CDC339DBG4

CDC339 SCAS331A – MARCH 1994 – REVISEDCDC339 MAY 2020 SCAS331A – MARCH 1994 – REVISED MAY 2020 www.ti.com CDC339 Clock Driver with 3-State Outputs 1 Features 3 Description • The CDC339 is a high-performance, low-skew clock driver. It is specifically designed for applications requiring synchronized output signals at both the primary clock frequency and one-half the primary clock frequency. The four Y outputs switch in phase and at the same frequency as the clock (CLK) input. The four Q outputs switch at one-half the frequency of CLK. • • • • • • Low Output Skew, Low Pulse Skew for ClockDistribution and Clock-Generation Applications TTL-Compatible Inputs and Outputs Distributes One Clock Input to Eight Outputs – Four Same-Frequency Outputs – Four Half-Frequency Outputs Distributed VCC and Ground Pins Reduce Switching Noise High-Drive Outputs (−48-mA IOH, 48-mA IOL) State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages 2 Applications • Data center switch and server motherboard When the output-enable (OE) input is low and the clear (CLR) input is high, the Y outputs follow CLK and the Q outputs toggle on low-to-high transitions of CLK. Taking CLR low asynchronously resets the Q outputs to the low level. When OE is high, the outputs are in the high-impedance state. The CDC339 is characterized for operation from −40°C to 85°C. Device Information (1) PART NUMBER PACKAGE(1) BODY SIZE (NOM) CDC339DW SOIC (20) 132 mm² 12.8 x 10.3 CDC339DB SSOP (20) 38 mm² 5.3 x 7.2 For all available packages, see the orderable addendum at the end of the data sheet. Logic Symbol Logic Diagram (Positive Logic) An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated intellectual property matters and other important disclaimers. PRODUCTION DATA. Product Folder Links: CDC339 1 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 Recommended Operating Conditions.........................4 6.3 Electrical Characteristics.............................................5 6.4 Timing Requirements ................................................. 5 6.5 Switching Characteristics ...........................................5 7 Parameter Measurement Information............................ 6 8 Device and Documentation Support..............................8 8.1 Receiving Notification of Documentation Updates......8 8.2 Support Resources..................................................... 8 8.3 Trademarks................................................................. 8 8.4 Electrostatic Discharge Caution..................................8 8.5 Glossary......................................................................8 9 Mechanical, Packaging, and Orderable Information.... 9 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (March 1994) to Revision A (May 2020) Page • Updated to new TI standard............................................................................................................................... 1 • Added Application bullet..................................................................................................................................... 1 2 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 5 Pin Configuration and Functions Figure 5-1. DB OR DW PACKAGE (TOP VIEW) Function Table INPUTS (1) OUTPUTS OE CLR CLK Y1−Y4 Q1−Q4 H X X Z Z L L L L L L L H H L L H L L Q0 (1) L H ↑ H Q 0 (1) The level of the Q outputs before the indicated steady-state input conditions were established. Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 3 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage range –0.5 7 V VI Input voltage range(2) –0.5 7 V VO Voltage range applied to any output in the disabled or power-off state –0.5 5.5 V IO Current into any output in the low state 96 mA IIK (VI < 0) Input clamp current –18 mA IOK (VO < 0) Output clamp current –50 mA 0.6 W Maximum power dissipation at TA = 55°C (in still air)(3) Tstg (1) (2) (3) DB Package DW Package Storage temperature –65 1.6 W 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B. 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage VI Input voltage MAX UNIT 4.75 5.25 V 2 0 V 0.8 V VCC V IOH High-level output current –48 mA IOL Low-level output current 48 mA fclock Input clock frequency 80 MHz TA Operating free-air temperature 85 °C (1) 4 MIN –40 Unused pins (input or I/O) must be held high or low. Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 6.3 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER VIK TEST CONDITIONS VCC = 4.75 V MIN TYP(1) II = –18 mA MAX UNIT −1.2 V 0.5 V VOH VCC = 4.75 V IOH = − 48 mA VOL VCC = 4.75 V IOL = 48 mA IIH VCC = 5.25 V VI = 2.7 V 50 µA IIL VCC = 5.25 V VI = 0.5 V −50 µA IOZ VCC = 5.25 V VO = 2.7 V or 0.5 V IO (2) VCC = 5.25 V VO = 2.5 V VCC = 5.25 V ICC IO = 0 VI = VCC or GND 2 V −50 ±50 µA −180 mA Outputs high 70 Outputs low 85 Outputs disabled 70 mA Ci VI = 2.5 V or 0.5 V 3 pF Co VO = 2.5 V or 0.5 V 8 pF (1) (2) All typical values are at VCC = 5 V, TA = 25°C. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 6.4 Timing Requirements over recommended ranges of supply voltage and operating free-air temperature MIN fclock Clock frequency tw Pulse duration tsu Setup time CLR low 4 CLK low 4 CLK high 4 CLR inactive before CLK↑ 2 Clock duty cycle MAX UNIT 80 MHz ns ns 40% 60% 6.5 Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature (see Figure 6-1 and Figure 6-2) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tPLH tPHL tPHL tPZH tPZL tPHZ tPLZ tsk(o) (1) MIN TYP(1) MAX UNIT 80 CLK Any Y or Q CLR Any Q OE Any Y or Q OE Any Y or Q CLK↑ MHz 3 9 3 9 4 9 2 7 3 7 2 7 2 7 Y↑ 0.75 Q↑ 0.9 Y↑ and Q↑ 0.9 ns ns ns ns ns tr 0.9 ns tf 0.7 ns All typical values are at VCC = 5 V, TA = 25°C. Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 5 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 7 Parameter Measurement Information Figure 7-1. Load Circuit and Voltage Waveforms 6 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 Figure 7-2. Skew Waveforms and Calculations Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 7 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 8 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 8.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 8.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 8.3 Trademarks EPIC-ΙΙB™ is a trademark of Texas Instruments Incorporated. TI E2E™ is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners. 8.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.5 Glossary TI Glossary 8 This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 CDC339 www.ti.com SCAS331A – MARCH 1994 – REVISED MAY 2020 9 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: CDC339 9 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) CDC339DB ACTIVE SSOP DB 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CK339 Samples CDC339DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDC339 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of