www.ti.com
FEATURES
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(1)
Member of the Texas Instruments Widebus™
Family
High-Bandwidth Data Path (up to 500 MHz (1))
5-V Tolerant I/Os With Device Powered Up or
Powered Down
Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 5 Ω Typ)
Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V VCC
– 0- to 3.3-V Switching With 2.5-V VCC
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 4 pF Typ)
Fast Switching Frequency (fOE = 20 MHz Max)
Data and Control Inputs Provide Undershoot
Clamp Diodes
Low Power Consumption (ICC = 1 mA Typ)
VCC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model (A114-B,
Class II)
– 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog
Applications: PCI Interface, Differential Signal
Interface, Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
SCDS171A – JULY 2004 – REVISED MARCH 2005
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
NC
1B1
1B2
GND
1B3
1B4
VCC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCC
2B5
2B6
GND
2B7
2B8
NC
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2OE
NC - No internal connection
For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,
literature number SCDA008.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A – JULY 2004 – REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION
The SN74CB3Q16245 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of
the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows
for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device
also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.
Specifically designed to support high-bandwidth applications, the SN74CB3Q16245 provides an optimized
interface solution ideally suited for broadband communications, networking, and data-intensive computing
systems.
The SN74CB3Q16245 is organized as two 8-bit bus switches with separate output-enable (1OE, 2OE) inputs. It
can be used as two 8-bit bus switches, or as one 16-bit bus switch. When OE is low, the associated 8-bit bus
switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE
is high, the associated 8-bit bus switch is OFF, and a high-impedance state exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PACKAGE (1)
TA
SSOP – DL
–40°C to 85°C
TSSOP – DGG
TVSOP – DGV
(1)
ORDERABLE PART NUMBER
Tube
SN74CB3Q16245DL
Tape and reel
SN74CB3Q16245DLR
Tube
SN74CB3Q16245DGG
Tape and reel
SN74CB3Q16245DGGR
Tape and reel
SN74CB3Q16245DGVR
CB3Q16245
CB3Q16245
BW245
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH 8-BIT BUS SWITCH)
2
TOP-SIDE MARKING
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
A port = B port
H
Z
Disconnect
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A – JULY 2004 – REVISED MARCH 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
47
2
1A1
1B1
SW
37
12
1A8
1B8
SW
48
1OE
36
13
2A1
23
26
2A8
2OE
2B1
SW
SW
2B8
25
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
VCC
Charge
Pump
EN(1)
(1) EN is the internal enable signal applied to the switch.
3
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A – JULY 2004 – REVISED MARCH 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
VI/O
Switch I/O voltage
range (2) (3) (4)
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±64
mA
±100
mA
II/O
ON-state switch
–0.5
current (5)
Continuous current through VCC or GND
θJA
Tstg
(1)
(2)
(3)
(4)
(5)
(6)
Package thermal impedance (6)
7
DGG package
70
DGV package
58
DL package
63
Storage temperature range
–65
150
UNIT
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
4
MIN
MAX
2.3
3.6
VCC = 2.3 V to 2.7 V
1.7
5.5
VCC = 2.7 V to 3.6 V
2
5.5
VCC = 2.3 V to 2.7 V
0
0.7
VCC = 2.7 V to 3.6 V
0
0.8
0
5.5
V
–40
85
°C
Supply voltage
UNIT
V
V
V
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A – JULY 2004 – REVISED MARCH 2005
Electrical Characteristics
(1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
VCC = 3.6 V,
IIN
II = –18 mA
Control inputs VCC = 3.6 V,
VIN = 0 to 5.5 V
IOZ (3)
VCC = 3.6 V,
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
ICC
VCC = 3.6 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
One input at 3 V,
Other inputs at VCC or GND
∆ICC
(4)
Control inputs VCC = 3.6 V,
VCC = 3.6 V,
ICCD (5)
Per control
input
Cin
Control inputs VCC = 3.3 V,
TYP (2) MAX
MIN
1
A and B ports open,
Control input switching at 50% duty cycle
VIN = 5.5 V, 3.3 V, or 0
V
±1
µA
±1
µA
1
µA
2
mA
30
µA
0.25
3.5
5
pF
Cio(OFF)
VCC = 3.3 V,
Cio(ON)
VCC = 3.3 V,
Switch ON,
VIN = VCC or GND,
VI/O = 5.5 V, 3.3 V, or 0
VI = 0,
IO = 30 mA
6
8
VI = 1.7 V,
IO = –15 mA
5
10
VI = 0,
IO = 30 mA
6
8
VI = 2.4 V,
IO = –15 mA
5
9
ron (6)
VCC = 3 V
(1)
(2)
(3)
(4)
(5)
(6)
mA/
MHz
0.15
Switch OFF,
VIN = VCC or GND,
VCC = 2.3 V,
TYP at VCC = 2.5 V
UNIT
–1.8
VI/O = 5.5 V, 3.3 V, or 0
4
6
pF
10
13
pF
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see
Figure 2).
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
(1)
(2)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
fOE (1)
OE
A or B
10
20
MHz
tpd (2)
A or B
B or A
0.18
0.3
ns
ten
OE
A or B
1.5
8
1.5
7
ns
tdis
OE
A or B
1
8
1
7
ns
PARAMETER
MIN
MAX
MIN
UNIT
MAX
Maximum toggle frequency for OE control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
5
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A – JULY 2004 – REVISED MARCH 2005
ron − ON−State Resistance − Ω
16
VCC = 3.3 V
TA = 25°C
IO = −15 mA
14
12
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VI − V
Figure 1. Typical ron vs VI
12
VCC = 3.3 V
TA = 25°C
A and B ports Open
10
ICC − mA
8
6
4
One OE Switching
2
0
0
2
4
6
8
10
12
14
OE Switching Frequency − MHz
Figure 2. Typical ICC vs OE Switching Frequency
6
16
18
20
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A – JULY 2004 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
2 × VCC
Input Generator
S1
RL
VO
VI
50 Ω
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
VCC or GND
VCC or GND
30 pF
50 pF
tPLZ/tPZL
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 × VCC
2 × VCC
500 Ω
500 Ω
GND
GND
30 pF
50 pF
0.15 V
0.3 V
tPHZ/tPZH
2.5 V ± 0.2 V
3.3 V ± 0.3 V
GND
GND
500 Ω
500 Ω
VCC
VCC
30 pF
50 pF
0.15 V
0.3 V
V∆
VCC
Output
Control
(VIN)
VCC/2
VCC
VCC/2
VCC/2
0V
tPLH
VOH
Output
VCC/2
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
VCC
VCC/2
VOL + V∆
VOL
tPZH
tPHL
VCC/2
0V
tPZL
Output
Control
(VIN)
Open
GND
Output
Waveform 2
S1 at GND
(see Note B)
tPHZ
VOH
VCC/2
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74CB3Q16245DGGRE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CB3Q16245DGGRG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CB3Q16245DGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CB3Q16245DGVRG4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CB3Q16245DLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q16245DGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q16245DGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q16245DL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q16245DLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CB3Q16245DLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.6
15.8
1.8
12.0
24.0
Q1
SN74CB3Q16245DGGR
TSSOP
DGG
48
2000
330.0
24.4
SN74CB3Q16245DGVR
TVSOP
DGV
48
2000
330.0
16.4
7.1
10.2
1.6
12.0
16.0
Q1
SN74CB3Q16245DLR
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CB3Q16245DGGR
TSSOP
DGG
48
2000
346.0
346.0
41.0
SN74CB3Q16245DGVR
TVSOP
DGV
48
2000
346.0
346.0
33.0
SN74CB3Q16245DLR
SSOP
DL
48
1000
346.0
346.0
49.0
Pack Materials-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74CB3Q16245DGGR
ACTIVE
TSSOP
DGG
48
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3Q16245
SN74CB3Q16245DGVR
ACTIVE
TVSOP
DGV
48
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
BW245
SN74CB3Q16245DL
ACTIVE
SSOP
DL
48
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3Q16245
SN74CB3Q16245DLR
ACTIVE
SSOP
DL
48
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3Q16245
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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