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SN74AUC1G19
SCES626E – MARCH 2005 – REVISED JUNE 2017
SN74AUC1G19 1-of-2 Decoder/Demultiplexer
1 Features
3 Description
•
This 1-of-2 decoder/demultiplexer is operational at
0.8-V to 2.7-V VCC, but is designed specifically for
1.65-V to 1.95-V VCC operation.
1
•
•
•
•
•
•
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Available in the Texas Instruments NanoFree™
Package
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal Operation
Ioff Supports Partial-Power-Down Mode Operation
Sub-1-V Operable
±8-mA Output Drive at 1.8 V VCC
Maximum tpd of 3 ns at 1.8 V
Low Power Consumption, 10-µA Maximum ICC
2 Applications
•
•
•
•
•
•
•
•
•
•
•
•
AV Receiver
Audio Dock: Portable
Blu-ray Player and Home Theater
Embedded PC
MP3 Player/Recorder (Portable Audio)
Personal Digital Assistant (PDA)
Power: Telecom/Server AC/DC Supply: Single
Controller: Analog and Digital
Solid State Drive (SSD): Client and Enterprise
TV: LCD/Digital and High-Definition (HDTV)
Tablet: Enterprise
Video Analytics: Server
Wireless Headset, Keyboard, and Mouse
The
SN74AUC1G19
is
a
1-of-2
decoder/demultiplexer. This device buffers the data
on input A and passes it to the outputs Y0 (true) and
Y1 (complement) when the enable (E) input signal is
low.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
For more information about AUC Little Logic devices,
see Applications of Texas Instruments AUC Sub-1-V
Little Logic Devices, SCEA027.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74AUC1G19DBV SOT-23 (6)
2.90 mm × 1.60 mm
SN74AUC1G19DCK SC70 (6)
2.00 mm × 1.25 mm
SN74AUC1G19DRL SOT-5X3 (6)
1.60 mm × 1.20 mm
SN74AUC1G19YZP
1.50 mm × 0.90 mm
DSBGA (6)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
A
6
4
Y0
Y1
E
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
SN74AUC1G19
SCES626E – MARCH 2005 – REVISED JUNE 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1 Absolute Maximum Ratings .....................................
6.2 ESD Ratings..............................................................
6.3 Recommended Operating Conditions .....................
6.4 Thermal Information ..................................................
6.5 Electrical Characteristics..........................................
6.6 Switching Characteristics: CL = 15 pF .....................
6.7 Switching Characteristics: CL = 30 pF .....................
3
4
4
4
5
5
5
6.8
7
8
Operating Characteristics ........................................ 5
Parameter Measurement Information .................. 6
Detailed Description .............................................. 7
8.1 Functional Block Diagram ......................................... 7
8.2 Device Functional Modes.......................................... 7
9
Device and Documentation Support.................... 8
9.1
9.2
9.3
9.4
9.5
9.6
Documentation Support ............................................
Receiving Notification of Documentation Updates....
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
8
8
8
8
8
8
10 Mechanical, Packaging, and Orderable
Information ............................................................. 8
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (April 2007) to Revision E
Page
•
Deleted DRY package throughout data sheet........................................................................................................................ 1
•
Added Application section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Thermal Information table, Feature Description section, Device Functional Modes, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
•
Deleted Ordering Information table, see Mechanical, Packaging, and Orderable Information at the end of the data
sheet ...................................................................................................................................................................................... 1
2
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SN74AUC1G19
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SCES626E – MARCH 2005 – REVISED JUNE 2017
5 Pin Configuration and Functions
DBV Package
6-Pin SOT-23
Top View
DRL Package
6-Pin SOT-5X3
Top View
A
1
6
Y0
GND
2
5
VCC
E
3
4
Y1
A
1
6
Y0
GND
2
5
VCC
E
3
4
Y1
YZP Package
6-Pin DSBGA
Bottom View
DCK Package
6-Pin SC70
Top View
1
2
C
E
Y1
A
1
6
Y0
B
GND
VCC
GND
2
5
VCC
A
A
Y0
E
3
4
Not to scale
Y1
See mechanical drawings for dimensions.
Pin Functions
PIN
NAME
DBV, DCK,
DRL
YZP
I/O
DESCRIPTION
A
1
A1
I
A Input
E
3
C1
I
Active Low Enable
GND
2
B1
—
Ground
VCC
5
B2
—
Positive Supply
Y0
6
A2
O
Y0 True Output
Y1
4
C2
O
Y1 Complemented Output
6 Specifications
6.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
3.6
V
VI
Input voltage (2)
–0.5
3.6
V
–0.5
3.6
V
–0.5
VCC + 0.5
V
(2)
VO
Voltage range applied to any output in the high-impedance or power-off state
VO
Voltage range applied to any output in the high or low state (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
Continuous current through VCC or GND
±100
mA
150
°C
Tstg
(1)
(2)
(3)
(3)
Storage temperature
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
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3
SN74AUC1G19
SCES626E – MARCH 2005 – REVISED JUNE 2017
www.ti.com
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
1000
Machine Model (A115-A)
200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3
Recommended Operating Conditions
See (1)
VCC
MIN
MAX
UNIT
0.8
2.7
V
VCC
3.6
VCC = 1.1 V to 1.95 V
0.65 × VCC
3.6
VCC = 2.3 V to 2.7 V
1.7
3.6
VCC = 1.1 V to 1.95 V
0
0.35 × VCC
VCC = 2.3 V to 2.7 V
0
0.7
0
VCC
Supply voltage
VCC = 0.8 V
VIH
High-level control input voltage
VCC = 0.8 V
VIL
Low-level control input voltage
VO
Output voltage
IOH
High-level control output current
IOL
Low-level control output current
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
V
0
VCC = 0.8 V
–0.7
VCC = 1.1 V
–3
VCC= 1.4 V
–5
VCC = 1.65 V
–8
VCC= 2.3 V
–9
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC= 2.3 V
9
VCC = 0.8 V to 1.95 V
20
VCC = 2.3 V to 2.7 V
15
–40
85
V
V
mA
mA
ns/V
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating
CMOS Inputs, SCBA004.
6.4 Thermal Information
SN74AUC1G19
THERMAL METRIC
RθJA
(1)
4
(1)
Junction-to-ambient thermal resistance
DBV (SOT-23)
DCK (SC70)
DRL (SOT-5X3)
YZP (DSBGA)
6 PINS
6 PINS
6 PINS
6 PINS
206
252
142
132
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5
SCES626E – MARCH 2005 – REVISED JUNE 2017
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
VOL
(1)
6.6
TEST CONDITIONS
VCC
TYP (1)
MIN
MAX
IOH = –100 μA
0.8 V to 2.7 V
IOH = –0.7 mA
0.8 V
IOH = –3 mA
1.1 V
0.8
IOH = –5 mA
1.4 V
1
IOH = –8 mA
1.65 V
1.2
IOH = –9 mA
2.3 V
1.8
IOL = 100 μA
0.8 V to 2.7 V
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
IOL = 9 mA
2.3 V
0.6
UNIT
VCC – 0.1
0.55
V
0.2
0.25
V
II
VI = VCC or GND
0 to 2.7 V
±5
µA
Ioff
VI or VO = 2.7 V
0
±10
µA
ICC
VI = VCC or GND,
10
µA
CI
VI = VCC or GND
IO = 0
0.8 V to 2.7 V
2.5 V
3
pF
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
Switching Characteristics: CL = 15 pF
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
6.7
VCC = 1.1 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
A or E
Y
7.5
0.5
4.6
0.4
3.0
0.3
2.4
0.2
1.7
UNIT
ns
Switching Characteristics: CL = 30 pF
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
6.8
FROM
(INPUT)
TO
(OUTPUT)
A or E
Y0 or Y1
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN
MAX
MIN
MAX
0.5
2.8
0.4
2.0
UNIT
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation
capacitance
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC =1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
f = 10 MHz
13
13
13
13
14
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UNIT
pF
5
SN74AUC1G19
SCES626E – MARCH 2005 – REVISED JUNE 2017
www.ti.com
7 Parameter Measurement Information
2 × V CC
S1
RL
From Output
Under Test
TEST
Open
GND
CL
(see Note A)
S1
t PLH/t PHL
Open
t PLZ/t PZL
2 × V CC
t PHZ/t PZH
GND
RL
LOAD CIRCUIT
V CC
CL
RL
VD
0.8 V
15 pF
2 kΩ
0.1 V
1.2 V ± 0.1 V
15 pF
2 kΩ
0.1 V
1.5 V ± 0.1 V
15 pF
2 kΩ
0.1 V
1.8 V ± 0.15 V
15 pF
2 kΩ
0.15 V
2.5 V ± 0.2 V
15 pF
2 kΩ
0.15 V
1.8 V ± 0.15 V
30 pF
1 kΩ
0.15 V
2.5 V ± 0.2 V
30 pF
500 Ω
0.15 V
V CC
Timing Input
V CC /2
0V
tw
t su
th
V CC
V CC /2
Input
VCC /2
V CC
V CC /2
V CC /2
Data Input
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLT AGE WAVEFORMS
SETUP AND HOLD TIMES
V CC
V CC /2
Input
V CC /2
V CC
Output
Control
V CC /2
V CC /2
0V
0V
t PHL
t PLH
V OH
V CC/2
Output
V CC/2
V OL
t PHL
t PLH
V CC/2
t PZL
t PLZ
V CC
V CC/2
t PZH
V OH
Output
Output
Waveform 1
S1 at 2 × V CC
(see Note B)
V CC/2
V OL
Output
Waveform 2
S1 at GND
(see Note B)
VOLT AGE WAVEFORMS
PROPAGATION DELA Y TIMES
INVERTING AND NONINVERTING OUTPUTS
V OL + V D
V OL
t PHZ
V CC/2
V OH − V D
V OH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW - AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHZ, ZO = 50 Ω , slew rate ≤ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. t PLZ and t PHZ are the same as t dis.
F. t PZL and t PZH are the same as t en.
G. t PLH and t PHL are the same as t pd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
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SCES626E – MARCH 2005 – REVISED JUNE 2017
8 Detailed Description
8.1 Functional Block Diagram
A
6
4
Y0
Y1
E
Figure 2. Logic Diagram (Positive Logic)
8.2 Device Functional Modes
Table 1 lists the functional mode of the SN74AUC1G19.
Table 1. Function Table
INPUTS
E
OUTPUTS
A
Y0
Y1
H
L
L
L
L
H
H
L
H
X
H
H
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SN74AUC1G19
SCES626E – MARCH 2005 – REVISED JUNE 2017
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9 Device and Documentation Support
9.1 Documentation Support
9.1.1 Related Documentation
For related documentation see the following:
• Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, SCEA027
• Implications of Slow or Floating CMOS Inputs, SCBA004
9.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
9.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
9.4 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
9.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
9.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
8
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74AUC1G19DBVR
ACTIVE
SOT-23
DBV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
U19R
Samples
SN74AUC1G19DCKR
ACTIVE
SC70
DCK
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
U5R
Samples
SN74AUC1G19DCKT
ACTIVE
SC70
DCK
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
U5R
Samples
SN74AUC1G19DRLR
ACTIVE
SOT-5X3
DRL
6
4000
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
(1KA, U57, U5R)
Samples
SN74AUC1G19YZPR
ACTIVE
DSBGA
YZP
6
3000
RoHS & Green
Level-1-260C-UNLIM
-40 to 85
U5N
Samples
SNAGCU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of