LM10692
Power Management Unit for
Po
Ma wer
Un nage
it
m
LM
106
92
ent
SandForce SF3700 SSD Controllers
Product Bulletin
High Efficiency Solution Optimized for M.2 Solid State Drives
Product Highlights
Overview
The LM10692 from Texas Instruments
is a fully integrated power management
unit (PMU) designed for SandForce
SF3700 controllers. This ultra-small,
reliable/flexible, and highly efficient
power solution replaces up to six (6)
discrete components typically used in
these drives. It functions cooperatively
with an SF3700 controller to optimize
the supply voltage for low power
conditions to obtain maximum system
efficiency and provide power for
NAND flash.
• Six highly efficient SPI-
programmable buck regulators
This design scheme delivers longer
battery life for portable devices
with SSDs. The chip uses I2C
interface to communicate with the
controller to achieve output voltage
programmability. Unlike discrete
solutions available today, the highly
integrated, all-in-one PMU solution
from TI delivers a higher performanceto-cost ratio and is specifically
designed and optimized with features
geared for SSD and flash drives using
the SF3700 controller.
• Sleep mode saves power during
idle times
• Automatic internal soft-start on
each supply limits startup
inrush current
• Phase-shifted buck operation
reduces input current ripple and
capacitor size
• Independent Enable input pins
and Power Good output pins for
AON (Always-On) and CPE
(Core Power) rails
Key Specifications
1.8V_AON
SandForce
SF3700 SSD
Controller
IO _VIN
LM10692
• ±1% feedback voltage accuracy
• Up to 95% efficient buck
regulators
EN _CPE
EN _AON
PG _AON
VIN_MODE
System
Control
PG _CPE
PFAIL
Power
Supply
2.5V - 5.5V
22 µF
I2C
AVIN
2.2 µF
4.7 µF
B1_SW
B4_VIN
10 µF
B5_VIN
10 µF
Control Logic and Registers
PGND
B2_SW
BUCK 2
B3_SW
BUCK
B4_SW
4
B6_SW
BUCK 6
B6_FB
LM10692 typical application diagram
1.8V AON
22 µF
1.8V CPE
1.1V/800 mA
2.2 µH
B5_FB
B6_VIN
10 µF
1.8V/ 2.5A
1.0 µH
B4_FB
B5_SW
2.5V AON
10 µF
1.8V/200 mA
2.2 µH
B3_FB
BUCK 5
PGND
2.5V/200 mA
2.2 µH
B2_FB
BUCK 3
2.85V / 3.3V
CPE
22 µF
B1_FB
B2_VIN
B3_VIN
Bypass Mode 2.5A
BUCK 1
PGND
4.7 µF
10 µF
SCL
AGND
B1_VIN
NAND
Flash
SDA
10 µF
1.1V AON
1.1V/ 2.5A
1.0 µH
22 µF
1.1V CPE
1.8V CPE
• 2 MHz switching frequency for
smaller inductor size
• 36-pin 5 x 5 mm QFN package
Features and Benefits
Ideal Power Solution for M.2 SSDs
• Integrated all-in-one power solution saves
valuable board space
• 2 MHz switching frequency for smaller
inductor size
• Minimum number of external components
• High bandwidth provides fast turn-on without
overshoot
• No loop compensation needed
Regulator Table
Regulator
Programmable VOUT (V)
Maximum IOUT
Description
Buck1
1.75 to 3.3
2.5A
2.85 CPE
Buck2
1.0 to 2.55
200 mA
2.5V AON
Buck3
0.8 to 2.35
200 mA
1.8V AON
Buck4
0.8 to 2.35
2.5A
1.8V CPE
Buck5
0.8 to 1.575
0.8A
1.1V AON
Buck6
0.8 to 1.575
2.5A
1.1V CPE
• PFM mode for low load high efficiency operation
Features Optimized for SSDs
• Built-in over-current limit and thermal protection
improves safety
• All six supply voltages offer user-programmable
options for maximum flexibility (DVS)
• Customizable startup sequencing for greater
flexibility
• Bypass mode on Buck1 eliminates inductor for
3.3V M.2 applications
• Easy-to-interface GUI for accelerated design
• Integrated solution leads to higher overall reliability
of SSD
• Sleep mode via I2C control
• Input power monitor PFAIL
• Fast active discharge
• Low quiescent current conserves battery life
LM10692 evaluation board
Visit ti.com/LM10692 for more product information.
Complete LM10692 PMU solution size is
13.5 mm x 9.3 mm
Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms
and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders.
TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The
publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty, or endorsement thereof.
The platform bar is a trademark of Texas Instruments.
©2014 Texas Instruments Incorporated
SLPT043
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
很抱歉,暂时无法提供与“LM10692BRMYT”相匹配的价格&库存,您可以联系我们找货
免费人工找货