User's Guide
SLPU005 – June 2017
CSD87355Q5DEVM-820
The CSD87355Q5DEVM-820 evaluation module (EVM) is a synchronous buck converter featuring TI's
NexFET™ Power Block technology to provide a high-current, ultra-high density power supply solution. The
EVM provides a 1.2-V output at 25 A from a 12-V nominal input bus at over 92% efficiency. The EVM is
designed to operate from a single supply, so no additional bias voltage is required. The EVM uses the
TPS51218 high-performance, mid-input voltage, synchronous buck controller and TI’s NexFET Power
Block to optimize the efficiency and power density of the total solution.
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3
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7
8
9
10
Contents
Description .................................................................................................................... 3
Applications ................................................................................................................... 3
2.1
Features .............................................................................................................. 3
CSD87355Q5DEVM-820 Electrical Performance Specifications ...................................................... 3
CSD87355Q5DEVM-820 Schematic ...................................................................................... 4
Connector, Jumper, and Test Point Descriptions........................................................................ 5
5.1
Input Power (J1) .................................................................................................... 5
5.2
Output Power (J2) .................................................................................................. 5
5.3
5-V Bias Jumper (JP1) ............................................................................................. 5
5.4
Disable Jumper (JP2) .............................................................................................. 5
5.5
MODE Jumper (JP3) ............................................................................................... 5
5.6
Test Point Descriptions ............................................................................................ 5
Test Set Up ................................................................................................................... 6
6.1
Equipment ........................................................................................................... 6
6.2
Equipment Setup.................................................................................................... 7
6.3
Start-Up and Shutdown Procedure ............................................................................... 8
6.4
Output Ripple Voltage Measurement Procedure ............................................................... 9
6.5
Equipment Shutdown............................................................................................... 9
CSD87355Q5DEVM-820 Test Data ....................................................................................... 9
7.1
Efficiency (Full Load) ............................................................................................... 9
7.2
Efficiency (Light Load) ............................................................................................ 10
7.3
Output Voltage Ripple ............................................................................................ 10
7.4
Output Voltage Ripple ............................................................................................ 11
7.5
Input Voltage Ripple .............................................................................................. 11
7.6
Load Transient Response ........................................................................................ 12
7.7
Start-Up on VIN ..................................................................................................... 12
7.8
Start-Up on EN .................................................................................................... 13
7.9
Thermal Image..................................................................................................... 13
CSD87355Q5DEVM-820 Modifications ................................................................................. 14
8.1
Switching Frequency .............................................................................................. 14
8.2
Output Voltage ..................................................................................................... 14
8.3
Gate Drive Resistors .............................................................................................. 14
CSD87355Q5DEVM-820 Assembly Drawings and Layout ........................................................... 14
CSD87355Q5DEVM-820 Bill of Materials............................................................................... 17
List of Figures
1
CSD87355Q5DEVM-820 Schematic ...................................................................................... 4
2
CSD87355Q5DEVM-820 Recommended Test Set-Up ................................................................. 8
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1
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3
Tip and Barrel Technique ................................................................................................... 8
4
CSD87355Q5DEVM-820 Efficiency vs Load Current ................................................................... 9
5
CSD87355Q5DEVM-820 Low Load Efficiency vs Load Current ..................................................... 10
6
CSD87355Q5DEVM-820 Output Voltage Ripple
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17
......................................................................
CSD87355Q5DEVM-820 Output Voltage Ripple ......................................................................
CSD87355Q5DEVM-820 Input Voltage Ripple ........................................................................
CSD87355Q5DEVM-820 Step Response ..............................................................................
CSD87355Q5DEVM-820 Start-Up on VIN ...............................................................................
CSD87355Q5DEVM-820 Start-Up on EN ..............................................................................
CSD87355Q5DEVM-820 Thermal Image ...............................................................................
CSD87355Q5DEVM-820 Top Component Placement (Top View) ..................................................
CSD87355Q5DEVM-820 Top Copper (Top View) .....................................................................
CSD87355Q5DEVM-820 Internal Copper Layer 1 (X-Ray Top View) ..............................................
CSD87355Q5DEVM-820 Internal Copper Layer 2 (X-Ray Top View) ..............................................
CSD87355Q5DEVM-820 Bottom Copper (Bottom View) .............................................................
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List of Tables
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2
3
4
................................................ 3
Test Point Description ....................................................................................................... 5
R6 and Switching Frequency ............................................................................................. 14
CSD87355Q5DEVM-820 Bill of Materials............................................................................... 17
CSD87355Q5DEVM-820 Electrical and Performance Specifications
Trademarks
NexFET is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
2
CSD87355Q5DEVM-820
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Description
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1
Description
The CSD87355Q5DEVM-820 is designed to use a regulated 12-V (8 V to 13 V) bus voltage to provide a
regulated 1.2-V output at up to 25 A of load current. The CSD87355Q5DEVM-820 is designed to
demonstrate the CSD87355Q5D NexFET Power Block in a typical 12-V bus to low-voltage application,
while providing a number of non-invasive test points to evaluate the performance of the CSD87355Q5D
NexFET Power Block in a given application.
2
Applications
•
•
•
2.1
Features
•
•
•
•
•
•
3
Synchronous Buck Converters
– High-Frequency Applications
– High-Current, Low-Duty Cycle Applications
Multiphase Synchronous Buck Converters
POL DC-DC Converters
8-V to 13-V input voltage rating
1.2-V output voltage
25-A steady state load current
290-kHz switching frequency
Simple access to IC features including enable, power good, and switching node
Convenient test points for simple, non-invasive measurements of converter performance including
input ripple, output ripple, and switching node
CSD87355Q5DEVM-820 Electrical Performance Specifications
Table 1. CSD87355Q5DEVM-820 Electrical and Performance Specifications
PARAMETER
NOTES AND CONDITIONS
MIN
TYP
MAX
8
12
13
UNIT
INPUT CHARACTERISTICS
VIN
Input voltage
V
IIN
Input current
VIN = 12 V, IOUT = 25 A
—
2.8
—
A
No load input current
VIN = 12 V, IOUT = 0 A, MODE = GND
—
0.35
—
mA
Vbias
External bias voltage
JP1 open, Bias applied on pin 2 of JP1
4.5
5.0
6.5
V
Ibias
External bias current
JP1 open, Bias applied on pin 2 of JP1
15
mA
OUTPUT CHARACTERISTICS
VOUT
Output voltage
VIN = 12 V, IOUT = 25 A
VOUT_ripple
Output voltage ripple
VIN = 12 V, IOUT = 25 A, measured across output
capacitor C12
IOUT
Output current
VIN = 8 V to 13 V
1.176
1.2
1.224
—
16
—
mVp-p
25
A
kHz
0
V
SYSTEM CHARACTERISTICS
FSW
Switching frequency
266
290
314
ηpk
Peak efficiency
VIN = 12 V
—
92.7
—
%
η
Full load efficiency
VIN = 12 V, IOUT = 25 A
—
91.4
—
%
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3
4
JP2
CSD87355Q5DEVM-820
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VIN
CCM
MODE
Auto-Skip
JP3
Open=On
Short=Off
EN
GND
1
2
3
GND
1
2
C8
1µF
TP3
R3
10.0k
5V
R6
1
4
475k
NC
GND
OUT
TPS71550DCKR
FB/NC
IN
U2
EN
GND
3
2
5
R5
100k
5V
C9
1µF
5V BIAS
JP1
2
R8
GND
5V
6.98k
5V
61.9k
R4
5
2
4
R7
10.0k
GND
EN
3
7
10
TPS51218DSCR
RF
TRIP
VFB
EN
V5IN
VBST
Insert jumper to use onboard LDO
Remove jumper to apply user gate drive voltage
between 4.5V and 6.5V on pin 2
See user's guide
1
GND
VOUT
10µF
C2
U1
GND
J1
SW
GND
PGOOD
DRVL
DRVH
2
1
GND
11
1
6
9
8
TP2
TP1
R9
R1
GND
TP5
0
0
C5
10µF
0.1µF
C1
GND
TP6
GND
C4
10µF
C6
10µF
C7
10µF
5
4
3
C14
1µF
2
1
GND
8
7
6
TP4
L1
440nH
C3
2700pF
C10
470µF
TP8
C11
470µF
TP7
C12
470µF
2
1
J2
GND
VOUT
VOUT
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GND
R2
1.80
Q1
CSD87355Q5D
VIN
4
9
VIN
8V-13V
CSD87355Q5DEVM-820 Schematic
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CSD87355Q5DEVM-820 Schematic
For reference only. See Section 10 for specific values.
Figure 1. CSD87355Q5DEVM-820 Schematic
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Connector, Jumper, and Test Point Descriptions
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5
Connector, Jumper, and Test Point Descriptions
5.1
Input Power (J1)
12-V input power connection to the CSD87355Q5DEVM-820. Connect the positive voltage to pin 2 and
the return connection to pin 1. See Section 6.1.5 for the appropriate sizing of the wire.
5.2
Output Power (J2)
1.2-V output power connection from the CSD87355Q5DEVM-820. Connect the positive LOAD connection
to pin 2 and the return LOAD connection to pin 1. See Section 6.1.5 for the appropriate sizing of the wire.
5.3
5-V Bias Jumper (JP1)
The CSD87355Q5DEVM-820 contains an onboard 5-V bias regulator (a TPS71550 linear regulator) to
power the TPS51218 controller. This allows the EVM to run off of a single 12-V input source. Insert the
shunt in JP1 to use the onboard regulator. Removing the shunt allows the user to apply a different bias
voltage to the EVM on pin 2 of JP1. This external bias voltage should be between 4.5 V and 6.5 V and be
able to supply 15 mA to properly power the TPS51218. The ground reference of this external source
should be TP5.
5.4
Disable Jumper (JP2)
The CSD87355Q5DEVM-820 contains a disable jumper header (JP2). Installing the shunt in JP2 shuts
down the TPS51218 and disables the power supply. Removing the shunt allows the EN pin on the
TPS51218 to be pulled up to 5 V and enables the TPS51218.
5.5
MODE Jumper (JP3)
The CSD87355Q5DEVM-820 contains a MODE jumper to select the mode of operation of the TPS51218.
Installing the jumper in the 'Auto-Skip' position in JP3 (between pins 2 and 3) connects the RF pin to GND
through R6 to increase efficiency at light loads. Installing the shunt in the CCM position in JP3 (between
pins 1 and 2) connects the RF pin to PGOOD through R6 in order to maintain a constant switching
frequency over the entire load range.
5.6
Test Point Descriptions
Table 2. Test Point Description
5.6.1
Test Point
Label
Use
Section
TP1
VIN
Measurement test point for input voltage
Section 5.6.1
TP2
PGND
Measurement test point for input voltage return
Section 5.6.1
TP3
PGOOD
Measurement test point for power good
Section 5.6.4
TP4
SW
Measurement test point for switch node voltage
Section 5.6.3
TP5
AGND
Reference test point for PGOOD and return connection for an external bias
voltage applied to pin 2 of JP1
Section 5.6.4
TP6
PGND
Measurement test point for switch node voltage return
Section 5.6.3
TP7
VOUT
Measurement test point for output voltage
Section 5.6.2
TP8
PGND
Measurement test point for output voltage return
Section 5.6.2
Input Voltage Monitoring (TP1 and TP2)
The CSD87355Q5DEVM-820 provides two test points for measuring the input voltage applied to the
module. This allows the user to measure the actual input voltage without losses from input cables and
connectors. All input voltage measurements should be made between TP1 and TP2. To use TP1 and
TP2, connect a voltmeter positive input to TP1 and negative input to TP2. Tip and barrel measurement
technique can be used on TP1 and TP2 to measure the input ripple of the EVM. See Figure 3.
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Test Set Up
5.6.2
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Output Voltage Monitoring (TP7 and TP8)
The CSD87355Q5DEVM-820 provides two test points for measuring the output voltage generated by the
module. This allows the user to measure the actual output voltage without losses from output cables and
connectors. All output voltage measurements should be made between TP7 and TP8. To use TP7 and
TP8, connect a voltmeter positive input to TP7 and negative input to TP8. Tip and barrel measurement
technique should not be used on TP7 and TP8 to measure the output ripple of the EVM, as the probe can
pick up substantial radiated noise. It is recommended to measure the output voltage ripple as described in
Section 6.4.
5.6.3
Switching Node Monitoring (TP4 and TP6)
The CSD87355Q5DEVM-820 provides two test points for measuring the switching node of the module
power stage. Tip and barrel measurement technique should be used on TP4 and TP6 to measure the
switching node waveform. See Figure 3.
5.6.4
Power Good Voltage Monitoring (TP3 and TP5)
The CSD87355Q5DEVM-820 provides a test point, TP3, and a local ground, TP5, for measuring the
power good output voltage. A 100-kΩ resistor pull-up to 5 V (R5) is included on the EVM to allow the
Power Good signal to be monitored without requiring an external pull-up. TP5 is the ground reference for
the power good test point.
TP5 also functions as the return connection for an external bias voltage source that may be supplied to
pin 2 of JP1.
6
Test Set Up
6.1
Equipment
6.1.1
Voltage Source
VIN — The input voltage source (VIN) should be a 0-V to 15-V variable DC source capable of supplying 5 A
6.1.2
Meters
A1 — Input current meter. 0-A to 5-A ammeter
V1 — Input voltage meter. 0-V to 15-V voltmeter
V2 — Output voltage meter. 0-V to 2-V voltmeter
6.1.3
Load
LOAD — Output load. Electronic load set for constant current or constant resistance capable of 0 A to 25
A at 1.2 V
6.1.4
Oscilloscope
For Output Voltage Ripple — Oscilloscope should be an analog or digital oscilloscope set for AC coupled
measurement with 20-MHz bandwidth limiting. Use 20-mV/division vertical resolution and 1-µs/division
horizontal resolution.
For Switch Node Waveform — Oscilloscope should be an analog or digital oscilloscope set for DC
coupled measurement with 20-MHz bandwidth limiting. Use 2-V/division or 5-V/division vertical resolution
and 1-µs/division horizontal resolution.
6
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6.1.5
Recommended Wire Gauge
VIN to J1 — The connection between the source voltage (VIN) and J1 of the CSD87355Q5DEVM-820 can
carry as much as 5 A of current. The minimum recommended wire size is AWG #16 with the total length
of wire less than 2 ft (1-ft input, 1-ft return).
J2 to LOAD: — The connection between J2 and the LOAD of the CSD87355Q5DEVM-820 can carry as
much as 25 A of current. The minimum recommended wire size is AWG #12 with the total length of wire
less than 2 ft (1-ft input, 1-ft return).
6.1.6
Other
FAN — The CSD87355Q5DEVM-820 evaluation module includes components that can get hot to the
touch when operating. Because this evaluation module is not enclosed to allow probing of circuit nodes, a
small fan capable of 200 lfm to 400 lfm is recommended to reduce component temperatures when
operating.
6.2
Equipment Setup
Shown in Figure 2 is the basic test set up recommended to evaluate the CSD87355Q5DEVM-820. Note
that although the return for J1 and J2 are the same ground, the connections should remain separate as
shown in Figure 2.
6.2.1
Procedure
1. Working at an ESD workstation, make sure that any wrist straps, bootstraps, or mats are connected
referencing the user to earth ground before power is applied to the EVM. Electrostatic smock and
safety glasses should also be worn.
2. Prior to connecting the DC input source, VIN, it is advisable to limit the source current from VIN to 5-A
maximum. Make sure VIN is initially set to 0 V and connected as shown in Figure 2.
3. Connect VIN to J1 as shown in Figure 2.
4. Connect ammeter A1 between VIN and J1 as shown in Figure 2.
5. Connect voltmeter V1 to TP1 and TP2 as shown in Figure 2.
6. Connect voltmeter V2 to TP7 and TP8 as shown in Figure 2.
7. Connect oscilloscope probes to desired test points per Table 2.
8. Place fan as shown in Figure 2 and turn on making sure to blow air directly across the evaluation
module.
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Test Set Up
6.2.2
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Test Setup Diagram
FAN
+
DC Load
1.2 V @ 25 A
±
Vin
+
±
+
±
V2
V1
±
+
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Figure 2. CSD87355Q5DEVM-820 Recommended Test Set-Up
Figure 3. Tip and Barrel Technique
6.3
Start-Up and Shutdown Procedure
1.
2.
3.
4.
5.
6.
7.
8.
9.
8
Install shunt in JP1
Remove shunt from JP2, if present
Verify shunt position of JP3 for desired operating MODE per Section 5.5
Increase VIN from 0 V to 12 V
Turn on FAN
Vary LOAD from 0 A to 25 A
Vary VIN from 8 V to 13 V
Decrease LOAD to 0 A
Decrease VIN to 0 V
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Test Set Up
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6.4
Output Ripple Voltage Measurement Procedure
1. Solder a bus wire onto the ground of output capacitor C12
2. Follow Section 6.3 (Start-Up and Shutdown Procedure) steps 1 – 7 to set VIN and LOAD to the desired
operating condition
3. Set oscilloscope for output voltage ripple measurement as described in Section 6.1.4
4. Measure output voltage ripple across C12 using the soldered bus wire wrapped around the exposed
oscilloscope probe ground barrel
5. Follow Section 6.3 (Start-Up and Shutdown Procedure) steps 8 and 9 to power down
6.5
Equipment Shutdown
1.
2.
3.
4.
7
Shut
Shut
Shut
Shut
down
down
down
down
oscilloscope
LOAD
VIN
FAN
CSD87355Q5DEVM-820 Test Data
Figure 4 through Figure 12 present typical performance curves for the CSD87355Q5DEVM-820. Since
actual performance data can be affected by measurement techniques and environmental variables, these
curves are presented for reference and may differ from actual field measurements.
7.1
Efficiency (Full Load)
100
Efficiency (%)
95
90
85
80
75
CSD87355Q5D 12 Vin
CSD87355Q5D 8 Vin
70
0
5
10
15
IO - Output Current (A)
20
25
D001
VIN = 8 V and 12 V, VOUT = 1.2 V, MODE = GND, AUTO-SKIP ON, no airflow
Figure 4. CSD87355Q5DEVM-820 Efficiency vs Load Current
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CSD87355Q5DEVM-820 Test Data
7.2
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Efficiency (Light Load)
100
Efficiency (%)
95
90
85
80
75
CSD87355Q5D 12 Vin
CSD87355Q5D 8 Vin
70
0
0.2
0.4
0.6
IO - Output Current (A)
0.8
1
D002
VIN = 8 V and 12 V, VOUT = 1.2 V, MODE = GND, no airflow
Figure 5. CSD87355Q5DEVM-820 Low Load Efficiency vs Load Current
7.3
Output Voltage Ripple
VOUT (AC Coupled)
20 mV/div
t - Time - 1 ms/div
VIN = 12 V, VOUT = 1.2 V, IOUT = 25 A, measured across output capacitor C12 using a bus wire wrapped around
exposed oscilloscope probe ground barrel
Figure 6. CSD87355Q5DEVM-820 Output Voltage Ripple
10
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7.4
Output Voltage Ripple
VOUT (AC Coupled)
20 mV/div
t - Time - 1 ms/div
VIN = 12 V, VOUT = 1.2 V, IOUT = 25 A, measured at TP7 and TP8 using the tip and barrel measurement technique
shown in Figure 3. Since the probe picks up substantial radiated noise, this method is not recommended to measure
the output voltage ripple.
Figure 7. CSD87355Q5DEVM-820 Output Voltage Ripple
7.5
Input Voltage Ripple
VIN (AC Coupled)
200 mV/div
SW
10 V/div
t - Time - 1 ms/div
VIN = 12 V, VOUT = 1.2 V, IOUT = 25 A
Figure 8. CSD87355Q5DEVM-820 Input Voltage Ripple
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CSD87355Q5DEVM-820 Test Data
7.6
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Load Transient Response
VOUT (AC Coupled)
20 mV/div
IOUT
10 A/div
t - Time - 100 ms/div
VIN = 12 V, VOUT = 1.2 V, IOUT = 12.5 A to 25 A, measured across output capacitor C12 using a bus wire wrapped
around exposed oscilloscope probe ground barrel
Figure 9. CSD87355Q5DEVM-820 Step Response
7.7
Start-Up on VIN
VIN
5 V/div
VOUT
200 mV/div
t - Time - 200 ms/div
VIN = 12 V, VOUT = 1.2 V, IOUT = 25 A
Figure 10. CSD87355Q5DEVM-820 Start-Up on VIN
12
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7.8
Start-Up on EN
EN
5 V/div
VOUT
200 mV/div
t - Time - 200 ms/div
VIN = 12 V, VOUT = 1.2 V, IOUT = 25 A
Figure 11. CSD87355Q5DEVM-820 Start-Up on EN
7.9
Thermal Image
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VIN = 12 V, VOUT = 1.2 V, IOUT = 25 A, no air flow
Figure 12. CSD87355Q5DEVM-820 Thermal Image
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CSD87355Q5DEVM-820 Modifications
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CSD87355Q5DEVM-820 Modifications
Several modifications can be made to the CSD87355Q5DEVM-820. Making any of these changes will
change the EVM's performance data and may require a modification to the inductor value or current limit
trip point (R4 value). The design may also change thermally. Consult the TPS51218 datasheet for details
on how to pick R4.
8.1
Switching Frequency
The switching frequency of the CSD87355Q5DEVM-820 may be altered by changing the value of R6, per
Table 3:
Table 3. R6 and Switching Frequency
8.2
R6 Value (kΩ)
Switching Frequency (fsw) (kHz)
470
290
200
340
100
380
39
430
Output Voltage
The output voltage of the CSD87355Q5DEVM-820 may be changed by changing the value of R8, per
Equation 1. ILripple is found from Equation 2.
CAUTION
The output voltage should not be set higher than 1.9 V or else damage may
occur to the EVM.
VOUT - (ILripple ´ 2mW)
R8 =
ILripple
8.3
2
0.7
(V - VOUT ) ´ VOUT
= IN
L ´ fsw ´ VIN
- 0.7
´ R7
(1)
(2)
Gate Drive Resistors
The gate drive to the high side MOSFET may be slowed by increasing the value of resistors R1 and/or
R9. This will slow down the turn on of the high side MOSFET and result in less ringing on the SW node.
This will also result in slightly lower efficiency and higher operating temperatures.
9
CSD87355Q5DEVM-820 Assembly Drawings and Layout
The following figures (Figure 13 through Figure 17) show the design of the CSD87355Q5DEVM-820
printed circuit board. The EVM has been designed using a 4-layer, 2-oz copper circuit board measuring 3
in × 3 in with all populated components on the top to allow the user to easily view, probe and evaluate the
CSD87355Q5D solution. Moving components to both sides of the PCB can offer additional size reduction
for space constrained systems.
14
CSD87355Q5DEVM-820
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CSD87355Q5DEVM-820 Assembly Drawings and Layout
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Figure 13. CSD87355Q5DEVM-820 Top Component Placement (Top View)
Figure 14. CSD87355Q5DEVM-820 Top Copper (Top View)
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CSD87355Q5DEVM-820 Assembly Drawings and Layout
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Figure 15. CSD87355Q5DEVM-820 Internal Copper Layer 1 (X-Ray Top View)
Figure 16. CSD87355Q5DEVM-820 Internal Copper Layer 2 (X-Ray Top View)
16
CSD87355Q5DEVM-820
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Copyright © 2017, Texas Instruments Incorporated
CSD87355Q5DEVM-820 Bill of Materials
www.ti.com
Figure 17. CSD87355Q5DEVM-820 Bottom Copper (Bottom View)
10
CSD87355Q5DEVM-820 Bill of Materials
Table 4. CSD87355Q5DEVM-820 Bill of Materials
QTY
REFDES
VALUE
SIZE
PART NUMBER
1
C1
0.1 µF
Capacitor, Ceramic, 16 V, X7R, 10%
DESCRIPTION
0603
Std
Std
3
C10, C11, C12
470 µF
Capacitor, Polymer Aluminum, 2V, 20%
7343
EEFSX0D471XE
Panasonic
1
C2
10 µF
Capacitor, Ceramic, 10 V, X5R, 10%
0805
Std
Std
1
C3
2700 pF
Capacitor, Ceramic, 50 V, X7R, 10%
0603
Std
Std
4
C4, C5, C6, C7
10 µF
Capacitor, Ceramic, 25 V, X5R, 20%
1206
Std
Std
3
C8, C9, C14
1 µF
Capacitor, Ceramic, 25 V, X5R, 10%
0603
Std
Std
1
L1
0.44 µH
0.510 x 0.530 inch
SLC1480-441ML
Coilcraft
1
Q1
CSD87355Q5D
2
R1, R9
0
Inductor, SMT Power, 35 A, ±20%
MOSFET, Dual N-Chan, 30 V, 45 A
MFR
QFN-8 POWER
CSD87355Q5D
TI
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
R2
1.8
Resistor, Metal Film, ½ W, 1%
2010
Std
Std
2
R3, R7
10.0 K
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
R4
61.9 K
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
R5
100 K
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
R6
475 K
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
R8
6.98 K
Resistor, Chip, 1/16 W, 1%
0603
Std
Std
1
U1
TPS51218DSC
IC, Single Synchronous Step-Down Controller
DSC-10
TPS51218DSC
TI
TPS71550DCKR
IC, High Input Voltage, Micropower, 3.2 µA at
50 mA LDO, 5 V
SC70-5
TPS71550DCKR
TI
1
U2
SLPU005 – June 2017
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CSD87355Q5DEVM-820
Copyright © 2017, Texas Instruments Incorporated
17
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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