TLC555TDF2

TLC555-DIE www.ti.com SLFS079 – JULY 2012 LinCMOS™ TIMER FEATURES 1 • • • • • 2 • • Very Low Power Consumption Capable of Operation in Astable Mode CMOS Output Capable of Swinging Rail to Rail High Output-Current Capability Output Fully Compatible With CMOS, TTL, and MOS Low Supply Current Reduces Spikes During Output Transitions Single-Supply Operation From 2 V to 15 V • • • Functionally Interchangeable With the NE555; Has Same Pinout ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015.2 Available in Q-Temp Automotive – High Reliability Automotive Applications – Configuration Control/Print Support – Qualification to Automotive Standards DESCRIPTION The TLC555 is a monolithic timing circuit fabricated using the TI LinCMOS process. The timer is fully compatible with CMOS, TTL, and MOS logic and operates at frequencies up to 2 MHz. Because of its high input impedance, this device uses smaller timing capacitors than those used by the NE555. As a result, more accurate time delays and oscillations are possible. Power consumption is low across the full range of power supply voltage. Like the NE555, the TLC555 has a trigger level equal to approximately one-third of the supply voltage and a threshold level equal to approximately two-thirds of the supply voltage. These levels can be altered by use of the control voltage terminal (CONT). When the trigger input (TRIG) falls below the trigger level, the flip-flop is set and the output goes high. If TRIG is above the trigger level and the threshold input (THRES) is above the threshold level, the flip-flop is reset and the output is low. The reset input (RESET) can override all other inputs and can be used to initiate a new timing cycle. If RESET is low, the flip-flop is reset and the output is low. Whenever the output is low, a low-impedance path is provided between the discharge terminal (DISCH) and GND. All unused inputs should be tied to an appropriate logic level to prevent false triggering. While the CMOS output is capable of sinking over 100 mA and sourcing over 10 mA, the TLC555 exhibits greatly reduced supply-current spikes during output transitions. This minimizes the need for the large decoupling capacitors required by the NE555. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE TLC555 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY TLC555TDF1 210 TLC555TDF2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinCMOS is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TLC555-DIE SLFS079 – JULY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 11 mils. Silicon with backgrind Floating TiW/AlSi (1%)Cu (0.5%) 760 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TLC555-DIE www.ti.com SLFS079 – JULY 2012 Table 1. Bond Pad Coordinates in Microns (1) (1) DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX GND 1 102.87 462.28 204.47 563.88 TRIG 2 373.38 104.14 474.98 205.74 OUT 3 773.43 104.14 875.03 205.74 RESET 4 1432.56 327.66 1534.16 429.26 CONT 5 1432.56 1064.26 1534.16 1165.86 THRES 6 849.63 1064.26 951.23 1151.89 DISCH 7 102.87 1064.26 204.47 1165.86 VDD 8 102.87 802.64 204.47 904.24 Substrate N/C. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) TLC555TDF1 ACTIVE 0 210 RoHS & Green Call TI N / A for Pkg Type TLC555TDF2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of