CC2590RGVTG4

CC2590 www.ti.com ........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power FEATURES APPLICATIONS • • • • • • • 1 • • • • • • • • • • Seamless Interface to 2.4-GHz Low Power RF Devices from Texas Instruments Up to +14-dBm (25mW) Output Power 6-dB Typical Improved Sensitivity on CC24xx and CC2500, CC2510, and CC2511 Few External Components – Integrated Switches – Integrated Matching Network – Integrated Balun – Integrated Inductors – Integrated PA – Integrated LNA Digital Control of LNA Gain by HGM Pin 100-nA in Power Down (EN = PAEN = 0) Low Transmit Current Consumption – 22-mA at 3-V for +12-dBm, PAE = 23% Low Receive Current Consumption – 3.4-mA for High Gain Mode – 1.8-mA for Low Gain Mode 4.6-dB LNA Noise Figure, including T/R Switch and external antenna match RoHS Compliant 4×4-mm QFN-16 Package 2.0-V to 3.6-V Operation All 2.4-GHz ISM Band Systems Wireless Sensor Networks Wireless Industrial Systems IEEE 802.15.4 and ZigBee Systems Wireless Consumer Systems Wireless Audio Systems DESCRIPTION CC2590 is a cost-effective and high performance RF Front End for low-power and low-voltage 2.4-GHz wireless applications. CC2590 is a range extender for all existing and future 2.4-GHz low-power RF transceivers, transmitters and System-on-Chip products from Texas Instruments. CC2590 increases the link budget by providing a power amplifier for increased output power, and an LNA with low noise figure for improved receiver sensitivity. CC2590 provides a small size, high output power RF design with its 4x4-mm QFN-16 package. CC2590 contains PA, LNA, switches, RF-matching, and balun for simple design of high performance wireless applications. CC2590 BLOCK DIAGRAM PA BALUN 4 RF_P 3 RXTX 2 RF_N 5 PAEN 6 EN 11 ANT LNA Logic Bias 15 7 BIAS HGM 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated CC2590 SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. PARAMETER Supply voltage All supply pins must have the same voltage Voltage on any digital pin –0.3 to 3.6 V V +10 dBm Storage temperature range ESD UNIT –0.3 to VDD + 0.3, max 3.6 Input RF level Reflow soldering temperature VALUE –50 to 150 °C According to IPC/JEDEC J-STD-020 260 °C Human Body Model, all pins except pin 10 2000 V Human Body Model, pin 10 1900 V Charged Device Model 1000 V RECOMMENDED OPERATING CONDITIONS The operating conditions for CC2590 are listed below. MIN MAX Ambient temperature range PARAMETER –40 85 °C Operating supply voltage 2.0 3.6 V 2400 2483.5 Operating frequency range UNIT MHz ELECTRICAL CHARACTERISTICS TC = 25°C, VDD = 3.0V , fRF= 2440MHz (unless otherwise noted). Measured on CC2590EM reference design including external matching components. PARAMETER TEST CONDITIONS Receive current, High Gain Mode HGM = 1 Receive current, Low Gain Mode HGM = 0 Transmit current MIN TYP MAX UNIT 3.4 4.0 mA 1.8 2.0 mA PIN = 0.5 dBm, POUT = 12.2 dBm 22.1 mA PIN = –3.5 dBm, POUT = 10.0 dBm 16.8 mA Transmit current No input signal 8.0 10.0 mA Power down current EN = PAEN = 0 0.1 0.3 µA High input level (control pins) EN, PAEN, HGM, RXTX VDD V Low input level (control pins) EN, PAEN, HGM, RXTX 0.3 V 1.3 Power down - Receive mode switching time 1.4 µs Power down - Transmit mode switching time 0.8 µs RF Receive Gain, High Gain Mode HGM = 1 11.4 dB Gain, Low Gain Mode HGM = 0 0 dB Gain variation, 2400 – 2483.5 MHz, High Gain Mode HGM = 1 1.2 dB Gain variation, 2.0V – 3.6V, High Gain Mode HGM = 1 1.7 dB Noise figure, High Gain Mode HGM = 1, including internal T/R switch and external antenna match 4.6 dB Input 1 dB compression, High Gain Mode HGM = 1 –21 dBm 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 CC2590 www.ti.com ........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008 ELECTRICAL CHARACTERISTICS (continued) TC = 25°C, VDD = 3.0V , fRF= 2440MHz (unless otherwise noted). Measured on CC2590EM reference design including external matching components. PARAMETER TEST CONDITIONS Input IP3, High Gain Mode HGM = 1 Input reflection coefficient, S11 HGM = 1, measured at antenna port MIN TYP MAX UNIT –9 dBm –19 dB RF Transmit Gain Output power, POUT Power Added Efficiency, PAE 14.1 dB PIN = 4.5 dBm 13.8 dBm PIN = 0.5 dBm 12.2 dBm PIN = -3.5 dBm 10.0 dBm PIN = 0.5 dBm 23.5 % 10.4 dBm Output 1 dB compression Output IP3 23 dBm Output power variation over frequency 2400 – 2483.5 MHz, PIN = 0.5 dBm 0.3 dB Output power variation over power supply 2.0V – 3.6V , PIN = 0.5 dBm 3.2 dB Output power variation over temperature -40°C – 85°C, PIN = 0.5 dBm 1.1 dB 2nd harmonic power The 2nd harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. See application note AN032 for regulatory requirements. –14 dBm 3rd harmonic power The 3rd harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. See application note AN032 for regulatory requirements. –28 dBm Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 3 CC2590 SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................ www.ti.com DEVICE INFORMATION The CC2590 pinout and description are shown in Figure 1 and Table 1, respectively. PABIAS GND 16 15 14 AVDD_LNA AVDD_BIAS PIN AND I/O CONFIGURATION (TOP VIEW) NC 1 13 12 RF_N 2 11 ANT AVDD_PA2 GND QFN-16 4x4mm 4 9 5 6 7 8 GND RF_P HGM 10 EN 3 PAEN RXTX GND Figure 1. NOTE: The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference layout. Changes will alter the performance. Also see the PCB landpattern information in this data sheet. For best performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when CC2590 is mounted onto layer 1. 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 CC2590 www.ti.com ........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008 Table 1. PIN FUNCTIONS PIN TYPE NO. NAME — GND 1 NC 2 RF_N RF 3 RXTX Analog/Control Ground DESCRIPTION The exposed die attach pad must be connected to a solid ground plane. See CC2590EM reference design for recommended layout. Not Connected RF interface towards CC24xx or CC25xx device. RXTX switching voltage when connected to CC24xx devices. See Table 3, Table 4, and Table 5 for details. 4 RF_P RF 5 PAEN Digital Input RF interface towards CC24xx or CC25xx device Digital control pin. See Table 3, Table 4, and Table 5 for details. 6 EN Digital Input Digital control pin. See Table 3, Table 4, and Table 5 for details. 7 HGM Digital Input Digital control pin. HGM=1 → Device in High Gain Mode HGM=0 → Device in Low Gain Mode (RX only) 8, 9, 12, 14 GND Ground Secondary ground connections. Should be shorted to the die attach pad on the top PCB layer. 10 AVDD_PA2 Power 2.0-V – 3.6-V Power. PCB trace to this pin serves as inductive load to PA. See CC2590EM reference design for recommended layout. 11 ANT RF 13 AVDD_LNA Power 2.0-V – 3.6-V Power. PCB trace to this pin serves as inductive load to LNA. See CC2590EM reference design for recommended layout. 15 BIAS Analog Biasing input. Resistor between this node and ground sets bias current to PAs. 16 AVDD_BIAS Power 2.0-V – 3.6-V Power. Antenna interface. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 5 CC2590 SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................ www.ti.com CC2590EM Evaluation Module VDD C101/C102 = PCB trace inductor VDD VDD C131/C132 AVDD_LNA AVDD_BIAS AVDD_PA2 TL131 TL101 C161 LDB182G4520C-110 RF_P RXTX RXTX SMA RXTX C112 L111 CC2590 ANT C111 SMA c RF_P Balun C2 RF_N RF_N RF_N PAEN PAEN EN EN HGM BIAS HGM RXTX R151 Figure 2. CC2590EM Evaluation Module Table 2. List of Materials (See CC2590EM Reference Design) DEVICE FUNCTION VALUE L112 Part of antenna match. 1.5 nH: LQW15AN1N5B00 from Murata C111 Part of antenna match. 0.5 pF, GRM1555C1HR50BZ01 from Murata C112 DC block. 47 pF, GRM1555C1H470JZ01 from Murata C161 Decoupling capacitor. 1 nF: GRM1555C1H102JA01 from Murata C101/C102 Decoupling. Will affect PA resonance. See CC2590EM reference design for placement. 27 pF || 1 nF. The smallest cap closest to CC2590. 27 pF: GRM1555C1H270JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C131/C132 Decoupling. Will affect LNA resonance. See CC2590EM reference design for placement. 18 pF || 1 nF. The smallest cap closest to CC2590. 18 pF: GRM1555C1H180JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C2 Decoupling of external balun 1 nF: LWQ15AN1N5B00 from Murata TL101 (1) Transmission line. Will affect PA resonance. (simulated inductance: 0.87nH) See CC2590EM reference design. Transmission line: Length ≈ 40 mil, Width = 8 mil TL131 Transmission line. Will affect LNA resonance. (simulated inductance: See CC2590EM reference design. 1.64nH) Transmission line: Length ≈ 100 mil, Width = 8 mil R151 Bias resistor (1) 4.3 kΩ: RK73H1ETTP4301F from Koa Transmission lines are measured from edge of pad of the CC2590 footprint to edge of pad of DC coupling capacitor. The length of the transmission lines depend on the distance to the ground plane. If another PCB stack up is chosen the length of the transmission lines needs to be adjusted. PCB description: 4 layer PCB 1.6mm Copper 1: 35 µm Dielectric 1-2: 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin) Copper 2: 18 µm Dielectric 2-3: 0.76 mm (4 x 7628M 43% Resin) Copper 3: 18 µm Dielectric 3-4: 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin) Copper 4: 35 µm DE104iML or equivalent substrate (Resin contents around 45%, which gives Er=4.42 at 2.4GHz, TanD=0.016) 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 CC2590 www.ti.com ........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008 TYPICAL CHARACTERISTICS LNA GAIN AND NOISE FIGURE vs FREQUENCY LNA GAIN vs TEMPERATURE 13 5.4 5.3 11 5.2 10 5.1 9 5 8 4.9 7 4.8 6 4.7 Noise Figure HGM 5 4.6 4 4.5 3 4.4 2 4.3 1 4.2 Gain LGM 0 Gain − dB Gain HGM Noise Figure − dB Gain − dB 12 4.1 -1 4 -2 2400 2410 3.9 2420 2430 2440 2450 2460 2470 2480 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 -1 -2 -3 -40 f − Frequency − MHz HGM LGM -20 0 20 40 60 80 T − Temperature − oC Figure 3. Figure 4. LNA GAIN vs POWER SUPPLY 13 12 m1 freq=2.440GHz S(1,1)=0.129 / -31.279 impedance = 61.723 - j8.383 HGM 8 7 6 5 4 3 2 S(1,1) Gain − dB 11 10 9 1 0 -1 -2 -3 m1 LGM 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Power Supply − V freq (2.400GHz to 2.485GHz) Figure 5. Figure 6. Input Impedance of LNA Measured from Antenna Port on CC2590EM Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 7 CC2590 SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) PAE Pout I_VDD 0 2 4 25 24.5 23 24 PAE 22 21 23 20 22.5 19 22 18 21 16 20.5 15 20 19.5 14 13 18.5 12 11 2400 2410 6 18 2420 2430 2440 2450 2460 2470 2480 f − Frequency − MHz Figure 8. OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs TEMPERATURE OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs POWER SUPPLY 23 26 26 22.8 24 PAE 22.6 22 22.4 20 22.2 I_VDD 18 22 16 21.8 14 21.6 Pout 12 21.4 10 21.2 8 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 21 Output Power (dBm) and PAE − % 28 Current Consumption − mA Output Power (dBm) and PAE − % 19 Pout Figure 7. 24 21.5 I_VDD 17 Input Power − dBm 26 PAE 25 22 24 20 23 I_VDD 18 22 21 16 14 20 POUT 12 19 10 18 8 2 2.2 o T − Temperature − C Figure 9. 8 23.5 2.4 2.8 2.6 3 Power Supply − V 3.2 3.4 Current Consumption − mA -6 -4 -2 25 24 Current Consumption − mA 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 Output Power (dBm) and PAE − % 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -20 -18 -16 -14 -12 -10 -8 OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs FREQUENCY Current Consumption − mA Output Power (dBm) and PAE − % OUTPUT POWER, PAE AND CURRENT CONSUMPTION vs INPUT POWER 17 3.6 Figure 10. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 CC2590 www.ti.com ........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008 Controlling the Output Power from CC2590 The output power of CC2590 is controlled by controlling the input power. The CC2590 PA is designed to work in compression (class AB), and the best efficiency is reached when a strong input signal is applied. Input Levels on Control Pins The four digital control pins (PAEN, EN, HGM, RXTX) have built-in level-shifting functionality, meaning that if the CC2590 is operating from a 3.6-V supply voltage, the control pins will still sense 1.6-V - 1.8-V signals as logical ‘1’. An example of the above would be that RXTX is connected directly to the RXTX pin on CC24xx, but the global supply voltage is 3.6-V. The RXTX pin on CC24xx will switch between 0-V (RX) and 1.8-V(TX), which is still a high enough voltage to control the mode of CC2590. The input voltages should however not have logical ‘1’ level that is higher than the supply. Connecting CC2590 to a CC24xx Device Table 3. Control Logic for Connecting CC2590 to a CC24xx Device PAEN = EN RXTX HGM MODE OF OPERATION 0 X X Power Down 1 0 0 RX Low Gain Mode 1 0 1 RX High Gain Mode 1 1 X TX VDD VDD VDD = PCB trace inductor C131/C132 TL131 TL101 C161 C101/C102 AVDD_LNA AVDD_BIAS AVDD_PA2 CC24xx RF_P RF_P RF_P RF_P L21 RXTX RXTX L111 RXTX C112 CC2590 ANT L112 C113 TXRX_SWITCH RF_N RF_N RF_N RF_N PAEN C111 RREG_OUT (CC243x, CC2480), VREGOUT (CC2420), GIO1 (CC2400) BIAS EN P1_1 (CC243x), GPIO1 (CC2480), GIO6 (CC2400) HGM R151 Alternatively to VDD/GND/MCU (CC2420) Alternatively from MCU Figure 11. CC2590 + CC24xx Application Circuit Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 9 CC2590 SWRS080 – SEPTEMBER 2008 ........................................................................................................................................................................................ www.ti.com Connecting CC2590 to the CC2500, CC2510, or CC2511 Device Table 4. Control Logic for Connecting CC2590 to a CC2500/10/11 Devices PAEN EN RXTX HGM 0 0 NC X MODE OF OPERATION Power Down 0 1 NC 0 RX Low Gain Mode 0 1 NC 1 RX High Gain Mode 1 0 NC X TX 1 1 NC X Not allowed VDD C101/C102 = PCB trace inductor VDD VDD C131/C132 AVDD_LNA AVDD_BIAS AVDD_PA2 TL131 TL101 C161 CC2500 CC2510 CC2511 RF_P RF_P RF_P RXTX RXTX L111 RXTX C112 CC2590 ANT C113 C111 BIAS L112 RF_P NC RF_N RF_N RF_N RF_N PAEN GDO0 EN GDO2 HGM R151 Connected to VDD/GND/MCU Alternatively from MCU Figure 12. CC2590 + CC2500/10/11 Device Application Circuit 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 CC2590 www.ti.com ........................................................................................................................................................................................ SWRS080 – SEPTEMBER 2008 Connecting CC2590 to a CC2520 Device Table 5. Control Logic for Connecting CC2590 to a CC2520 Device PAEN EN RXTX HGM 0 0 NC X Power Down 0 1 NC 0 RX Low Gain Mode 0 1 NC 1 RX High Gain Mode 1 0 NC X TX 1 1 NC X Not allowed VDD C101/C102 VDD VDD AVDD_LNA AVDD_PA2 AVDD_BIAS = PCB trace inductor C131/C132 TL131 TL101 C161 CC2520 RF_P RF_P RF_P RXTX RXTX L111 RXTX C112 CC2590 ANT C113 C111 BIAS L112 MODE OF OPERATION RF_P NC C1 RF_N RF_N RF_N RF_N PAEN GPIO5 EN GPIO4 HGM GPIO3 R151 Alternatively to VDD/GND/MCU Alternatively from MCU Figure 13. CC2590 + CC2520 Application Circuit PCB Layout Guidelines The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference layout. Changes will alter the performance. Also see the PCB landpattern information in this data sheet. For best performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when CC2590 is mounted onto layer 1. PCB trace inductors are used to be able to optimize the inductance value, and they are too small to be replaced by discrete inductors. The placement of the power supply decoupling capacitors C101/C102 and C131/C132 are important to set the PCB trace inductance values accurately. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): CC2590 11 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) CC2590RGVR ACTIVE VQFN RGV 16 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2590 Samples CC2590RGVT ACTIVE VQFN RGV 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2590 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of