Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
TL783 High-voltage Adjustable Regulator
1 Features
3 Description
•
The TL783 device is an adjustable three-terminal
high-voltage regulator with an output range of 1.25 V
to 125 V and a DMOS output transistor capable of
sourcing more than 700 mA. It is designed for use in
high-voltage applications where standard bipolar
regulators cannot be used. Excellent performance
specifications, superior to those of most bipolar
regulators, are achieved through circuit design and
advanced layout techniques.
1
•
•
•
•
•
Output Adjustable From 1.25 V to 125 V when
Used with an External Resistor Divider
700-mA Output Current
Full Short-Circuit, Safe-Operating-Area, and
Thermal-Shutdown Protection
0.001%/V Typical Input Voltage Regulation
0.15% Typical Output Voltage Regulation
76-dB Typical Ripple Rejection
Device Information(1)
2 Applications
•
•
•
•
PART NUMBER
Electronic Point of Sale
Medical, Health, and Fitness Applications
Printers
Applications and White Goods
PACKAGE (PIN)
TO-220 (3)
TL783
BODY SIZE (NOM)
10.17 mm × 9.02 mm
10.16 mm × 8.70 mm
PFM (3)
9.40 mm × 8.00 mm
TO-263 (3)
10.18 mm × 8.41 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
VI
−
Error
Amplifier
IN
æ R2 ö
VO » Vref ç 1 +
R1 ÷ø
è
+
VO
OUT
Protection
Circuit
Vref
R1
ADJ
R2
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9
Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application .................................................. 12
10 Power Supply Recommendations ..................... 16
11 Layout................................................................... 16
11.1 Layout Guidelines ................................................. 16
11.2 Layout Example .................................................... 16
12 Device and Documentation Support ................. 16
12.1 Trademarks ........................................................... 16
12.2 Electrostatic Discharge Caution ............................ 16
12.3 Glossary ................................................................ 16
13 Mechanical, Packaging, and Orderable
Information ........................................................... 16
5 Revision History
Changes from Revision M (April 2008) to Revision N
Page
•
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
2
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
TL783
www.ti.com
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
6 Pin Configuration and Functions
KC (TO-220) PACKAGE
(TOP VIEW)
OUT
IN
OUT
ADJ
KTE (PowerFLEXTM) PACKAGE
(TOP VIEW)
OUT
IN
OUT
ADJ
KTT (TO-263) PACKAGE
(TOP VIEW)
OUT
IN
OUT
ADJ
Pin Functions
PIN
KC
TO-220
KTE
PowerFLEX™
KTT
TO-263
TYPE
ADJ
1
1
1
I/O
IN
3
3
3
I
Supply Input
OUT
2
2
2
O
Voltage Output
NAME
DESCRIPTION
Voltage adjustment pin. Connect a
resistor divider to determine the output
voltage.
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
3
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating temperature range (unless otherwise noted) (1)
MIN
Vl – VO
Input-to-output differential voltage
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
MAX
UNIT
125
V
150
°C
150
°C
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
2500
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
Vl – VO
Input-to-output differential voltage
IO
Output current
TJ
Operating virtual junction temperature
MAX
UNIT
125
V
15
700
mA
0
125
°C
7.4 Thermal Information
TL783
THERMAL METRIC (1)
KTE
KTT
KC
UNIT
3 PINS
RθJA
Junction-to-ambient thermal resistance
23
25.3
19
RθJC(top)
Junction-to-case (top) thermal resistance
N/A
18
17
RθJP
Junction-to-exposed-pad thermal resistance
2.7
1.94
3
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
TL783
www.ti.com
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
7.5 Electrical Characteristics
Vl – VO = 25 V, IO = 0.5 A, TJ = 0°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS (1)
TYP
MAX
TJ = 25°C
0.001
0.01
TJ = 0°C to 125°C
0.004
0.02
Input voltage regulation (2)
Vl – VO = 20 V to 125 V,
P ≤ rated dissipation
Ripple rejection
ΔVI(PP) = 10 V, VO = 10 V, f = 120 Hz
MIN
66
IO = 15 mA to 700 mA,
TJ = 25°C
25
VO ≥ 5 V
0.15%
0.5%
—
IO = 15 mA to 700 mA,
P ≤ rated dissipation
VO ≤ 5 V
20
70
mV
VO ≥ 5 V
0.3%
1.5%
0.4%
Output voltage long-term drift
1000 hours at TJ = 125°C, Vl – VO = 125 V
Output noise voltage
f = 10 Hz to 10 kHz, TJ = 25°C
Minimum output current to maintain regulation
Vl – VO = 125 V
0.003%
15
715
Vl – VO = 25 V, t = 30 ms
700
900
Vl – VO = 125 V, t = 30 ms
100
250
ADJ input current
Change in ADJ input current
Reference voltage (OUT to ADJ) (3)
Vl – VO = 10 V to 125 V, IO = 15 mA to 700 mA,
P ≤ rated dissipation
mA
1100
Vl – VO = 15 V, t = 30 ms
Vl – VO = 15 V to 125 V, IO = 15 mA to 700 mA,
P ≤ rated dissipation
mV
—
0.2%
Vl – VO = 25 V, t = 1 ms
(2)
(3)
dB
7.5
Output voltage change with temperature
(1)
%/V
VO ≤ 5 V
Output voltage regulation
Peak output current
76
UNIT
1.2
mA
83
110
μA
0.5
5
μA
1.27
1.3
V
Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be
taken into account separately.
Input voltage regulation is expressed here as the percentage change in output voltage per 1-V change at the input
Due to the dropout voltage and output current-limiting characteristics of this device, output current is limited to less than 700 mA at
input-to-output voltage differentials of less than 25 V.
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
5
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
7.6 Typical Characteristics
2
2
tw = 1 ms
1.8
1.6
Output Current Limit − (A)
Output Current Limit − (A)
1.6
1.4
1.2
TJ = 0°C
1
0.8
0.6
tw = 30 ms
1.8
TJ = 25°C
1.4
1.2
TJ = 0°C
1
0.8
TJ = 25°C
0.6
0.4
0.4
TJ = 125°C
TJ = 125°C
0.2
0.2
0
0
0
25
50
75
100
0
125
Figure 1. Output Current Limit
vs
Input-to-Output Voltage Differential
50
75
125
100
Figure 2. Output Current Limit
vs
Input-to-Output Voltage Differential
1.6
120
VI − VO = 25 V
TJ = 25°C
1.4
100
1.2
Ripple Rejection − (dB)
Output Current Limit − (A)
25
VI − VO − Input-to-Output Voltage Differential − (V)
VI − VO − Input-to-Output Voltage Differential − (V)
1
0.8
0.6
80
60
40
VI(AV) − VO = 25 V
DVI(PP) = 10 V
IO = 100 mA
f = 120 Hz
Co = 0
TJ = 25°C
0.4
20
0.2
0
0
10
0
20
30
0
40
10
20
30
40
50
60
70
80
90
100
VO − Output Voltage − (V)
Time − (ms)
Figure 4. Ripple Rejection
vs
Output Voltage
Figure 3. Output Current Limit
vs
Time
100
100
90
Ripple Rejection − dB
Ripple Rejection − (dB)
80
80
60
40
20
VI(AV) = 25 V
DVI(PP) = 10 V
VO = 10 V
f = 120 Hz
Co = 0
TJ = 25°C
100
200
50
40
Co = 0
30
10
300
400
500
600
700
800
IO − Output Current − (mA)
0
0.01
VI(AV) = 25 V
∆VI(PP) = 10 V
VO = 10 V
IO = 500 mA
TJ = 25°C
0.1
1
10
100
1000
f − Frequency − kHz
Figure 5. Ripple Rejection
vs
Output Current
6
Co = 10 µF
60
20
0
0
70
Figure 6. Ripple Rejection
vs
Frequency
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
TL783
www.ti.com
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
Typical Characteristics (continued)
1.30
102
VI = 35 V
VO = 10 V
IO = 500 mA
TJ = 25°C
VI = 20 V
IO = 15 mA
1.29
V ref − Reference Voltage − (V)
Zo − Output Impedance − (W)
101
1
10−1
10−2
1.28
1.27
1.26
1.25
1.24
10−3
1.23
10−4
101
102
103
104
105
106
1.22
−75 −50 −25
107
25
90
VI = 25 V
VO = Vref
IO = 500 mA
Dropout Voltage − (V)
ADJ Input Current − (mA)
84
82
80
75
100 125 150 175
DVO = 100 mV
25
50
75
100
125
15
IO = 700 mA
IO = 600 mA
IO = 500 mA
10
IO = 250 mA
5
IO = 100 mA
IO = 15 mA
0
−75
−50
−25
0
25
75
50
100
TJ − Virtual Junction Temperature − (°C)
TJ − Virtual Junction Temperature − (°C)
Figure 9. Input Current at ADJ
vs
Virtual Junction Temperature
Figure 10. Dropout Voltage
vs
Virtual Junction Temperature
0
125
12
VI = 25 V
VO = 5 V
IO = 15 mA to 700 mA
−0.1
TJ = 0°C
10
I O − Output Current − (mA)
DVO − Output Voltage Deviation − (%)
50
20
86
0
25
Figure 8. Reference Voltage
vs
Virtual Junction Temperature
Figure 7. Output Impedance
vs
Frequency
88
0
TJ − Virtual Junction Temperature − (°C)
f − Frequency − (kHz)
−0.2
−0.3
−0.4
8
TJ = 25°C
6
TJ = 125°C
4
2
0
−0.5
0
25
50
75
100
125
0
150
25
50
75
100
125
VI − Input Voltage − (V)
TJ − Virtual Junction Temperature − (°C)
Figure 11. Output Voltage Deviation
vs
Virtual Junction Temperature
(1) This is the minimum current required to maintain voltage
regulation.
Figure 12. Output Current
vs
Input Voltage
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
7
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
8 Detailed Description
8.1 Overview
The TL783 device is an adjustable three-terminal high-voltage regulator with an output range of 1.25 V to 125 V
and a DMOS output transistor capable of sourcing more than 700 mA. It is designed for use in high-voltage
applications where standard bipolar regulators cannot be used. Excellent performance specifications, superior to
those of most bipolar regulators, are achieved through circuit design and advanced layout techniques.
As a state-of-the-art regulator, the TL783 device combines standard bipolar circuitry with high-voltage doublediffused MOS transistors on one chip, to yield a device capable of withstanding voltages far higher than standard
bipolar integrated circuits. Because of its lack of secondary-breakdown and thermal-runaway characteristics
usually associated with bipolar outputs, the TL783 maintains full overload protection while operating at up to
125 V from input to output. Other features of the device include current limiting, safe-operating-area (SOA)
protection, and thermal shutdown. Even if ADJ is disconnected inadvertently, the protection circuitry remains
functional.
Only two external resistors are required to program the output voltage. An input bypass capacitor is necessary
only when the regulator is situated far from the input filter. An output capacitor, although not required, improves
transient response and protection from instantaneous output short circuits. Excellent ripple rejection can be
achieved without a bypass capacitor at the adjustment terminal.
8.2 Functional Block Diagram
VI
−
IN
Error
Amplifier
æ R2 ö
VO » Vref ç 1 +
R1 ÷ø
è
+
VO
OUT
Protection
Circuit
Vref
R1
ADJ
R2
8.3 Feature Description
•
•
•
•
•
•
Output Adjustable From 1.25 V to 125 V when Used with an External Resistor Divider
700-mA Output Current
Full Short-Circuit, Safe-Operating-Area, and Thermal-Shutdown Protection
0.001%/V Typical Input Voltage Regulation
0.15% Typical Output Voltage Regulation
76-dB Typical Ripple Rejection
8.4 Device Functional Modes
8.4.1 Active Mode
The TL783 acts as a high-voltage adjustable regulator. The device works to keep the voltage at the OUT pin 1.25
V higher than the voltage at the ADJ pin. Therefore, a resistor divider can be used to set the output voltage.
8
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
TL783
www.ti.com
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 General Configurations
VI = 145 to 200 V
7.5 kW, 1 W
TIP150
120 V, 1.5 W
IN
OUT
ADJ
R1
82 W
TL783
0.1 mF
125 V
+
10 mF
R2
8.2 kW, 2W
Figure 13. 125-V Short-Circuit-Protected Off-Line Regulator
VI = 70 to 125 V
10 W
TIP30C
TIPL762
1 kW
TL783
VO = 50 V
at 0.5 A
10 kW
IN
OUT
ADJ
82 W
+
50 mF
3.3 kW, 1W
Figure 14. 50-V Regulator With Current Boost
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
9
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
Application Information (continued)
125 V
1W
10 W
TIPL762
1 kW
TL783
10 kW
IN
OUT
æ R2 ö
VO = Vref ç 1 +
R1 ÷ø
è
ADJ
R1
82 W
+
50 mF
R2
Figure 15. Adjustable Regulator With Current Boost and Current Limit
VI
Load
I
V ref
R
TL783
IN
OUT
ADJ
R
Figure 16. Current-Sinking Regulator
10
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
TL783
www.ti.com
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
Application Information (continued)
VI
TL783
1 mF
IN
OUT
ADJ
R
I=
V ref
R
Load
Figure 17. Current-Sourcing Regulator
VCC
TL783
1 mF
IN
OUT
ADJ
OUTPUT
82 W
R2
V+
−
+
INPUT
TL081
V−
æ R2 ö
VOFFSET = Vref ç I +
÷
è 82 ø
Figure 18. High-Voltage Unity-Gain Offset Amplifier
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
11
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
Application Information (continued)
VI = 90 V
TL783
IN
OUT
ADJ
6.25 W
TL783
IN
OUT
ADJ
82 W
48 V
3.9 kW
Figure 19. 48-V 200-mA Float Charger
9.2 Typical Application
The TL783 is typically used as an adjustable regulator.
æ R2 ö
VO = Vref ç 1 +
R1 ÷ø
è
TL783
IN
VI
OUT
ADJ
1 mF
(see Note A)
R1
82 W
+
+
10 mF
R2
0 to 8 kW
A.
Needed if device is more than 4 inches from filter capacitor
Figure 20. 1.25-V to 115-V Adjustable Regulator
9.2.1 Design Requirements
• Input and output decoupling capacitors for noise filtering.
• Resistor divider consisting of R1 and R2 to set the output voltage.
12
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
TL783
www.ti.com
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
Typical Application (continued)
9.2.2 Detailed Design Procedure
The internal reference (see Simplified Schematic) generates 1.25 V nominal (Vref) between OUT and ADJ. This
voltage is developed across R1 and causes a constant current to flow through R1 and the programming resistor
R2, giving an output voltage of:
VO = Vref (1 + R2 / R1) + lI(ADJ) (R2)
or
VO ≉ Vref (1 + R2 / R1)
The TL783 was designed to minimize the input current at ADJ and maintain consistency over line and load
variations, thereby minimizing the associated (R2) error term.
To maintain II(ADJ) at a low level, all quiescent operating current is returned to the output terminal. This quiescent
current must be sunk by the external load and is the minimum load current necessary to prevent the output from
rising. The recommended R1 value of 82 Ω provides a minimum load current of 15 mA. Larger values can be
used when the input-to-output differential voltage is less than 125 V (see the output-current curve in Figure 12) or
when the load sinks some portion of the minimum current.
9.2.2.1 Bypass Capacitors
The TL783 regulator is stable without bypass capacitors; however, any regulator becomes unstable with certain
values of output capacitance if an input capacitor is not used. Therefore, the use of input bypassing is
recommended whenever the regulator is located more than four inches from the power-supply filter capacitor. A
1-μF tantalum or aluminum electrolytic capacitor usually is sufficient.
Adjustment-terminal capacitors are not recommended for use on the TL783 because they can seriously degrade
load transient response, as well as create a need for extra protection circuitry. Excellent ripple rejection presently
is achieved without this added capacitor.
Due to the relatively low gain of the MOS output stage, output voltage dropout may occur under large-load
transient conditions. The addition of an output bypass capacitor greatly enhances load transient response and
prevents dropout. For most applications, it is recommended that an output bypass capacitor be used, with a
minimum value of:
Co (μF) = 15 / VO
Larger values provide proportionally better transient-response characteristics.
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
13
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
Typical Application (continued)
9.2.2.2 Protection Circuitry
The TL783 regulator includes built-in protection circuits capable of guarding the device against most overload
conditions encountered in normal operation. These protective features are current limiting, safe-operating-area
protection, and thermal shutdown. These circuits protect the device under occasional fault conditions only.
Continuous operation in the current limit or thermal shutdown mode is not recommended.
The internal protection circuits of the TL783 protect the device up to maximum-rated VI as long as certain
precautions are taken. If Vl is switched on instantaneously, transients exceeding maximum input ratings may
occur, which can destroy the regulator. Usually, these are caused by lead inductance and bypass capacitors
causing a ringing voltage on the input. In addition, when rise times in excess of 10 V/ns are applied to the input,
a parasitic npn transistor in parallel with the DMOS output can be turned on, causing the device to fail. If the
device is operated over 50 V and the input is switched on, rather than ramped on, a low-Q capacitor, such as
tantalum or aluminum electrolytic, should be used, rather than ceramic, paper, or plastic bypass capacitors. A Q
factor of 0.015, or greater, usually provides adequate damping to suppress ringing. Normally, no problems occur
if the input voltage is allowed to ramp upward through the action of an ac line rectifier and filter network.
Similarly, when an instantaneous short circuit is applied to the output, both ringing and excessive fall times can
result. A tantalum or aluminum electrolytic bypass capacitor is recommended to eliminate this problem. However,
if a large output capacitor is used, and the input is shorted, addition of a protection diode may be necessary to
prevent capacitor discharge through the regulator. The amount of discharge current delivered is dependent on
output voltage, size of capacitor, and fall time of Vl. A protective diode (see Figure 21) is required only for
capacitance values greater than:
Co (μF) = 3 × 104 / (VO)2
Care always should be taken to prevent insertion of regulators into a socket with power on. Power should be
turned off before removing or inserting regulators.
TL783
VI
IN
OUT
VO
ADJ
R1
Co
R2
Figure 21. Regulator With Protective Diode
14
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
TL783
www.ti.com
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
Typical Application (continued)
9.2.2.3 Load Regulation
The current-set resistor (R1) should be located close to the regulator output terminal, rather than near the load.
This eliminates long line drops from being amplified, through the action of R1 and R2, to degrade load regulation.
To provide remote ground sensing, R2 should be near the load ground.
VO
TL783
VI
IN
Rline
OUT
ADJ
RL
R1
R2
Figure 22. Regulator With Current-Set Resistor
D VO − Output Voltage Deviation − (V)
TJ = 25°C
Co = 0
0.4
0.2
Co = 10 mF
0
−0.2
1
0.5
0
0
1
2
3
4
Time − (ms)
I O − Output Current − (A)
Change in Input Voltage − (V) D VO − Output Voltage Deviation − (V)
9.2.3 Application Curves
6
4
2
0
−2
−4
−6
0.8
VI = 35 V
VO = 10 V
Co = 1 mF
TJ = 25°C
0.6
0.4
0.2
0
Figure 23. Line Transient Response
0
40
80
120
160
200
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
240
Time − (ms)
Figure 24. Load Transient Response
15
TL783
SLVS036N – SEPTEMBER 1981 – REVISED JANUARY 2015
www.ti.com
10 Power Supply Recommendations
A decoupling capacitor is needed on the IN pin of the TL783 if the TL783 is more than 4 inches from its power
supply's filter capacitor. The differential input and output voltage levels are detailed in Recommended Operating
Conditions.
11 Layout
11.1 Layout Guidelines
Input and output traces should be thick enough to handle desired currents, which can reach up to 700 mA on the
output. ADJ pin traces can be smaller because the adjustment current is negligible.
11.2 Layout Example
Ground
OUTPUT
R2
Power
INPUT
OUTPUT
ADJ/GND
R1
Cadj
Ground
Figure 25. Layout Example
12 Device and Documentation Support
12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
Submit Documentation Feedback
Copyright © 1981–2015, Texas Instruments Incorporated
Product Folder Links: TL783
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TL783CKCSE3
ACTIVE
TO-220
KCS
3
50
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 125
TL783C
TL783CKTTR
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
0 to 125
TL783C
TL783CKTTRG3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
0 to 125
TL783C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Mar-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TL783CKTTR
DDPAK/
TO-263
KTT
3
500
330.0
24.4
TL783CKTTR
DDPAK/
TO-263
KTT
3
500
330.0
24.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.8
16.3
5.11
16.0
24.0
Q2
10.8
16.1
4.9
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Mar-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TL783CKTTR
DDPAK/TO-263
KTT
3
500
340.0
340.0
38.0
TL783CKTTR
DDPAK/TO-263
KTT
3
500
350.0
334.0
47.0
Pack Materials-Page 2
PACKAGE OUTLINE
KCS0003B
TO-220 - 19.65 mm max height
SCALE 0.850
TO-220
4.7
4.4
10.36
9.96
1.32
1.22
2.9
2.6
6.5
6.1
8.55
8.15
(6.3)
( 3.84)
12.5
12.1
19.65 MAX
9.25
9.05
3X
3.9 MAX
13.12
12.70
3
1
3X
3X
0.47
0.34
0.90
0.77
2.79
2.59
2X 2.54
1.36
1.23
5.08
4222214/A 10/2015
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-220.
www.ti.com
EXAMPLE BOARD LAYOUT
KCS0003B
TO-220 - 19.65 mm max height
TO-220
0.07 MAX
ALL AROUND
3X
2X (1.7)
METAL
(1.2)
2X SOLDER MASK
OPENING
(1.7)
R (0.05)
SOLDER MASK
OPENING
2
1
(2.54)
3
0.07 MAX
ALL AROUND
(5.08)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:15X
4222214/A 10/2015
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
