REG104GA-3G4

REG104 REG 104 REG 104 SBVS025G – SEPTEMBER 2001 – REVISED SEPTEMBER 2005 DMOS 1A Low-Dropout Regulator FEATURES q NEW DMOS TOPOLOGY: Ultra Low Dropout Voltage: 230mV typ at 1A and 3.3V Output Output Capacitor NOT Required for Stability q FAST TRANSIENT RESPONSE q VERY LOW NOISE: 33µVRMS q HIGH ACCURACY: ±2% max q HIGH EFFICIENCY: IGND = 1.7mA at IOUT = 1A Not Enabled: IGND = 0.5µA q 2.5V, 2.7V, 3.0V, 3.3V, 5.0V AND ADJUSTABLE OUTPUT VERSIONS q THERMAL PROTECTION q SMALL SURFACE-MOUNT PACKAGES: SOT223-5, DDPAK-5 DESCRIPTION The REG104 is a family of low-noise, low-dropout linear regulators with low ground pin current. Its new DMOS topology provides significant improvement over previous designs, including low dropout voltage (only 230mV typ at full load), and better transient performance. In addition, no output capacitor is required for stability, unlike conventional low dropout regulators that are difficult to compensate and require expensive low ESR capacitors greater than 1µF. Typical ground pin current is only 1.7mA (at IOUT = 1A) and drops to 0.5µA in not enabled mode. Unlike regulators with PNP pass devices, quiescent current remains relatively constant over load variations and under dropout conditions. The REG104 has very low output noise (typically 33µVRMS for VOUT = 3.3V with CNR = 0.01µF), making it ideal for use in portable communications equipment. On-chip trimming results in high output voltage accuracy. Accuracy is maintained over temperature, line, and load variations. Key parameters are tested over the specified temperature range (–40°C to +85°C). The REG104 is well protected—internal circuitry provides a current limit which protects the load from damage. Thermal protection circuitry keeps the chip from being damaged by excessive temperature. The REG104 is available in the DDPAK-5 and the SOT223-5. APPLICATIONS q q q q q PORTABLE COMMUNICATION DEVICES BATTERY-POWERED EQUIPMENT MODEMS BAR-CODE SCANNERS BACKUP POWER SUPPLIES Enable VIN + 0.1µF REG104 (Fixed Voltage Versions) Gnd + VOUT COUT(1) VIN + 0.1µF Enable VOUT REG104-A R1 Adj Gnd R2 + COUT(1) NR NR = Noise Reduction NOTE: (1) Optional. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001-2005, Texas Instruments Incorporated www.ti.com ABSOLUTE MAXIMUM RATINGS(1) Supply Input Voltage, VIN ....................................................... –0.3V to 16V Enable Input Voltage, VEN ....................................................... –0.3V to VIN Feedback Voltage, VFB ........................................................ –0.3V to 6.0V NR Pin Voltage, VNR ............................................................. –0.3V to 6.0V Output Short-Circuit Duration ...................................................... Indefinite Operating Temperature Range ....................................... –55°C to +125°C Storage Temperature Range .......................................... –65°C to +150°C Junction Temperature ..................................................... –55°C to +150°C Lead Temperature (soldering, 3s, SOT, and DDPAK) ................... +240°C ESD Rating: HBM (VOUT to GND) ..................................................... 1.5kV HBM (All other pins) ........................................................ 2kV CDM .............................................................................. 500V NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT REG104xx-yyyy/zzz XX is package designator. YYYY is typical output voltage (5 = 5.0V, 2.85 = 2.85V, A = Adjustable). ZZZ is package quantity. (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. VOUT PIN CONFIGURATIONS Top View DDPAK-5 Tab is Gnd Tab is Gnd SOT223-5 12345 1 VO Gnd VIN Enable 2 3 4 5 NR/Adjust(1) VIN VOUT Gnd Enable NR/Adjust(1) (KTT Package) (DCQ Package) NOTE: (1) For REG104A-A: voltage setting resistor pin. All other models: noise reduction capacitor pin. 2 REG104 SBVS025G ELECTRICAL CHARACTERISTICS Boldface limits apply over the specified temperature range, TJ = –40°C to +85°C At TJ = +25°C, VIN = VOUT + 1V (VOUT = 3.0V for REG104-A), VENABLE = 2V, IOUT = 10mA, CNR = 0.01µF, and COUT = 0.1µF(1), unless otherwise noted. REG104GA REG104FA PARAMETER OUTPUT VOLTAGE Output Voltage Range REG104-2.5 REG104-2.7 REG104-3.0 REG104-3.3 REG104-5 REG104-A Reference Voltage Adjust Pin Current Accuracy TJ = –40°C to +85°C vs Temperature vs Line and Load TJ = –40°C to +85°C DC DROPOUT VOLTAGE(2, 3) For all models except 5V For 5V model For all models except 5V TJ = –40°C to +85°C For 5V models TJ = –40°C to +85°C VOLTAGE NOISE f = 10Hz to 100kHz Without CNR (all models) With CNR (all fixed voltage models) OUTPUT CURRENT Current Limit(4) TJ = –40°C to +85°C RIPPLE REJECTION f = 120Hz ENABLE CONTROL VENABLE High (output enabled) VENABLE Low (output disabled) IENABLE High (output enabled) IENABLE Low (output disabled) Output Disable Time Output Enable Softstart Time THERMAL SHUTDOWN Junction Temperature Shutdown Reset from Shutdown GROUND PIN CURRENT Ground Pin Current Enable Pin Low INPUT VOLTAGE Operating Input Voltage Range(6) Specified Input Voltage Range TJ = –40°C to +85°C TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance DDPAK-5 Surface Mount SOT223-5 Surface Mount VIN VIN > 2.7V VIN > 2.9V TJ 2.1 VOUT + 0.7 VOUT + 0.9 –40 –55 –65 Junction-to-Case Junction-to-Case 4 15 15 15 15 +85 +125 +150 V V V °C °C °C °C/W °C/W IGND IOUT = 10mA IOUT = 1A VENABLE ≤ 0.5V VENABLE IENABLE VENABLE = 2V to VIN, VIN = 2.1V to 6.5(5) VENABLE = 0V to 0.5V 2 –0.2 1 2 50 1.5 VOUT 2.5 2.7 3.0 3.3 5 VREF VREF IADJ dVOUT/dT TJ = –40°C to +85°C IOUT = 10mA to 1A, VIN = (VOUT + 0.7V) to 15V VIN = (VOUT + 0.9V) to 15V IOUT IOUT IOUT IOUT = = = = 10mA 1A 1A 1A 1.295 0.2 ±0.5 70 ±0.5 3 230 320 5.5 1 ±2 ±3.0 V V V V V V V µA % % ppm/°C % % mV mV mV mV mV CONDITION MIN TYP MAX UNITS ±3.5 25 400 500 480 580 ±2.5 VDROP IOUT = 1A Vn CNR = 0, COUT = 0 CNR = 0.01µF, COUT = 10µF ICL 1.2 1.0 35µVRMS/V • VOUT 10µVRMS/V • VOUT 1.7 2.1 2.2 µVRMS µVRMS A A dB VIN 0.5 100 100 V V nA nA µs ms 65 150 130 0.5 1.7 0.5 0.7 1.8 °C °C mA mA µA θJC θJC NOTES: (1) The REG104 does not require a minimum output capacitor for stability. However, transient response can be improved with proper capacitor selection. (2) Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at VIN = VOUT + 1V at fixed load. (3) Not applicable for VOUT less than 2.7V. (4) Current limit is the output current that produces a 15% change in output voltage from VIN = VOUT + 1V and IOUT = 10mA. (5) For VIN > 6.5V, see typical characteristic VENABLE vs IENABLE. (6) The REG104 no longer regulates when VIN < VOUT + VDROP (MAX). In drop-out or when the input voltage is between 2.7V and 2.1V, the impedance from VIN to VOUT is typically less than 1Ω at TJ = +25°C. See typical characteristic Output Voltage Change vs VIN. REG104 SBVS025G 3 TYPICAL CHARACTERISTICS For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted. OUTPUT VOLTAGE CHANGE vs IOUT (VIN = VOUT + 1V, Output Voltage % Change Referred to IOUT = 10mA at +25°C) DC DROPOUT VOLTAGE vs IOUT 350 0.8 0.6 Output Voltage Change (%) 0.4 0.2 0 –0.2 –0.4 –0.6 –0.8 –1 –1.2 0 100 DC Dropout Voltage (mV) +125°C 300 250 200 150 100 50 0 –55°C +125°C +25°C +25°C –55°C 200 300 400 500 600 700 800 900 1000 0 200 400 600 800 1000 Output Current (mA) IOUT (mA) OUTPUT VOLTAGE CHANGE vs VIN (Output Voltage % Change Referred to VIN = VOUT + 1V at IOUT = 10mA) OUTPUT VOLTAGE CHANGE vs IOUT (Output Voltage % Change Referred to IOUT = 10mA at +25°C) 0.5 IOUT = 10mA IOUT = 200mA 0.6 0.4 0.2 IOUT = 10mA IOUT = 200mA Output Voltage Change (%) 0 Output Voltage (%) –0.5 IOUT = 1000mA 0 –0.2 –0.4 –0.6 –0.8 –1 IOUT = 1000mA –1 –1.5 –2 0 2 4 6 8 10 12 Input Voltage Above VOUT (V) –1.2 –60 –40 –20 0 20 40 60 80 100 120 Temperature (°C) DC DROPOUT VOLTAGE vs TEMPERATURE 350 IOUT = 1000mA LINE REGULATION vs TEMPERATURE (VIN = VOUT + 1V to 16V) 0.5 Output Voltage Change (%) 300 DC Dropout Voltage (mV) 0.4 250 200 150 100 IOUT = 200mA 50 0 –75 IOUT = 10mA –50 –25 0 25 50 75 100 125 0.3 IOUT = 10mA 0.2 0.1 IOUT = 200mA 0 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) Temperature (°C) 4 REG104 SBVS025G TYPICAL CHARACTERISTICS (Cont.) For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted. LOAD TRANSIENT RESPONSE 500mV/div 50mV/div LINE TRANSIENT RESPONSE REG104-3.3 IOUT = 200mA VOUT COUT = 10µF VOUT REG104-3.3 COUT = 0 VOUT COUT = 10µF VOUT COUT = 0 500mV/div 1A 10mA 10µs/div ILOAD 50mV/div 6V 5V 50µs/div VIN LOAD TRANSIENT RESPONSE REG104–A LOAD TRANSIENT RESPONSE REG104–A 500mV/div 500mV/div COUT = 0 50mV/div 50mV/div CFB = 0.01µF, VOUT = 3.3V Load = 200mA, CFB = 0.01µF, VOUT = 3.3V COUT = 0 COUT = 10µF COUT = 10µF 1A 10mA 10µs/div ILOAD 6V 5V 50µs/div VIN LOAD REGULATION vs TEMPERATURE (VIN = VOUT + 1V and 10mA < IOUT < 1000mA) 0.5 Output Voltage Change (%) OUTPUT NOISE DENSITY 10 5 Noise Density (µV/√Hz) 0.4 2 1 0.5 0.2 0.1 0.05 0.02 CNR = 0 COUT = 0 CNR = 0.01µF COUT = 10µF 10 100 1000 Frequency (Hz) 10000 100,000 0.3 0.2 0.1 0 –60 0.01 –40 –20 0 20 40 60 80 100 120 Temperature (°C) REG104 SBVS025G 5 TYPICAL CHARACTERISTICS (Cont.) For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted. GROUND PIN CURRENT vs TEMPERATURE 1.8 IOUT = 1000mA 1.6 1.4 IGND (mA) 2.5 2 IGND (µA) GROUND PIN CURRENT, NOT ENABLED vs TEMPERATURE 3 VENABLE = 0V 1.2 1 0.8 0.6 0.4 –60 IOUT = 200mA 1.5 1 0.5 IOUT = 10mA –40 –20 0 20 40 60 80 100 120 0 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) Temperature (°C) GROUND PIN CURRENT vs IOUT 1.6 1.4 IADJUST vs TEMPERATURE 0.28 REG104-A 0.26 Adjust Pin Current (µA) 1.2 0.24 0.22 0.20 0.18 0.16 0.14 –60 –40 –20 IGND (mA) 1 0.8 0.6 0.4 1 10 IOUT (mA) 100 1000 0 20 40 60 80 100 120 140 Temperature (°C) CURRENT LIMIT vs TEMPERATURE 1850 VOUT = VOUT-NOMINAL • 0.90 1800 1750 VOUT = 1V 1700 1650 1600 1550 –60 Ripple Rejection (dB) Current Limit (mA) RIPPLE REJECTION vs FREQUENCY 70 60 50 COUT = 10µF 40 COUT = 0 30 20 –40 –20 0 20 40 60 80 100 120 10 100 1k Frequency (Hz) 10k 100k Temperature (°C) 6 REG104 SBVS025G TYPICAL CHARACTERISTICS (Cont.) For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted. RIPPLE REJECTION vs IOUT 75 VRIPPLE = 3Vp-p, f = 120Hz 70 SOFT START 1V/div Ripple Rejection (dB) 65 60 55 50 45 40 0 200 400 600 800 1000 IOUT (mA) VOUT 2V 0 250µs/div VENABLE OUTPUT DISABLE TIME OUTPUT VOLTAGE DRIFT HISTOGRAM 45 40 Percent of Units (%) COUT = 0 1V/div VOUT 35 30 25 20 15 10 5 0 2V VENABLE 0 10µs/div 40 45 50 55 60 65 70 75 80 85 90 VOUT Drift (ppm/°C) OUTPUT VOLTAGE ACCURACY HISTOGRAM 60 50 Percent of Units (%) 40 30 20 10 0 –1 –0.8 –0.6 –0.4 –0.2 0 0.2 0.4 0.6 0.8 1 Error (%) REG104 SBVS025G 7 BASIC OPERATION The REG104 series is a family of LDO (Low DropOut) linear regulators. The family includes five fixed output versions (2.5V to 5.0V) and an adjustable output version. An internal DMOS power device provides low dropout regulation with near constant ground pin current (largely independent of load and dropout conditions) and very fast line and load transient response. All versions include internal current limit and thermal shutdown circuitry. Figure 1 shows the basic circuit connections for the fixed voltage models. Figure 2 gives the connections for the adjustable output version (REG104A) and example resistor values for some commonly used output voltages. Values for other voltages can be calculated from the equation shown in Figure 2. None of the versions require an output capacitor for regulator stability. The REG104 will accept any output capacitor type less than 1µF. For capacitance values larger than 1µF the effective ESR should be greater than 0.1Ω. This minimum ESR value includes parasitics such as printed circuit board traces, solder joints, and sockets. A minimum 0.1µF low ESR capacitor connected to the input supply voltage is recommended. ENABLE The Enable pin allows the regulator to be turned on and off. This pin is active HIGH and compatible with standard TTLCMOS levels. Inputs below 0.5V (max) turn the regulator off and all circuitry is disabled. Under this condition ground-pin current drops to approximately 0.5µA. When not used, the Enable pin may be connected to VIN. Internal to the part, the Enable pin is connected to an input resistor-zener diode circuit, as shown in Figure 3, creating a nonlinear input impedance. Enable VIN 0.1µF In REG104 Gnd NR CNR 0.01µF Out COUT VOUT Enable 175kΩ VZ = 10V Optional FIGURE 1. Fixed Voltage Nominal Circuit for REG104. FIGURE 3. Enable Pin Equivalent Input Circuit. Enable 5 2 VIN 0.1µF 1 REG104 4 3 Gnd Pin numbers for SOT-223 package. Optional VOUT = (1 + R1/R2) • 1.295V To reduce current through divider, increase resistor values (see table at right). As the impedance of the resistor divider increases, IADJ (~200nA) may introduce an error. CFB improves noise and transient response. 5 IADJ R1 Adj R2 3 3.3 CFB 0.01µF COUT Load VOUT EXAMPLE RESISTOR VALUES VOUT (V) 1.295 2.5 R1 (Ω)(1) Short 12.1k 1.21k 16.9k 1.69k 20k 2.0k 37.4k 3.74k R2 (Ω)(1) Open 13k 1.3k 13k 1.3k 13k 1.3k 13k 1.3k NOTE: (1) Resistors are standard 1% values. FIGURE 2. Adjustable Voltage Circuit for REG104A. 8 REG104 SBVS025G The Enable Pin Current versus Applied Voltage relationship is shown in Figure 4. When the Enable pin is connected to VIN greater than 10V, a series resistor may be used to limit the current. Since the value of VREF is 1.295V, this relationship reduces to: VN = 35 µVRMS • VOUT V 100 10 Enable Current (µA) 1 Connecting a capacitor, CNR, from the Noise-Reduction (NR) pin to ground can reduce the output noise voltage. Adding CNR, as shown in Figure 5, forms a low-pass filter for the voltage reference. For CNR = 10nF, the total noise in the 10Hz to 100kHz bandwidth is reduced by approximately a factor of 3.5. This noise reduction effect is shown in Figure 6. 0.1 45 REG104-3.3 0.01 Output Noise Voltage (µVRMS 10Hz - 100kHz) 0.001 0 2 4 6 8 10 12 14 16 Enable Voltage 35 FIGURE 4. Enable Pin Current versus Applied Voltage. OUTPUT NOISE A precision band-gap reference is used for the internal reference voltage, VREF, for the REG104. This reference is the dominant noise source within the REG104. It generates approximately 45µVRMS in the 10Hz to 100kHz bandwidth at the reference output. The regulator control loop gains up the reference noise, so that the noise voltage of the regulator is approximately given by: VN = 45µVRMS V R1 + R 2 = 45µVRMS • OUT R2 VREF 25 0.001 0.01 CNR (µF) 0.1 COUT = 0 COUT = 10µF 1 FIGURE 6. Output Noise versus Noise Reduction Capacitor. The REG104 adjustable version does not have the noisereduction pin available, however, the adjust pin is the summing junction of the error amplifier. A capacitor, CFB, VIN NR (fixed output versions only) CNR (optional) VREF (1.295V) Low Noise Charge Pump DMOS Output Over Current Over Temp Protection VOUT R1 Adj (Adjustable Versions) Enable R2 REG104 NOTE: R1 and R2 are internal on fixed output versions. FIGURE 5. Block Diagram. REG104 SBVS025G 9 connected from the output to the adjust pin will reduce both the output noise and the peak error from a load transient. Figure 7 shows improved output noise performance for two capacitor combinations. For large step changes in load current, the REG104 requires a larger voltage drop across it to avoid degraded transient response. The boundary of this transient dropout region is shown as the top line in Figure 8. Values of VIN to VOUT voltage drop above this line insure normal transient response. In the transient dropout region between DC and Transient, transient response recovery time increases. The time required to recover from a load transient is a function of both the magnitude and rate of the step change in load current and the available headroom VIN to VOUT voltage drop. Under worst-case conditions (full-scale load change with VIN to VOUT voltage drop close to DC dropout levels), the REG104 can take several hundred microseconds to re-enter the specified window of regulation. 10.0 nV/√Hz 1.0 0.1 10 COUT = 0, CFB = 0 COUT = 0, CFB = 0.01µF COUT = 10µF, CFB = 0.01µF 100 1000 Frequency 10000 100000 TRANSIENT RESPONSE The REG104 response to transient line and load conditions improves at lower output voltages. The addition of a capacitor (nominal value 10nF) from the output pin to ground may improve the transient response. In the adjustable version, the addition of a capacitor, CFB (nominal value 10nF), from the output to the adjust pin will also improve the transient response. FIGURE 7. Output Noise Density on Adjustable Versions. The REG104 utilizes an internal charge pump to develop an internal supply voltage sufficient to drive the gate of the DMOS pass element above VIN. The charge-pump switching noise (nominal switching frequency = 2MHz) is not measurable at the output of the regulator. THERMAL PROTECTION Power dissipated within the REG104 will cause the junction temperature to rise. The REG104 has thermal shutdown circuitry that protects the regulator from damage. The thermal protection circuitry disables the output when the junction temperature reaches approximately 150°C, allowing the device to cool. When the junction temperature cools to approximately 130°C, the output circuitry is again enabled. Depending on various conditions, the thermal protection circuit may cycle on and off. This limits the dissipation of the regulator, but may have an undesirable effect on the load. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable operation, junction temperature should be limited to 125°C, maximum. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is triggered. Use worst-case loads and signal conditions. For good reliability, thermal protection should trigger more than 35°C above the maximum expected ambient condition of your application. This produces a worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load. The internal protection circuitry of the REG104 has been designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the REG104 into thermal shutdown will degrade reliability. DROP-OUT VOLTAGE The REG104 uses an N-channel DMOS as the pass element. When the input voltage is within a few hundred millivolts of the output voltage, the DMOS device behaves like a resistor. Therefore, for low values of VIN to VOUT, the regulator’s input-to-output resistance is the RdsON of the DMOS pass element (typically 230mΩ). For static (DC) loads, the REG104 will typically maintain regulation down to VIN to VOUT voltage drop of 230mV at full rated output current. In Figure 8, the bottom line (DC dropout) shows the minimum VIN to VOUT voltage drop required to prevent dropout under DC load conditions. REG104 –3.3 at 25°C 250 DC Transient Drop Out Voltage (mV) 200 150 100 50 0 0 100 200 300 400 500 IOUT (mA) FIGURE 8. Transient and DC Dropout. 10 REG104 SBVS025G POWER DISSIPATION The REG104 is available in two different package configurations. The ability to remove heat from the die is different for each package type and, therefore, presents different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. While it is difficult to impossible to quantify all of the variables in a thermal design of this type, performance data for several configurations are shown in Figure 9. In all cases the PCB copper area is bare copper, free of solder resist mask, and not solder plated. All examples are for 1-ounce copper. Using heavier copper will increase the effectiveness in moving the heat from the device. In those examples where there is copper on both sides of the PCB, no connection has been provided between the two sides. The addition of plated through holes will improve the heat sink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the average output current times the voltage across the output element, VIN to VOUT voltage drop. PD = (VIN – VOUT ) • IOUT ( AVG) 5 CONDITIONS #1 #2 #3 #4 Power Dissipation (Watts) 4 3 2 1 0 0 25 50 75 100 125 Ambient Temperature (°C) CONDITION 1 2 3 4 PACKAGE DDPAK SOT-223 DDPAK SOT-223 PCB AREA 4in2 Top Side Only 4in2 Top Side Only None 0.5in2 Top Side Only θJA 27°C/W 53°C/W 65°C/W 110°C/W Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage. FIGURE 9. Maximum Power Dissipation versus Ambient Temperature for the Various Packages and PCB Heat Sink Configurations. REG104 SBVS025G 11 REGULATOR MOUNTING The tab of both packages is electrically connected to ground. For best thermal performance, the tab of the DDPAK surface-mount version should be soldered directly to a circuitboard copper area. Increasing the copper area improves heat dissipation. Figure 10 shows typical thermal resistance from junction to ambient as a function of the copper area for the DDPAK. Figure 11 shows the same relationship for the SOT-223. Although the tabs of the DDPAK and the SOT-223 are electrically grounded, they are not intended to carry any current. The copper pad that acts as a heat sink should be isolated from the rest of the circuit to prevent current flow through the device from the tab to the ground pin. Solder pad footprint recommendations for the various REG104 devices are presented in the Application Bulletin Solder Pad Recommendations for Surface-Mount Devices (SBFA015A), available from the Texas Instruments web site (www.ti.com). THERMAL RESISTANCE vs PCB COPPER AREA 50 Thermal Resistance, θJA (°C/W) REG104 Surface Mount Package 1 oz. copper Circuit Board Copper Area 40 30 20 10 REG104 DDPAK Surface Mount Package 0 1 2 3 4 5 Copper Area (inches2) 0 FIGURE 10. Thermal Resistance versus PCB Area for the Five-Lead DDPAK. THERMAL RESISTANCE vs PCB COPPER AREA 180 Circuit Board Copper Area REG104 Surface Mount Package 1 oz. copper Thermal Resistance, θJA (°C/W) 160 140 120 100 80 60 40 20 0 0 1 2 REG104 SOT-223 Surface Mount Package 3 4 5 Copper Area (inches2) FIGURE 11. Thermal Resistance versus PCB Area for the Five Lead SOT-223. 12 REG104 SBVS025G PACKAGE OPTION ADDENDUM www.ti.com 17-Jun-2008 PACKAGING INFORMATION Orderable Device REG104FA-2.5 REG104FA-2.5/500 REG104FA-2.5/500G3 REG104FA-2.5KTTT REG104FA-2.5KTTTG3 REG104FA-2.7 REG104FA-2.7KTTT REG104FA-2.7KTTTG3 REG104FA-3 REG104FA-3.3 REG104FA-3.3/500 REG104FA-3.3/500G3 REG104FA-3.3KTTT REG104FA-3.3KTTTG3 REG104FA-3/500 REG104FA-3/500G3 REG104FA-3KTTT REG104FA-3KTTTG3 REG104FA-5 REG104FA-5/500 REG104FA-5/500G3 REG104FA-5KTTT REG104FA-5KTTTG3 REG104FA-A REG104FA-A/500 Status (1) OBSOLETE NRND ACTIVE NRND ACTIVE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE NRND ACTIVE NRND ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE Package Type DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 Package Drawing KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT Pins Package Eco Plan (2) Qty 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 500 500 500 50 50 500 500 50 50 500 500 50 50 50 50 500 500 50 50 TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Lead/Ball Finish Call TI CU SN CU SN CU SN CU SN Call TI CU SN CU SN Call TI Call TI CU SN CU SN CU SN CU SN CU SN CU SN CU SN CU SN Call TI CU SN CU SN CU SN CU SN Call TI CU SN MSL Peak Temp (3) Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 17-Jun-2008 Orderable Device REG104FA-A/500E3 REG104FA-A/500G3 REG104FA-AKTTT REG104FA-AKTTTG3 REG104GA-2.5 REG104GA-2.5/2K5 REG104GA-2.5/2K5G4 REG104GA-2.5G4 REG104GA-2.7 REG104GA-2.7G4 REG104GA-3 REG104GA-3.3 REG104GA-3.3/2K5 REG104GA-3.3/2K5G4 REG104GA-3.3G4 REG104GA-3G4 REG104GA-5 REG104GA-5/2K5 REG104GA-5/2K5G4 REG104GA-5G4 REG104GA-A REG104GA-A/2K5 REG104GA-A/2K5G4 REG104GA-AG4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE NRND NRND ACTIVE ACTIVE ACTIVE ACTIVE NRND ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 Package Drawing KTT KTT KTT KTT DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ DCQ Pins Package Eco Plan (2) Qty 5 5 5 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 500 500 50 50 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU SN CU SN CU SN CU SN CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 78 78 78 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 78 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 78 Green (RoHS & no Sb/Br) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 17-Jun-2008 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 28-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SOT-223 SOT-223 SOT-223 SOT-223 DCQ DCQ DCQ DCQ 6 6 6 6 SPQ Reel Reel Diameter Width (mm) W1 (mm) 330.0 330.0 330.0 330.0 12.4 12.4 12.4 12.4 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8.0 8.0 8.0 8.0 W Pin1 (mm) Quadrant 12.0 12.0 12.0 12.0 Q3 Q3 Q3 Q3 REG104GA-2.5/2K5 REG104GA-3.3/2K5 REG104GA-5/2K5 REG104GA-A/2K5 2500 2500 2500 2500 6.8 6.8 6.8 6.8 7.3 7.3 7.3 7.3 1.88 1.88 1.88 1.88 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Mar-2008 *All dimensions are nominal Device REG104GA-2.5/2K5 REG104GA-3.3/2K5 REG104GA-5/2K5 REG104GA-A/2K5 Package Type SOT-223 SOT-223 SOT-223 SOT-223 Package Drawing DCQ DCQ DCQ DCQ Pins 6 6 6 6 SPQ 2500 2500 2500 2500 Length (mm) 358.0 358.0 358.0 358.0 Width (mm) 335.0 335.0 335.0 335.0 Height (mm) 35.0 35.0 35.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated