SN74ABT244ADWR


   

 
 
SCBS099J − JANUARY 1991 − REVISED APRIL 2005 D D D D 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 description 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT240, SN74ABT240A, SN54ABT241, and SN74ABT241A, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE inputs. VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 SN54ABT244 . . . FK PACKAGE (TOP VIEW) 2Y4 1A1 1OE VCC D Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C High-Drive Outputs (−32-mA IOH, 64-mA IOL) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package SN54ABT244 . . . J OR W PACKAGE SN74ABT244A . . . DB, DW, N, OR PW PACKAGE (TOP VIEW) 2OE D State-of-the-Art EPIC-ΙΙB BiCMOS Design The SN54ABT244 and SN74ABT244A are organized as two 4-bit buffers/line drivers with separate OE inputs. When OE is low, the devices pass noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54ABT244 is characterized for operation over the full military temperature range of −55°C to 125°C. The SN74ABT244A is characterized for operation from −40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-ΙΙB is a trademark of Texas Instruments. Copyright  2005, Texas Instruments Incorporated   !"# $ %&'# "$  (&)*%"# +"#', +&%#$ %! # $('%%"#$ (' #-' #'!$  '."$ $#&!'#$ $#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1  "** (""!'#'$, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 

   

 
 
SCBS099J − JANUARY 1991 − REVISED APRIL 2005 FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z logic symbol† 1OE 1A1 1A2 1A3 1A4 1 19 EN 2OE 18 2 4 16 6 14 12 8 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 EN 11 9 13 7 15 5 17 3 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 2 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 POST OFFICE BOX 655303 19 11 9 13 7 15 5 17 3 • DALLAS, TEXAS 75265 2Y1 2Y2 2Y3 2Y4 2Y1 2Y2 2Y3 2Y4 

   

 
 
SCBS099J − JANUARY 1991 − REVISED APRIL 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT244A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages, which use a trace length of zero. recommended operating conditions (see Note 3) SN54ABT244 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC −24 Low-level output current 48 ∆t/∆v Input transition rise or fall rate High-level input voltage SN74ABT244A MIN 2 2 0.8 Input voltage 0 Outputs enabled TA Operating free-air temperature NOTE 3: Unused inputs must be held high or low to prevent them from floating. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 −55 125 −40 V V 0.8 0 UNIT V VCC −32 mA V 64 mA 5 ns/V 85 °C 3 

   

 
 
SCBS099J − JANUARY 1991 − REVISED APRIL 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = −18 mA IOH = −3 mA VCC = 5 V, VCC = 4.5 V VOL VCC = 4.5 V Vhys II Ioff ICEX IO‡ Co SN54ABT244 MIN −1.2 MAX SN74ABT244A MIN −1.2 2.5 2.5 IOH = −3 mA IOH = −24 mA 3 3 3 2 2 IOH = −32 mA IOL = 48 mA 2* VCC = 5.5 V, VCC = 0, VO = 0.5 V VI or VO ≤ 5.5 V VCC = 5.5 V VCC = 5.5 V, Outputs high VO = 2.5 V Outputs high 0.55 0.55* 0.55 V mV ±1 ±1 ±1 µA 10 10 10 µA −10 −10 −10 µA ±100 µA 50 µA −180 mA ±100 50 50 −100 −180 1 250 250 250 µA Outputs low 24 30 30 30 mA Outputs disabled 0.5 250 250 250 µA Outputs enabled 1.5 1.5 1.5 Outputs disabled 0.05 0.05 0.05 1.5 1.5 1.5 Data inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND VI = 2.5 V or 0.5 V VO = 2.5 V or 0.5 V −50 V 2 0.55 IOL = 64 mA VI = VCC or GND VO = 2.7 V UNIT V −50 −180 −50 POST OFFICE BOX 655303 mA 3.5 pF 7.5 pF * On products compliant to MIL-PRF-38535, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second. § This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. 4 MAX −1.2 2.5 VCC = 5.5 V, VCC = 5.5 V, VCC = 5.5 V, IO = 0, VI = VCC or GND ICC Ci TA = 25°C TYP† MAX 100 IOZH IOZL ∆ICC§ MIN • DALLAS, TEXAS 75265 

   

 
 
SCBS099J − JANUARY 1991 − REVISED APRIL 2005 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54ABT244 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y VCC = 5 V, TA = 25°C MIN MAX MIN TYP MAX 1 2.6 4.1 1 5.3 1 2.9 4.2 1 5 1.1 3.1 4.6 0.8 5.7 2.1 4.1 5.6 1.2 7.9 2.1 4.1 5.6 1.2 7.6 1.5 3.7 5.6 1 7.9 UNIT ns ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN74ABT244A PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 VCC = 5 V, TA = 25°C MIN MAX MIN TYP MAX 1 2.6 4.1 1 4.6 1 2.9 4.3 1 4.6 1.1 3.1 4.6 1.1 5.1 2.1 4.1 5.6 2.1 6.1 1.8 4.1 5.6 1.8 6.6 1.4 3.7 5.2 1.4 5.7 UNIT ns ns ns 5 

   

 
 
SCBS099J − JANUARY 1991 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V Input 1.5 V 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL Output 3V Output Control tPHL tPLH 1.5 V Output Waveform 2 S1 at Open (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9214701M2A ACTIVE LCCC FK 20 1 TBD 5962-9214701MRA ACTIVE CDIP J 20 1 TBD 5962-9214701MSA ACTIVE CFP W 20 1 SN74ABT244ADB ACTIVE SSOP DB 20 70 SN74ABT244ADBE4 ACTIVE SSOP DB 20 70 SN74ABT244ADBG4 ACTIVE SSOP DB 20 70 SN74ABT244ADBLE OBSOLETE SSOP DB 20 SN74ABT244ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244AN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT244ANE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT244ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244APWLE OBSOLETE TSSOP PW 20 TBD Call TI SN74ABT244APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT244APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A42 N / A for Pkg Type TBD Call TI N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 1 POST-PLATE N / A for Pkg Type Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SNJ54ABT244FK ACTIVE LCCC FK 20 1 TBD SNJ54ABT244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54ABT244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54ABT244, SN74ABT244A : SN74ABT244 • Catalog: • Enhanced Product: SN74ABT244A-EP NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog Enhanced Product - Supports Defense, Aerospace and Medical Applications • Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT244ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ABT244ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ABT244ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74ABT244APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT244ADBR SN74ABT244ADWR SSOP DB 20 2000 346.0 346.0 33.0 SOIC DW 20 2000 346.0 346.0 41.0 SN74ABT244ANSR SO NS 20 2000 346.0 346.0 41.0 SN74ABT244APWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-9214701M2A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 59629214701M2A SNJ54ABT 244FK 5962-9214701MRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9214701MR A SNJ54ABT244J 5962-9214701MSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9214701MS A SNJ54ABT244W SN74ABT244ADB ACTIVE SSOP DB 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB244A Samples SN74ABT244ADBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB244A Samples SN74ABT244ADBRG4 ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM AB244A Samples SN74ABT244ADW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT244A Samples SN74ABT244ADWE4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT244A Samples SN74ABT244ADWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT244A Samples SN74ABT244ADWRG4 ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT244A Samples SN74ABT244AN ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74ABT244AN Samples SN74ABT244ANSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT244A Samples SN74ABT244APW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB244A Samples SN74ABT244APWG4 ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB244A Samples SN74ABT244APWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB244A Samples SN74ABT244APWRE4 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB244A Samples SN74ABT244APWRG4 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB244A Samples Addendum-Page 1 Samples Samples Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Oct-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking Samples (4/5) (6) SNJ54ABT244FK ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 59629214701M2A SNJ54ABT 244FK SNJ54ABT244J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9214701MR A SNJ54ABT244J SNJ54ABT244W ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9214701MS A SNJ54ABT244W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of