SNJ54HC157FK

SN54HC157, SN74HC157 SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 SNx4HC157 Quadruple 2-Line to 1-Line Data Selectors/Multiplexers 1 Features 2 Description • • • • • • The SNx4HC157 contains four data selectors/ multiplexers to select one of two data sources. All channels are controlled by the same address select (A/B) input, and strobe (G) input. A high level at the strobe terminal forces all outputs low. Wide operating voltage range of 2 V to 6 V Outputs can drive up to 15 LSTTL loads Low power consumption, 80-µA max ICC Typical tpd = 11 ns ±6-mA output drive at 5 V Low input current of 1 µA max Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) SN74HC157D SOIC (16) 9.90 mm × 3.90 mm SN74HC157DB SSOP (16) 6.20 mm × 5.30 mm SN74HC157N PDIP (16) 19.31 mm × 6.35 mm SN74HC157NS SO (16) 6.20 mm × 5.30 mm SN74HC157PW TSSOP (16) 5.00 mm × 4.40 mm SN54HC157J CDIP (16) 24.38 mm × 6.92 mm SNJ54HC157FK LCCC (20) 8.89 mm × 8.45 mm SNJ54HC157W CFP (16) 10.16 mm × 6.73 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 (1) 5.2 Recommended Operating Conditions ..................... 4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics ...........................................5 5.6 Operating Characteristics........................................... 6 6 Parameter Measurement Information............................ 7 7 Detailed Description........................................................8 7.1 Overview..................................................................... 8 7.2 Functional Block Diagram........................................... 8 7.3 Device Functional Modes............................................9 8 Power Supply Recommendations................................10 9 Layout.............................................................................10 9.1 Layout Guidelines..................................................... 10 10 Device and Documentation Support..........................11 10.1 Documentation Support.......................................... 11 10.2 Receiving Notification of Documentation Updates.. 11 10.3 Support Resources................................................. 11 10.4 Trademarks............................................................. 11 10.5 Electrostatic Discharge Caution.............................. 11 10.6 Glossary.................................................................. 11 11 Mechanical, Packaging, and Orderable Information.................................................................... 11 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (September 2003) to Revision E (February 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 4 Pin Configuration and Functions J, D, DB, N, NS, or PW package 16-Pin CDIP, SOIC, SSOP, PDIP, SO, TSSOP Top View FK package 20-Pin LCCC Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 3 SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range (2) IIK Input clamp current IOK Output clamp current IO Continuous output current (2) MIN MAX -0.5 7 Junction temperature Tstg Storage temperature (1) (2) V (VI < 0 or VI > VCC) ±20 mA (VO < 0 or VO > VCC) ±20 mA (VO = 0 to VCC) ±35 mA ±70 mA 150 °C 150 °C Continuous current through VCC or GND TJ UNIT -65 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (1) 5.2 Recommended Operating Conditions SN54HC157 VCC Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V VCC = 6 V NOM MAX 2 5 6 Low-level input voltage VI Input voltage VO Output voltage TA (1) MAX 2 5 6 3.15 3.15 4.2 4.2 VCC = 4.5 V 0 0.5 0.5 1.35 1.35 0 VCC 0 V VCC V VCC = 4.5 V 500 500 VCC = 6 V 400 400 125 V VCC 1000 -55 V 1.8 VCC 1000 Operating free-air temperature UNIT V 1.8 0 VCC = 2 V Input transition rise/fall time NOM 1.5 VCC = 6 V tt MIN 1.5 VCC = 2 V VIL SN74HC157 MIN -40 85 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating SMOS Inputs, literature number SCBA004. 5.3 Thermal Information THERMAL METRIC RθJA (1) 4 Junction-to-ambient thermal (1) resistance D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS UNIT 73 82 67 64 108 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 5.4 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER (1) TEST CONDITIONS IOH = −20 μA VOH IOH = −6 mA IOH = −7.8 mA II MAX MIN SN74HC253 MIN TYP MAX MIN 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 MAX UNIT V 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 IOL = 6 mA 4.5 V 0.17 0.26 0.4 0.33 IOL = 7.8 mA 6V 0.15 0.26 0.4 0.33 VI = VCC or 0 6V ±0.1 ±100 ±1000 ±1000 nA VI = VCC or 0 IO = 0 6V 8 160 80 μA 10 10 10 pF Ci (1) SN54HC253 IOL = 20 μA VOL ICC TA = 25°C VCC 2 V to 6 V 3 V VI = VIH or VIL, unless otherwise noted. 5.5 Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (See Figure 6) PARAMETER FROM (INPUT) A or B tpd Propagation delay A/B G tt Transition time TO (OUTPUT) Y Y Y Y VCC (V) TA = 25°C MIN SN54HC157 MIN MAX SN74HC157 TYP MAX MIN MAX 2 63 125 190 160 4.5 13 25 38 32 6 11 21 32 27 2 67 125 190 160 4.5 18 25 38 31 6 14 21 32 27 2 59 115 170 145 4.5 16 23 34 29 6 13 20 29 25 2 28 60 90 75 4.5 8 12 18 15 6 6 10 15 13 UNIT ns ns ns ns Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 5 SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 5.5 Switching Characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (See Figure 6) PARAMETER tpd Propagation delay SN54HC157 SN74HC157 TO (OUTPUT) VCC (V) A or B Y 6 18 33 49 41 2 81 210 320 260 4.5 23 42 64 52 6 18 36 54 45 A/B Y G tt TA = 25°C FROM (INPUT) Y Transition time Y MIN TYP MAX MIN MAX MIN MAX 2 81 190 290 235 4.5 23 38 58 47 2 91 190 290 235 4.5 24 38 58 47 6 18 33 49 41 2 45 210 315 265 4.5 17 42 63 53 6 13 36 53 45 UNIT ns ns ns ns 5.6 Operating Characteristics TA = 25°C Cpd 6 Power dissipation capacitance Test Conditions TYP UNIT No load 40 pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 6 Parameter Measurement Information tpd is the maximum between tPLH and tPHL Figure 6-1. Load Circuit Figure 6-2. Voltage Waveforms Propagation Delay and Output Transition Times Figure 6-3. Voltage Waveform Input Rise and Fall Times A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following charactersitics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 7 SN54HC157, SN74HC157 SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 www.ti.com 7 Detailed Description 7.1 Overview These data selectors/multiplexers contain inverters and drivers to supply full data selection to the four output gates. A separate strobe (G) input is provided. A 4-bit word is selected from one of two sources and is routed to the four outputs. The ’HC157 devices present true data. 7.2 Functional Block Diagram Pin numbers shown are for the D, DB, J, N, NS, PW, W packages. 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 7.3 Device Functional Modes Table 7-1. Function Table INPUTS OUTPUT Data G Select A/B A B H X X X L L L L X L L L H X H L H X L L L H X H H Y Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 9 SN54HC157, SN74HC157 SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 www.ti.com 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 SN54HC157, SN74HC157 www.ti.com SCLS113E – DECEMBER 1982 – REVISED FEBRUARY 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC157 SN74HC157 11 PACKAGE OPTION ADDENDUM www.ti.com 2-Dec-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-86061012A ACTIVE LCCC FK 20 55 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 596286061012A SNJ54HC 157FK 5962-8606101EA ACTIVE CDIP J 16 25 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8606101EA SNJ54HC157J 5962-8606101VEA ACTIVE CDIP J 16 25 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8606101VE A SNV54HC157J SN54HC157J ACTIVE CDIP J 16 25 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC157J Samples SN74HC157DBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC157 Samples SN74HC157DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC157 Samples SN74HC157N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC157N Samples SN74HC157NE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC157N Samples SN74HC157NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC157 Samples SN74HC157PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC157 Samples SNJ54HC157FK ACTIVE LCCC FK 20 55 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 596286061012A SNJ54HC 157FK SNJ54HC157J ACTIVE CDIP J 16 25 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8606101EA SNJ54HC157J Samples SNJ54HC157W ACTIVE CFP W 16 25 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SNJ54HC157W Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 1 Samples Samples Samples Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Dec-2023 OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of