TLV2217-25KCE3

  
 
  
  SLVS067L − MARCH 1992 − REVISED APRIL 2005 D Fixed 1.8-V, 2.5-V, and 3.3-V Outputs D ±1% Maximum Output Voltage Tolerance at TJ = 25°C D 500-mV Maximum Dropout Voltage at 500 mA (3.3-V Option) D ±2% Output Voltage Variation Across Load D D D and Temperature Internal Overcurrent Limiting Internal Thermal-Overload Protection Internal Overvoltage Protection PW (TSSOP) PACKAGE (TOP VIEW) HEAT SINK GND INPUT HEAT SINK 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 KTP (PowerFLEXE/TO-252*) PACKAGE (TOP VIEW) OUTPUT HEAT SINK GND GND INPUT GND OUTPUT *Complies with JEDEC TO-252, variation AC HEAT SINK HEAT SINK − These terminals have an internal resistive connection to ground and should be grounded or electrically isolated. KCS (TO-220) PACKAGE (TOP VIEW) KC (TO-220) PACKAGE (TOP VIEW) GND OUTPUT GND INPUT GND OUTPUT GND INPUT description/ordering information ORDERING INFORMATION TJ VO (NOM) 1.8 V 0°C 0 C to 125 125°C C TOP-SIDE MARKING PowerFLEX/TO-252* (KTP) Reel of 3000 TLV2217-18KTPR 2217−18 TO-220 (KCS) Tube of 50 TLV2217-18KCS TLV2217−18 TO-220 (KC) Tube of 50 TLV2217-25KC TLV2217−25 PowerFLEX/TO-252* (KTP) Reel of 3000 TLV2217-25KTPR 2217−25 Tube of 70 TLV2217-25PW Reel of 2000 TLV2217-25PWR PowerFLEX/TO-252* (KTP) Reel of 3000 TLV2217-33KTPR 2217−33 TO-220 (KC) Tube of 50 TLV2217-33KC TLV2217−33 TSSOP (PW) Reel of 2000 TLV2217-33PWR 2217−33 2.5 V TSSOP (PW) 3.3 V ORDERABLE PART NUMBER PACKAGE† 2217−25 *Complies to TO-252, variation AC. † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX is a trademark of Texas Instruments. Copyright  2005, Texas Instruments Incorporated  
 
  ! "#$ !  %#&'" ($) (#"! "  !%$""! %$ *$ $! 
$+! !#$! !(( ,-) (#" %"$!!. ($!  $"$!!'- "'#($ $!.  '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 
  
 
  
   SLVS067L − MARCH 1992 − REVISED APRIL 2005 description/ordering information (continued) The TLV2217 family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum continuous input voltage of 16 V, making them more versatile than CMOS regulators. Utilizing a pnp pass element, these regulators are capable of sourcing 500 mA of current, with a specified maximum dropout of 500 mV (3.3-V and 2.5-V options), making these regulators ideal for low-voltage applications. Additionally, the TLV2217 regulators offer very tight output accuracy of ±2% across operating load and temperature ranges. Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection, and overvoltage protection. The TLV2217 family of regulators is available in fixed voltages of 1.8 V, 2.5 V, and 3.3 V. absolute maximum ratings over operating virtual junction temperature range (unless otherwise noted)† Continuous input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 V Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package thermal data (see Note 1) PowerFLEX/TO-252 (KTP) High K, JESD 51-5 θJP‡ 1.4°C/W TO-220 (KC/KCS) High K, JESD 51-5 3°C/W PACKAGE BOARD θJC 19°C/W θJA 28°C/W 17°C/W 19°C/W TSSOP (PW) High K, JESD 51-7 32°C/W 83°C/W ‡ For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. recommended operating conditions VI IO Input voltage Output current TJ Operating virtual junction temperature range § Minimum VI is equal to 3.0 V or VO(max) + 0.6 V, whichever is greater. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN MAX 3.0 12 UNIT V 0 500 mA 0 125 °C 
  
 
  
  SLVS067L − MARCH 1992 − REVISED APRIL 2005 electrical characteristics at VI = 4.5 V, IO = 500 mA, TJ = 25°C (unless otherwise noted) TLV2217-33 TEST CONDITIONS† PARAMETER Output voltage IO = 20 mA to 500 mA, VI = 3.8 V to 5.5 V TJ = 25°C TJ = 0°C to 125°C Input voltage regulation VI = 3.8 V to 5.5 V f = 120 Hz, Vripple = 1 VPP VI = 4.5 V Ripple rejection Output voltage regulation Output noise voltage MIN TYP MAX 3.267 3.30 3.333 3.234 5 Dropout voltage Bias current IO = 0 IO = 500 mA V 15 mV 30 mV −62 IO = 20 mA to 500 mA f = 10 Hz to 100 kHz IO = 250 mA IO = 500 mA 3.366 UNIT dB 5 µV 500 400 500 2 5 19 49 mV mA † Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output. electrical characteristics at VI = 3.3 V, IO = 500 mA, TJ = 25°C (unless otherwise noted) Output voltage IO = 20 mA to 500 mA, Input voltage regulation VI = 3.0 V to 5.5 V f = 120 Hz, Ripple rejection Output voltage regulation Output noise voltage TLV2217-25 TEST CONDITIONS† PARAMETER VI = 3.0 V to 5.5 V TJ = 25°C TJ = 0°C to 125°C IO = 250 mA IO = 500 mA Bias current IO = 0 IO = 500 mA TYP MAX 2.475 2.5 2.525 2.45 2.55 4 Vripple = 1 VPP, VI = 4.5 V IO = 20 mA to 500 mA f = 10 Hz to 100 kHz Dropout voltage MIN V 12 mV 23 mV −62 4 UNIT dB µV 500 400 500 2 5 19 49 mV mA † Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 
  
 
  
   SLVS067L − MARCH 1992 − REVISED APRIL 2005 electrical characteristics at VI = 3.3 V, IO = 500 mA, TJ = 25°C (unless otherwise noted) TLV2217-18 TEST CONDITIONS† PARAMETER Output voltage IO = 20 mA to 500 mA, VI = 3.0 V to 5.5 V TJ = 25°C TJ = 0°C to 125°C Input voltage regulation VI = 3.0 V to 5.5 V f = 120 Hz, Vripple = 1 VPP, VI = 4.5 V Ripple rejection Output voltage regulation Output noise voltage Dropout voltage Bias current IO = 0 IO = 500 mA TYP MAX 1.782 1.8 1.818 1.764 1.836 3 IO = 20 mA to 500 mA f = 10 Hz to 100 kHz IO = 250 mA IO = 500 mA MIN V 9 mV 17 mV −62 3 UNIT dB 500 ‡ µV ‡ mV 2 5 19 49 mA † Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output. ‡ Dropout voltage is limited by the input voltage range, with minimum VI = 3.0 V. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
  
 
  
  SLVS067L − MARCH 1992 − REVISED APRIL 2005 COMPENSATION-CAPACITOR SELECTION INFORMATION The TLV2217 is a low-dropout regulator. This means that the capacitance loading is important to the performance of the regulator because it is a vital part of the control loop. The capacitor value and the equivalent series resistance (ESR) both affect the control loop and must be defined for the load range and the temperature range. Figures 1 and 2 can be used to establish the capacitance value and ESR range for the best regulator performance. TLV2217 ESR OF OUTPUT CAPACITOR vs LOAD CURRENT ÇÇÇ ÇÇÇ CL = 22 µF CI = 0.1 µF TJ = 25°C 2.8 2.6 2.4 Not Recommended Potential Instability 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0.03 0.3 0.4 400 µF 0.02 200 µF 0.015 Minimum ESR Boundary 0.2 Region of Best Stability 0.025 ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ 0.1 Not Recommended Potential Instability Recommended Minimum ESR 1000 µF 0.035 Maximum ESR Boundary 0 ÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ 0.04 CL ESR − Equivalent Series Resistance − Ω 3 TLV2217 STABILITY vs ESR 100 mF 0.01 0.005 0 0.5 22 µF 10 µF 0 0.5 1 1.5 Load Voltage 2.5 3 3.5 4 4.5 5 1/ESR IL − Load Current − A Applied Load Current 2 Figure 2 ∆IL ∆VL ∆VL = ESR × ∆IL Figure 1 typical application schematic TLV2217-33 INPUT OUTPUT VO = 3.3 V GND 3.8 V 0.1 µF 22 µF Figure 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV2217-18KCS ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type Request Free Samples TLV2217-18KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type Request Free Samples Samples Not Available TLV2217-18KTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI TLV2217-18KTPRG3 OBSOLETE PFM KTP 2 TBD Call TI Call TI Samples Not Available TLV2217-18KVURG3 ACTIVE PFM KVU 3 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR Request Free Samples TLV2217-25KC OBSOLETE TO-220 KC 3 TBD Call TI Call TI Samples Not Available TLV2217-25KCE3 OBSOLETE TO-220 KC 3 TLV2217-25KCSE3 ACTIVE TO-220 KCS 3 TLV2217-25KTPR OBSOLETE PFM KTP 2 TLV2217-25KTPRG3 OBSOLETE PFM KTP 2 TLV2217-25KVURG3 ACTIVE PFM KVU 3 2500 50 1 TBD Call TI Call TI Samples Not Available Pb-Free (RoHS) CU SN N / A for Pkg Type Request Free Samples TBD Call TI Call TI Samples Not Available TBD Call TI Call TI Samples Not Available Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR Request Free Samples TLV2217-25PW ACTIVE TSSOP PW 20 TBD Call TI Call TI Purchase Samples TLV2217-25PWE4 ACTIVE TSSOP PW 20 TBD Call TI Call TI Purchase Samples TLV2217-25PWG4 ACTIVE TSSOP PW 20 TBD Call TI Call TI TLV2217-25PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV2217-25PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV2217-25PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV2217-33KC OBSOLETE TO-220 KC 3 TBD Call TI Call TI Samples Not Available TLV2217-33KCE3 OBSOLETE TO-220 KC 3 TBD Call TI Call TI Samples Not Available TLV2217-33KCSE3 ACTIVE TO-220 KCS 3 Pb-Free (RoHS) CU SN N / A for Pkg Type Request Free Samples TLV2217-33KTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI Samples Not Available TLV2217-33KTPRG3 OBSOLETE PFM KTP 2 TBD Call TI Call TI Samples Not Available TLV2217-33KVURG3 ACTIVE PFM KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR Request Free Samples TLV2217-33PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM Contact TI Distributor or Sales Office 50 Addendum-Page 1 Purchase Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Aug-2010 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV2217-33PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV2217-33PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM Contact TI Distributor or Sales Office (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLV2217-18KVURG3 Package Package Pins Type Drawing PFM KVU TLV2217-25KVURG3 PFM KVU TLV2217-25PWR TSSOP PW TLV2217-33KVURG3 PFM KVU TLV2217-33PWR TSSOP PW 3 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.9 10.5 2.7 8.0 16.0 Q2 2500 330.0 16.4 3 1 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2217-18KVURG3 PFM KVU 3 2500 340.0 340.0 38.0 TLV2217-25KVURG3 PFM KVU 3 1 340.0 340.0 38.0 TLV2217-25PWR TSSOP PW 20 2000 346.0 346.0 33.0 TLV2217-33KVURG3 PFM KVU 3 2500 340.0 340.0 38.0 TLV2217-33PWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MPSF001F – JANUARY 1996 – REVISED JANUARY 2002 KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE 0.080 (2,03) 0.070 (1,78) 0.243 (6,17) 0.233 (5,91) 0.228 (5,79) 0.218 (5,54) 0.050 (1,27) 0.040 (1,02) 0.010 (0,25) NOM 0.130 (3,30) NOM 0.215 (5,46) NOM 0.247 (6,27) 0.237 (6,02) Thermal Tab (See Note C) 0.287 (7,29) 0.277 (7,03) 0.381 (9,68) 0.371 (9,42) 0.100 (2,54) 0.090 (2,29) 0.032 (0,81) MAX Seating Plane 0.090 (2,29) 0.180 (4,57) 0.004 (0,10) 0.005 (0,13) 0.001 (0,02) 0.031 (0,79) 0.025 (0,63) 0.010 (0,25) M 0.010 (0,25) NOM Gage Plane 0.047 (1,19) 0.037 (0,94) 0.010 (0,25) 2°–ā6° 4073388/M 01/02 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC TO-252 variation AC. PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated