LM10692RMYT

LM10692 Power Management Unit for Po Ma wer Un nage it m LM 106 92 ent SandForce SF3700 SSD Controllers Product Bulletin High Efficiency Solution Optimized for M.2 Solid State Drives Product Highlights Overview The LM10692 from Texas Instruments is a fully integrated power management unit (PMU) designed for SandForce SF3700 controllers. This ultra-small, reliable/flexible, and highly efficient power solution replaces up to six (6) discrete components typically used in these drives. It functions cooperatively with an SF3700 controller to optimize the supply voltage for low power conditions to obtain maximum system efficiency and provide power for NAND flash. • Six highly efficient SPI- programmable buck regulators This design scheme delivers longer battery life for portable devices with SSDs. The chip uses I2C interface to communicate with the controller to achieve output voltage programmability. Unlike discrete solutions available today, the highly integrated, all-in-one PMU solution from TI delivers a higher performanceto-cost ratio and is specifically designed and optimized with features geared for SSD and flash drives using the SF3700 controller. • Sleep mode saves power during idle times • Automatic internal soft-start on each supply limits startup inrush current • Phase-shifted buck operation reduces input current ripple and capacitor size • Independent Enable input pins and Power Good output pins for AON (Always-On) and CPE (Core Power) rails Key Specifications 1.8V_AON SandForce SF3700 SSD Controller IO _VIN LM10692 • ±1% feedback voltage accuracy • Up to 95% efficient buck regulators EN _CPE EN _AON PG _AON VIN_MODE System Control PG _CPE PFAIL Power Supply 2.5V - 5.5V 22 µF I2C AVIN 2.2 µF 4.7 µF B1_SW B4_VIN 10 µF B5_VIN 10 µF Control Logic and Registers PGND B2_SW BUCK 2 B3_SW BUCK B4_SW 4 B6_SW BUCK 6 B6_FB LM10692 typical application diagram 1.8V AON 22 µF 1.8V CPE 1.1V/800 mA 2.2 µH B5_FB B6_VIN 10 µF 1.8V/ 2.5A 1.0 µH B4_FB B5_SW 2.5V AON 10 µF 1.8V/200 mA 2.2 µH B3_FB BUCK 5 PGND 2.5V/200 mA 2.2 µH B2_FB BUCK 3 2.85V / 3.3V CPE 22 µF B1_FB B2_VIN B3_VIN Bypass Mode 2.5A BUCK 1 PGND 4.7 µF 10 µF SCL AGND B1_VIN NAND Flash SDA 10 µF 1.1V AON 1.1V/ 2.5A 1.0 µH 22 µF 1.1V CPE 1.8V CPE • 2 MHz switching frequency for smaller inductor size • 36-pin 5 x 5 mm QFN package Features and Benefits Ideal Power Solution for M.2 SSDs • Integrated all-in-one power solution saves valuable board space • 2 MHz switching frequency for smaller inductor size • Minimum number of external components • High bandwidth provides fast turn-on without overshoot • No loop compensation needed Regulator Table Regulator Programmable VOUT (V) Maximum IOUT Description Buck1 1.75 to 3.3 2.5A 2.85 CPE Buck2 1.0 to 2.55 200 mA 2.5V AON Buck3 0.8 to 2.35 200 mA 1.8V AON Buck4 0.8 to 2.35 2.5A 1.8V CPE Buck5 0.8 to 1.575 0.8A 1.1V AON Buck6 0.8 to 1.575 2.5A 1.1V CPE • PFM mode for low load high efficiency operation Features Optimized for SSDs • Built-in over-current limit and thermal protection improves safety • All six supply voltages offer user-programmable options for maximum flexibility (DVS) • Customizable startup sequencing for greater flexibility • Bypass mode on Buck1 eliminates inductor for 3.3V M.2 applications • Easy-to-interface GUI for accelerated design • Integrated solution leads to higher overall reliability of SSD • Sleep mode via I2C control • Input power monitor PFAIL • Fast active discharge • Low quiescent current conserves battery life LM10692 evaluation board Visit ti.com/LM10692 for more product information. Complete LM10692 PMU solution size is 13.5 mm x 9.3 mm Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty, or endorsement thereof. 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