User's Guide
SLOU407A – April 2015 – Revised May 2015
DRV2700EVM-HV500 High Voltage Piezo Driver Evaluation
Kit
The DRV2700 is a single chip high-voltage driver with an integrated 105-V boost switch, integrated power
diode, and integrated fully differential amplifier. This evaluation kit utilizes this high-voltage switch into a
flyback configuration that is able to achieve (but is not limited to) up to 500 V:
• Controllable input modes: Analog input, PWM and MSP430 controllable
• Variable output voltages from 0 V to 500 V
• 2 power supply inputs to isolate power consumption on DRV2700 application circuitry
• 4 convenient max output voltage settings
• Small footprint (14 mm x 14.5 mm)
The evaluation kit is designed for all-around use and can be used not only for evaluation but can also be
used for prototyping into systems for driving piezo actuators, polymers, valves and many other
applications. The EVM also contains a microcontroller, LDO (3.3 V) and LEDs for status and input
settings.
Evaluation Kit Contents:
• DRV2700EVM-HV500 evaluation board
• Demonstration mode firmware preloaded onto microcontroller
• Downloadable software to control EVM
• Mini-B USB cable
Needed for programming and advanced configuration:
• Code Composer Studio™ (CCS) for MSP430
• MSP430 LaunchPad™ (MSP-EXP430G2) or MSP430-FET430UIF hardware programming tool
• DRV2700EVM firmware available on the DRV2700EVM-HV500 tool folder
Code Composer Studio, LaunchPad are trademarks of Texas Instruments.
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Contents
Getting Started ............................................................................................................... 6
1.1
Evaluation Module Operating Parameters ....................................................................... 6
1.2
Quick Start Board Setup ........................................................................................... 7
1.3
Connecting a Load.................................................................................................. 7
Overview of EVM ............................................................................................................ 8
2.1
DRV2700............................................................................................................. 8
2.2
Microcontroller (MSP430) .......................................................................................... 8
2.3
Power Supply Inputs and Path .................................................................................... 8
2.4
EN Configuration .................................................................................................... 9
2.5
Inputs ................................................................................................................. 9
2.6
Outputs ............................................................................................................... 9
2.7
TRIG Button ......................................................................................................... 9
EVM Control Software (GUI).............................................................................................. 10
Flyback Converter .......................................................................................................... 12
4.1
Programming the HV Maximum Output Voltage .............................................................. 13
4.2
Programming the Flyback Current Limit ........................................................................ 14
4.3
Transformer Selection ............................................................................................ 14
4.4
HV Capacitor Selection ........................................................................................... 14
PWM and Analog Inputs .................................................................................................. 15
5.1
PWM Input Using MSP430....................................................................................... 15
5.2
Analog Input ....................................................................................................... 16
Output ........................................................................................................................ 17
6.1
Load Selection ..................................................................................................... 17
6.2
Pulldown Network ................................................................................................. 17
Input Filter ................................................................................................................... 19
7.1
First Order Filter ................................................................................................... 19
7.2
Integrator ........................................................................................................... 19
Reference ................................................................................................................... 20
8.1
Schematic .......................................................................................................... 20
8.2
PCB Layout ........................................................................................................ 21
8.3
Bill of Materials .................................................................................................... 22
List of Figures
1
Board Diagram ............................................................................................................... 6
2
Power Path Diagram ........................................................................................................ 8
3
Output Diagram .............................................................................................................. 9
4
GUI Interface ................................................................................................................ 10
5
Low PWM Frequency ...................................................................................................... 11
6
Mid PWM Frequency
7
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......................................................................................................
High PWM Frequency .....................................................................................................
Arbitrary Waveform Using Wavebuilder Tab............................................................................
VHV Feedback Network.....................................................................................................
PWM Signal .................................................................................................................
10-Hz Input Signal .........................................................................................................
100-Hz Input Signal ........................................................................................................
Instantaneous Max Load Current vs Max Output Voltage ............................................................
Pulldown Network ..........................................................................................................
With FET Pulldown .........................................................................................................
Without FET Pulldown .....................................................................................................
Input Filter ...................................................................................................................
DRV2700EVM-HV500 Schematic ........................................................................................
DRV2700EVM-HV500 High Voltage Piezo Driver Evaluation Kit
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Top and Bottom Layers.................................................................................................... 21
WARNING
EXPORT NOTICE
Recipient agrees to not knowingly export or re-export, directly or
indirectly, any product or technical data (as defined by the U.S.,
EU, and other Export Administration Regulations) including
software, or any controlled product restricted by other applicable
national regulations, received from Disclosing party under this
Agreement, or any direct product of such technology, to any
destination to which such export or re-export is restricted or
prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other
competent Government authorities to the extent required by those
laws. This provision shall survive termination or expiration of this
Agreement. According to our best knowledge of the state and enduse of this product or technology, and in compliance with the
export control regulations of dual-use goods in force in the origin
and exporting countries, this technology is classified as follows:
US ECCN: 3E991
EU ECCN: EAR99
And may require export or re-export license for shipping it in
compliance with the applicable regulations of certain countries.
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Cautions and Warnings
CAUTION:
Warning! Do not leave EVM powered when unattended.
HOT SURFACE:
Warning Hot Surface! Contact may cause burns. Do not touch. Please take the proper
precautions when operating.
HIGH VOLTAGE:
Danger High Voltage! Electric shock possible when connecting board to live wire. Board should
be handled with care by a professional. For safety, use of isolated test equipment with
overvoltage/overcurrent protection is highly recommended.
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General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
WARNING
Always follow TI’s setup and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help
ensure your personal safety and those working around you. Contact TI's Product Information Center
http://support/ti./com for further information.
Save all warnings and instructions for future reference.
Failure to follow warnings and instructions may result in personal injury, property damage, or
death due to electrical shock and burn hazards.
The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed
printed circuit board assembly. It is intended strictly for use in development laboratory environments,
solely for qualified professional users having training, expertise and knowledge of electrical safety
risks in development and application of high voltage electrical circuits. Any other use and/or
application are strictly prohibited by Texas Instruments. If you are not suitable qualified, you should
immediately stop from further use of the HV EVM.
1. Work Area Safety
(a) Keep work area clean and orderly.
(b) Qualified observer(s) must be present anytime circuits are energized.
(c) Effective barriers and signage must be present in the area where the TI HV EVM and its interface
electronics are energized, indicating operation of accessible high voltages may be present, for the
purpose of protecting inadvertent access.
(d) All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other
related apparatus used in a development environment exceeding 50Vrms/75VDC must be
electrically located within a protected Emergency Power Off EPO protected power strip.
(e) Use stable and nonconductive work surface.
(f) Use adequately insulated clamps and wires to attach measurement probes and instruments. No
freehand testing whenever possible.
2. Electrical Safety
As a precautionary measure, it is always a good engineering practice to assume that the entire EVM
may have fully accessible and active high voltages.
(a) De-energize the TI HV EVM and all its inputs, outputs and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely deenergized.
(b) With the EVM confirmed de-energized, proceed with required electrical circuit configurations,
wiring, measurement equipment connection, and other application needs, while still assuming the
EVM circuit and measuring instruments are electrically live.
(c) After EVM readiness is complete, energize the EVM as intended.
WARNING: WHILE THE EVM IS ENERGIZED, NEVER TOUCH THE EVM OR ITS ELECTRICAL
CIRCUITS AS THEY COULD BE AT HIGH VOLTAGES CAPABLE OF CAUSING ELECTRICAL
SHOCK HAZARD.
3. Personal Safety
(a) Wear personal protective equipment (for example, latex gloves or safety glasses with side shields)
or protect EVM in an adequate lucent plastic box with interlocks to protect from accidental touch.
Limitation for safe use:
EVMs are not to be used as all or part of a production unit.
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Getting Started
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Getting Started
The DRV2700EVM-HV500 is designed for flexible use for prototyping as well as evaluation. Figure 1
shows the names and locations of the various elements on the EVM. To power the board, connect the
DRV2700EVM-HV500 to an available USB port on your computer using a mini-B USB cable. The default
board settings cause the microcontroller (MSP430) to control the inputs of the DRV2700 at power up. The
MSP430 has each of these control settings low which disables the DRV2700, by default. Figure 1 shows
the basic board diagram of the DRV2700EVM-HV500. Table 2 shows the original configuration of the
jumpers, as shipped.
SBW
Connector
EN Header
PWM
Disconnect
Input Signal
DRV2700 HV
Circuit
Footprint
USB Input
Output
Terminal
EXT Input
Power
Routings
MSP430
(Microcontroller)
Max Output
Voltage Switches
Figure 1. Board Diagram
1.1
Evaluation Module Operating Parameters
Table 1 lists the operating conditions for the DRV2700 on the evaluation module.
Table 1. Typical Operating Conditions
Parameter
Specification
Supply voltage range
3.6 V to 5.5 V
Power-supply current rating
500 mA
Input voltage
0 V to VDD
Max output voltage
500 VP*
*Maximum output voltage will vary based on feedback resistors and opamp variability.
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1.2
Quick Start Board Setup
The DRV2700EVM-HV500 comes with preprogrammed firmware to provide a 0- to 500-Vp signal between
the output and GND.
1. Out of the box, the jumpers are set to begin demo mode using USB power. The default jumper settings
are found in Table 2.
2. Connect a mini-USB cable to the USB connector on the DRV2700EVM-HV500 board.
3. Connect the other end of the USB cable to an available USB port on a computer, USB charger, or USB
battery pack.
4. If the board is powered correctly, the 5-V LED is on.
5. Enable the output using the GUI or programmatically through the computer, see GUI Interface for
additional assistance. If using an external input signal, EN the output by changing the jumper (JP3) or
equivalent control signal.
6. Once the output is EN, the device allows for the high-voltage output.
Table 2. Default Jumper Settings
Parameter
JP1 PWM
Jumper
Setting
Default
Open
Connected
Disconnected PWM input and I/O of MSP430
X
Open
JP4 DRV
DRV2700 connected to VIN power supply
X
Open
JP3 EN
EN pulled up to MSP power supply through external pull up resistor
X
Open
JP4 DRV
VIN
(1)
1.3
EN tied to I/O of MSP430
DRV2700 not connected to either power supply
(1)
USB (1)
DRV2700 connected to USB power supply
EN pulled internally to GND through DRV2700 internal resistance
PU (1)
MSP (1)
Connected PWM input and I/O of MSP430
DRV2700 not connected to either power supply
VIN (1)
USB (1)
Specification
DRV2700 connected to VIN power supply
X
DRV2700 connected to USB power supply
In the table, jumper setting name means that side of the terminal is connected to the middle of the 3-terminal header. For
questions, refer to Figure 1.
Connecting a Load
1. With the power supply off, connect the negative terminal of the load to GND and connect the positive
terminal of the load to the "HIGH VOLTAGE" side of JP2.
2. Ensure the terminals are connected correctly, then enable the supply
CAUTION
Before connecting the load, ensure that the load is rated for the selected output
voltage. If not, see the Programming the HV Maximum Output Voltage section
to adjust the DRV2700 maximum output voltage.
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Overview of EVM
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Overview of EVM
The following sections provide a description of each of the blocks identified in Figure 1.
2.1
DRV2700
The DRV2700 is a single-chip, high-voltage piezo driver with an integrated 105-V boost switch, integrated
power diode, and integrated fully-differential amplifier. This EVM allows the designer to evaluate this
device and appropriately prototype it into their design. See the DRV2700 (SLOS861) datasheet for more
in-depth information.
2.2
Microcontroller (MSP430)
An onboard MSP430F5510 is used to control the various input signals as well as communicate through
the USB to the GUI. See the Quick Start Board Setup section for how to setup and run with the GUI.
2.3
Power Supply Inputs and Path
Two power supply inputs are available to power the EVM: USB power and VEXTERNAL (Ext VIN on the EVM).
Each of these inputs can be used to power the entire board or parts of the board.
2.3.1
USB Power Input
The USB power input can be supplied from a standard USB port on a computer, USB charger, or USB
battery pack. This input is intended for ease-of-use and can be routed to power all circuitry on the EVM.
Additionally, this input has a 5-V LED indicator showing that power is being supplied to the EVM. If the
GUI is going to be used, the USB must be connected to the computer and JP2 routed to USB connection.
2.3.2
VIN/External Power Input
Provide the VIN power input with an external 3.6- to 5.5-V power supply. Additionally, this input can power
the entire board.
2.3.3
Power Path Selection
VIN
External
DRV Header
USB
Power
MSP Header
Each of the two power supply inputs can be routed to the DRV2700 or the rest of the IC. The positions of
the jumpers are described in Table 2 or can be read from the silkscreen of the EVM. Figure 2 shows the
basic diagram of the power paths.
Power to Rest of Board
Power to DRV2700
Figure 2. Power Path Diagram
If a power measurement of the DRV2700 circuitry is desired, it is best to provide the MSP jumper (JP2)
with USB power and the DRV jumper (JP4) with VIN. With this configuration, measuring the provided
voltage and current into VIN gives the power consumption of the DRV2700.
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2.4
EN Configuration
The EN input for the DRV2700 has 4 different driving configurations:
• Driven through the MSP430. This is done by connecting the configuration jumper to the “MSP” state
(default).
• Pulled to a logic level high through pullup resistor. This is done by connecting the configuration jumper
to the “PU” state.
• Pulled to a logic level low through internal pulldown resistor. This is done by removing the configuration
jumper.
• Driven externally. This is done by connecting the external control signal to the center 100-mil header.
This signal has an LED to indicate when the signal is at a logic-level high.
2.5
Inputs
The analog input (TP1) is used for PWM and analog inputs. See PWM and Analog Inputs, for more
information.
2.6
Outputs
The DRV2700EVM-HV500 has a high voltage output ranging from 0–500 V. This output is routed to a
terminal connector to mitigate the user touching between the high voltage node and GND. Be sure to
disable power when connecting and disconnecting the high voltage node.
GND
High Voltage
Output
Figure 3. Output Diagram
2.7
TRIG Button
The DRV2700EVM-HV500 has a built-in trigger button for user prototyping. If different modes of operation
are desired without using the GUI, the MSP430 can be programmed such that the trigger button can cycle
through different modes.
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EVM Control Software (GUI)
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EVM Control Software (GUI)
By default, the DRV2700EVM-HV500 can be controlled programmatically through the GUI Interface.
Figure 4 is a screenshot of the GUI.
Run the GUI by downloading it from the DRV2700EVM-HV500 tool folder, installing the GUI and then
running it. When prompted, connect to the USBHID setting.
Quick Launch
Freq Buttons
EN/Disable
PWM Frequency
Control
PWM Duty Cycle
Control
EN/Disable
Indicator
0-99 Single Point
Adder to Waveform
Expected Waveform
Start/Stop Button
Quick Sample
Waveforms
Repeat Waveform
User Generated
waveform from
Excel/Text
Figure 4. GUI Interface
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EVM Control Software (GUI)
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The GUI is broken up into two tabs: Standard Drive and WaveBuilder. The Standard Drive utilizes
changing the frequency and duty cycle of the PWM signal and is intended for easy prototyping and
evaluating. The WaveBuilder tab is for showcasing the DRV2700 as a proportional controller that can
drive a variety of user-created waveforms. On both tabs, the sections are intuitive, however, the following
sections are worth describing:
• Output Timing: This button has 3 different modes: Continuous, Pulsed, and Single. These modes help
with a timed EN signal.
• Boost Voltage Percentage: This is the duty cycle of the PWM waveform and after filtered will be a
DC value to modulate the output. Note in the scopeshots in Figure 5 through Figure 8, that the PWM
signal's duty cycle is inverse to the output. (As duty cycle increases, the output voltage percentage
decreases.) This has been taken care of through software so that the slider bar will reelect the true
output percentage though. The boost voltage percentage will only have a true "Boost Voltage
Percentage" effect during High Frequency/DC Mode.
• PWM Input Frequency: This will change the frequency of the PWM signal coming from the
microcontroller, which is fed into the input filter:
– Low PWM Frequency (< 1 kHz): When below 1 kHz, the PWM signal will hardly be attenuated such
that the majority of the PWM signal will propagate through. This will cause the output to try and
reflect the PWM signal coming from the microcontroller and the output will try to be a square wave.
The AC Mode - Quick Launch frequency button will set the frequency to this range.
– Mid PWM Frequency (1 kHz < freq < 20 kHz): When the frequency is set in this range, the PWM
signal will be somewhat attenuated and the output will still somewhat reflect a PWM signal. This
mode can be used for audio tones, however, the output may not be able to drive to full scale,
depending on the load capacitance.
– High PWM Frequency (> 20 kHz): As the frequency starts to go higher, the PWM signal will be
greatly attenuated. This will cause the PWM signal to appear DC after this filter. This mode can be
used to drive the output at a DC level which is set by the Boost Voltage Percentage (that is, duty
cycle). The DC Mode - Quick Launch frequency button will set the frequency to 50 kHz, which is in
this range.
• Time Between Steps (ms): The time between steps on the wavebuilder tab is the time step between
points. This is implemented using a series of DC set points occurring at a certain time of the waveform.
The output is limited to 200 sample points.
• Waveform From Excel/Text: This text box will build a waveform in the graph based on a commaseparated string of integers from 0-100%.
It is best practice to have an oscilloscope measure the output to verify how the load is actually being
driven, based on the conditions applied.
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Flyback Converter
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VDD = 5 V
C(LOAD) = 22 nF
VHV = 0 to 500 V
VDD = 5 V
Figure 5. Low PWM Frequency
VDD = 5 V
C(LOAD) = 22 nF
VHV = 0 to 500 V
Figure 7. High PWM Frequency
4
C(LOAD) = 22 nF
VHV = 0 to 500 V
Figure 6. Mid PWM Frequency
VDD = 5 V
C(LOAD) = 22 nF
VHV = 0 to 500 V
Figure 8. Arbitrary Waveform Using Wavebuilder Tab
Flyback Converter
The DRV2700 device creates a boosted supply rail with an integrated DC-DC converter that can go up to
105 V. The switch-mode power supplies have a few different sources of losses. When boosting to very
high voltages, the efficiency begins to degrade because of these losses. The DRV2700 device has a
hysteretic boost design to minimize switching losses and therefore increase efficiency. A hysteretic
controller is a self-oscillation circuit that regulates the output voltage by keeping the output voltage within a
hysteresis window set by a reference voltage regulator and, in this case, the current-limit comparator.
Hysteretic converters typically have a larger ripple as a trade-off because of the minimized switching. This
ripple is a function of the output capacitor, internal delays, and the hysteresis of the control loop.
Before connecting the load, ensure the load is rated for the current boost voltage setting.
See Programming the HV Maximum Output Voltage for more information on how to set the boost voltage.
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Flyback Converter
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4.1
Programming the HV Maximum Output Voltage
The high voltage output (HV) is set through an external network. For ease-of-use of this EVM, two
switches (SW3 and SW4) are installed to change RFB1 and CFB2 with ease. For a normal application,
switches should not be needed and those values can be set by passives.
Additionally, RFB2 is split into two resistors to provide a reference voltage for the pull-down operational
amplifier (opamp) that is discussed in Pulldown Network.
VHV
C(FB1)
VFB
R (FB2A)
Pull down
Reference
C(FB2)
R(FB2B)
Filte r O utp ut
Figure 9. VHV Feedback Network
The HV output voltage is given by: Equation 2
æ
VHV = VFB ç 1 +
è
RFB1 ö æ RFB1 ö
÷-ç
÷ VOP
RFB2 ø è RFB2 ø
(1)
where VFB = 1.30 V and VOP is the VOL of the opamp since it cannot go all the way to ground. TI
recommends the sum of the resistance of RFB1 and RFB2 be between 500 kΩ and 1 MΩ.
The capacitors are needed in the feedback network to increase the performance at low and high
frequencies. Because the charge storage is inversely proportional to the capacitance, use Equation 2 to
calculate the values of the capacitors. In general, select a value around 22 pF for CFB1 and size CFB2
accordingly.
RFB1 CFB2
=
RFB2
CFB1
(2)
Refer to Table 3 for the switch setting to change the maximum output voltage.
CAUTION
Be sure not to hot switch the SW3 and SW4 connection. This should only be
switched while the output is disabled or the board is unpowered.
Table 3. VHV Setting Based on the Jumper Configuration
SW3
SW4
RFB2
CFB2
RFB1
CFB1
VMAX
Down
Down
5.49 kΩ
8200 pF
2.05 MΩ
22 pF
500 V
Down
Up
5.49 kΩ
4505 pF
1.122 MΩ
22 pF
275 V
Up
Down
5.49 kΩ
3717 pF
0.866 MΩ
22 pF
212 V
Up
Down
5.49 kΩ
2710 pF
0.642 MΩ
22 pF
158 V
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Flyback Converter
4.2
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Programming the Flyback Current Limit
The peak inductor current is set with resistor R3 (REXT). The current limit is not a safety mechanism, but
the highest value current the inductor will see each cycle. The inductor must be capable of handling this
programmed limit during normal operation. The relationship of REXT to ILIM is approximated with Equation 3
where ILIM is the current limit set by REXT, K = 10500, VREF = 1.35 V and RINT = 60 Ω.
æ V
REXT = ç K REF
è ILIM
4.3
ö
÷ - RINT
ø
(3)
Transformer Selection
Transformer selection plays a critical role in the performance of the DRV2700. The range of
recommended primary-side inductance values is 3.3 µH to 22 µH. When a larger inductance is chosen,
the DRV2700 flyback converter automatically runs at a lower switching frequency and incurs less
switching losses; however, the larger inductances may also have a higher equivalent series resistance
(ESR), which will increase the parasitic inductor losses.
Another factor to consider for transformers is the winding ratio. In general, if a 200-V output is desired
then, because the SW node can boost up to 100 V, a transformer of 1:2 (100 V:200 V) is the minimum
required winding. However, selecting a slightly higher winding ratio to ensure that the 100 V on the
primary side is not surpassed while trying to boost up to the desired voltage is good design practice.
The transformer used on this EVM is a 1:10 winding ratio with a primary side inductance of 7 µH.
4.4
HV Capacitor Selection
The HV output voltage may be programmed as high as 500 V on this EVM. A capacitor must have a
voltage rating equivalent to the boost output voltage or higher. Because the output can be unloaded, a 1nF output capacitor is added to ensure some amount of stability on the output.
Additionally, a non-populated landing pad (C6) is provided for additional capacitance, if desired.
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PWM and Analog Inputs
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5
PWM and Analog Inputs
The flyback configuration on this EVM uses a low-pass (two pole) filtered PWM waveform from the
microcontroller or an analog signal from the user. By default, the DRV2700EVM-HV500 uses the MSP430
PWM input mode. This section describes each input mode in detail and the modifications necessary for
operation of each.
The DRV2700EVM supports two input modes for driving the DRV2700:
• PWM input using MSP430: In this mode, the onboard MSP430 generates a PWM waveform that is
sent through the low-pass input filter to the DRV2700.
• Analog input: An external source supplies an analog waveform to the TP1 header which is sent
through the low-pass input filter to the DRV2700.
Because the low-pass filter will try to pass the DC components of the signal, the PWM/Analog input's
frequency will determine if the filtered signal will still appear AC.
•
•
•
Low Frequency/AC Mode (< 1 kHz): When below 1 kHz, the PWM signal will hardly be attenuated
such that the majority of the PWM signal will propagate through. This will cause the output to try and
reflect the PWM signal coming from the microcontroller and the output will try to be a square wave.
Mid Frequency (1 kHz < freq < 20 kHz): When the frequency is set in this range, the PWM signal will
be attenuated but it will still somewhat reflect a PWM signal. This mode can be used for audio tones,
however the output may not be able to drive to full scale, depending on the load capacitance.
High Frequency/DC Mode (> 20 kHz): As the frequency starts to go higher, the PWM signal will be
greatly attenuated. This will cause the PWM signal to appear DC after this filter. This mode can be
used to drive the output at a DC level which is set by the Boost Voltage Percentage (that is, duty
cycle).
See the scopeshots in Section 3 for example waveforms.
5.1
PWM Input Using MSP430
MSP430
Low-Pass
Filter
DRV2700
Figure 10. PWM Signal
When using the DRV2700EVM-HV500 in MSP430 PWM input mode, the onboard MSP430 generates a
PWM signal that is sent through a low-pass filter to the DRV2700. The DRV2700EVM-HV500 is set up to
use this mode by default. Set to the default settings to use this input mode.
If specific waveforms (other than those already on the MSP430) are needed, the firmware can be updated.
To update the firmware, download Code Composer Studio (or a third-party MSP430 IDE) and connect the
DRV2700EVM-HV500 Spy-Bi-Wire to the computer. The TI website offers an MSP430 USB-to-JTAG
hardware interface (MSP-FET430UIF) for updating and debugging MSP430 code.
NOTE: Sample code is also available on the DRV2700 product web page.
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PWM and Analog Inputs
5.2
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Analog Input
The following instructions are provided to use an external analog source to drive the DRV2700:
1. Disconnect the MSP430 output pin from the DRV2700 input pins by removing jumper JP1
2. Connect the DRV2700 EN signal:
(a) Use the onboard MSP430 and GUI to control the EN pin by connecting JP3 between EN and MSP
(b) EN the output all the time by connecting JP3 between PU and EN
(c) Use an external control signal by connecting source to the middle header of JP3
3. Connect the analog input signal to TP1 (INPUT). Note, the default input range is from 0–3.3 V (same
as PWM signal). Therefore, if a voltage divider is needed, R21 and R2 can be changed accordingly.
4. Enable the power supply
5. Enable the analog input signal (and EN)
Figure 11 and Figure 12 show waveforms using an external sine wave.
VDD = 5 V
Input Frequency =
10 Hz
C(LOAD) = 22 nF
VHV = 0 to 500 V
VDD = 5 V
C(LOAD) = 22 nF
VHV = 0 to 500 V
Figure 12. 100-Hz Input Signal
Figure 11. 10-Hz Input Signal
16
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Output
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6
Output
The DRV2700 has an output terminal header for connecting the piezo load.
6.1
Load Selection
The DRV2700 is intended to drive piezo (capacitive) loads. Therefore, there are several key specifications
to consider when choosing a piezo load; such as dimensions, blocking force, and displacement. However,
the key electrical specifications from the driver perspective are voltage rating and capacitance. Figure 13
shows the typical instantaneous maximum load current versus output voltage.
600
540
Max Output Voltage [V]
480
420
360
300
240
180
120
60
0
0
1
2
3
4
5
6
7
8
Instantaneous Load Current [mA]
9
10
11
D001
Figure 13. Instantaneous Max Load Current vs Max Output Voltage
6.2
Pulldown Network
The pulldown FET and one or more resistors are used to remove the charge on the high-voltage output
faster than just simply using the feedback resistors. Because the FET must be driven from a comparator,
an NMOS FET must be used. During normal operation, the VDS of the NMOS is subject to any voltage
from approximately 0 V when the FET is on, to the output on the flyback configuration (VHV) when the FET
is off. Therefore, selecting a FET with a VDS breakdown higher than the maximum VHV is required.
Additionally, placing a resistor in series with this FET (on the source side) to limit the current going
through the FET is recommended. This resistor can be sized according to the maximum current allowed
per the data sheet of the FET, such that when current flows through the resistor, it raises the source
voltage and thereby lowers the VGS and shuts the FET off. Using Equation 4 provides a good value of RS
where VG is the VOH of the opamp, VGS(th) is the threshold voltage of the FET and IDS(Max) is the maximum
current allowed through the FET. As an additional measure, one or more resistors can be placed on the
drain and gate side to protect the pulldown FET by minimizing sharp transients that can be coupled to the
other terminals of the FET.
VG - VGS(th)
RS =
I DS(Max)
(4)
Because the output voltage will ripple (based on the load current and cap) the threshold at which the
opamp turns on the FET needs to be set effectively. To try and eliminate the need for external references,
two references from the basic circuit configuration are used. The REXT voltage at ≈ 1.3 V is regulated
internally by the DRV2700; however, it cannot source or sink very much current. Therefore, by connecting
this reference to a high impedance input to an opamp, which draws zero current, this reference can be
used.
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Output
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The second reference voltage is set to about 93% of VFB by creating an additional resistor divider in the
feedback network (VFB2A and VFB2B). This works, such that when the output is rippling during normal
operation, the threshold will not be triggered. However, when the input signal changes so that the output
needs to be discharged, the feedback network will be changed so this reference will become higher than
VREXT and therefore turn on the output FET.
VHV
C(HV)
Piezo
Elemen t
V(Pul ldo wn)
VDD
+
V(REXT)
±
R(S)
Figure 14. Pulldown Network
Figure 15 and Figure 16 show the different discharge times with and without the pulldown network. Note
the 4x timescale in Figure 16.
VDD = 5 V
500us/div
C(LOAD) = 22 nF
VHV = 0 to 500 V
Figure 15. With FET Pulldown
18
VDD = 5 V
2ms/div
C(LOAD) = 22 nF
VHV = 0 to 500 V
Figure 16. Without FET Pulldown
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7
Input Filter
The DRV2700EVM-HV500 has an active low-pass input filter to attenuate high frequency PWM signals
coming from the input source. Depending on the input frequency and input voltage, the filter can be
adapted to attenuate any undesired out-of-band content. This section describes the input filter
requirements and the various respective configurations. The filter can be modified by the user, however be
sure that the 3-dB point is no higher than 5 kHz.
See scopeshots in Section 3 for example waveforms.
7.1
First Order Filter
In order to attenuate the high frequency PWM signal, a first order filter was used prior to the integrator to
attenuate the high-frequency components. This RC network has a 3-dB point around 1.75 kHz.
7.2
Integrator
In order to attenuate the PWM signal even further, a non-inverting integrator is used.
Inte grator
C1
PWM
from uC
TP1
INP UT
R3
JP1
VDR V
Filte r O ut
R21
±
R1
+
C2
R2
First Order Filter
Figure 17. Input Filter
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Reference
8
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Reference
This section includes the DRV2700EVM-HV500 schematic, PCB layout, and bill of materials.
8.1
Schematic
Figure 18 illustrates the DRV2700EVM-HV500 schematic.
7
VBUS
4
1
2 D-
2
1 VBUS
3
3
1
IO1
VCC
IO2
IO4
GND
IO3
R21
69.8k
VBUS
6
5
4
C2
R1
D2
C4
0.1uF
D2
90.9k
R2
49.9k
5.6V
C2
1000pF
2
U2
U3B
OPA2376AIYZD
12
10
11
6
8
GND
GND
GND
EN
GND
JP1
1
2
C9
0.1uF
GND
5.5V Vmax
J3
Power Inputs
VIN
PWM+_MSP
20
19
18
1
17
16
VDD
VBST
VBST
SW
SW
EN
GAIN1
GAIN0
VPUMP
REXT B1
VPullDown C1
REXT
IN+
IN-
OUT+
OUT-
2
C7
0.1µF
R5
15 REXT
R28
10k
VDRV
R20
R22
5.1k
0
VDIV
3
GND
C5
DNPC6
1000pF
0.047µF
i HV
C8
10µF
Q1
10k
R4
220
GND
13
14
4
5
6
21
GND
GND
GND
PAD
NC
T1
GND
GND
GND
DRV2700RGP
A1
V+
V-
A
R27
5.1k
GND
7
8
FB
A2
9
C10
0.1uF
GND
PVDD
GND
VDRV
GND
D1
VGate
TPD4E004DRY
GND
C3
0.1µF
Filter_Out
B2
V+
V-
B
GND
Ext VIN
2
3
3 D+
DANGER HIGH VOLTAGE
HV
J2
i
HV 1
VDRV
U1
4
D-
VDRV
2
D+
DRV2700 HV
10k
INPUT
1
ID
R3
3900pF
TP1
5
A2
GND
GND
D1
9
C1
J1
USB
VGate
D1
U3A
OPA2376AIYZD
GND
JP2
3 VIN
2
1
VBUS
TLV70033DCKR
U4
VREST
1
C11
10µF
3
IN
OUT
EN
NC
3p3
5
C12
1000pF
4
HV
i
VREST
GND
VBUS
2
HV
R6
100
R7
3.3k
D+
PWM+_MSP
R8
1.40k
2
GND
1
JP4
3 VIN
2
1
PUR
14
15
16
17
18
19
20
21
22
C17
10µF
GND
D4
Green
3p3
GND
TRIG
SW2
R15
511
1
R14
10k
SDA
SCL
2
TRIG
Power Routing
29
30
31
32
33
34
35
36
C20
0.1µF
GND
GND
GND
43
13
C22
0.22µF
C23
0.47µF
VBUS
0.1µF
TP2
TP3
41
42
3p3
C24
C25
0.22µF
7
11
28
GND
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P2.0/TA1.1
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
V18
VCORE
VBUS
VUSB
AVCC1
DVCC1
DVCC2
P5.0/A8/VEREF+
P5.1/A9/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
PU.0/DP
PU.1/DM
PUR
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RST/NMI/SBWTDIO
TEST/SBWTCK
PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
5
6
45
46
8
9
D3
Green
R11
1.24M
R24
750k
RNET1
R25
1.24M
HV i
HV i
DANGER HIGH VOLTAGE
Output Voltage
Selection
RNET2
Rshort = !Cshort
R13
511
4
2
G
G
SW3
RNET1
R18
392
GND
C18
0.01µF
VDIV
VDIV
CNET1
GND
CNET1
VPullDown
C19
6800pF
R16
38
40
39 PUR
33
23
24
25
26
R26
5.11k
D+
R17
CL-SB-22B-02T
CNET2
Rshort = !Cshort
D-
SW4
C21
8200pF
33
J4
R19
9.76k
SBWTDIO
SBWTCK
RNET2
VDIV
3p3
1
2
3
4
5
6
CNET1
CNET2
GND
37
10
44
12
27
MSP430F5510IRGZ
C26
0.1µF
GND
R10
750k
VDIV
ABM8G-12.000MHZ-B4Y-T
12MHz
EN_MSP
1
2
3
4
48
47
R23
1.05M
GND
3
1
C13
22pF
EN
C15
10pF
Y1
U5
R12
1.0Meg
VBUS
3
2
1
C14
10pF
VDRV
R9
1.00M
JP3
MSP430
BSL
SW1
GND
Filter_Out
CL-SB-22B-02T
Switch States
Equivalent Circuit
Ceq
Req
Ceq
Req
SW3
SW4 Lower [nF]Lower[kΩ] Upper [nF]Upper[kΩ] HV [V]
Up
Up
2.710
5.502
0.022
641.97
159
Up
Down
3.717
5.502
0.022
866.20
214
Down Up
4.505
5.502
0.022
1122.30
277
Down Down
8.200
5.502
0.022
2050.00
504
GND
GND
Figure 18. DRV2700EVM-HV500 Schematic
20
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8.2
PCB Layout
Figure 19 shows the DRV2700EVM-HV500 PCB layout.
Figure 19. Top and Bottom Layers
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Reference
8.3
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Bill of Materials
Table 4 lists the DRV2700EVM-HV500 bill of materials.
Table 4. Bill of Materials (1)
Designator
Qty
Part Number
Manufacturer
!PCB
1
C1
1
3900pF
CAP, CERM, 3900 pF, 50 V, +/- 10%, X7R,
0402
0402
AIP041
Any
GRM155R71H392KA01D
Murata
C2
1
1000pF
CAP, CERM, 1000 pF, 10 V, +/- 10%, X5R,
0402
0402
GRM155R61A102KA01D
Murata
C3, C7
2
0.1uF
C4, C9, C10
3
0.1uF
CAP, CERM, 0.1 µF, 25 V, +/- 10%, X7R, 0603
0603
GRM188R71E104KA01D
Murata
CAP CER 0.1UF 16V 5% X7R 0402
0402
GRM155R71C104JA88D
Murata Electronics
North America
C5
1
1000pF
CAP, CERM, 1000 pF, 630 V, +/- 5%,
C0G/NP0, 1206
1206
GRM31B5C2J102JW01L
Murata
C8
C11, C17
1
10uF
CAP, CERM, 10 µF, 25 V, +/- 20%, X5R, 0603
0603
GRM188R61E106MA73
Murata
2
10uF
CAP, CERM, 10uF, 16V, +/-20%, X5R, 0805
0805
0805YD106MAT2A
AVX
C12
1
1000pF
CAP, CERM, 1000pF, 6.3V, +/-10%, X5R, 0402 0402
GRM155R60J102KA01D
Murata
C13
1
22pF
CAP, CERM, 22 pF, 630 V, +/- 10%, X7R,
0805_140
0805_140
C0805C220KBRACTU
Kemet
C14, C15
2
10pF
CAP, CERM, 10pF, 50V, +/-5%, C0G/NP0,
0402
0402
GRM1555C1H100JA01D
Murata
C18
1
0.01uF
CAP, CERM, 0.01 µF, 16 V, +/- 10%, X7R,
0402
0402
GRM155R71C103KA01D
Murata
C19
1
6800pF
CAP, CERM, 6800 pF, 25 V, +/- 10%, X7R,
0402
0402
GRM155R71E682KA01D
Murata
C20, C24, C26
3
0.1uF
CAP, CERM, 0.1uF, 6.3V, +/-10%, X5R, 0402
0402
C1005X5R0J104K
TDK
C21
1
8200pF
CAP, CERM, 8200 pF, 16 V, +/- 10%, X7R,
0402
0402
GRM155R71C822KA01D
Murata
C22, C25
2
0.22uF
CAP, CERM, 0.22uF, 6.3V, +/-10%, X6S, 0402
0402
GRM155C80J224KE01D
Murata
C23
1
0.47uF
CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603
0603
C0603C474K8RACTU
Kemet
D1
1
350V
Diode, Switching, 350 V, 0.225 A, SOT-23
SOT-23
MMBD3004S-7-F
Diodes Inc.
D2
1
5.6V
Diode, Zener, 5.6V, 500 mW, SOD-123
SOD-123
MMSZ5232B-7-F
Diodes Inc.
D3, D4
2
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190KGKT
Lite-On
H1, H2, H3, H4 4
Bumpon, Hemisphere, 0.375 X 0.235, Black
Black Bumpon
SJ61A2
3M
J1
1
Connector, USB Mini B
Connector, Mini B
897-43-005-00-100001
Mill-Max
J2
1
Terminal Block, 2x1, 3.81mm, 24-16 AWG,
10A, 300VAC, TH
2x1 Terminal Block
691214310002
Wurth Elektronik eiSos
J3
1
Header, 2 Pos, 6A, 63V, TH
6.2x8.5x5.54 mm
1725656
Phoenix Contact
J4
1
Receptacle, 50mil, 6x1, R/A, TH
6x1 Receptacle
LPPB061NGCN-RC
Sullins Connector
Solutions
(1)
22
Value
Description
Package Reference
Printed Circuit Board
Alternate Part
Number
Alternate
Manufacturer
-
-
Unless otherwise noted in the Alternate Part Number and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.
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Table 4. Bill of Materials (1) (continued)
Designator
Qty
JP1
JP2, JP3, JP4
Q1
1
R1
Value
Description
Package Reference
Part Number
Manufacturer
1
Header, 100mil, 2x1, Gold, TH
Header, 2x1, 100mil
5-146261-1
TE Connectivity
3
Header, 100mil, 3x1, Tin, TH
Header, 3x1, 100mil, TH
5-146278-3
TE Connectivity
600V
MOSFET, N-CH, 600 V, 0.021 A, SOT-23
SOT-23
BSS127 H6327XTSA2
Infineon Technologies
1
90.9k
RES, 90.9 k, 1%, 0.063 W, 0402
0402
CRCW040290K9FKED
Vishay-Dale
R2
1
49.9k
RES, 49.9 k, 1%, 0.063 W, 0402
0402
CRCW040249K9FKED
Vishay-Dale
R3, R5, R28
3
10k
RES, 10 k, 5%, 0.063 W, 0402
0402
CRCW040210K0JNED
Vishay-Dale
R4
1
220
RES, 220, 5%, 0.063 W, 0402
0402
CRCW0402220RJNED
Vishay-Dale
R6
1
100
RES, 100 ohm, 1%, 0.063W, 0402
0402
CRCW0402100RFKED
Vishay-Dale
R7
1
3.3k
RES, 3.3k ohm, 5%, 0.063W, 0402
0402
CRCW04023K30JNED
Vishay-Dale
R8
1
1.40k
RES, 1.40k ohm, 1%, 0.063W, 0402
0402
CRCW04021K40FKED
Vishay-Dale
R9
1
1.00Meg
RES, 1.00 M, 1%, 0.125 W, 0805
0805
CRCW08051M00FKEA
Vishay-Dale
R10, R24
2
750k
RES, 750 k, 0.1%, 0.125 W, 0805
0805
RT0805BRD07750KL
Yageo America
R11, R25
2
1.24Meg
RES, 1.24 M, 1%, 0.125 W, 0805
0805
CRCW08051M24FKEA
Vishay-Dale
R12
1
1.0Meg
RES, 1.0Meg ohm, 5%, 0.063W, 0402
0402
CRCW04021M00JNED
Vishay-Dale
R13, R15
2
511
RES, 511 ohm, 1%, 0.063W, 0402
0402
CRCW0402511RFKED
Vishay-Dale
R14
1
10k
RES, 10k ohm, 5%, 0.063W, 0402
0402
CRCW040210K0JNED
Vishay-Dale
R16, R17
2
33
RES, 33 ohm, 5%, 0.063W, 0402
0402
CRCW040233R0JNED
Vishay-Dale
R18
1
392
RES, 392, 1%, 0.063 W, 0402
0402
CRCW0402392RFKED
Vishay-Dale
R19
1
9.76k
RES, 9.76k ohm, 1%, 0.063W, 0402
0402
CRCW04029K76FKED
Vishay-Dale
R20
1
0
RES, 0, 5%, 0.063 W, 0402
0402
RC0402JR-070RL
Yageo America
R21
1
69.8k
RES, 69.8 k, 1%, 0.063 W, 0402
0402
CRCW040269K8FKED
Vishay-Dale
R22, R27
2
5.1k
RES, 5.1 k, 5%, 0.125 W, 0805
0805
CRCW08055K10JNEA
Vishay-Dale
R23
1
1.05Meg
RES, 1.05 M, 1%, 0.125 W, 0805
0805
CRCW08051M05FKEA
Vishay-Dale
R26
1
5.11k
RES, 5.11 k, 1%, 0.063 W, 0402
0402
CRCW04025K11FKED
Vishay-Dale
SH-JP1, SHJP2, SH-JP3,
SH-JP4
4
1x2
Shunt, 2mm, Gold plated, Black
2mm Shunt, Closed Top
2SN-BK-G
Samtec
SW1, SW2
2
Switch, Tactile, SPST-NO, 0.05A, 12V, SMT
Switch, 4.4x2x2.9 mm
TL1015AF160QG
E-Switch
SW3, SW4
2
Switch, Slide, DPDT, 0.2A, GULL, 12V, SMD
SMD, 6-Leads, Body
8.5x3.5mm, Pitch 2.5mm
CL-SB-22B-02T
Copal Electronics
T1
1
7uH
Transformer, Xenon Flash, 7uH, SMT
3.2x1.5x2.5mm
ATB322515-0110
TDK
TP1
1
Orange
Test Point, Multipurpose, Orange, TH
Orange Multipurpose
Testpoint
5013
Keystone
TP2, TP3
2
Black
Test Point, Multipurpose, Black, TH
Black Multipurpose Testpoint
5011
Keystone
U1
1
4-CHANNEL ESD-PROTECTION ARRAY FOR
HIGH-SPEED DATA INTERFACES, DRY006A
DRY0006A
TPD4E004DRY
Texas Instruments
None
U2
1
Piezo Driver with Integrated Boost Converter,
RGP0020D
RGP0020D
DRV2700RGP
Texas Instruments
Texas
Instruments
SLOU407A – April 2015 – Revised May 2015
Submit Documentation Feedback
Alternate Part
Number
Alternate
Manufacturer
None
DRV2700EVM-HV500 High Voltage Piezo Driver Evaluation Kit
Copyright © 2015, Texas Instruments Incorporated
23
Reference
www.ti.com
Table 4. Bill of Materials (1) (continued)
Designator
Qty
U3
Description
Package Reference
Part Number
Manufacturer
1
Low-Noise, Low Quiescent Current, Precision
Operational Amplifier e-trim Series
YZD0008ANAP
OPA2376AIYZD
Texas Instruments
U4
1
Single Output LDO, 200 mA, Fixed 3.3 V
Output, 2 to 5.5 V Input, with Low IQ, 5-pin
SC70 (DCK), -40 to 125 degC, Green (RoHS &
no Sb/Br)
DCK0005A
TLV70033DCKR
Texas Instruments
U5
1
Mixed Signal MicroController, RGZ0048A
RGZ0048A
MSP430F5510IRGZ
Texas Instruments
Y1
1
CRYSTAL 12.000MHZ 10PF SMD
3.2x0.55x2.5mm
ABM8G-12.000MHZ-B4Y-T
Abracon Corporation
C6
0
CAP, CERM, 0.047 µF, 630 V, +/- 10%, X7R,
1210
1210
GRM32DR72J473KW01L
Murata
FID1, FID2,
FID3
0
N/A
N/A
24
Value
0.047uF
Fiducial mark. There is nothing to buy or mount. Fiducial
DRV2700EVM-HV500 High Voltage Piezo Driver Evaluation Kit
Alternate Part
Number
Alternate
Manufacturer
Texas
Instruments
Equivalent
None
None
SLOU407A – April 2015 – Revised May 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Revision History
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Revision History
Changes from Original (April 2015) to A Revision .......................................................................................................... Page
•
Changed GUI Interface image.
........................................................................................................
10
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
SLOU407A – April 2015 – Revised May 2015
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Revision History
Copyright © 2015, Texas Instruments Incorporated
25
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
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www.ti.com/automotive
Amplifiers
amplifier.ti.com
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Data Converters
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www.ti.com/computers
DLP® Products
www.dlp.com
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Copyright © 2015, Texas Instruments Incorporated