SN74HC138NS

SN54HC138, SN74HC138 SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 SNx4HC138 3-Line To 8-Line Decoders/Demultiplexers 1 Features 3 Description • The SNx4HC138 devices are designed to be used in high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories using a fast enable circuit, the delay times of these decoders and the enable time of the memory are usually less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible. • • • • • • • • Targeted Specifically for High-Speed Memory Decoders and Data-Transmission Systems Wide Operating Voltage Range (2 V to 6 V) Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 80-µA Maximum ICC Typical tpd = 15 ns ±4-mA Output Drive at 5 V Low Input Current of 1-µA Maximum Active Low Outputs ( Selected Output is Low) Incorporate Three Enable Inputs to Simplify Cascading or Data Reception 2 Applications • • • • • • LED Displays Servers White Goods Power Infrastructure Building Automation Factory Automation Device Information PART NUMBER PACKAGE (1) BODY SIZE (NOM) SN74HC138D SOIC (16) 9.90 mm x 3.90 mm SN74HC138DB SSOP (16) 6.20 mm x 5.30 mm SN74HC138N PDIP (16) 19.32 mm x 6.35 mm SN74HC138NS SO (16) 10.20 mm x 5.30 mm SN74HC138PW TSSOP (16) 5.00 mm x 4.40 mm SN54HC138J CDIP (16) 21.34 mm x 6.92 mm SN54HC138W CFP (16) 10.16 mm x 6.73 mm SN54HC138FK LCCC (20) 8.89 mm x 8.89 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. Functional Block DIagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 Pin Functions.................................................................... 3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings: SN74HC138......................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information: SN74HC138..............................5 6.5 Thermal Information: SN54HC138..............................5 6.6 Electrical Characteristics.............................................5 6.7 Electrical Characteristics: SN74HC138...................... 6 6.8 Electrical Characteristics: SN54HC138...................... 6 6.9 Switching Characteristics............................................6 6.10 Switching Characteristics: SN74HC138....................7 6.11 Switching Characteristics: SN54HC138....................7 6.12 Typical Characteristic................................................7 7 Parameter Measurement Information............................ 8 8 Detailed Description........................................................9 8.1 Overview..................................................................... 9 8.2 Functional Block Diagram........................................... 9 8.3 Feature Description.....................................................9 8.4 Device Functional Modes..........................................10 9 Application and Implementation.................................. 11 9.1 Application Information..............................................11 9.2 Typical Application.................................................... 11 10 Power Supply Recommendations..............................12 11 Layout........................................................................... 12 11.1 Layout Guidelines................................................... 12 11.2 Layout Example...................................................... 12 12 Device and Documentation Support..........................13 12.1 Documentation Support.......................................... 13 12.2 Related Links.......................................................... 13 12.3 Receiving Notification of Documentation Updates..13 12.4 Support Resources................................................. 13 12.5 Trademarks............................................................. 13 12.6 Electrostatic Discharge Caution..............................13 12.7 Glossary..................................................................13 13 Mechanical, Packaging, and Orderable Information.................................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (September 2003) to Revision F (September 2016) Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1 • Deleted Ordering Information table; see POA at the end of the data sheet....................................................... 1 • Changed RθJA values from 73 to 87.3 (D), from 82 to 104.3 (DB), from 67 to 54.8 (N), from 64 to 91.1 (NS), and from 108 to 114.6 (PW)................................................................................................................................5 Changes from Revision F (September 2016) to Revision G (October 2021) Page • Updated the ESD ratings table to fit modern data sheet standards....................................................................4 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 5 Pin Configuration and Functions SOIC, SSOP, PDIP, SO, TSSOP, CDIP, or CFP Package 16-Pin D, DB, N, NS, PW, J or W Top View NC: No internal connection LCCC Package 20-Pin FK Top View Pin Functions PIN I/O(1) DESCRIPTION SOIC, SSOP, PDIP, SO, TSSOP, CDIP, CFP LCCC A 1 2 I Select input A (least significant bit) B 2 3 I Select input B C 3 4 I Select input C (most significant bit) G2A 4 5 I Active low enable A G2B 5 7 I Active low enable B G1 6 8 I Active high enable GND 8 10 — Ground NC — 1, 6, 11, 16 — No internal connection VCC 16 20 — Supply voltage Y0 15 19 O Output 0 (least significant bit) Y1 14 18 O Output 1 Y2 13 17 O Output 2 Y3 12 15 O Output 3 Y4 11 14 O Output 4 Y5 10 13 O Output 5 Y6 9 12 O Output 6 Y7 7 9 O Output 7 (most significant bit) NAME (1) Signal Types: I = Input, O = Output, I/O = Input or Output. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 3 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) VCC (1) MIN MAX UNIT –0.5 7 V VI < 0 or VI > VCC ±20 mA VO < 0 or VO > VCC ±20 mA VO = 0 to VCC ±25 mA ±50 mA 150 °C 150 °C Supply voltage range (2) IIK Input clamp current IOK Output clamp current IO Continuous output current (2) Continuous current through VCC or GND TJ Junction temperature Tstg Storage temperature (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 6.2 ESD Ratings: SN74HC138 VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) UNIT ±2000 Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) V ±1000 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage VIH High-level input voltage VCC = 2 V VCC = 4.5 V VCC = 6 V MIN NOM MAX 2 5 6 V 4.2 0.5 VCC = 4.5 V Low-level input voltage 1.35 VCC = 6 V V 1.8 VI Input voltage 0 VCC V VO Output voltage 0 VCC V VCC = 2 V Δt/Δv Cpd TA (1) 4 V 1.5 3.15 VCC = 2 V VIL UNIT Input transition rise or fall time 1000 VCC = 4.5 V 500 VCC= 6 V 400 Power dissipation capacitance (no load) Operating free-air temperature 85 ns pF SN54HC138 –55 125 SN74HC138 –40 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 6.4 Thermal Information: SN74HC138 SN74HC138 THERMAL METRIC(1) D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS UNIT RθJA Junction-to-ambient thermal resistance 87.3 104.3 54.8 91.1 141.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 45.8 54.7 42.1 49.5 49.5 °C/W RθJB Junction-to-board thermal resistance 44.8 54.9 34.8 51.5 59.6 °C/W ψJT Junction-to-top characterization parameter 14.2 17.7 27 17.8 6.9 °C/W ψJB Junction-to-board characterization parameter 44.5 54.4 34.7 51.2 59.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Thermal Information: SN54HC138 SN54HC138(2) THERMAL METRIC(1) J (CDIP) W (CFP) FK (LCCC) 16 PINS 16 PINS 20 PINS — — — °C/W RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter RθJC(bot) Junction-to-case (bottom) thermal resistance 17.7 (1) UNIT 45.4 68.1 49 °C/W — 118.4 47.7 °C/W — — 7.2 °C/W 62.5 — — °C/W 9 — °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. RθJC follows MIL-STD-883, and RθJB follows JESD51. (2) 6.6 Electrical Characteristics TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP VCC = 2 V 1.9 1.998 VCC = 4.5 V 4.4 4.499 VCC = 6 V 5.9 5.999 IOH = –4 mA, VCC = 4.5 V 3.98 4.3 IOH= –5.2 mA, VCC = 6 V 5.48 5.8 IOH = –20 µA VOH VI = VIH or VIL IOL = 20 µA VOL VI= VIH or VIL MAX UNIT V VCC = 2 V 0.002 0.1 VCC = 4.5 V 0.001 0.1 VCC = 6 V V 0.001 0.1 IOL = 4 mA, VCC = 4.5 V 0.17 0.26 IOL = 5.2 mA, VCC = 6 V 0.15 0.26 ±0.1 ±100 nA 8 µA 3 10 pF II VI = VCC or 0, VCC = 6 V ICC VI = VCC or 0, IO = 0, VCC = 6 V Ci VCC = 2 V to 6 V Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 5 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 6.7 Electrical Characteristics: SN74HC138 over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN IOH = –20 µA VOH VI = VIH or VIL VCC = 2 V 1.9 VCC = 4.5 V 4.4 VCC = 6 V IOH = –4 mA, VCC = 4.5 V IOL = 20 µA VI= VIH or VIL 5.34 VCC = 2 V 0.1 VCC = 4.5 V 0.1 VCC = 6 V 0.1 ICC Ci V 0.33 IOL = 5.2 mA, VCC = 6 V VI = VCC or 0, VCC = 6 V UNIT V 5.9 IOL = 4 mA, VCC = 4.5 V II MAX 3.84 IOH= –5.2 mA, VCC = 6 V VOL TYP 0.33 ±1000 nA VI = VCC or 0, IO = 0, VCC = 6 V 80 µA VCC = 2 V to 6 V 10 pF MAX UNIT 6.8 Electrical Characteristics: SN54HC138 over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = –20 µA VOH VI = VIH or VIL MIN VCC = 2 V 1.9 VCC = 4.5 V 4.4 VCC = 6 V 5.9 IOH = –4 mA, VCC = 4.5 V IOL = 20 µA VI= VIH or VIL V 3.7 IOH= –5.2 mA, VCC = 6 V VOL TYP 5.2 VCC = 2 V 0.1 VCC = 4.5 V 0.1 VCC = 6 V 0.1 IOL = 4 mA, VCC = 4.5 V 0.4 IOL = 5.2 mA, VCC = 6 V 0.4 II VI = VCC or 0, VCC = 6 V ICC VI = VCC or 0, IO = 0, VCC = 6 V Ci VCC = 2 V to 6 V V ±1000 nA 160 µA 10 pF 6.9 Switching Characteristics TA = 25°C and CL = 50 pF (unless otherwise noted; see Section 7) PARAMETER TEST CONDITIONS From A, B, or C (input) to any Y (output) tpd From enable (input) to any Y (output) tt 6 To any output TYP MAX VCC = 2 V MIN 67 180 VCC = 4.5 V 18 36 VCC = 6 V 15 31 VCC = 2 V 66 155 VCC = 4.5 V 18 31 VCC = 6 V 15 26 VCC = 2 V 38 75 VCC = 4.5 V 8 15 VCC = 6 V 6 13 Submit Document Feedback UNIT ns ns Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 6.10 Switching Characteristics: SN74HC138 over recommended operating free-air temperature range and CL = 50 pF (unless otherwise noted; see Section 7) PARAMETER TEST CONDITIONS MIN TYP VCC = 2 V From A, B, or C (input) to any Y (output) tpd From enable (input) to any Y (output) tt To any output MAX UNIT 225 VCC = 4.5 V 45 VCC = 6 V 38 VCC = 2 V 195 VCC = 4.5 V 39 VCC = 6 V 33 VCC = 2 V 95 VCC = 4.5 V 19 VCC = 6 V 16 ns ns 6.11 Switching Characteristics: SN54HC138 over recommended operating free-air temperature range and CL = 50 pF (unless otherwise noted; see Section 7) PARAMETER TEST CONDITIONS MIN TYP VCC = 2 V From A, B, or C (input) to any Y (output) tpd From enable (input) to any Y (output) tt To any output MAX UNIT 270 VCC = 4.5 V 54 VCC = 6 V 46 VCC = 2 V 235 VCC = 4.5 V 47 VCC = 6 V 40 VCC = 2 V 110 VCC = 4.5 V 22 VCC = 6 V 19 ns ns Propagation Delay From A, B, C to any Y (ns) 6.12 Typical Characteristic 70 65 60 55 50 45 40 35 30 25 20 15 2 2.5 3 3.5 4 4.5 Supply Voltage VCC (V) 5 5.5 6 D001 Figure 6-1. Typical Propagation Delay vs Supply Voltage Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 7 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 7 Parameter Measurement Information From Output Under Test VCC Test Point Input 50% 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT tPHL 90% 50% 10% 90% tr Input 50% 10% 90% tPHL VCC 90% 50% 10% 0 V tr Out-of-Phase Output 90% tPLH 50% 10% tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 50% 10% VOL tf tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 7-1. Load Circuit and Voltage Waveforms 8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 8 Detailed Description 8.1 Overview The SNx4HC138 devices are 3-to-8 decoders and demultiplexers. The three input pins, A, B, and C, select which output is active. The selected output is pulled LOW, while the remaining outputs are all HIGH. The conditions at the binary-select inputs at the three enable inputs select one of eight output lines. Two active-low and one active-high enable inputs reduce the requirement for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications. 8.2 Functional Block Diagram Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. 8.3 Feature Description This device features three binary inputs to select a single active-low output. Three enable pins are also available to enable or disable the outputs. One active high enable and two active low enable pins are available, and any enable pin can be deactivated to force all outputs high. All three enable pins must be active for the output to be enabled. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 9 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 8.4 Device Functional Modes Table 8-1 lists the functions of the SNx4HC138 devices. Table 8-1. Function Table INPUTS ENABLE 10 OUTPUTS SELECT G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X H X X X X H H H H H H H H X X H X X X H H H H H H H H L X X X X X H H H H H H H H H L L L L L L H H H H H H H H L L L L H H L H H H H H H H L L L H L H H L H H H H H H L L L H H H H H L H H H H H L L H L L H H H H L H H H H L L H L H H H H H H L H H H L L H H L H H H H H H L H H L L H H H H H H H H H H L Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information The SN74HC138 is useful as a scanning column selector for an LED Matrix display as it can be used for the low side drive of the LED string. The decoder functionality ensures that no more than one output is pulled to a low-level logic voltage so that only a single column is enabled at any point in time. 9.2 Typical Application SER GPIO Inputs SRCLK QA 0V RCLK SN74HC595B QH 3.3V 3.3V HIGH GPIO Inputs A Y0 HIGH B 0V Y7 SN74HC138 HIGH C Copyright © 2016, Texas Instruments Incorporated Figure 9-1. LED Matrix Driver Application 9.2.1 Design Requirements These devices use CMOS technology and have balanced output drive. Take care to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive also creates fast edges into light loads, so routing and load conditions must be considered to prevent ringing. 9.2.2 Detailed Design Procedure 1. Recommended Input Conditions • For switch time specifications, see propagation delay times in Section 6.9. • For input voltage level specifications for control inputs, see VIH and VIL in Section 6.6. 2. Recommended Output Conditions • Outputs must not be pulled above VCC or below GND. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 11 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 9.2.3 Application Curve 5 VIH MIN VIL MAX 4.5 Logic Level (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 2 2.4 2.8 3.2 3.6 4 4.4 4.8 Supply Voltage VCC (V) 5.2 5.6 6 D002 Figure 9-2. Input High and Input Low Thresholds vs Supply Voltage 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Section 6.3. Each VCC terminal must have a good bypass capacitor to prevent power disturbance. A 0.1-µF bypass capacitor is recommended to be placed close to the VCC terminal. It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise; 0.1-µF and 1-µF capacitors are commonly used in parallel. The bypass capacitor must be installed as close to the power terminal as possible for best results. 11 Layout 11.1 Layout Guidelines Reflections and matching are closely related to loop antenna theory, but different enough to warrant their own discussion. When a PCB trace turns a corner at a 90° angle, a reflection can occur. This is primarily due to the change of width of the trace. At the apex of the turn, the trace width is increased to 1.414 times its width. This upsets the transmission line characteristics, especially the distributed capacitance and self–inductance of the trace (resulting in the reflection). It is a given that not all PCB traces can be straight, and so they have to turn corners. Figure 11-1 shows progressively better techniques of rounding corners. Only the last example maintains constant trace width and minimizes reflections. 11.2 Layout Example BETTER BEST 2W WORST 1W min. W Figure 11-1. Trace Example 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 SN54HC138, SN74HC138 www.ti.com SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: Implications of Slow or Floating CMOS Inputs (SCBA004) 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 12-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY SN54HC138 Click here Click here Click here Click here Click here SN74HC138 Click here Click here Click here Click here Click here 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.5 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN54HC138 SN74HC138 13 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-8406201VEA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8406201VE A SNV54HC138J 5962-8406201VFA ACTIVE CFP W 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8406201VF A SNV54HC138W 84062012A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 84062012A SNJ54HC 138FK 8406201EA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8406201EA SNJ54HC138J Samples 8406201FA ACTIVE CFP W 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8406201FA SNJ54HC138W Samples JM38510/65802B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65802B2A Samples JM38510/65802BEA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65802BEA Samples M38510/65802B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65802B2A Samples M38510/65802BEA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65802BEA Samples SN54HC138J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC138J Samples SN74HC138D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138DBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138DE4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138DG4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138DRE4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples Addendum-Page 1 Samples Samples Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Oct-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74HC138DRG4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138DT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU | SN N / A for Pkg Type -40 to 85 SN74HC138N Samples SN74HC138NE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC138N Samples SN74HC138NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138PWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SN74HC138PWT ACTIVE TSSOP PW 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Samples SNJ54HC138FK ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 84062012A SNJ54HC 138FK SNJ54HC138J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8406201EA SNJ54HC138J Samples SNJ54HC138W ACTIVE CFP W 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8406201FA SNJ54HC138W Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of