
R76, R77,
R78, R79
20
0
RES, 0, 5%,
0.333 W,
AEC-Q200
Grade 0,
0805
R58, R61,
R64, R67
4
0
RES, 0, 5%,
0.1 W, 0603
CRCW06035
1R0JNEA
Vishay-Dale
Panasonic
Vishay-Dale
R59, R60,
R65, R66
4
51
RES, 51, 5%,
0.1 W, AEC0603
Q200 Grade
0, 0603
R62, R63
2
1.00k
RES, 1.00 k,
1%, 0.1 W,
0603
0603
ERJ-3EKF10
01V
100
RES, 100,
0.1%, 0.1 W,
AEC-Q200
Grade 0,
0603
0603
ERA-3AEB10
Panasonic
1V
1210
CRCW12101
0R0FKEAHP
Vishay-Dale
0603
CRCW06030
000Z0EA
Vishay-Dale
R80, R81,
R84, R85,
R89, R90,
R93, R94,
R97, R98,
R101, R102,
R105, R106,
R109, R110,
R113
17
R82, R83,
R86, R87,
R91, R92,
R95, R96,
R99, R100,
R103, R104,
R107, R108,
R111, R112,
R114
17
10.0
RES, 10.0,
1%, 0.75 W,
AEC-Q200
Grade 0,
1210
R88
1
0
RES, 0, 5%,
0.1 W, AECQ200 Grade
0, 0603
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
Alternate
Manufacturer
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
61
BQ79656EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Table 9-1. BQ79656EVM BOM (continued)
Designator
R119
62
Quantity
1
Value
Description
PackageRefe
Alternate
PartNumber Manufacturer
rence
PartNumber
100
RES, 100,
5%, 0.25 W,
AEC-Q200
Grade 0,
0603
0603
ESR03EZPJ1
Rohm
01
0603
CRCW06031
K00JNEA
Vishay-Dale
0603
ERTJ1VG103GA
Panasonic
R121, R128
2
1.0k
RES, 1.0 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
RT1, RT2,
RT3, RT4,
RT5, RT6,
RT7, RT8
8
10k
Thermistor
NTC, 10k
ohm, 2%,
0603
S1, S2
2
Switch, SPST
9.65X8X22.4
8Pos, Rocker,
mm
TH
76SB08ST
Grayhill
SH1, SH2,
SH3, SH4,
SH5, SH6,
SH7, SH8
8
Shunt,
100mil, Gold
plated, Black
881545-2
TE
Connectivity
TP1, TP2,
TP3, TP4,
TP5, TP6,
TP7, TP8,
TP9, TP10,
TP11, TP12,
TP16, TP17,
TP18, TP19,
TP21, TP22,
TP23, TP24,
TP25, TP26,
TP27, TP28,
TP29, TP30,
TP31, TP32,
TP33, TP34,
TP35, TP36,
TP42, TP43,
TP44
35
Test Point,
White
Multipurpose, Multipurpose
White, TH
Testpoint
5012
Keystone
TP13, TP14,
TP15
3
Terminal,
Turret, TH,
Triple
1598-2
Keystone
TP20, TP38,
TP39
3
Test Point,
Black
Multipurpose, Multipurpose
Black, TH
Testpoint
5011
Keystone
TP37, TP40
2
Test Point,
Red
Multipurpose, Multipurpose
Red, TH
Testpoint
5010
Keystone
Shunt 2 pos.
100 mil
Keystone159
8-2
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
Alternate
Manufacturer
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79656EVM Schematic, Assembly, Layout, and BOM
www.ti.com
Table 9-1. BQ79656EVM BOM (continued)
Designator
Quantity
Value
Description
PackageRefe
Alternate
PartNumber Manufacturer
rence
PartNumber
1
14S or 16S
Standalone
Precision
Automotive
Battery
Monitor,
Balancer and
Integrated
HTQPF64
Current
Sense with up
to
SafeTITM-26
262 ASIL-D
ASIL-D
Compliance
BQ79656PAP Texas
Q1
Instruments
U2
1
Automotive,
Low-power,
QuadChannel 2/2
Digital
Isolator,
DW0016B
(SOIC-16)
ISO7342CQD Texas
WRQ1
Instruments
C61, C62
0
0.01uF
CAP, CERM,
0.01 uF, 50 V,
0603
+/- 10%, X7R,
0603
Samsung
CL10B103KB
Electro8NCNC
Mechanics
D4
0
75V
Diode, TVS,
Uni, 75 V, 121
SMA
Vc, 400 W,
3.3 A, SMA
SMAJ75A
Littelfuse
80 V
Transistor,
NPN, 80 V, 1
SOT-223
A, AEC-Q101,
SOT-223
BCP56T1G
ON
Semiconducto
r
0
RES, 0, 5%,
0.25 W, AEC1206
Q200 Grade
0, 1206
ERJ-8GEY0R
Panasonic
00V
0603
CRCW06031
00KJNEA
Vishay-Dale
U1
Q2
R10, R13,
R17, R122
0
0
DW0016B
R20
0
100k
RES, 100 k,
5%, 0.1 W,
AEC-Q200
Grade 0,
0603
R21, R22,
R23, R24,
R25, R26,
R27, R28,
R38, R41
0
0
RES, 0, 5%,
0.1 W, AECQ200 Grade
0, 0603
0603
CRCW06030
000Z0EA
Vishay-Dale
R115, R116,
R117, R118
0
499
RES, 499,
1%, 0.1 W,
0603
0603
RC0603FR-0
7499RL
Yageo
T1, T2
0
SMT_TRANS
BMS
FORMER_8M
TRANSFORM
HMU1228NL
M89_10MM0
ER
9
Alternate
Manufacturer
ISO7342CQD Texas
WQ1
Instruments
Pulse
1. Unless otherwise noted in the Alternate PartNumber and/or Alternate Manufacturer columns, all parts may be
substituted with equivalents.
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
63
Revision History
www.ti.com
10 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2019) to Revision B (October 2020)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................3
• Added BQ79656EVM Schematic, Assembly, Layout, and BOM...................................................................... 57
Changes from Revision * (July 2019) to Revision A (October 2019)
Page
• Changed instances of BQ79606/BQ79606-Q1 to BQ79606A/BQ79606A-Q1................................................... 3
• Corrected EVM device typographical errors in the General Description and Host Interface sections................6
• Added Section 3 ................................................................................................................................................ 9
• Changed contents of the Name column in the Pin Description table................................................................11
• Added Section 8 .............................................................................................................................................. 40
64
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1 Evaluation Modules
Copyright © 2020 Texas Instruments Incorporated
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
Submit Document Feedback
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
www.ti.com
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
2
www.ti.com
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
3
www.ti.com
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
4
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
5
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
