SN74S1053
16-BIT SCHOTTKY BARRIER DIODE
BUS-TERMINATION ARRAY
SDLS017A – SEPTEMBER 1990 – REVISED AUGUST 1997
D
D
D
D
DW OR N PACKAGE
(TOP VIEW)
Designed to Reduce Reflection Noise
Repetitive Peak Forward Current to 200 mA
16-Bit Array Structure Suited for
Bus-Oriented Systems
Package Options Include Plastic
Small-Outline Packages and Standard
Plastic 300-mil DIPs
VCC
D01
D02
D03
D04
D05
D06
D07
D08
GND
description
This Schottky barrier diode bus-termination array
is designed to reduce reflection noise on memory
bus lines. This device consists of a 16-bit
high-speed Schottky diode array suitable for
clamping to VCC and/or GND.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
D16
D15
D14
D13
D12
D11
D10
D09
GND
The SN74S1053 is characterized for operation
from 0°C to 70°C.
schematic diagrams
D01
2
D02
3
D03
4
D04
5
D05
6
D06
7
D07
8
D08
9
D09
12
D10
13
10
GND
11
GND
D11
14
D12
15
D13
16
D14
17
D15
18
D16
19
VCC
1
VCC
20
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
SN74S1053
16-BIT SCHOTTKY BARRIER DIODE
BUS-TERMINATION ARRAY
SDLS017A – SEPTEMBER 1990 – REVISED AUGUST 1997
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Steady-state reverse voltage, VR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Continuous forward current, IF: Any D terminal from GND or to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Total through all GND or VCC terminals . . . . . . . . . . . . . . . . . . . . . . . 170 mA
Repetitive peak forward current‡, IFRM: Any D terminal from GND or VCC . . . . . . . . . . . . . . . . . . . . . 200 mA
Total through all GND or VCC terminals . . . . . . . . . . . . . . . . . . 1.2 A
Continuous total power dissipation at (or below) 25°C free-air temperature (see Note 1) . . . . . . . . . . 625 mW
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ These values apply for tw ≤ 100 µs, duty cycle ≤ 20%.
NOTE 1: For operation above 25°C free-air temperature, derate linearly at the rate of 5 m/W/°C.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
single-diode operation (see Note 2)
TYP§
MAX
To VCC
IF = 18 mA
IF = 50 mA
0.85
1.05
1.05
1.3
From GND
IF = 18 mA
IF = 50 mA
0.75
0.95
0.95
1.2
IF = 200 mA
1.45
PARAMETER
VF
VFM
TEST CONDITIONS
Static forward voltage
Peak forward voltage
IR
Static reverse current
Ct
Total capacitance
To VCC
MIN
VR = 0 V,
VR = 2 V,
V
V
5
VR = 7 V
From GND
UNIT
5
f = 1 MHz
8
16
f = 1 MHz
4
8
µA
pF
§ All typical values are at VCC = 5 V, TA = 25°C.
NOTE 2: Test conditions and limits apply separately to each of the diodes. The diodes not under test are open-circuited during the measurement
of these characteristics.
multiple-diode operation
PARAMETER
Ix
Internal crosstalk current
TEST CONDITIONS
MIN
TYP‡
MAX
Total IF current = 1 A,
See Note 3
0.8
2
Total IF current = 198 mA,
See Note 3
0.02
0.2
TYP
MAX
8
16
UNIT
mA
§ All typical values are at VCC = 5 V, TA = 25°C.
NOTE 3: Ix is measured under the following conditions with one diode static, and all others switching:
Switching diodes: tw = 100 µs, duty cycle = 20%
Static diode: VR = 5 V
The static diode input current is the internal crosstalk current Ix.
switching characteristics, TA = 25°C (see Figures 1 and 2)
PARAMETER
trr
2
Reverse recovery time
TEST CONDITIONS
IF = 10 mA,
IRM(REC) = 10 mA,
POST OFFICE BOX 655303
IR(REC) = 1 mA,
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MIN
RL = 100 Ω
UNIT
ns
SN74S1053
16-BIT SCHOTTKY BARRIER DIODE
BUS-TERMINATION ARRAY
SDLS017A – SEPTEMBER 1990 – REVISED AUGUST 1997
PARAMETER MEASUREMENT INFORMATION
50 Ω
(See Note A)
450 Ω
Pulse
Generator
Sampling
Oscilloscope
(See Note B)
DUT
90%
VFM
VF
Output
Waveform
(See Note B)
Input Pulse
(See Note A)
10%
tr
NOTES: A. The input pulse is supplied by a pulse generator having the following characteristics: tr = 20 ns, ZO = 50 Ω, freq = 500 Hz,
duty cycle = 1%.
B. The output waveform is monitored by an oscilloscope having the following characteristics: tr ≤ 350 ps, Ri = 50 Ω, Ci ≤ 5 pF.
Figure 1. Forward Recovery Voltage
DUT
(See Note A)
Pulse
Generator
IF
Sampling
Oscilloscope
If
tf
10%
(See Note B)
trr
0
Output
Waveform
(See Note B) IR(REC)
Input Pulse
(See Note A)
90%
IRM(REC)
NOTES: A. The input pulse is supplied by a pulse generator having the following characteristics: tf = 0.5 ns, ZO = 50 Ω, tw ≥ 50 ns,
duty cycle = 1%.
B. The output waveform is monitored by an oscilloscope having the following characteristics: tr ≤ 350 ps, Ri = 50 Ω, Ci ≤ 5 pF.
Figure 2. Reverse Recovery Time
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SN74S1053
16-BIT SCHOTTKY BARRIER DIODE
BUS-TERMINATION ARRAY
SDLS017A – SEPTEMBER 1990 – REVISED AUGUST 1997
APPLICATION INFORMATION
Large negative transients occurring at the inputs of memory devices (DRAMs, SRAMs, EPROMs, etc.) or on the
CLOCK lines of many clocked devices can result in improper operation of the devices. The SN74S1053 diode
termination array helps suppress negative transients caused by transmission-line reflections, crosstalk, and
switching noise.
Diode terminations have several advantages when compared to resistor termination schemes. Split resistor or
Thevenin equivalent termination can cause a substantial increase in power consumption. The use of a single resistor
to ground to terminate a line usually results in degradation of the output high level, resulting in reduced noise immunity.
Series damping resistors placed on the outputs of the driver reduce negative transients, but they also can increase
propagation delays down the line, as a series resistor reduces the output drive capability of the driving device. Diode
terminations have none of these drawbacks.
The operation of the diode arrays in reducing negative transients is explained in the following figures. The diode
conducts current when the voltage reaches a negative value large enough for the diode to turn on. Suppression of
negative transients is tracked by the current-voltage characteristic curve for that diode. Typical current versus voltage
curves for the SN74S1053 are shown in Figures 3 and 4.
To illustrate how the diode arrays act to reduce negative transients at the end of a transmission line, the test setup
in Figure 5 was evaluated. The resulting waveforms with and without the diode are shown in Figure 6.
The maximum effectiveness of the diode arrays in suppressing negative transients occurs when the diode arrays are
placed at the end of a line and/or the end of a long stub branching off a main transmission line. The diodes also can
be used to reduce the negative transients that occur due to discontinuities in the middle of a line. An example of this
is a slot in a backplane that is provided for an add-on card.
DIODE FORWARD CURRENT
vs
DIODE FORWARD VOLTAGE
–100
TA = 25°C
–90
I I – Forward Current – mA
–80
–70
–60
–50
–40
–30
–20
–10
0
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
VI – Forward Voltage – V
Figure 3. Typical Input Current vs Input Voltage
(Lower Diode)
4
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SN74S1053
16-BIT SCHOTTKY BARRIER DIODE
BUS-TERMINATION ARRAY
SDLS017A – SEPTEMBER 1990 – REVISED AUGUST 1997
DIODE FORWARD CURRENT
vs
DIODE FORWARD VOLTAGE
100
TA = 25°C
90
I I – Forward Current – mA
80
70
60
50
40
30
20
10
0
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
VI – Forward Voltage – V
Figure 4. Typical Input Current vs Input Voltage
(Upper Diode)
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SN74S1053
16-BIT SCHOTTKY BARRIER DIODE
BUS-TERMINATION ARRAY
SDLS017A – SEPTEMBER 1990 – REVISED AUGUST 1997
APPLICATION INFORMATION
ZO = 50 Ω
Length = 36 in.
Figure 5. Diode Test Setup
56.500 ns
31.500 ns
End-ofLine
Without
Diode
81.500 ns
End-of-Line With Diode
Vmarker 1
Vmarker 2
Ch 2
Timebase
Memory 1
Vmarker 1
Vmarker 2
Offset = 0.000 V
Delay = 56.500 ns
Delta V = –2.293 V
= 1.880 V/div
= 5.00 ns/V
= 1.880 V/div
= –1.353 V
= –3.647 V
Figure 6. Oscilloscope Display
6
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PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74S1053DBR
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
S1053
SN74S1053DW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
S1053
SN74S1053DWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
S1053
SN74S1053N
ACTIVE
PDIP
N
20
20
RoHS &
Non-Green
NIPDAU
N / A for Pkg Type
0 to 70
SN74S1053N
SN74S1053NE4
ACTIVE
PDIP
N
20
20
RoHS &
Non-Green
NIPDAU
N / A for Pkg Type
0 to 70
SN74S1053N
SN74S1053NSR
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
74S1053
SN74S1053PW
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
S1053
SN74S1053PWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
S1053
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of