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SN74HCT573NSRG4

SN74HCT573NSRG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC20

  • 描述:

    SN74HCT573NSRG4

  • 数据手册
  • 价格&库存
SN74HCT573NSRG4 数据手册
SN54HCT573, SN74HCT573 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS176E – MARCH 1984 – REVISED JULY 2003 D D D D D D SN54HCT573 . . . J OR W PACKAGE SN74HCT573 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) Operating Voltage Range of 4.5 V to 5.5 V High-Current 3-State Outputs Drive Bus Lines Directly or Up To 15 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 21 ns ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max Inputs Are TTL-Voltage Compatible Bus-Structured Pinout OE 1D 2D 3D 4D 5D 6D 7D 8D GND description/ordering information These octal transparent D-type latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The ’HCT573 devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q LE 2D 1D SN54HCT573 . . . FK PACKAGE (TOP VIEW) 3D 4D 5D 6D 7D While the latch-enable (LE) input is high, the Q outputs respond to the data (D) inputs. When LE is low, the outputs are latched to retain the data that was set up at the D inputs. OE VCC 1Q D D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2Q 3Q 4Q 5Q 6Q 8D GND LE 8Q 7Q A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. ORDERING INFORMATION PDIP – N SN74HCT573N Tube SN74HCT573DW Tape and reel SN74HCT573DWR SOP – NS Tape and reel SN74HCT573NSR HCT573 SSOP – DB Tape and reel SN74HCT573DBR HT573 Tube SN74HCT573PW Tape and reel SN74HCT573PWR CDIP – J Tube SNJ54HCT573J SNJ54HCT573J CFP – W Tube SNJ54HCT573W SNJ54HCT573W LCCC – FK Tube SNJ54HCT573FK TSSOP – PW –55°C to 125°C TOP-SIDE MARKING Tube SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74HCT573N HCT573 HT573 SNJ54HCT573FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2003, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54HCT573, SN74HCT573 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS176E – MARCH 1984 – REVISED JULY 2003 description/ordering information (continued) OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z logic diagram (positive logic) OE LE 1 11 C1 1D 2 19 1Q 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54HCT573, SN74HCT573 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS176E – MARCH 1984 – REVISED JULY 2003 recommended operating conditions (see Note 3) SN54HCT573 NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO ∆t/∆v Output voltage 0 High-level input voltage SN74HCT573 MIN VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V 2 2 Input transition rise/fall time V V 0.8 VCC VCC UNIT 0 0 500 0.8 V VCC VCC V 500 ns V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = –20 µA IOH = –6 mA 45V 4.5 VOL VI = VIH or VIL IOL = 20 µA IOL = 6 mA 45V 4.5 II IOZ VI = VCC or 0 VO = VCC or 0 ICC VI = VCC or 0, IO = 0 One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC 5.5 V ∆ICC† MIN SN54HCT573 MIN MAX SN74HCT573 MIN 4.4 4.499 4.4 4.4 3.98 4.3 3.7 3.84 MAX UNIT V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 5.5 V ±0.1 ±100 ±1000 ±1000 nA 5.5 V ±0.01 ±0.5 ±10 ±5 µA 8 160 80 µA 1.4 2.4 3 2.9 mA 3 10 10 10 pF 5.5 V 4.5 V to 5.5 V Ci TA = 25°C TYP MAX V † This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC tw Pulse duration, duration LE high tsu Setup time, time data before LE↓ th Hold time, time data after LE↓ TA = 25°C MIN MAX SN54HCT573 MIN MAX SN74HCT573 MIN 4.5 V 20 30 25 5.5 V 17 27 23 4.5 V 10 15 13 5.5 V 9 14 12 4.5 V 5 5 5 5.5 V 5 5 5 MAX UNIT ns ns ns PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54HCT573, SN74HCT573 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS176E – MARCH 1984 – REVISED JULY 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) D Q tpd d LE Any Q ten OE Any Q tdis di OE Any Q tt Any Q VCC MIN TA = 25°C TYP MAX SN54HCT573 MIN MAX SN74HCT573 MIN MAX 4.5 V 25 35 53 44 5.5 V 21 32 48 40 4.5 V 28 35 53 44 5.5 V 25 32 48 40 4.5 V 26 35 53 44 5.5 V 23 32 48 40 4.5 V 23 35 53 44 5.5 V 22 32 48 40 4.5 V 9 12 18 15 5.5 V 9 11 16 14 UNIT ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) D Q tpd d ten tt LE Any Q OE Any Q Any Q VCC MIN TA = 25°C TYP MAX SN54HCT573 MIN MAX SN74HCT573 MIN MAX 4.5 V 32 52 79 65 5.5 V 27 47 71 59 4.5 V 38 52 79 65 5.5 V 36 47 71 59 4.5 V 33 52 79 65 5.5 V 28 47 71 59 4.5 V 18 42 63 53 5.5 V 16 38 57 48 UNIT ns ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per latch No load PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP 50 UNIT pF SN54HCT573, SN74HCT573 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS176E – MARCH 1984 – REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC S1 Test Point From Output Under Test PARAMETER ten RL tdis CL (see Note A) S2 tPZH RL 1 kΩ tPZL tPHZ tPLZ tpd or tt 1 kΩ CL S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 50 pF 50 pF or 150 pF –– LOAD CIRCUIT 3V High-Level Pulse 1.3 V 3V Reference Input 1.3 V 0V 1.3 V tsu 0V tw Data Input 1.3 V 0.3 V 3V Low-Level Pulse 1.3 V 1.3 V Output Control (Low-Level Enabling) 3V 1.3 V 0V tPLH In-Phase Output 1.3 V 10% tPHL 90% 90% tr Out-ofPhase Output tPHL 90% VOH 1.3 V 10% V OL tf 1.3 V 10% tf 3V 1.3 V 0.3 V 0 V tf 3V 1.3 V 1.3 V 0V tPZL Output Waveform 1 (See Note B) tPLZ ≈VCC 1.3 V 10% tPZH tPLH 1.3 V 10% 2.7 V VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS PULSE DURATIONS 1.3 V 2.7 V tr 0V Input th 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES Output Waveform 2 (See Note B) VOL tPHZ 1.3 V 90% VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty 2000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 TBD Call TI Call TI -40 to 85 Device Marking (4/5) SN74HCT573DBR ACTIVE SSOP DB 20 HT573 SN74HCT573DBRE4 ACTIVE SSOP DB 20 SN74HCT573DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT573 SN74HCT573DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT573 SN74HCT573DWE4 ACTIVE SOIC DW 20 TBD Call TI Call TI -40 to 85 SN74HCT573DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT573 SN74HCT573DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT573 SN74HCT573DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT573 SN74HCT573DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT573 SN74HCT573N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HCT573N SN74HCT573N3 OBSOLETE PDIP N 20 TBD Call TI Call TI -40 to 85 SN74HCT573NE4 ACTIVE PDIP N 20 TBD Call TI Call TI -40 to 85 SN74HCT573NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT573 SN74HCT573NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HCT573 SN74HCT573NSRG4 ACTIVE SO NS 20 TBD Call TI Call TI -40 to 85 SN74HCT573PW ACTIVE TSSOP PW 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SN74HCT573PWE4 ACTIVE TSSOP PW 20 TBD Call TI Call TI -40 to 85 SN74HCT573PWG4 ACTIVE TSSOP PW 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 70 70 Addendum-Page 1 HT573 HT573 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 17-May-2014 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74HCT573PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT573 SN74HCT573PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT573 SN74HCT573PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HT573 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-May-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HCT573DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HCT573DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74HCT573NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74HCT573PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCT573DBR SN74HCT573DWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74HCT573NSR SO NS 20 2000 367.0 367.0 45.0 SN74HCT573PWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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