OPA1632DGN

OPA1632 SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 High-Performance, Fully-Differential AUDIO OP AMP FEATURES D D D D D SUPERIOR SOUND QUALITY ULTRA LOW DISTORTION: 0.000022% LOW NOISE: 1.3nV/√Hz HIGH SPEED: − Slew Rate: 50V/µs − Gain Bandwidth: 180MHz FULLY DIFFERENTIAL ARCHITECTURE: − Balanced Input and Output Converts Single-Ended Input to Balanced DESCRIPTION The OPA1632 is a fully-differential amplifier designed for driving high-performance audio analog-to-digital converters (ADCs). It provides the highest audio quality, with very low noise and output drive characteristics optimized for this application. The OPA1632’s excellent gain bandwidth of 180MHz and very fast slew rate of 50V/µs produce exceptionally low distortion. Very low input noise of 1.3nV/√Hz further ensures maximum signal-to-noise ratio and dynamic range. The flexibility of the fully differential architecture allows for easy implementation of a single-ended to fully-differential output conversion. Differential output reduces even-order harmonics and minimizes common-mode noise interference. The OPA1632 provides excellent performance when used to drive high-performance audio ADCs such as the PCM1804. A shutdown feature also enhances the flexibility of this amplifier. The OPA1632 is available in an SO-8 package and a thermally-enhanced MSOP-8 PowerPAD package. Differential Output D WIDE SUPPLY RANGE: ±2.5V to ±16V D SHUTDOWN TO CONSERVE POWER APPLICATIONS D D D D D AUDIO ADC DRIVER BALANCED LINE DRIVER BALANCED RECEIVER ACTIVE FILTER PREAMPLIFIER RELATED DEVICES OPAx134 OPA627/637 OPAx227/x228 High-Performance Audio Amplifiers Precision High-Speed DiFET Amplifiers Low-Noise Bipolar Amplifiers THD + NOISE vs FREQUENCY 0.001 +15V Digital Output VCOM Gain = +1 RF = 348Ω VO = 3Vrms Differential I/O VIN+ VOCM VIN− VIN− VIN+ THD + Noise (%) 0.0001 RL = 600Ω RL = 2kΩ 0.00001 − 15V Typical ADC Circuit 10 100 1000 Frequency (Hz) 10k 100k Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  2003−2006, Texas Instruments Incorporated www.ti.com OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD SO-8 OPA1632 MSOP-8 PowerPAD DGN −40°C to +85°C 1632 PACKAGE DRAWING D SPECIFIED TEMPERATURE RANGE −40°C to +85°C PACKAGE MARKING OPA1632 ORDERING NUMBER OPA1632D OPA1632DR OPA1632DGN OPA1632DGNR TRANSPORT MEDIA, QUANTITY Rails, 100 Tape and Reel, 2500 Rails, 100 Tape and Reel, 2500 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS(1)(2) over operating free-air temperature range unless otherwise noted. Supply Voltage, ±VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±16.5V Input Voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VS Output Current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mA Differential Input Voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3V Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Operating Free-Air Temperature Range . . . . . . . . . . . . . . . −40°C to +85°C Storage Temperature Range, TSTG . . . . . . . . . . . . . . . . . −65°C to +150°C ESD Ratings: Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV Charge Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PIN CONFIGURATION Top View MSOP, SO (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the PowerPAD thermally enhanced package. OPA1632 VIN− VOCM V+ VOUT+ 1 2 3 4 8 7 6 5 VIN+ Enable V− VOUT− 2 OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 ELECTRICAL CHARACTERISTICS: VS = ±15V VS = ±15V: RF = 390Ω, RL = 800Ω, and G = +1, unless otherwise noted. PARAMETER OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply, DC INPUT BIAS CURRENT Input Bias Current Input Offset Current NOISE Input Voltage Noise Input Current Noise INPUT VOLTAGE Common-Mode Input Range Common-Mode Rejection Ratio, DC INPUT IMPEDANCE Input Impedance (each input pin) OPEN-LOOP GAIN Open-Loop Gain , DC FREQUENCY RESPONSE Small-Signal Bandwidth (VO = 100mVPP, Peaking < 0.5 dB) G = +1, RF= 348Ω G = +2, RF = 602Ω G = +5, RF = 1.5kΩ G = +10, RF = 3.01kΩ G = +1, VO = 100mVPP VO = 100mVPP G = +2, VO = 20VPP G = +1 G = +1, VO = 5V Step G = +1, VO = 2V Step G = +1, VO = 2V Step G = +1, f = 1kHz, VO = 3Vrms RL = 600Ω RL = 2kΩ RL = 600Ω RL = 2kΩ G = +1, SMPTE/DIN, VO = 2VPP RL = 600Ω RL = 2kΩ RL = 600Ω RL = 2kΩ THD < 0.01%, RL = 2kΩ RL = 2kΩ RL = 800Ω Sourcing/Sinking G = +1, f = 100kHz (V+) − 1.9 (V+) − 4.5 +50/−60 66 CONDITIONS MIN OPA1632 TYP ±0.5 ±5 13 2 ±100 f = 10 kHz f = 10 kHz (V−) + 1.5 74 1.3 0.4 (V+) − 1 90 34 || 4 78 180 90 36 18 40 0.5 800 50 100 75 200 0.0003 0.000022 0.000059 0.000043 0.00008 0.00005 0.0001 0.0007 20.0 (V−) + 1.9 (V−) + 4.5 85 0.3 (V−) + 2 (V−) + 0.8 0.85 2 2 ±15 ±2.5 IQ Per Channel −40 −40 −65 qJA MAX ±3 UNITS mV µV/_C µV/V µA nA nV/√Hz pA/√Hz V dB MΩ || pF dB MHz MHz MHz MHz MHz dB kHz V/µs ns ns ns % % % % % % % % VPP V V mA Ω V V mA µs µs V V mA _C _C _C _C/W dVos/dT PSRR IB IOS 316 6 ±500 Bandwidth for 0.1dB Flatness Peaking at a Gain of 1 Large-Signal Bandwidth Slew Rate (25% to 75% ) Rise and Fall Time Settling Time to 0.1% 0.01% Total Harmonic Distortion + Noise Differential Input/Output Differential Input/Output Single-Ended In/Differential Out Single-Ended In/Differential Out Intermodulation Distortion Differential Input/Output Differential Input/Output Single-Ended In/Differential Out Single-Ended In/Differential Out Headroom OUTPUT Voltage Output Swing Short-Circuit Current Closed-Loop Output Impedance POWER-DOWN(1) Enable Voltage Threshold Disable Voltage Threshold Shutdown Current Turn-On Delay Turn-Off Delay POWER SUPPLY Specified Operating Voltage Operating Voltage Quiescent Current TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance ISC VENABLE = −15V Time for IQ to Reach 50% Time for IQ to Reach 50% 1.5 ±16 17.1 +85 +125 +150 14 200 (1) Amplifier has internal 50kΩ pull-up resistor to VCC+ pin. This enables the amplifier with no connection to shutdown pin. 3 OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 TYPICAL CHARACTERISTICS At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted. THD + NOISE vs FREQUENCY 0.001 Gain = +1 RF = 348Ω VO = 3Vrms Differential I/O 0.001 THD + NOISE vs FREQUENCY Gain = +1 RF = 348Ω VO = 3Vrms Single− Ended Input Differential Output THD + Noise (%) 0.0001 THD + Noise (%) 0.0001 RL = 600Ω RL = 2kΩ RL = 600Ω RL = 2kΩ 0.00001 10 100 1k Frequency (Hz) 10k 100k 0.00001 10 100 1k Frequency (Hz) 10k 100k THD + NOISE vs OUTPUT VOLTAGE 0.1 Gain = +1 RF = 348Ω f = 1kHz Differential I/O THD + Noise (%) 0.001 RL = 600Ω 0.01 THD + NOISE vs OUTPUT VOLTAGE 0.01 THD + Noise (%) 0.001 RL = 600Ω 0.0001 RL = 2kΩ 0.0001 0.00001 0.01 0.1 1 10 100 0.00001 0.01 Gain = +1 RF = 348Ω f = 1kHz Single− Ended Input Differential Output 0.1 1 RL = 2kΩ 10 100 Differential Output Voltage (Vrms) Differential Output Voltage (Vrms) INTERMODULATION DISTORTION vs OUTPUT VOLTAGE 0.1 0.1 INTERMODULATION DISTORTION vs OUTPUT VOLTAGE 0.01 IMD (%) RL = 600Ω IMD (%) 0.01 RL = 600Ω Gain = +1 RF = 348Ω Single− Ended Input Differential Output SMPTE 4:1; 60Hz, 7kHz DIN 4:1; 250Hz, 8kHz 0.1 1 10 0.001 Gain = +1 RF = 348Ω Differential I/O SMPTE 4:1; 60Hz, 7kHz DIN 4:1; 250Hz, 8kHz 0.1 1 0.001 0.0001 0.0001 R L = 2kΩ 0.00001 10 100 RL = 2kΩ 0.00001 0.01 0.01 100 Differential Output Voltage (VPP ) Differential Output Voltage (VPP ) 4 OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted. VOLTAGE NOISE vs FREQUENCY 10 10 CURRENT NOISE vs FREQUENCY Vn (nV/√ Hz) In (pA/√ Hz) 1 10 100 1k Frequency (Hz) 10k 100k 1 0.1 10 100 1k Frequency (Hz) 10k 100k OUTPUT VOLTAGE vs DIFFERENTIAL LOAD RESISTANCE 15 10 5 VO (V) 0 VCC = ± 5V −5 − 10 − 15 100 1k RL (Ω) 10k 100k RF = 1kΩ G = +2 100 VCC = ± 15V VCC = ± 5V Output Impedance (Ω) VCC = ± 5V OUTPUT IMPEDANCE vs FREQUENCY 10 1 VCC = ± 15V 0.1 100k 1M 10M Frequency (Hz) 100M 1G 5 OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 APPLICATIONS INFORMATION Figure 1 shows the OPA1632 used as a differential-output driver for the PCM1804 high-performance audio ADC. Supply voltages of ±15V are commonly used for the OPA1632. The relatively low input voltage swing required by the ADC allows use of lower power-supply voltage, if desired. Power supplies as low as ±8V can be used in this application with excellent performance. This reduces power dissipation and heat rise. Power supplies should be bypassed with 10µF tantalum capacitors in parallel with 0.1µF ceramic capacitors to avoid possible oscillations and instability. The VCOM reference voltage output on the PCM1804 ADC provides the proper input common-mode reference voltage (2.5V). This VCOM voltage is buffered with op amp A2 and drives the output common-mode voltage pin of the OPA1632. This biases the average output voltage of the OPA1632 to 2.5V. The signal gain of the circuit is generally set to approximately 0.25 to be compatible with commonly-used audio line levels. Gain can be adjusted, if necessary, by V+ +8V to +16V changing the values of R1 and R2. The feedback resistor values (R3 and R4) should be kept relatively low, as indicated, for best noise performance. R5, R6, and C3 provide an input filter and charge glitch reservoir for the ADC. The values shown are generally satisfactory. Some adjustment of the values may help optimize performance with different ADCs. It is important to maintain accurate resistor matching on R1/R2 and R3/R4 to achieve good differential signal balance. Use 1% resistors for highest performance. When connected for single-ended inputs (inverting input grounded, as shown in Figure 1), the source impedance must be low. Differential input sources must have well-balanced or low source impedance. Capacitors C1, C2, and C3 should be chosen carefully for good distortion performance. Polystyrene, polypropylene, NPO ceramic, and mica types are generally excellent. Polyester and high-K ceramic types such as Z5U can create distortion. 10µF + 0.1µF R3 270Ω C1 1nF R1 1kΩ Balanced or + Single−Ended Input − VOCM 8 3 R5 40Ω C3 2.7nF R6 40Ω R4 270Ω 1/2 PCM1804 5 R2 1kΩ 2 OPA1632 1 6 7 4 C2 1nF VCOM (2.5V) Enable(1) 0.1µF NOTE: (1) Leave open to enable. Logic signals referenced to V− supply. See the Shutdown Function section. 10µ F + OPA134 0.1µF 1kΩ − 8V to − 16V V− Figure 1. ADC Driver for Professional Audio 6 OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 FULLY-DIFFERENTIAL AMPLIFIERS Differential signal processing offers a number of performance advantages in high-speed analog signal processing systems, including immunity to external common-mode noise, suppression of even-order nonlinearities, and increased dynamic range. Fully-differential amplifiers not only serve as the primary means of providing gain to a differential signal chain, but also provide a monolithic solution for converting single-ended signals into differential signals allowing for easy, high-performance processing. A standard configuration for the device is shown in Figure 2. The functionality of a fully differential amplifier can be imagined as two inverting amplifiers that share a common noninverting terminal (though the voltage is not necessarily fixed). For more information on the basic theory of operation for fully differential amplifiers, refer to the Texas Instruments application note SLOA054, Fully Differential Amplifiers, available for download from the TI web site (www.ti.com). Quiescent current is reduced to approximately 0.85mA when the amplifier is disabled. When disabled, the output stage is not in a high-impedance state. Thus, the shutdown function cannot be used to create a multiplexed switching function in series with multiple amplifiers. OUTPUT COMMON-MODE VOLTAGE The output common-mode voltage pin sets the DC output voltage of the OPA1632. A voltage applied to the VOCM pin from a low-impedance source can be used to directly set the output common-mode voltage. For a VOCM voltage at mid-supply, make no connection to the VOCM pin. Depending on the intended application, a decoupling capacitor is recommended on the VOCM node to filter any high-frequency noise that could couple into the signal path through the VOCM circuitry. A 0.1µF or 1µF capacitor is generally adequate. Output common-mode voltage causes additional current to flow in the feedback resistor network. Since this current is supplied by the output stage of the amplifier, this creates additional power dissipation. For commonly-used feedback resistance values, this current is easily supplied by the amplifier. The additional internal power dissipation created by this current may be significant in some applications and may dictate use of the MSOP PowerPAD package to effectively control self-heating. +15V Digital Output VREF VIN+ VOCM VIN− AIN AIN − 15V PowerPAD DESIGN CONSIDERATIONS The OPA1632 is available in a thermally-enhanced PowerPAD family of packages. These packages are constructed using a downset leadframe upon which the die is mounted (see Figure 3[a] and Figure 3[b]). This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package (see Figure 3[c]). Because this thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal pad. Figure 2. Typical ADC Circuit SHUTDOWN FUNCTION The shutdown (enable) function of the OPA1632 is referenced to the negative supply of the operational amplifier. A valid logic low (< 0.8V above negative supply) applied to the enable pin (pin 7) disables the amplifier output. Voltages applied to pin 7 that are greater than 2V above the negative supply place the amplifier output in an active state, and the device is enabled. If pin 7 is left disconnected, an internal pull-up resistor enables the device. Turn-on and turn-off times are approximately 2µs each. DIE (a) Side View DIE Thermal Pad (b) End View (c) Bottom View Figure 3. Views of the Thermally-Enhanced Package. 7 OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat can be conducted away from the package into either a ground plane or other heat-dissipating device. Soldering the PowerPAD to the printed circuit board (PCB) is always required, even with applications that have low power dissipation. It provides the necessary thermal and mechanical connection between the lead frame die pad and the PCB. These vias help dissipate the heat generated by the OPA1632 IC, and may be larger than the 13mil diameter vias directly under the thermal pad. They can be larger because they are not in the thermal pad area to be soldered so that wicking is not a problem. 5. Connect all holes to the internal power plane that is at the same voltage potential as V−. 6. When connecting these holes to the plane, do not use the typical web or spoke via connection methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat transfer during soldering operations. This makes the soldering of vias that have plane connections easier. In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the holes under the OPA1632 PowerPAD package should make their connection to the internal plane with a complete connection around the entire circumference of the plated-through hole. 7. The top-side solder mask should leave the terminals of the package and the thermal pad area with its five holes exposed. The bottom-side solder mask should cover the five holes of the thermal pad area. This prevents solder from being pulled away from the thermal pad area during the reflow process. 8. Apply solder paste to the exposed thermal-pad area and all of the IC terminals. 9. With these preparatory steps in place, the IC is simply placed in position and runs through the solder reflow operation as any standard surface-mount component. This results in a part that is properly installed. PowerPAD PCB LAYOUT CONSIDERATIONS 1. The thermal pad must be connected to the most negative supply voltage on the device, V−. 2. Prepare the PCB with a top-side etch pattern, as shown in Figure 4. There should be etch for the leads as well as etch for the thermal pad. Single or Dual Figure 4. PowerPAD PCB Etch and Via Pattern. 3. Place five holes in the area of the thermal pad. These holes should be 13mils in diameter. Keep them small so that solder wicking through the holes is not a problem during reflow. 4. Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. 8 ÓÓÓ Ó ÓÓ ÓÓÓÓÓÓÓ ÓÓ ÓÓÓÓÓ ÓÓÓÓÓÓÓ ÓÓ ÓÓÓÓÓÓÓ 68mils x 70mils (via diameter = 13mils) OPA1632 www.ti.com SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 POWER DISSIPATION AND THERMAL CONSIDERATIONS The OPA1632 does not have thermal shutdown protection. Take care to assure that the maximum junction temperature is not exceeded. Excessive junction temperature can degrade performance or cause permanent damage. For best performance and reliability, assure that the junction temperature does not exceed +125°C. The thermal characteristics of the device are dictated by the package and the circuit board. Maximum power dissipation for a given package can be calculated using the following formula: P Dmax + Where: PDmax is the maximum power dissipation in the amplifier (W). Tmax is the absolute temperature (_C). qJA = qJC + qCA. qJC is the thermal coefficient from the silicon junctions to the case (_C/W). qCA is the thermal coefficient from the case to ambient air (_C/W). maximum junction T max * T A q JA For systems where heat dissipation is more critical, the OPA1632 is offered in an MSOP-8 with PowerPAD. The thermal coefficient for the MSOP PowerPAD (DGN) package is substantially improved over the traditional SO package. Maximum power dissipation levels are depicted in Figure 5 for the two packages. The data for the DGN package assumes a board layout that follows the PowerPAD layout guidelines. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE 3.5 Maximum Power Dissipation (W) 3.0 2.5 2.0 1.5 1.0 SO− (D) Package 8 0.5 0 − 40 − 15 10 35 Ambient Temperature (_ C) 60 85 θ JA = 170 _ C/W for SO− (D) 8 θ JA = 58.4 _ C/W for MSOP− (DGN) 8 TJ = 150_ C No Airflow (1) MSOP− (DGN) Package 8 TA is the ambient temperature (_C). Figure 5. Maximum Power Dissipation vs Ambient Temperature 9 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 PACKAGING INFORMATION Orderable Device OPA1632D OPA1632DG4 OPA1632DGN Status (1) ACTIVE ACTIVE ACTIVE Package Type SOIC SOIC MSOPPower PAD MSOPPower PAD MSOPPower PAD MSOPPower PAD SOIC SOIC Package Drawing D D DGN Pins Package Eco Plan (2) Qty 8 8 8 75 75 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM OPA1632DGNG4 ACTIVE DGN 8 80 CU NIPDAU Level-1-260C-UNLIM OPA1632DGNR ACTIVE DGN 8 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA1632DGNRG4 ACTIVE DGN 8 CU NIPDAU Level-1-260C-UNLIM OPA1632DR OPA1632DRG4 (1) ACTIVE ACTIVE D D 8 8 CU NIPDAU CU NIPDAU Level-1-260C-UNLIM Level-1-260C-UNLIM The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) 330 330 Reel Width (mm) 12 12 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8 8 W Pin1 (mm) Quadrant 12 12 Q1 Q1 OPA1632DGNR OPA1632DR DGN D 8 8 SITE 40 SITE 60 5.2 6.4 3.3 5.2 1.6 2.1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device OPA1632DGNR OPA1632DR Package DGN D Pins 8 8 Site SITE 40 SITE 60 Length (mm) 338.1 346.0 Width (mm) 340.5 346.0 Height (mm) 21.1 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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