SN74HCT139PWRE4

SN54HCT139, SN74HCT139 SCLS066E – MARCH 1982 – REVISED AUGUST 2022 Dual 2-Line To 4-Line Decoders/Demultiplexers 1 Features 2 Description • • • • • • • • The ’HCT139 devices are designed for highperformance memory-decoding or data-routing applications requiring very short propagation delay times. • Operating voltage range of 4.5 V to 5.5 V Outputs can drive up to 10 LSTTL loads Low power consumption, 80-µA max ICC Typical tpd = 10 ns ±4-mA output drive at 5 V Low input current of 1 µA max Inputs are TTL-voltage compatible Designed specifically for high-speed memory decoders and data-transmission systems Incorporate two enable inputs to simplify cascading and/or data reception Device Information(1) ORDERABLE PART NUMBER SN74HCT139 PACKAGE† N (PDIP, 16) 19.31 mm × 6.35 mm D (SOIC, 16) 9.90 mm × 3.90 mm DB (SSOP, 16) 6.2 mm x 5.3 mm PW (TSSOP, 16) 5.00 mm × 4.40 mm J (CDIP, 16) 24.38 mm × 6.92 mm W (CFP, 16) 10.3 mm x 1.65 mm SNJ54HCT139 (1) A. BODY SIZE (NOM) For all available packages, see the orderable addendum at the end of the data sheet. Pin numbers shown are for the D, DB, J, N, PW, and W packages. Logic Diagram (Positive Logic) An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HCT139, SN74HCT139 www.ti.com SCLS066E – MARCH 1982 – REVISED AUGUST 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Description (continued).................................................. 3 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Rating.......................................... 4 6.2 Recommended Operating Conditions(1) .................... 4 6.3 Thermal Information....................................................4 6.4 Electrical Characteristics.............................................5 6.5 Switching Characteristics ...........................................5 6.6 Operating Characteristics........................................... 5 7 Parameter Measurement Information............................ 6 8 Detailed Description........................................................7 8.1 Overview..................................................................... 7 8.2 Functional Block Diagram........................................... 7 8.3 Device Functional Modes............................................7 9 Power Supply Recommendations..................................8 10 Layout.............................................................................8 10.1 Layout Guidelines..................................................... 8 11 Device and Documentation Support............................9 11.1 Documentation Support............................................ 9 11.2 Receiving Notification of Documentation Updates.... 9 11.3 Support Resources................................................... 9 11.4 Trademarks............................................................... 9 11.5 Electrostatic Discharge Caution................................ 9 11.6 Glossary.................................................................... 9 12 Mechanical, Packaging, and Orderable Information...................................................................... 9 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (September 2003) to Revision E (August 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 SN54HCT139, SN74HCT139 www.ti.com SCLS066E – MARCH 1982 – REVISED AUGUST 2022 4 Description (continued) The ’HCT139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its driving circuit. 5 Pin Configuration and Functions Figure 5-1. SN54HCT139 J or W Package SN74HCT139 D, DB, N, or PW Package Top View A. NC - No internal connection Figure 5-2. SN54HCT139 FK Package Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 3 SN54HCT139, SN74HCT139 www.ti.com SCLS066E – MARCH 1982 – REVISED AUGUST 2022 6 Specifications 6.1 Absolute Maximum Rating over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range current(2) MIN MAX –0.5 7 UNIT V IIK Input clamp VI < 0 or VI > VCC ±20 mA IOK Output clamp current(2) VO < 0 or VO> VCC ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA 150 ℃ 150 ℃ Continuous current through VCC or GND TJ Junction Temperature Tstg Storage temperature range (1) (2) –65 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 6.2 Recommended Operating Conditions(1) SN54HCT139 SN74HCT139 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC Supply voltage VIH High-level input voltage VCC = 4.5 V to 5.5 V VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 V VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V tt Input transition (rise and fall) time 500 ns TA Operating free-air temperature 85 °C (1) 2 V 2 V 0.8 500 −55 125 −40 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6.3 Thermal Information THERMAL RθJA (1) 4 METRIC(1) Package thermal impedance D (SOIC) DB (SSOP) N (PDIP) PW (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS UNIT 73 82 67 108 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 SN54HCT139, SN74HCT139 www.ti.com SCLS066E – MARCH 1982 – REVISED AUGUST 2022 6.4 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL II ICC ΔICC (1) High level output voltage VI = VIH or VIL Low level output voltage VI = VIH or VIL IOH = −20 µA IOH = −4 mA IOL = 20 µA VCC TA = 25°C SN54HCT139 MAX MIN SN74HCT139 MIN TYP MAX MIN 4.4 4.499 4.4 4.4 3.98 4.3 3.7 3.84 MAX UNIT 4.5 V V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 ±0.1 ±100 ±1000 ±1000 nA 8 160 80 µA 1.4 2.4 3 2.9 mA 3 10 10 10 pF 4.V IOL = 4 mA Input leakage VI = VCC or 0 current V 5.5 V Supply current VI = VCC IO = 0 or 0 5.5 V SupplyCurrent Change One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC 5.5 V Input Capacitance Ci (1) TEST CONDITIONS V 4.5 V to 5.5 V This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. 6.5 Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 7-1) PARAMETER FROM (INPUT) TO (OUTPUT) A or B Y G Y tpd tt Y VCC TA = 25°C MIN SN54HCT139 MIN SN74HCT139 TYP MAX MAX MIN MAX 4.5 V 14 34 51 43 5.5 V 12 30 50 40 4.5 V 11 34 51 43 5.5 V 10 30 50 40 4.5 V 8 15 22 19 5.5 V 6 14 21 17 UNIT ns ns 6.6 Operating Characteristics TA = 25℃ PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per decoder No load TYP 25 UNIT pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 5 SN54HCT139, SN74HCT139 www.ti.com SCLS066E – MARCH 1982 – REVISED AUGUST 2022 7 Parameter Measurement Information A. B. C. D. CL includes probe and test-fixture capacitance. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. The outputs are measured one at a time with one input transition per measurement. tPLH and tPHL are the same as tpd. Figure 7-1. Load Circuit and Voltage Waveforms 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 SN54HCT139, SN74HCT139 www.ti.com SCLS066E – MARCH 1982 – REVISED AUGUST 2022 8 Detailed Description 8.1 Overview The ’HCT139 devices are designed for high performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay time of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible. 8.2 Functional Block Diagram Figure 8-1. Function Diagram 8.3 Device Functional Modes Table 8-1. Function Table INPUTS(1) G (1) (2) OUTPUTS(2) SELECT B A Y0 Y1 Y2 Y3 H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L H = High Voltage Level, L = Low Voltage Level, X = Don’t Care H = Driving High, L = Driving Low, Z = High Impedance State Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 7 SN54HCT139, SN74HCT139 SCLS066E – MARCH 1982 – REVISED AUGUST 2022 www.ti.com 9 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 10 Layout 10.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 SN54HCT139, SN74HCT139 www.ti.com SCLS066E – MARCH 1982 – REVISED AUGUST 2022 11 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 11.1 Documentation Support 11.1.1 Related Documentation 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 11.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HCT139 SN74HCT139 9 PACKAGE OPTION ADDENDUM www.ti.com 10-Aug-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74HCT139D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT139 Samples SN74HCT139DBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT139 Samples SN74HCT139DE4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT139 Samples SN74HCT139DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT139 Samples SN74HCT139N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HCT139N Samples SN74HCT139PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT139 Samples SN74HCT139PWRE4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT139 Samples SN74HCT139PWT ACTIVE TSSOP PW 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT139 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of