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SN74HCT14PWRE4

SN74HCT14PWRE4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP14

  • 描述:

    IC INVERTER 6CH 6-INP 14TSSOP

  • 数据手册
  • 价格&库存
SN74HCT14PWRE4 数据手册
Product Folder Sample & Buy Technical Documents Support & Community Tools & Software SN54HCT14, SN74HCT14 SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 SNx4HCT14 Hex Schmitt-Trigger Inverters 1 Features 3 Description • • • • • • • The SNx4HCT14 devices contain six independent inverters. The devices perform the Boolean function Y = A in positive logic. 1 Operating Voltage Range of 4.5 V to 5.5 V Outputs Can Drive Up to 10 LSTTL Loads Low Power Consumption: 20-µA Maximum ICC Typical tpd = 18 ns ±4-mA Output Drive at 5 V Maximum Low Input Current of 1 µA Maximum Inputs Are TTL-Voltage Compatible Device Information(1) PART NUMBER SN54HCT14 PACKAGE BODY SIZE (NOM) CFP (14) 9.21 mm × 5.97 mm CDIP (14) 19.56 mm × 6.67 mm LCCC (20) 8.89 mm × 8.89 mm 2 Applications SOIC (14) 8.65 mm × 3.91 mm • • • • • • TVSOP (14) 3.60 mm × 4.40 mm PDIP (14) 19.30 mm × 6.35 mm TSSOP (14) 5.00 mm × 4.40 mm UPS White Goods Computer Peripherals Printers AC Servo Drives Desktop Computers SN74HCT14 (1) For all available packages, see the orderable addendum at the end of the data sheet. Logic Diagram (Positive Logic) A Y Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HCT14, SN74HCT14 SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 4 4 4 4 5 6 6 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics .......................................... Operating Characteristics.......................................... Typical Characteristics .............................................. Parameter Measurement Information .................. 7 Detailed Description .............................................. 8 8.1 Overview ................................................................... 8 8.2 Functional Block Diagram ......................................... 8 8.3 Feature Description................................................... 8 8.4 Device Functional Modes.......................................... 8 9 Application and Implementation .......................... 9 9.1 Application Information.............................................. 9 9.2 Typical Application .................................................... 9 10 Power Supply Recommendations ..................... 10 11 Layout................................................................... 10 11.1 Layout Guidelines ................................................. 10 11.2 Layout Example .................................................... 10 12 Device and Documentation Support ................. 11 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resource............................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 11 11 11 11 11 11 11 13 Mechanical, Packaging, and Orderable Information ........................................................... 11 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (October 2010) to Revision G Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Deleted Ordering Information table; see Package Option Addendum at the end of the data sheet ...................................... 1 • Changed Package thermal impedance, RθJA, values in Thermal Information table From: 86 To: 90.9 (D), From: 96 To: 105 (DB), From: 127 To: 132.2 (DGV), From: 80 To: 55.3 (N), and From: 113 To: 120.2 (PW)..................................... 4 2 Submit Documentation Feedback Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 SN54HCT14, SN74HCT14 www.ti.com SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 5 Pin Configuration and Functions D, DB, DGV, J, N, PW, or W Package X-Pin SOIC, SSOP, TVSOP, CDIP, PDIP, TSSOP, or CFP Top View 5A 3A 5 10 5Y 3Y 6 9 4A GND 7 8 4Y 6A 11 19 4 2A 4 18 6Y NC 5 17 NC 2Y 6 16 5A NC 7 15 NC 3A 8 14 5Y 13 2Y VCC 6Y 20 12 12 3 NC 2A 1 6A 11 13 1A 2 2 1Y 10 VCC 1Y 14 3 1 9 1A FK Package X-Pin LCCC Top View 4A 4Y NC GND 3Y Not to scale Not to scale Pin Functions PIN I/O DESCRIPTION SOIC, SSOP, TVSOP, CDIP, PDIP, TSSOP, CFP LCCC 1A 1 2 I Channel 1 input 1Y 2 3 O Channel 1 output 2A 3 4 I Channel 2 input 2Y 4 6 O Channel 2 output 3A 5 8 I Channel 3 input 3Y 6 9 O Channel 3 output 4A 9 13 I Channel 4 input 4Y 8 12 O Channel 4 output 5A 11 16 I Channel 5 input 5Y 10 14 O Channel 5 output 6A 13 19 I Channel 6 input 6Y 12 18 O Channel 6 output GND 7 10 — Ground NC — 1, 5, 7, 11, 15, 17 — No internal connection VCC 14 20 — Power supply NAME Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 Submit Documentation Feedback 3 SN54HCT14, SN74HCT14 SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage, VCC Input voltage, VI (2) Output voltage, VO (2) MIN MAX UNIT –0.5 7 V –0.5 VCC + 0.5 V –0.5 VCC + 0.5 V Input clamp current, IIK VI < 0 or VI > VCC ±20 mA Output clamp current, IOK VO < 0 or VO > VCC ±20 mA Continuous output current, IO VO = 0 to VCC ±25 mA ±50 mA 150 °C 150 °C Continuous current through VCC or GND Operating junction temperature, TJ Storage temperature, Tstg (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions see (1) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V TA Operating free-air temperature SN54HCT14 –55 125 SN74HCT14 –40 85 (1) °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 6.4 Thermal Information SN74HCT14 THERMAL METRIC (1) D (SOIC) DB (SSOP) DGV (TVSOP) N (PDIP) PW (TSSOP) 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 90.9 105 132.2 55.3 120.2 °C/W 51 57 51.7 42.5 48.9 °C/W UNIT RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance 45.2 52.4 61.4 35.1 61.9 °C/W ψJT Junction-to-top characterization parameter 18.4 22.2 5.5 27.2 5.7 °C/W ψJB Junction-to-board characterization parameter 44.9 51.8 60.7 35 61.3 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 SN54HCT14, SN74HCT14 www.ti.com SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 6.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC = 4.5 V VT+ Positive-going threshold VCC = 5.5 V VCC = 4.5 V VT– Negative-going threshold VCC = 5.5 V VCC = 4.5 V Hysteresis (VT+ – VT–) ΔVT VCC = 5.5 V IOH = –20 µA and VCC = 4.5 V VOH MIN TYP MAX TA = 25°C 1.2 1.5 1.9 SN54HCT14 1.2 SN74HCT14 1.2 TA = 25°C 1.4 SN54HCT14 1.4 SN74HCT14 1.4 TA = 25°C 0.5 SN54HCT14 0.5 SN74HCT14 0.5 TA = 25°C 0.6 SN54HCT14 0.6 SN74HCT14 0.6 TA = 25°C 0.4 SN54HCT14 0.4 SN74HCT14 0.4 TA = 25°C 0.4 SN54HCT14 0.4 SN74HCT14 0.4 TA = 25°C 4.4 SN54HCT14 4.4 SN74HCT14 High-level output voltage TA = 25°C IOH = –4 mA and VCC = 4.5 V SN54HCT14 3.7 SN74HCT14 3.84 TA = 25°C IOL = 20 µA and VCC = 4.5 V VOL Low-level output voltage II Input current VI = VCC or GND and VCC = 5.5 V 1.9 1.7 ICC Supply current ΔICC (1) Change in supply current One input at 0.5 V or 2.4 V, other inputs at GND or VCC, and VCC = 5.5 V 2.1 0.9 1.2 1.2 1 (1) Input capacitance VI = VCC or GND and VCC = 5 V 1.4 V 1.4 1.4 0.6 1.4 1.4 1.4 0.65 1.5 V 1.5 1.5 4.49 V 4.3 0.001 0.1 0.1 0.1 0.17 0.26 SN54HCT14 0.4 SN74HCT14 0.33 TA = 25°C ±0.1 SN54HCT14 ±1 SN74HCT14 ±1 V µA 2 SN54HCT14 40 SN74HCT14 20 0.2 3 SN74HCT14 2.9 3 µA 2.4 SN54HCT14 TA = 25°C Ci 1.2 SN74HCT14 TA = 25°C V 2.1 TA = 25°C VI = VCC or GND, IO = 0, and VCC = 5.5 V 2.1 SN54HCT14 TA = 25°C IOL = 4 mA and VCC = 4.5 V 1.9 4.4 3.98 UNIT mA 10 SN54HCT14 10 SN74HCT14 10 pF This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 Submit Documentation Feedback 5 SN54HCT14, SN74HCT14 SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 www.ti.com 6.6 Switching Characteristics over recommended operating free-air temperature range and CL = 50 pF (unless otherwise noted; see Figure 5) FROM (INPUT) PARAMETER TO (OUTPUT) TEST CONDITIONS MIN TA = 25°C VCC = 4.5 V tpd Propagation (delay) time A Y tt — 20 32 48 SN74HCT14 40 18 30 SN54HCT14 45 SN74HCT14 38 TA = 25°C VCC = 4.5 V MAX SN54HCT14 TA = 25°C VCC = 5.5 V TYP 7 22 SN74HCT14 19 TA = 25°C VCC = 5.5 V ns 15 SN54HCT14 Y UNIT 6 14 SN54HCT14 20 SN74HCT14 17 ns 6.7 Operating Characteristics TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance TYP No load 10 UNIT pF 6.8 Typical Characteristics VCC = 4.5 V VCC = 5.5 V 0.45 0.45 0.4 0.3 VI = 0 to VCC 0.25 VI = VCC to 0 0.2 0.15 I CC − Supply Current − mA I CC − Supply Current − mA 0.4 0.35 VI = VCC to 0 0.3 0.25 0.2 0.15 0.1 0.1 0.05 0.05 0 0 0.45 0.9 1.35 1.8 2.26 2.7 3.16 3.61 4 VI = 0 to VCC 0.35 0 0 0.55 1.1 1.66 VI − Input Voltage − V Figure 1. Supply Current vs Input Voltage 6 Submit Documentation Feedback 2.2 2.76 3.3 3.86 4.4 4.97 VI − Input Voltage − V Figure 2. Supply Current vs Input Voltage Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 SN54HCT14, SN74HCT14 www.ti.com SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 Typical Characteristics (continued) 6 6 VCC = 4.5 V VCC = 5.5 V 5 VO − Output Voltage − V − VO − Output Voltage − V − 5 4 VI = Down 3 VI = Up 2 1 0 4 VI = Down 3 VI = Up 2 1 0 −1 −1 0 0.75 3 1.5 2.27 VI – Input Voltage – V 3.77 0 Figure 3. Output Voltage vs Input Voltage 3.68 1.84 2.76 VI – Input Voltage − V 0.92 4.6 Figure 4. Output Voltage vs Input Voltage 7 Parameter Measurement Information From Output Under Test 3V Test Point Input 1.3 V 1.3 V 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT tPHL 90% 1.3 V 10% 90% tr Input 1.3 V 10% 90% tPHL VCC 90% 1.3 V 10% 0 V tr Out-of-Phase Output tPLH 90% 1.3 V 10% 1.3 V 10% 90% tf tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 1.3 V 10% V OL tf VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 5. Load Circuit and Voltage Waveforms Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 Submit Documentation Feedback 7 SN54HCT14, SN74HCT14 SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 www.ti.com 8 Detailed Description 8.1 Overview The SNx4HCT14 Schmitt-Trigger devices contain six independent inverters. They perform the Boolean function Y = A in positive logic. Schmitt-Trigger inputs are designed to provide a minimum separation between positive and negative switching thresholds. This allows for noisy or slow inputs that would cause problems such as oscillation or excessive current draw with normal CMOS inputs. 8.2 Functional Block Diagram A Y Copyright © 2016, Texas Instruments Incorporated 8.3 Feature Description The wide operating range of these devices allow them to be used in a variety of systems that use different logic levels. The outputs can drive up to 10 LSTTL loads each. The balanced drive outputs can source or sink 8 mA at 5-V VCC. This device is also input TTL compatible. 8.4 Device Functional Modes Table 1 lists the functional modes of the SNx4HCT14. Table 1. Function Table INPUT A 8 Submit Documentation Feedback OUTPUT Y H L L H Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 SN54HCT14, SN74HCT14 www.ti.com SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The SN74HCT14 device is a Schmitt-Trigger input CMOS device that can be used for a multitude of inverting buffer type functions. The application shown here takes advantage of the Schmitt-Trigger inputs to produce a delay for a logic input. 9.2 Typical Application Copyright © 2016, Texas Instruments Incorporated Figure 6. Simplified Application Schematic 9.2.1 Design Requirements This device uses CMOS technology. Take care to avoid bus contention, because it can drive currents that would exceed maximum limits. Parallel output drive can create fast edges into light loads, so consider routing and load conditions to prevent ringing. 9.2.2 Detailed Design Procedure This circuit is designed around an RC network that produces a slow input to the second inverter. The RC time constant, τ, is calculated from: τ = RC. The delay time for this circuit is from tdelay(min) = –ln |1 – VT+(min) / VCC| τ to tdelay(max) = –ln |1 – VT+(max) / VCC| τ. It must be noted that the delay is consistent for each device, but because the switching threshold is only ensured between the minimum and maximum value, the output pulse length varies between devices. These values must be calculated by using the minimum and maximum ensured VT+ values in the Electrical Characteristics. The resistor value must be chosen such that the maximum current to and from the SN74HCT14 is 8 mA at 5-V VCC. Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 Submit Documentation Feedback 9 SN54HCT14, SN74HCT14 SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 www.ti.com Typical Application (continued) 9.2.3 Application Curve VCC Voltage VT+(max) VT+ VT+ Typical VT+(min) tdelay (max) ln | 1 t delay (min) ln | 1 VT (max) VCC VT (min) VCC |W VC |W VOUT t0 + 42 t0 + 52 0.0 t0 t0 + 2 t0 + 22 t0 + 32 Time Figure 7. Ideal Capacitor Voltage and Output Voltage With Positive Switching Threshold 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. The VCC terminal must have a good bypass capacitor to prevent power disturbance. TI recommends using a 0.1-µF capacitor on the VCC terminal, and must be placed as close as possible to the pin for best results. 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices, inputs must never float. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only three of the four buffer gates are used. Such inputs must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally they are tied to GND or VCC, whichever makes more sense or is more convenient. Floating outputs are generally acceptable, unless the part is a transceiver. 11.2 Layout Example Vcc Unused Input Input Output Output Unused Input Input Figure 8. Layout Diagram 10 Submit Documentation Feedback Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 SN54HCT14, SN74HCT14 www.ti.com SCLS225G – JULY 1995 – REVISED NOVEMBER 2016 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: Implications of Slow or Floating CMOS Inputs (SCBA004) 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY SN54HCT14 Click here Click here Click here Click here Click here SN74HCT14 Click here Click here Click here Click here Click here 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.4 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 1995–2016, Texas Instruments Incorporated Product Folder Links: SN54HCT14 SN74HCT14 Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-86890012A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 596286890012A SNJ54HCT 14FK 5962-8689001CA ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8689001CA SNJ54HCT14J Samples 5962-8689001DA ACTIVE CFP W 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8689001DA SNJ54HCT14W Samples SN74HCT14D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT14 Samples SN74HCT14DE4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DGVR ACTIVE TVSOP DGV 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT14 Samples SN74HCT14DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DRG3 ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DT ACTIVE SOIC D 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14DTG4 ACTIVE SOIC D 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HCT14 Samples SN74HCT14N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HCT14N Samples SN74HCT14NE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HCT14N Samples SN74HCT14PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HT14 Samples SN74HCT14PWRE4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT14 Samples Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 10-Jun-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74HCT14PWRG4 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT14 Samples SN74HCT14PWT ACTIVE TSSOP PW 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT14 Samples SN74HCT14PWTG4 ACTIVE TSSOP PW 14 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HT14 Samples SNJ54HCT14FK ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 596286890012A SNJ54HCT 14FK SNJ54HCT14J ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8689001CA SNJ54HCT14J Samples SNJ54HCT14W ACTIVE CFP W 14 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8689001DA SNJ54HCT14W Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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