SN74HC08N

SN74HC08, SN54HC08 SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 SNx4HC08 Quadruple 2-Input AND Gates 1 Features 3 Description • • • This device contains four independent 2-input AND gates. Each gate performs the Boolean function Y = A ● B in positive logic. • • Buffered inputs Wide operating voltage range: 2 V to 6 V Wide operating temperature range: –40°C to +85°C Supports fanout up to 10 LSTTL loads Significant power reduction compared to LSTTL logic ICs 2 Applications • • Combining power good signals Enable digital signals Device Information PART NUMBER 1Y 2A 2B 2Y GND BODY SIZE (NOM) SOIC (14) 8.65 mm × 3.90 mm SN74HC08DB SSOP (14) 6.30 mm × 5.30 mm SN74HC08N PDIP (14) 19.34 mm × 6.35 mm SN74HC08N SO (14) 10.30 mm × 5.30 mm SN74HC08PW TSSOP (14) 5.00 mm × 4.40 mm LCCC (14) 1.83 mm × 8.89 mm CDIP (14) 19.56 mm × 6.67 mm CFP (14) 9.21 mm × 5.97 mm (1) 1B (1) SN74HC08D SN54HC08 1A PACKAGE For all available packages, see the orderable addendum at the end of the data sheet. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y Functional pinout An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 Pin Functions.................................................................... 3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information....................................................5 6.5 Electrical Characteristics - 74..................................... 5 6.6 Electrical Characteristics - 54..................................... 6 6.7 Switching Characteristics - 74.....................................6 6.8 Switching Characteristics - 54.....................................6 6.9 Operating Characteristics........................................... 7 6.10 Typical Characteristics.............................................. 7 7 Parameter Measurement Information............................ 8 8 Detailed Description........................................................9 8.1 Overview..................................................................... 9 8.2 Functional Block Diagram........................................... 9 8.3 Feature Description.....................................................9 8.4 Device Functional Modes..........................................10 9 Application and Implementation.................................. 11 9.1 Application Information..............................................11 9.2 Typical Application.................................................... 11 10 Power Supply Recommendations..............................13 11 Layout........................................................................... 13 11.1 Layout Guidelines................................................... 13 11.2 Layout Example...................................................... 13 12 Device and Documentation Support..........................14 12.1 Documentation Support.......................................... 14 12.2 Support Resources................................................. 14 12.3 Trademarks............................................................. 14 12.4 Electrostatic Discharge Caution..............................14 12.5 Glossary..................................................................14 13 Mechanical, Packaging, and Orderable Information.................................................................... 14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision H (April 2021) to Revision I (September 2021) Page • Removed Schmitt-Trigger inputs from the pinout image on the first page..........................................................1 Changes from Revision G (June 2016) to Revision H (April 2021) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................1 • Updated to new data sheet standards................................................................................................................ 1 • Increased D (86 to 133.6), DB (106.8 to 113.1), NS (76 to 122.6), and PW (113 to 151.7); decreased N (80 to 66) °C/W............................................................................................................................................................. 5 Changes from Revision F (January 2007) to Revision G (June 2016) Page • Added ESD Ratings table,Feature Descriptionsection, Device Functional Modes, Application and Implementation section, Power Supply Recommendationssection, Layoutsection, Device and Documentation Support section, andMechanical, Packaging, and Orderable Information section........................................... 14 • Removed Ordering Information table, see POA at the end of the datasheet................................................... 14 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 5 Pin Configuration and Functions 1B 1A NC VCC 4B 1A 1 14 VCC 1B 2 13 4B 1Y 3 12 4A 1Y 4 3 2 1 20 19 18 4A NC 5 17 NC 4Y 2A 4 11 4Y 2B 5 10 3B 2A 6 16 2Y 6 9 3A NC 7 15 NC GND 7 8 3Y 2B 8 14 9 10 11 12 13 3B D, DB, N, PW, J, or W Package 14-Pin SOIC, SSOP, PDIP, TSSOP, CDIP, or CFP Top View 2Y GND NC 3Y 3A FK Package 20-Pin LCCC Top View Pin Functions PIN D, DB, N, PW, J, or W FK 1A 1 2 1B 2 1Y 3 2A 2B NAME I/O DESCRIPTION Input Channel 1, Input A 3 Input Channel 1, Input B 4 Output 4 6 Input Channel 2, Input A 5 8 Input Channel 2, Input B 2Y 6 9 Output GND 7 10 — 3Y 8 12 Output 3A 9 13 Input Channel 3, Input A 3B 10 14 Input Channel 3, Input B 4Y 11 16 Output 4A 12 18 Input Channel 4, Input A 4B 13 19 Input Channel 4, Input B VCC 14 20 — Positive Supply 1, 5, 7, 11, 15, 17 — Not internally connected NC Channel 1, Output Y Channel 2, Output Y Ground Channel 3, Output Y Channel 4, Output Y Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 3 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage current(2) MIN MAX –0.5 7 UNIT V IIK Input clamp VI < 0 or VI > VCC ±20 mA IOK Output clamp current(2) VO < 0 ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA 150 °C 150 °C Continuous current through VCC or GND temperature(3) TJ Junction Tstg Storage temperature (1) (2) (3) –60 Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. Guaranteed by design. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/ JEDEC JS-001(1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted)1 VCC Supply voltage VIH High-level input voltage VCC = 2 V VCC = 4.5 V VCC = 6 V MIN NOM MAX 2 5 6 Low-level input voltage V 1.5 3.15 V 4.2 VCC = 2 V VIL UNIT 0.5 VCC = 4.5 V 1.35 VCC = 6 V V 1.8 VI Input voltage 0 VCC V VO Output voltage 0 VCC V Δt/Δv Input transition rise and fall rate VCC = 2 V 1000 VCC = 4.5 V 500 VCC = 6 V TA Operating free-air temperature ns 400 SN54HC08 –55 125 SN74HC08 –40 85 °C 1. All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs, . 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 6.4 Thermal Information SN74HC08 THERMAL METRIC(1) Junction-to-ambient thermal resistance RθJA Rθ JC(top) Junction-to-case (top) thermal resistance UNIT D (SOIC) DB (SSOP) N (CFP) NS (SO) PW (TSSOP) 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 133.6 113.1 66.0 122.6 151.7 °C/W 89 62.8 53.7 81.8 79.4 °C/W RθJB Junction-to-board thermal resistance 89.5 63.4 45.7 83.8 94.7 °C/W ΨJT Junction-to-top characterization parameter 45.5 22.3 33.3 45.4 25.2 °C/W ΨJB Junction-to-board characterization parameter 89.1 62.7 45.5 83.4 94.1 °C/W Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W Rθ JC(bot) (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics - 74 over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). Operating free-air temperature (TA) PARAMETER VOH High-level output voltage TEST CONDITIONS VI = VIH or VIL IOH = -20 µA Low-level output VI = VIH voltage or VIL 25°C -40°C to 85°C MIN TYP 2V 1.9 1.998 1.9 4.5 V 4.4 4.499 4.4 6V MAX MIN 5.9 5.999 5.9 IOH = -4 mA 4.5 V 3.98 4.3 3.84 IOH = -5.2 mA 6V 5.48 IOL = 20 µA VOL VCC 5.8 TYP UNIT MAX V 5.34 2V 0.002 0.1 0.1 4.5 V 0.001 0.1 0.1 IOL = 20 µA 6V 0.001 0.1 0.1 IOL = 4 mA 4.5 V 0.17 0.26 0.33 IOL = 5.2 mA 6V 0.15 0.26 0.33 V II Input leakage current VI = VCC or 0 6V ±0.1 ±1 µA ICC Supply current VI = VCC or 0 6V 2 20 µA Ci Input capacitance 10 10 pF IO = 0 2 V to 6 V 3 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 5 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 6.6 Electrical Characteristics - 54 over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). Operating free-air temperature (TA) PARAMETER TEST CONDITIONS VCC IOH = –20 µA VOH High-level output voltage VI = VIH or IOH = –4 VIL mA IOL = 20 µA Low-level output VI = VIH or voltage VIL –40°C to 85°C MAX MIN TYP –55°C to 125°C TYP MAX MIN 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.84 3.7 6V 5.48 5.8 5.34 5.2 TYP UNIT MAX V IOH = –5.2 mA VOL 25°C MIN 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 IOL = 4 mA 4.5 V 0.17 0.26 0.33 0.4 IOL = 5.2 mA 0.15 0.26 0.33 0.4 6V V II Input leakage current VI = VCC or 0 6V ±0.1 ±1 ±1 µA ICC Supply current VI = VCC or IO = 0 0 6V 2 20 40 µA Ci Input capacitance 10 10 10 pF 2 V to 6V 3 6.7 Switching Characteristics - 74 over operating free-air temperature range (unless otherwise noted) Operating free-air temperature (TA) PARAMETER FROM TO VCC 25°C MIN tpd tt Propagation delay A or B Y Transition-time Y –40°C to 85°C MIN TYP UNIT TYP MAX 2V 50 100 MAX 125 4.5 V 10 20 25 6V 8 17 24 2V 38 75 95 4.5 V 8 15 19 6V 6 13 16 ns ns 6.8 Switching Characteristics - 54 over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). Operating free-air temperature (TA) PARAMETER FROM TO VCC 25°C MIN tpd tt 6 Propagation delay Transition-time A or B Y Y –40°C to 85°C MIN TYP –55°C to 125°C TYP MAX 2V 50 100 MAX 125 MIN TYP 150 4.5 V MAX 10 20 25 30 6V 8 17 24 25 2V 38 75 95 110 4.5 V 8 15 19 22 6V 6 13 16 19 Submit Document Feedback UNIT ns ns Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 6.9 Operating Characteristics over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS Power dissipation capacitance No load per gate Cpd VCC MIN 2 V to 6 V TYP MAX UNIT 20 pF 6.10 Typical Characteristics TA = 25°C 0.3 7 VOL Output Low Voltage (V) VOH Output High Voltage (V) 6 5 4 3 2 2-V 4.5-V 6-V 1 0 2-V 4.5-V 6-V 0.25 0.2 0.15 0.1 0.05 0 0 1 2 3 4 IOH Output High Current (mA) 5 6 Figure 6-1. Typical output voltage in the high state (VOH) 0 1 2 3 4 IOL Output Low Current (mA) 5 6 Figure 6-2. Typical output voltage in the low state (VOL) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 7 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 7 Parameter Measurement Information • • Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tt < 6 ns. The outputs are measured one at a time, with one input transition per measurement. Test Point 90% VCC 90% Input 10% 10% tr(1) From Output Under Test CL(1) 0V tf(1) 90% VOH 90% Output 10% A. 10% tr(1) CL= 50 pF and includes probe and jig capacitance. A. Figure 7-1. Load Circuit tf(1) VOL tt is the greater of tr and tf. Figure 7-2. Voltage Waveforms Transition Times VCC Input 50% 50% 0V tPHL(1) tPLH(1) VOH Output 50% 50% VOL tPLH(1) tPHL(1) VOH Output 50% 50% VOL A. The maximum between tPLH and tPHL is used for tpd. Figure 7-3. Voltage Waveforms Propagation Delays 8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 8 Detailed Description 8.1 Overview This device contains four independent 2-input AND gates. Each gate performs the Boolean function Y = A ● B in positive logic. 8.2 Functional Block Diagram xA xY xB 8.3 Feature Description 8.3.1 Balanced CMOS Push-Pull Outputs A balanced output allows the device to sink and source similar currents. The drive capability of this device may create fast edges into light loads so routing and load conditions should be considered to prevent ringing. Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without being damaged. It is important for the output power of the device to be limited to avoid damage due to over-current. The electrical and thermal limits defined in the Absolute Maximum Ratings must be followed at all times. The SN74HC08 can drive a load with a total capacitance less than or equal to the maximum load listed in the Electrical Characteristics - 74 connected to a high-impedance CMOS input while still meeting all of the datasheet specifications. Larger capacitive loads can be applied, however it is not recommended to exceed the provided load value. If larger capacitive loads are required, it is recommended to add a series resistor between the output and the capacitor to limit output current to the values given in the Absolute Maximum Ratings. 8.3.2 Standard CMOS Inputs Standard CMOS inputs are high impedance and are typically modeled as a resistor from the input to ground in parallel with the input capacitance given in the Electrical Characteristics - 74. The worst case resistance is calculated with the maximum input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the Electrical Characteristics - 74, using ohm's law (R = V ÷ I). Signals applied to the inputs need to have fast edge rates, as defined by the input transition time in the Recommended Operating Conditions to avoid excessive current consumption and oscillations. If a slow or noisy input signal is required, a device with a Schmitt-trigger input should be used to condition the input signal prior to the standard CMOS input. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 9 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 8.3.3 Clamp Diode Structure The inputs and outputs to this device have both positive and negative clamping diodes as depicted in Figure 8-1. CAUTION Voltages beyond the values specified in the Absolute Maximum Ratings table can cause damage to the device. The recommended input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VCC Device +IIK +IOK Logic Input -IIK Output -IOK GND Figure 8-1. Electrical Placement of Clamping Diodes for Each Input and Output 8.4 Device Functional Modes Table 8-1. Function Table INPUTS 10 OUTPUT A B Y H H H L X L X L L Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information In this application, three 2-input AND gates are combined to produce a 4-input AND gate function as shown in Figure 9-1. The fourth gate can be used for another application in the system, or the inputs can be grounded and the channel left unused. This device is used to directly control the RESET pin of a motor controller. The controller requires four input signals to all be HIGH before being enabled, and should be disabled in the event that any one signal goes LOW. The 4-input AND gate function combines the four individual reset signals into a single active-low reset signal. 9.2 Typical Application Power Sup ply Over Current Detection Motor Con trol ler OC PG ON/OFF RESET OT On/Off Switch Over Temp Detection Figure 9-1. Typical application schematic 9.2.1 Design Requirements 9.2.1.1 Power Considerations Ensure the desired supply voltage is within the range specified in the Recommended Operating Conditions. The supply voltage sets the device's electrical characteristics as described in the Electrical Characteristics - 74. The supply must be capable of sourcing current equal to the total current to be sourced by all outputs of the SN74HC08 plus the maximum supply current, ICC, listed in the Electrical Characteristics - 74. The logic device can only source or sink as much current as it is provided at the supply and ground pins, respectively. Be sure not to exceed the maximum total current through GND or VCC listed in the Absolute Maximum Ratings. Total power consumption can be calculated using the information provided in CMOS Power Consumption and Cpd Calculation. Thermal increase can be calculated using the information provided in Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices. CAUTION The maximum junction temperature, TJ(max) listed in the Absolute Maximum Ratings, is an additional limitation to prevent damage to the device. Do not violate any values listed in the Absolute Maximum Ratings. These limits are provided to prevent damage to the device. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 11 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 9.2.1.2 Input Considerations Unused inputs must be terminated to either VCC or ground. These can be directly terminated if the input is completely unused, or they can be connected with a pull-up or pull-down resistor if the input is to be used sometimes, but not always. A pull-up resistor is used for a default state of HIGH, and a pull-down resistor is used for a default state of LOW. The resistor size is limited by drive current of the controller, leakage current into the SN74HC08, as specified in the Electrical Characteristics - 74, and the desired input transition rate. A 10-kΩ resistor value is often used due to these factors. The SN74HC08 has standard CMOS inputs, so input signal edge rates cannot be slow. Slow input edge rates can cause oscillations and damaging shoot-through current. The recommended rates are defined in the Recommended Operating Conditions. Refer to Section 8.3 for additional information regarding the inputs for this device. 9.2.1.3 Output Considerations The positive supply voltage is used to produce the output HIGH voltage. Drawing current from the output will decrease the output voltage as specified by the VOH specification in the Electrical Characteristics - 74. Similarly, the ground voltage is used to produce the output LOW voltage. Sinking current into the output will increase the output voltage as specified by the VOL specification in the Electrical Characteristics - 74. Unused outputs can be left floating. Do not connect outputs directly to VCC or ground. Refer to Section 8.3 for additional information regarding the outputs for this device. 9.2.2 Detailed Design Procedure 1. Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the device and electrically close to both the VCC and GND pins. An example layout is shown in Section 11. 2. Ensure the capacitive load at the output is ≤ 70 pF. This is not a hard limit, however it will ensure optimal performance. This can be accomplished by providing short, appropriately sized traces from the SN74HC08 to the receiving device. 3. Ensure the resistive load at the output is larger than (VCC / IO(max)) Ω. This will ensure that the maximum output current from the Absolute Maximum Ratings is not violated. Most CMOS inputs have a resistive load measured in megaohms; much larger than the minimum calculated above. 4. Thermal issues are rarely a concern for logic gates, however the power consumption and thermal increase can be calculated using the steps provided in the application report, CMOS Power Consumption and Cpd Calculation 9.2.3 Application Curves OC PG ON/OFF OT RESET Figure 9-2. Typical application timing diagram 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results, as shown in Figure 11-1. 11 Layout 11.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 11.2 Layout Example GND VCC Recommend GND flood fill for improved signal isolation, noise reduction, and thermal dissipation 0.1 F Avoid 90° corners for signal lines Bypass capacitor placed close to the device 1A 1 14 VCC 1B 2 13 4B 1Y 3 12 4A 2A 4 11 4Y 2B 5 10 3B 2Y 6 9 3A GND 7 8 3Y Unused inputs tied to VCC Unused output left floating Figure 11-1. Example layout for the SN74HC08 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 13 SN74HC08, SN54HC08 www.ti.com SCLS081I – DECEMBER 1982 – REVISED SEPTEMBER 2021 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: • HCMOS Design Considerations • CMOS Power Consumption and CPD Calculation • Designing with Logic 12.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74HC08 SN54HC08 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-8404701VCA ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8404701VC A SNV54HC08J 5962-8404701VDA ACTIVE CFP W 14 25 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8404701VD A SNV54HC08W 84047012A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 84047012A SNJ54HC 08FK 8404701CA ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8404701CA SNJ54HC08J Samples 8404701DA ACTIVE CFP W 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8404701DA SNJ54HC08W Samples JM38510/65203B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65203B2A Samples JM38510/65203BCA ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65203BCA Samples JM38510/65203BDA ACTIVE CFP W 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65203BDA Samples M38510/65203B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65203B2A Samples M38510/65203BCA ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65203BCA Samples M38510/65203BDA ACTIVE CFP W 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65203BDA Samples SN54HC08J ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC08J Samples SN74HC08D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08DBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08DE4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08DG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples Addendum-Page 1 Samples Samples Samples PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74HC08DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08DT ACTIVE SOIC D 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08DTE4 ACTIVE SOIC D 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC08N Samples SN74HC08NE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC08N Samples SN74HC08NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08PW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08PWG4 ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SN74HC08PWT ACTIVE TSSOP PW 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC08 Samples SNJ54HC08FK ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 84047012A SNJ54HC 08FK SNJ54HC08J ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8404701CA SNJ54HC08J Samples SNJ54HC08W ACTIVE CFP W 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8404701DA SNJ54HC08W Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of