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LP358, LP2904
SLOS475A – AUGUST 2005 – REVISED MAY 2017
Ultra-Low Power Dual Operational Amplifiers
1 Features
3 Description
•
•
•
•
•
•
The LP358 and LP2904 devices are dual low-power
operational amplifiers especially suited for batteryoperated applications. Good input specifications and
wide supply-voltage range still are achieved despite
the ultra-low supply current. Single-supply operation
is achieved with an input common-mode range that
includes GND.
1
Low Supply Current: 54 μA (Typical)
Low Offset Voltage: 2 mV (Typical)
Low Input Bias Current: 2 nA (Typical)
Input Common-Mode to GND
Wide Supply Voltage: 3 V < VCC < 32 V
Pin Compatible With LM358 and LM2904
2 Applications
•
•
•
•
•
LCD Displays
Portable Instrumentation
Sensor and Metering Equipment
Consumer Electronics (MP3 Players, Toys)
Power Supplies
The LP358 and LP2904 devices are ideal in
applications where wide supply voltages and low
power are more important than speed and bandwidth.
These applications include portable instrumentation,
LCD displays, consumer electronics (MP3 players,
toys, and so forth), and power supplies.
Device Information(1)
PART NUMBER
LP2904
LP358
PACKAGE
SOIC (8)
BODY SIZE (NOM)
4.90 × 3.91
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Symbol (Each Amplifier)
Schematic (Each Amplifier)
VCC
−
IN−
OUT
+
IN+
IN−
OUT
IN+
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP358, LP2904
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
6
6
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics: LP358 ..............................
Electrical Characteristics: LP2904 ............................
Operating Characteristics..........................................
Typical Characteristics.......................................... 7
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9
Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application .................................................... 9
10 Power Supply Recommendations ..................... 11
11 Layout................................................................... 12
11.1 Layout Guidelines ................................................. 12
11.2 Layout Example .................................................... 12
12 Device and Documentation Support ................. 13
12.1
12.2
12.3
12.4
12.5
12.6
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
13
13
13
13
13
13
13 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
Changes from Original (August 2005) to Revision A
Page
•
Added table of contents and Revision History section .......................................................................................................... 1
•
Deleted Ordering Information table ....................................................................................................................................... 1
•
Changed low supply current in Features list from 85 µA to 54 µA ........................................................................................ 1
•
Added Device Information table and table note ..................................................................................................................... 1
•
pinout image and pinout information in Pin Configuration and Functions section ................................................................ 3
•
Deleted θJA values and table notes from Absolute Maximum Ratings table and added information to Thermal
Information table ..................................................................................................................................................................... 4
•
Added Recommended Operating Conditions table ............................................................................................................... 4
•
Added Thermal Information table .......................................................................................................................................... 4
•
Reformatted Electrical Characteristics table .......................................................................................................................... 5
•
Changed typical supply current value (TA = 25°C) from 85 µA to 54 µA in Electrical Characteristics: LP358 table.............. 5
•
Changed maximum supply current value (TA = 25°C) from 150 µA to 75 µA in Electrical Characteristics: LP358 table ...... 5
•
Added table note to IOS, VCC parameter in Electrical Characteristics: LP358 table ................................................................. 5
•
Changed typical supply current value (TA = 25°C) from 85 µA to 54 µA in Electrical Characteristics: LP2904 table............ 6
•
Changed maximum supply current value (TA = 25°C) from 150 µA to 75 µA in Electrical Characteristics: LP2904 table .... 6
•
Added table note to IOS, VCC parameter in Electrical Characteristics: LP2904 table ............................................................... 6
•
Added Typical Characteristics graphs ................................................................................................................................... 7
•
Added Detailed Description section ....................................................................................................................................... 8
•
Added Application and Implementation section .................................................................................................................... 9
•
Deleted "of the same magnitude" text from Typical Application section ............................................................................... 9
•
Added Power Supply Recommendations section ............................................................................................................... 11
•
Added Layout section .......................................................................................................................................................... 12
•
Added Device and Documentation Support and Mechanical, Packaging, and Orderable Information sections.................. 13
•
Added Related Links table.................................................................................................................................................... 13
2
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5 Pin Configuration and Functions
D, DGK Package
8-Pin SOIC
Top View
1OUT
1
8
VCC
1IN±
2
7
2OUT
1IN+
3
6
2IN±
GND
4
5
2IN+
Not to scale
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
GND
4
—
Ground or negative power supply
1IN+
3
I
Channel 1 noninverting input
1IN–
2
I
Channel 1 inverting input
1OUT
1
O
Channel 1 output
2IN+
5
I
Channel 2 noninverting input
2IN–
6
I
Channel 2 inverting input
2OUT
7
O
Channel 2 output
VCC
8
—
Positive power supply
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6 Specifications
6.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
Supply voltage range (2)
VCC
V
±32
V
32
V
(3)
VID
Differential input voltage
VI
Input voltage (either input)
–0.3
Duration of output short circuit (one amplifier) to ground at (or below) TA =
25°C, VCC ≤ 15 V (4)
Unlimited
Operating virtual temperature, TJ
Storage temperature, Tstg
(1)
(2)
(3)
(4)
UNIT
±16 or 32
–65
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
Differential voltages are at IN+, with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
VCM
Common-mode voltage
TA
LP358
Operating free-air temperature
LP2904
MIN
MAX
3
32
UNIT
V
0
VCC – 1.5 V
V
0
70
–40
85
°C
6.4 Thermal Information
THERMAL METRIC (1)
(2) (3)
LP358
LP2904
D, DGK
(SOIC)
D, DGK (SOIC)
8 PINS
8 PINS
118.8
118.8
°C/W
UNIT
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
71.7
71.7
°C/W
RθJB
Junction-to-board thermal resistance
68.6
68.6
°C/W
ψJT
Junction-to-top characterization parameter
23.3
23.3
°C/W
ψJB
Junction-to-board characterization parameter
67.7
67.7
°C/W
(1)
(2)
(3)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
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6.5 Electrical Characteristics: LP358
TA = 25°C, VCC = 5 V, VIC = VCC / 2, RL = 100 kΩ to GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
(1) (2)
MIN
TA = 25°C
VIO
Input offset voltage
IIB
Input bias current
IIO
Input offset current
AV
Large-signal voltage gain
RL = 10 kΩ to GND,
VCC = 30 V
TA = 25°C
50
TA = Full range
40
CMRR
Common-mode rejection ratio
VCC = 30 V,
VIC = 0 V to VCC – 1.5 V
TA = 25°C
80
TA = Full range
75
kVSR
Power-supply rejection ratio
VCC = 5 V to 30 V
TA = 25°C
80
TA = Full range
75
ICC
Supply current
RL = ∞
VOH
Output voltage swing (high)
IL = 0.35 mA to GND
VIC = 0 V
TA = 25°C
VOL
Output voltage swing (low)
IL = 0.35 mA from VCC
VIC = 0 V
TA = 25°C
IO
Output source current
VO = 3 V, VID = 1 V
(3)
MAX
2
4
TA = Full range
2
TA = Full range
0.2
TA = Full range
nA
2
nA
100
TA = Full range
V/mV
90
dB
90
54
TA = Full range
V
75
µA
125
3.4
3.6
V
VCC – 1.9
0.82
TA = Full range
1
TA = 25°C
7
TA = Full range
4
TA = 25°C
4
TA = Full range
3
TA = 25°C
2
TA = Full range
1
TA = 25°C
0.7
V
10
mA
5
mA
4
20
35
IOS,GND
Output short to GND
IOS,VCC
Output short to VCC
αVIO
Input offset voltage drift
TA = 25°C
10
μV/°C
αIIO
Input offset current drift
TA = 25°C
10
pA/°C
(1)
(2)
(3)
(4)
(4)
VID = 1 V
10
4
TA = 25°C
VO = 1.5 V, VID = –1 V,
VIC = 0 V
mV
20
TA = 25°C
Output sink current
UNIT
9
TA = 25°C
VO = 1.5 V, VID = –1 V
IO
TYP
VID = –1 V
TA = Full range
mA
40
TA = 25°C
15
TA = Full range
30
mA
45
For full-range temperature limits: VCC = 3 V to 32 V, VICR = 0 V to VCC – 1.5 V (unless otherwise noted)
Full range is 0°C to 70°C for LP358.
All typical values are at TA = 25°C.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
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6.6 Electrical Characteristics: LP2904
TA = 25°C, VCC = 5 V, VIC = VCC / 2, RL = 100 kΩ to GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
(1) (2)
MIN
TA = 25°C
(3)
MAX
2
VIO
Input offset voltage
IIB
Input bias current
IIO
Input offset current
AV
Large-signal voltage gain
RL = 10 kΩ to GND,
VCC = 30 V
TA = 25°C
40
TA = Full range
30
CMRR
Common-mode rejection ratio
VCC = 30 V,
VIC = 0 V to VCC – 1.5 V
TA = 25°C
80
TA = Full range
75
kVSR
Power-supply rejection ratio
VCC = 5 V to 30 V
TA = 25°C
80
TA = Full range
75
ICC
Supply current
RL = ∞
VOH
Output voltage swing (high)
IL = 0.35 mA to GND,
VIC = 0 V
TA = 25°C
VOL
Output voltage swing (low)
IL = 0.35 mA from VCC,
VIC = 0 V
TA = 25°C
IO
Output source current
VO = 3 V, VID = 1 V
4
TA = Full range
10
TA = 25°C
2
20
TA = Full range
40
TA = 25°C
0.5
4
TA = Full range
8
70
Output sink current
VO = 1.5 V, VID = –1 V,
VIC = 0 V
75
138
3.6
TA = Full range
1
TA = 25°C
7
TA = Full range
4
TA = 25°C
4
TA = Full range
3
TA = 25°C
2
TA = Full range
1
µA
V
VCC – 1.9
0.82
nA
V
54
3.4
nA
0.7
V
10
mA
5
mA
4
TA = 25°C
20
35
IOS,GND
Output short to GND
IOS,VCC
Output short to VCC
αVIO
Input offset voltage drift
TA = 25°C
10
μV/°C
αIIO
Input offset current drift
TA = 25°C
10
pA/°C
(1)
(2)
(3)
(4)
(4)
VID = 1 V
TA = Full range
mV
dB
90
TA = Full range
UNIT
V/mV
90
TA = 25°C
VO = 1.5 V, VID = –1 V
IO
TYP
VID = –1 V
TA = Full range
40
TA = 25°C
15
30
TA = Full range
45
mA
mA
For full-range temperature limits: VCC = 3 V to 32 V, VICR = 0 V to VCC – 1.5 V (unless otherwise noted)
Full range is –40°C to +85°C for LP2904.
All typical values are at TA = 25°C.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
6.7 Operating Characteristics
over operating free-air temperature range (unless otherwise noted)
MIN
GBW
Gain bandwidth product
SR
Slew rate
6
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NOM
MAX
UNIT
100
kHz
50
V/ms
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7 Typical Characteristics
See Recommended Operating Conditions for device temperature limits.
10
-40 qC
0 qC
25 qC
0
70 qC
85 qC
125 qC
Sinking Output Current (mA)
Sourcing Output Current (mA)
5
-5
-10
-15
-20
-25
-30
8
6
4
2
-40 qC
0 qC
25 qC
0
70 qC
85 qC
125 qC
-2
0
1
2
3
Output Voltage (V)
4
5
0
1
2
3
Output Voltage (V)
VCC = 5 V
4
5
VCC = 5 V
Figure 1. Sourcing Output Current vs Output Voltage
Figure 2. Sinking Output Current vs Output Voltage
120
Supply Current (PA)
100
80
60
40
-40C
0C
25C
20
70C
85C
125C
0
0
5
10
15
20
Supply Voltage (V)
25
30
No load
Figure 3. Supply Current vs Supply Voltage
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8 Detailed Description
8.1 Overview
The LP358 and LP2904 devices consist of two independent, low-power, unity-gain, stable operational amplifiers
designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is
possible. The input voltage range includes ground and extends up to VCC – 1.5 V. The output cannot drive to
either rail, however, loads terminated to ground can support VOL as low as ground. Loads to VCC can support VOH
as high as VCC.
8.2 Functional Block Diagram
VCC
OUT
IN−
IN+
8.3 Feature Description
8.3.1 Power Efficient Output Stage
Darlington source driver and emitter follower sink driver will pass bias current through the load to keep device
quiescent current independent of load current.
8.3.2 Input Common-Mode Range
The valid common-mode range is from device ground to VCC – 1.5 V. Inputs may exceed VCC up to the maximum
VCC without device damage. At least one input must be in the valid input common-mode range for output to be
correct phase. If both inputs exceed valid range then output phase is undefined. If either input is less than –0.3 V
then input current must be limited to 1 mA and output phase is undefined.
8.4 Device Functional Modes
These devices are powered on when the supply is connected. This device can be operated as a single-supply
operational amplifier or dual-supply amplifier depending on the application.
8
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LP358 and LP2904 operational amplifiers are useful in a wide range of signal conditioning applications due
to the wide VCC range. Inputs can be powered before VCC for flexibility in multiple supply circuits.
9.2 Typical Application
A typical application for an operational amplifier in an inverting amplifier. This amplifier takes a positive voltage
on the input, and makes the voltage a negative voltage. In the same manner, the amplifier also makes negative
voltages positive.
RF
RI
Vsup+
VOUT
+
VIN
VsupCopyright © 2016, Texas Instruments Incorporated
Figure 4. Application Schematic
9.2.1 Design Requirements
The supply voltage must be selected such that it is larger than the input voltage range and output range. For
instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to
accommodate this application
9.2.2 Detailed Design Procedure
Determine the gain required by the inverting amplifier using Equation 1 and Equation 2.
VOUT
AV
VIN
1.8
AV
3.6
0.5
(1)
(2)
Once the desired gain is determined, select a value for RI or RF. Selecting a value in the kΩ range is desirable
because the amplifier circuit uses currents in the milliamp range. This ensures the part does not draw too much
current. This example uses 10 kΩ for RI, so 36 kΩ is used for RF; this is determined by Equation 3.
RF
AV
(3)
RI
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Typical Application (continued)
9.2.3 Application Curves
2
VIN
1.5
VOUT
1
Volts
0.5
0
-0.5
-1
-1.5
-2
0
0.5
1
Time (ms)
1.5
2
Figure 5. Input and Output Voltages of the Inverting Amplifier
10
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10 Power Supply Recommendations
CAUTION
Supply voltages larger than 32 V can permanently damage the device (see Absolute
Maximum Ratings).
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, see Layout.
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11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance
power sources local to the analog circuitry.
– Connect low-ESR, 0.1-μF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for singlesupply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current. For more detailed information, refer to
Circuit Board Layout Techniques, (SLOA089).
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace.
• Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Layout Example.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
11.2 Layout Example
VIN
RIN
RG
+
VOUT
RF
Figure 6. Operational Amplifier Schematic for Noninverting Configuration
Place components close to
device and to each other to
reduce parasitic errors
Run the input traces as far
away from the supply lines
as possible
VS+
RF
OUT1
VCC+
GND
IN1í
OUT2
VIN
IN1+
IN2í
VCCí
IN2+
RG
GND
RIN
Use low-ESR, ceramic
bypass capacitor
Only needed for
dual-supply
operation
GND
VS(or GND for single supply)
Ground (GND) plane on another layer
Figure 7. Operational Amplifier Board Layout for Noninverting Configuration
12
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12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LP358
Click here
Click here
Click here
Click here
Click here
LP2904
Click here
Click here
Click here
Click here
Click here
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14
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Copyright © 2005–2017, Texas Instruments Incorporated
Product Folder Links: LP358 LP2904
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LP2904D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LP2904
LP2904DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LP2904
LP358D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
LP358
LP358DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
LP358
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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