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TLV320AIC3253EVM-K

TLV320AIC3253EVM-K

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    KIT EVAL/DEMO FOR TLV320AIC3253

  • 数据手册
  • 价格&库存
TLV320AIC3253EVM-K 数据手册
User's Guide SLAU317A – May 2010 – Revised October 2012 TLV320AIC3253EVM-K This user's guide describes the characteristics, operation, and use of the TLV320AIC3253EVM-K. This evaluation module (EVM) features a complete stereo audio codec with several inputs and outputs, extensive audio routing, mixing, and effects capabilities. A complete circuit description, schematic diagram, and bill of materials are also included. The following related documents are available through the Texas Instruments Web site at www.ti.com. EVM-Compatible Device Data Sheets Device Literature Number TLV320AIC3253 SLOS631 TAS1020B SLES025 Contents 1 EVM Overview ............................................................................................................... 3 2 EVM Description and Basics .............................................................................................. 3 3 TLV320AIC3253EVM-K Setup and Installation ......................................................................... 7 4 AIC3253 Control Software ............................................................................................... 11 Appendix A EVM Connector Descriptions ................................................................................... 19 Appendix B TLV320AIC3253EVM Schematic ............................................................................... 23 Appendix C TLV320AIC3253EVM Layout Views ........................................................................... 24 Appendix D TLV320AIC3253EVM Bill of Materials ......................................................................... 28 Appendix E USB-MODEVM Schematic ...................................................................................... 30 Appendix F USB-MODEVM Bill of Materials ................................................................................ 31 Appendix G Writing Scripts ..................................................................................................... 33 List of Figures ................................................................................. 1 TLV320AIC3253EVM-K Block Diagram 2 Initial Screen of TLV320AIC3253EVM-K Software ..................................................................... 9 3 Compatibility Tab .......................................................................................................... 10 4 Playback Script Tab ....................................................................................................... 12 5 Program Device Pop-Up Window ....................................................................................... 12 6 Equalizers miniDSP Application ......................................................................................... 13 7 Spectrum Analyzer ........................................................................................................ 14 8 Audio Inputs Panel ........................................................................................................ 15 9 Status Flags Panel ........................................................................................................ 16 10 Register Tables Panel .................................................................................................... 17 11 Command-line Interface Panel 12 Top Layer ................................................................................................................... 24 13 Mid-Layer 1 ................................................................................................................. 24 14 Mid-Layer 2 ................................................................................................................. 25 .......................................................................................... 4 18 I2S, I2C are trademarks of Koninklijke Philips Electronics N.V. Windows is a trademark of Microsoft Corporation. SPI is a trademark of Motorola, Inc. I2C is a trademark of Philips Corporation. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 1 www.ti.com 15 Bottom Layer ............................................................................................................... 25 16 Top Overlay ................................................................................................................ 26 17 Bottom Overlay ............................................................................................................ 26 18 Drill Drawing ................................................................................................................ 27 19 Composite .................................................................................................................. 27 List of Tables 1 USB-MODEVM SW2 Settings ............................................................................................. 5 2 List of Jumpers and Switches ............................................................................................. 5 3 Analog Interface Pinout ................................................................................................... 19 4 Alternate Analog Connectors 5 Digital Interface Pinout .................................................................................................... 21 6 Power Supply Pin Out 7 8 2 ............................................................................................ .................................................................................................... TLV320AIC3253EVM Bill of Materials .................................................................................. USB-MODEVM Bill of Materials ......................................................................................... TLV320AIC3253EVM-K 20 22 28 31 SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated EVM Overview www.ti.com 1 EVM Overview 1.1 Features • • • • Full-featured evaluation board for the TLV320AIC3253 stereo audio codec. USB connection to PC provides power, control, and streaming audio data for easy evaluation. Digital microphone connections Connection points for external control and digital audio signals for quick connection to other circuits/input devices. The TLV320AIC3253EVM-K is a complete evaluation kit, which includes a universal serial bus (USB)based motherboard and evaluation software for use with a personal computer running the Microsoft Windows™ operating system (XP). 1.2 Introduction The TLV320AIC3253EVM is in the Texas Instruments (TI) modular EVM form factor, which allows direct evaluation of the device performance and operating characteristics and eases software development and system prototyping. The TLV320AIC3253EVM-K is a complete evaluation/demonstration kit, which includes a USB-based motherboard called the USB-MODEVM Interface board and evaluation software for use with a personal computer (PC) running the Microsoft Windows operating systems. The TLV320AIC3253EVM-K is operational with one USB cable connection to a PC. The USB connection provides power, control, and streaming audio data to the EVM for reduced setup and configuration. The EVM also allows external control signals, audio data, and power for advanced operation, which allows prototyping and connection to the rest of the development or system evaluation. 2 EVM Description and Basics This section provides information on the analog input and output, digital control, power, and general connection of the TLV320AIC3253EVM-K. 2.1 TLV320AIC3253EVM-K Block Diagram The TLV320AIC3253EVM-K consists of two separate circuit boards, the USB-MODEVM and the TLV320AIC3253EVM. The USB-MODEVM is built around the TAS1020B streaming audio USB controller with an 8051-based core. The motherboard features two positions for modular EVMs, or one double-wide serial modular EVM can be installed. The TLV320AIC3253EVM is one of the double-wide modular EVMs that is designed to work with the USB-MODEVM. The simple diagram of Figure 1 shows how the TLV320AIC3253EVM is connected to the USB-MODEVM. The USB-MODEVM Interface board is intended to be used in USB mode, where control of the installed EVM is accomplished using the onboard USB controller device. Provision is made, however, for driving all the data buses ( I2C™, SPI™, I2S, etc.) externally. The source of these signals is controlled by SW2 on the USB-MODEVM. See Table 1 for details on the switch settings. The USB-MODEVM has two EVM positions that allow for the connection of two small evaluation module or one larger evaluation module. The TLV320AIC3253EVM is designed to fit over both of the smaller evaluation module slots as shown in Figure 1 SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 3 EVM Description and Basics 2.1.1 www.ti.com USB-MODEVM Interface Board The simple diagram of Figure 1 shows only the basic features of the USB-MODEVM Interface board. Because the TLV320AIC3253EVM is a double-wide modular EVM, it is installed with connections to both EVM positions, which connects the TLV320AIC3253 digital control interface to the I2C port realized using the TAS1020B, as well as the TAS1020B digital audio interface. In the factory configuration, the board is ready to be used with the USB-MODEVM. To view all the functions and configuration options available on the USB-MODEVM board, see the USB-MODEVM Interface Board schematic in Appendix G. TLV320AIC3253EVM TLV320AIC3253 USB-MODEVM EVM Position 1 Control Interface 2 SPI, I C TAS1020B USB 8051 Microcontroller EVM Position 2 USB 2 I S, AC97 Audio Interface Figure 1. TLV320AIC3253EVM-K Block Diagram 4 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated EVM Description and Basics www.ti.com 2.2 Default Configuration and Connections 2.2.1 USB-MODEVM Table 1 provides a list of the SW2 settings on the USB-MODEVM. For use with the TLV320AIC3253EVM, SW-2 positions 1, 3, 4, 5, 6, and 7 must be set to ON, whereas SW-2.2 and SW-2.8 must be set to OFF. If the TLV320AIC3253EVM is to be used with an external audio interface, SW2.4 and SW2.5 also need to be set to OFF and such interface must be connected as explained in Section 2.4 Table 1. USB-MODEVM SW2 Settings SW-2 Switch Number 2.2.2 Label Switch Description 1 A0 USB-MODEVM EEPROM I2C Address A0 ON: A0 = 0 OFF: A0 = 1 2 A1 USB-MODEVM EEPROM I2C Address A1 ON: A1 = 0 OFF: A1 = 1 3 A2 USB-MODEVM EEPROM I2C Address A2 ON: A2 = 0 OFF: A2 = 1 4 USB I2S I2S Bus Source Selection ON: I2S Bus connects to TAS1020 OFF: I2S Bus connects to USB-MODEVM J14 5 USB MCK I2S Bus MCLK Source Selection ON: MCLK connects to TAS1020 OFF: MCLK connects to USB-MODEVM J14 6 USB SPI SPI Bus Source Selection ON: SPI Bus connects to TAS1020 OFF: SPI Bus connects to USB-MODEVM J15 7 USB RST RST Source Selection ON: EVM Reset Signal comes from TAS1020 OFF: EVM Reset Signal comes from USB-MODEVM J15 8 EXT MCK External MCLK Selection ON: MCLK Signal is provided from USB-MODEVM J10 OFF: MCLK Signal comes from either selection of SW2-5 TLV320AIC3253 Jumper Locations Table 2 provides a list of jumpers found on the EVM and their factory default conditions. Table 2. List of Jumpers and Switches Jumper Default Position Jumper Description W1 1-2 Sets IOVDD to 3.3V (default) or 1.8V. W2 2-3 Sets DIGMIC_PWR to 3.3V (default) or 1.8V. W3 Removed Connects GPIO2 to RESET line. W4 Installed Provides a means to measure LDOin/HPVDD current. W5 Installed Provides a means to measure AVDD current. When using the internal LDO, this jumper should be removed. W6 Installed Provides a means to measure DVDD current. W7 Installed Provides a means to measure IOVDD current. W8 Removed Connects 16-Ω load to HPL outputs. W9 Removed Connects 16-Ω load to HPR outputs. W10 Removed When installed, shorts across the output capacitor on HPL; remove this jumper if using AC-coupled output drive. W11 Removed When installed, shorts across the output capacitor on HPR; remove this jumper if using AC-coupled output drive. W12 Removed When inserted, connects MICBIAS to J2.4 for headset detection use. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 5 EVM Description and Basics www.ti.com Table 2. List of Jumpers and Switches (continued) Jumper Default Position Jumper Description W13 Installed When installed, it selects onboard EEPROM as firmware source. W14 2-3 When SW1 is configured for I2C, selects SCLK source for digital microphone or headset detection use. W15 Installed Connects MISO to USB-MODEVM. Remove this jumper for digital microphone use. SW1 Toward I2C When set to I2C, the I2C signals from P12/J12 are connected to the codec and SPI_SELECT is set low. When set to SPI, the SPI signals from P12/J12 are connected to the codec and SPI_SELECT is pulled to IOVDD. 2.3 2.3.1 Analog Signal Connections Analog Inputs The analog input sources can be applied directly to terminal block J5 or input jack J4. The connection details can be found in Appendix A. 2.3.2 Analog Output The analog outputs are available from terminal block J1 or output jacks J2 and J3. Note that J3 is provided for signal-to-noise ratio (SNR) measurements only. The connection details can be found in Appendix A. 2.4 Digital Signal Connections The digital inputs and outputs of the EVM can be monitored through P12 and P22. If external signals need to be connected to the EVM, digital inputs must be connected via J14 and J15 on the USB-MODEVM and the SW2 switch must be changed accordingly (see Section 2.2.1). The connector details are available in Section A.2. 2.5 Power Connections The TLV320AIC3253EVM can be powered independently when being used in stand-alone operation or by the USB-MODEVM when it is plugged onto the motherboard. 6 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K Setup and Installation www.ti.com 2.5.1 Stand-Alone Operation When used as a stand-alone EVM, power is applied to P23/J23 directly, making sure to reference the supplies to the appropriate grounds on that connector. CAUTION Verify that all power supplies are within the safe operating limits shown on the TLV320AIC3253 data sheet before applying power to the EVM. P23/J23 provides connection to the common power bus for the TLV320AIC3253EVM. Power is supplied on the pins listed in Table 6. The TLV320AIC3253EVM-K motherboard (the USB-MODEVM Interface board) supplies power to P23/J23 of the TLV320AIC3253EVM. Power for the motherboard is supplied either through its USB connection or via terminal blocks on that board. 2.5.2 USB-MODEVM Operation The USB-MODEVM Interface board can be powered from several different sources: • USB • 6-Vdc to 10-Vdc AC/DC external wall supply (not included) • Laboratory power supply When powered from the USB connection, JMP6 must have a shunt from pins 1–2 (this is the default factory configuration). When powered from 6-Vdc to 10-Vdc power supply, either through the J8 terminal block or J9 barrel jack, JMP6 must have a shunt installed on pins 2–3. If power is applied in any of these ways, onboard regulators generate the required supply voltages, and no further power supplies are necessary. If laboratory supplies are used to provide the individual voltages required by the USB-MODEVM Interface, JMP6 must have no shunt installed. Voltages are then applied to J2 (+5VA), J3 (+5VD), J4 (+1.8VD), and J5 (+3.3VD). The +1.8VD and +3.3VD can also be generated on the board by the onboard regulators from the +5VD supply; to enable this configuration, the switches on SW1 need to be set to enable the regulators by placing them in the ON position (lower position, looking at the board with text reading rightside up). If +1.8VD and +3.3VD are supplied externally, disable the onboard regulators by placing SW1 switches in the OFF position. Each power supply voltage has an LED (D1-D7) that illuminates when the power supplies are active. 3 TLV320AIC3253EVM-K Setup and Installation The following section provides information on using the TLV320AIC3253EVM-K, including setup, program installation, and program usage. 3.1 Software Installation 1. Download the latest version of the AIC3253 Control Software (CS) located in the TLV320AIC3253EVM-K Product Folder. 2. Open the self-extracting installation file. 3. Extract the software to a known folder. 4. Install the EVM software by double-clicking the Setup executable, and follow the directions. The user may be prompted to restart their computer. This installs all the TLV320AIC3253EVM-K software and required drivers onto the PC. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 7 TLV320AIC3253EVM-K Setup and Installation 3.2 www.ti.com EVM Connections 1. Ensure that the TLV320AIC3253EVM is installed on the USB-MODEVM Interface board, aligning J11, J12, J21, J22, and J23 with the corresponding connectors on the USB-MODEVM. 2. Verify that the jumpers and switches are in their default conditions. 3. Attach a USB cable from the PC to the USB-MODEVM Interface board. The default configuration provides power, control signals, and streaming audio via the USB interface from the PC. On the USBMODEVM, LEDs D3, D4, D5, and D7 illuminate to indicate that the USB is supplying power. 4. For the first connection, the PC recognizes new hardware and begins an initialization process. The user may be prompted to identify the location of the drivers or allow the PC to automatically search for them. Allow the automatic detection option. 5. Once the PC confirms that the hardware is operational, D2 on the USB-MODEVM illuminates to indicate that the firmware has been loaded and the EVM is ready for use. If D2 does not illuminate, verify that the EEPROM jumper and switch settings conform to Table 1 and Table 2. After the TLV320AIC3253EVM-K software installation (described in Section 3.2) is complete, evaluation and development with the TLV320AIC3253 can begin. 8 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K Setup and Installation www.ti.com The TLV320AIC3253EVM-K software can now be launched. The user sees an initial screen that looks similar to Figure 2. Figure 2. Initial Screen of TLV320AIC3253EVM-K Software SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 9 TLV320AIC3253EVM-K Setup and Installation www.ti.com If running the software in Windows Vista or Windows 7, right-click the AIC3253EVM-K CS shortcut and select Properties. Configure the Compatibility tab as shown in Figure 3 Figure 3. Compatibility Tab 10 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated AIC3253 Control Software www.ti.com 4 AIC3253 Control Software The AIC3253 Control Software (CS) is an intuitive, easy-to-use, powerful tool to learn, evaluate, and control the TLV320AIC3253. This tool was specifically designed to make learning the TLV320AIC3253 software easy. The following sections describe the operation of this software. NOTE: For configuration of the codec, the TLV320AIC3253 block diagram located in the TLV320AIC3253 data sheet is a good reference to help determine the signal routing. 4.1 Main Panel Window The Main Panel window, shown in Figure 2, provides easy access to all the features of the AIC3253 CS. The Firmware Name and Version boxes provide information about the firmware loaded into the EVM's EEPROM. The USB-MODEVM Interface drop-down menu allows the user to select which communication protocol the TAS1020B USB Controller uses to communicate with the TLV320AIC3253 or to toggle the TAS1020B GPIO pins. The TLV320AIC3253 supports I2C Standard, I2C Fast, and 8-bit register SPI. The USBMODEVM Interface selection is global to all panels, including the Command-Line Interface. To communicate to the TLV320AIC3253 using SPI, SW1 must be switched towards SPI and W15 must be inserted on the TLV320AIC3253EVM. The Panel Selection Tree provides access to typical configurations, features, and other panels that allow the user to control the TLV320AIC3253. The tree is divided into several categories which contain items that pop up panels. A panel can be opened by double-clicking any item inside a category in the Panel Selection Tree. Below the Panel Selection Tree are three buttons that pop up the following: • • • Status Flags - Allows the user to monitor the TLV320AIC3253 status flags. Register Tables - A tool to monitor register pages. Command-Line Interface - A tool to execute/generate scripts and monitor register activity. The USB LED indicates if the EVM kit is recognized by the software and the ACTIVITY LED illuminates every time a command request is sent. The dialog box at the bottom of the Main Panel provides feedback of the current status of the software. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 11 AIC3253 Control Software 4.1.1 www.ti.com Typical Configurations This panel can help users to quickly become familiar with the TLV320AIC3253. This panel has controls relevant to the selected configuration; a tab shows the script that will be loaded for that particular configuration. Each script includes a brief description of the selected configuration, as shown in Figure 4. Figure 4. Playback Script Tab 4.1.2 Features The Features category allows the user to evaluate various features of the TLV320AIC3253. Each of the Features panels include an Information tab that explains the feature and provides hardware setup information for easy evaluation. Any item in the Features category can be accessed by a double-click. As soon as a Features panel opens, a pop-up message appears asking to program the codec for that feature (see Figure 5). A command script is sent to the codec if the OK button is clicked. This script programs all registers necessary to evaluate the feature. This can be bypassed by clicking the Cancel button. Figure 5. Program Device Pop-Up Window The script corresponding to each feature can be accessed at the Installation Directory\DATA\EVM folder. Also, each script can be manually customized and loaded as the feature's start-up script as long as the file name remains the same. 12 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated AIC3253 Control Software www.ti.com 4.1.3 miniDSP Applications The TLV320AIC3253 features two miniDSP cores, one for the ADC and another for the DAC. Currently, the AIC3253 CS has two DAC miniDSP applications: Equalizers and Spectrum Analyzer. Visit the TLV320AIC3253EVM-K product folder for updates and availability on new miniDSP applications. See the miniDSP section in the data sheet (SLOS631) for information on how to develop custom miniDSP algorithms. 4.1.3.1 Equalizers The Equalizers miniDSP application features 20 cascaded biquad filters per DAC channel (Figure 6). Each of the 40 20-Band EQ sliders modify its corresponding biquad filter in the cascade as a function of gain. Each Master slider controls the digital volume control of the TLV320AIC3253. All sliders can be set to track the opposing channel slider movement by turning on the Lock L+R switch. Preset configurations are available at the red selection box below the graphic equalizer. A frequency slider movement changes any preset to Custom. The Small Speaker EQ section, contains filter presets that are suitable for small speaker applications. Emphasizing certain frequencies and reducing low-frequency energy provides higher volume with less distortion and more intelligible speech and music for small speakers. These presets use the first seven biquads of the cascade for filtering whereas the rest of the 13 graphic equalizer sliders can be used to emphasize other frequencies. This feature is enabled by setting the green ON/OFF switch to ON. Although an option is available to program the codec for this feature when the panel pops up, provision is made to re-program this miniDSP application by clicking the Program EQ into miniDSP button. Figure 6. Equalizers miniDSP Application SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 13 AIC3253 Control Software 4.1.3.2 www.ti.com Spectrum Analyzer The 20-Band Spectrum Analyzer provides a visual representation of the frequency content of the input signal (Figure 70. If Both Channels is selected in the selection box below the display window, the AIC3253 CS polls the registers related to both channels. To enable polling, set the ON/OFF switch to ON. Modifying the DAC volume control does not affect the spectrum reading because the analysis is done before the DAC volume control. Although an option is available to program the codec for this feature when the panel pops up, provision is made to re-program this miniDSP application by clicking the Program Spectrum Analyzer into miniDSP button. Figure 7. Spectrum Analyzer 4.1.4 Control Categories The Digital Settings, Analog Settings, and Signal Processing categories provide control of many registers and other features of the TLV320AIC3253 . These categories are intended for the advanced user. Hovering the mouse cursor on top of a control displays a tip strip that contains page, register, and bit information. As an example, hovering on top of the ‘J’ control of the Clocks / Interface panel, as shown in Figure 8 displays p0_r6_b5-0 which means that this control writes to Page 0/Register 6, Bits D5 to D0. 14 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated AIC3253 Control Software www.ti.com Figure 8. Audio Inputs Panel Before changing a control, see the data sheet to ensure that a particular control is compatible with the current state of the codec. As an example, some controls in the Analog Setup panel must be modified in a particular order as described in the data sheet. Other controls must only be modified with a specific hardware setup, such as powering up the AVDD LDO. All controls update their status with respect to the register contents in the following conditions: • A panel is opened. • The Execute Command Buffer button in the Command-Line Interface is pressed (if enabled to do so). • The Refresh button at the bottom right of a panel is pressed. 4.2 Status Flags Panel The TLV320AIC3253 status flags can monitored in the Status Flags panel (Figure 9) which is located below the Panel Selection Tree . Pressing the POLL button continuously reads all the registers relevant to each flag and updates those flags accordingly. The rate at which the registers are read can be modified by changing the value in the Polling Interval numeric control. Note that a smaller interval reduces responsiveness of other controls, especially volume sliders, due to bandwidth limitations. By default, the polling interval is 200 ms and can be set to a minimum of 20 ms. The Sticky Flags tab contains indicators whose corresponding register contents clear every time a read is performed to that register. To read all the sticky flags, click the Read Sticky Flags button. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 15 AIC3253 Control Software www.ti.com Figure 9. Status Flags Panel 4.3 Register Tables Panel The contents of configuration and coefficient pages of the TLV320AIC3253 can be accessed through the Register Tables panel (Figure 10). The Page Number control changes to the page to be displayed in the register table. The register table contains page information such as the register name, reset value, current value, and a bitmap of the current value. The contents of the selected page can be exported into a spreadsheet by clicking the Dump to Spreadsheet button. 16 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated AIC3253 Control Software www.ti.com Figure 10. Register Tables Panel 4.4 Command-Line Interface Panel The Command-Line Interface panel provides a means to communicate with the TLV320AIC3253 using a simple scripting language (described in Section G.1). The TAS1020B USB Controller (located on the USBMODEVM motherboard) handles all communication between the PC and the TLV320AIC3253. A script is loaded into the command buffer, either by loading a script file using the File menu or by pasting text from the clipboard using the Ctrl-V key combination (Figure 11). When the command buffer is executed, the return data packets which result from each individual command are displayed in the Command History control. This control is an array (with a maximum size of 100 elements) that contains information about each command as well as status. The Interface box displays the interface used for a particular command in the Command History array. The Command box displays the type of command executed (i.e., write, read) for a particular interface. The Flag Retries box displays the number of read iterations performed by a Wait for Flag command (see Section G.1 for details). The Register Data array displays the register number and data bytes that correspond to a particular command. The Information tab provides additional information related to the Command History as well as additional settings. The Syntax and Examples tabs provide useful information related to the scripting language. The File menu provides some options for working with scripts. The first option, Open Script File..., loads a command file script into the command buffer. This script can then be executed by pressing the Execute Command Buffer button. The contents of the Command Buffer can be saved using the Save Script File... option. Both the Command Buffer and Command History can be cleared by clicking their corresponding Clear buttons. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM-K 17 AIC3253 Control Software www.ti.com Figure 11. Command-line Interface Panel 18 TLV320AIC3253EVM-K SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated www.ti.com Appendix A EVM Connector Descriptions This appendix contains the connection details for each of the main connectors on the EVM. A.1 A.1.1 Analog Interface Connectors Analog Dual-Row Socket Details, J11 and J21 The TLV320AIC3253EVM has two analog dual-row sockets located at the bottom of the board. These sockets provide support to the EVM and connect the analog ground plane of the EVM to the USBMODEVM analog ground. Consult Samtec at www.samtec.com or call 1-800-SAMTEC-9 for a variety of mating connector options. Table 3 summarizes the analog interface pinout for the TLV320AIC3253EVM. Table 3. Analog Interface Pinout PIN NUMBER SIGNAL DESCRIPTION J11.1 NC Not Connected J11.2 NC Not Connected J11.3 NC Not Connected J11.4 NC Not Connected J11.5 NC Not Connected J11.6 NC Not Connected J11.7 NC Not Connected J11.8 NC Not Connected J11.9 AGND Analog Ground J11.10 NC Not Connected J11.11 AGND Analog Ground J11.12 NC Not Connected J11.13 AGND Analog Ground J11.14 NC Not Connected J11.15 NC Not Connected J11.16 NC Not Connected J11.17 AGND Analog Ground J11.18 NC Not Connected J11.19 AGND Analog Ground J11.20 NC Not Connected J21.1 NC Not Connected J21.2 NC Not Connected J21.3 NC Not Connected J21.4 NC Not Connected J21.5 NC Not Connected J21.6 NC Not Connected J21.7 NC Not Connected J21.8 NC Not Connected J21.9 AGND Analog Ground J21.10 NC Not Connected J21.11 AGND Analog Ground J21.12 NC Not Connected J21.13 AGND Analog Ground J21.14 NC Not Connected J21.15 NC Not Connected J21.16 NC Not Connected J21.17 AGND Analog Ground J21.18 NC Not Connected J21.19 AGND Analog Ground SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated EVM Connector Descriptions 19 Analog Interface Connectors www.ti.com Table 3. Analog Interface Pinout (continued) A.1.2 PIN NUMBER SIGNAL DESCRIPTION J21.20 NC Not Connected Analog Screw Terminal and Audio Jack Details, J1 to J10 The analog inputs and outputs can be accessed through screw terminals or audio jacks. Table 4 summarizes the screw terminals and audio jacks available on the TLV320AIC3253EVM. Table 4. Alternate Analog Connectors 20 DESIGNATOR PIN 1 PIN 2 PIN 3 J1 (HEADPHONE) HPL GND HPR PIN 4 PIN 5 PIN 6 J2 (HEADSET OUTPUT) GND HPL HPR SCLK NC NC J3 (HEADPHONE TEST ONLY) GND HPL HPR NC NC J4 (LINE IN) J5 (LINE IN) GND INL INR NC NC INL GND INR J6 (DIG_MIC 1) DIG_MIC_PWR DIG_MIC_CLK DIG_MIC_DATA DIG_MIC_GND J7 (DIG_MIC 2) DIG_MIC_PWR DIG_MIC_CLK DIG_MIC_DATA DIG_MIC_GND EVM Connector Descriptions SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Digital Interface Connectors, P12/J12 and P22/J22 www.ti.com A.2 Digital Interface Connectors, P12/J12 and P22/J22 The TLV320AIC3253EVM is designed to easily interface with multiple control platforms. Samtec part numbers SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin, dual-row header/socket combination at P12/J12 and P22/J22. These headers/sockets provide access to the digital control and serial data pins of the device. Consult Samtec at www.samtec.com or call 1-800- SAMTEC-9 for a variety of mating connector options. Table 5 summarizes the digital interface pinout for the TLV320AIC3253EVM. Table 5. Digital Interface Pinout PIN NUMBER SIGNAL DESCRIPTION P12.1/J12.1 NC Not Connected P12.2/J12.2 NC Not Connected P12.3/J12.3 SCLK SPI Serial Clock P12.4/J12.4 DGND Digital Ground P12.5/J12.5 NC Not Connected P12.6/J12.6 NC Not Connected P12.7/J12.7 /SS SPI Chip Select P12.8/J12.8 RESET TAS1020B Reset P12.9/J12.9 NC Not Connected P12.10/J12.10 DGND Digital Ground P12.11/J12.11 MOSI SPI MOSI Slave Serial Data Input P12.12/J12.12 NC Not Connected P12.13/J12.13 MISO SPI MISO Slave Serial Data Output P12.14/J12.14 RESET TAS1020B Reset P12.15/J12.15 NC Not Connected P12.16/J12.16 SCL I2C Serial Clock P12.17/J12.17 NC Not Connected P12.18/J12.18 DGND Digital Ground P12.19/J12.19 NC Not Connected P12.20/J12.20 SDA I2C Serial Data Input/Output P22.1/J22.1 NC Not Connected P22.2/J22.2 NC Not Connected P22.3/J22.3 BCLK Audio Serial Data Bus Bit Clock (Input/Output) P22.4/J22.4 DGND Digital Ground P22.5/J22.5 NC Not Connected P22.6/J22.6 NC Not Connected P22.7/J22.7 WCLK Audio Serial Data Bus Word Clock (Input/Output) P22.8/J22.8 NC Not Connected P22.9/J22.9 NC Not Connected P22.10/J22.10 DGND Digital Ground P22.11/J22.11 DIN Audio Serial Data Bus Data Input (Input) P22.12/J22.12 NC Not Connected P22.13/J22.13 DOUT Audio Serial Data Bus Data Output (Output) P22.14/J22.14 NC Not Connected P22.15/J22.15 NC Not Connected P22.16/J22.16 NC Not Connected P22.17/J22.17 MCLK Master Clock Input P22.18/J22.18 DGND Digital Ground P22.19/J22.19 NC Not Connected P22.20/J22.20 NC Not Connected SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated EVM Connector Descriptions 21 Power Supply Connector Pin Header, P23/J23 www.ti.com Note that P22/J22 comprises the signals needed for an I2S™ serial digital audio interface; the control interface ( I2C™ and RESET) signals are routed to P12/J12. A.3 Power Supply Connector Pin Header, P23/J23 P23/J23 provides connection to the common power bus for the TLV320AIC3253EVM. Power is supplied on the pins listed in Table 6. Table 6. Power Supply Pin Out SIGNAL PIN NUMBER SIGNAL NC P23.1/J23.1 P23.2/J23.2 NC +5VA P23.3/J23.3 P23.4/J23.4 NC DGND P23.5/J23.5 P23.6/J23.6 AGND +1.8VD P23.7/J23.7 P23.8/J23.8 NC +3.3VD P23.9/J23.9 P23.10/J23.10 NC The TLV320AIC3253EVM-K motherboard (the USB-MODEVM Interface board) supplies power to P23/J23 of the TLV320AIC3253EVM. Power for the motherboard is supplied either through its USB connection or via terminal blocks on that board. 22 EVM Connector Descriptions SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated www.ti.com Appendix B TLV320AIC3253EVM Schematic The schematic diagram for the TLV320AIC3253EVM is provided as a reference. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM Schematic 23 1 2 3 4 5 6 Revision History REV ECN Number Approved Daughtercard_Interface Daughtercard_Interface.SCH D D C C B B ti A DATA ACQUISITION PRODUCTS HIGH PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 12500 T.I. Boulevard, Dallas, Texas 75243 USA TITLE ENGINEER Mike Tsecouras TLV320AIC3253_RGE_EVM DRAWN BYSteve Leggio DOCUMENT CONTROL NO.N/A SHEET 1 1 2 3 4 5 OF 3 SIZE A DATE 18-Mar-2009 REV 01 FILE 6 A 1 2 3 4 5 6 REVISION HISTORY REV D AGND AGND VCOM AGND AGND AGND A3(-) A2(-) A1(-) A0(-) APPROVED P12/ J12 J11 19 17 15 13 11 9 7 5 3 1 ENGINEERING CHANGE NUMBER REF+ REFA7 A6 A5 A4 A3(+) A2(+) A1(+) A0(+) 20 18 16 14 12 10 8 6 4 2 SCLK /SS MOSI MISO 1 3 5 7 9 11 13 15 17 19 CONN_EVM_ANALOG BOTTOM SIDE CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 2 4 6 8 10 12 14 16 18 20 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA W3 1 D 2 RESET /RESET SCL SDA DAUGHTER-SERIAL P12 (TOP) = SAMTEC - P/N: TSM-110-01-L-DV-P J12 (BOTTOM) = SAMTEC - P/N: SSW-110-22-F-D-VS-K 3 VIN 10 TP4 +1.8VA C5 10uF U3 LM317 R3 3 2 C2 47uF C4 0.1uF C C8 0.1uF HPVDD IN ADJ +5VA C3 0.1uF +1.8VA 2 VOUT 1 C1 47uF GND U2 REG1117A-18 R2 2 OUT TP5 HPVDD R5 240 1 +5VA C C6 10uF C9 0.1uF R1 500 J21 19 17 15 13 11 9 7 5 3 1 B AGND AGND VCOM AGND AGND AGND A3(-) A2(-) A1(-) A0(-) REF+ REFA7 A6 A5 A4 A3(+) A2(+) A1(+) A0(+) P22/ J22 C7 10uF R4 47 20 18 16 14 12 10 8 6 4 2 BCLK WCLK DIN DOUT TP1 +5VA +5VA CONN_EVM_ANALOG BOTTOM SIDE TP2 P23/J23 1 3 5 7 9 +1.8VD +1.8VD TP3 DIGMIC_PWR TP12 DIGMIC_PWR CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 2 4 6 8 10 12 14 16 18 20 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA B DAUGHTER-SERIAL P22 (TOP) = SAMTEC - P/N: TSM-110-01-L-DV-P J22 (BOTTOM) = SAMTEC - P/N: SSW-110-22-F-D-VS-K P23 (TOP) = SAMTEC - P/N: TSM-105-01-L-DV-P J23 (BOTTOM) = SAMTEC - P/N: SSW-105-22-F-D-VS-K IOVDD IOVDD +1.8VD +3.3VD For any IOVDD (W1) jumper setting, ensure that IOVDD SELECT switches on the USB-MODEVM are set accordingly. 3 2 1 +1.8VD 3 2 1 +3.3VD -VA -5VA AGND VD1 +5VD DAUGHTER-POWER +3.3VD +3.3VD TP11 +VA +5VA DGND +1.8VD +3.3VD MCLK 2 4 6 8 10 1 3 5 7 9 11 13 15 17 19 W2 DIGMIC_PWR W1 IOVDD TP6 HPGND TP7 TP8 MICGND AGND TP9 DGND ti TP10 DGND A DATA ACQUISITION PRODUCTS HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 12500 T.I. Boulevard, Dallas, Texas 75243 USA ENGINEER MIKE TSECOURAS TITLE TLV320AIC3253_RGE_EVM DRAWN BY STEVE LEGGIO DOCUMENT CONTROL NO.N/A SHEET 2 1 2 3 4 5 OF 3 SIZE B DATE 18-Mar-2009 REV 01 FILE 6 A 1 2 3 4 5 6 Revision History REV W10 2 1 ECN Number Approved C29 IOVDD IOVDD 0.1uF HPL D R6 0 2 C23 NI 3 C24 NI 47uF C26 R7 0 2 4 5 3 1 C20 47nF 1 TP23 SCL/SSZ W9 1 TP24 SDA/MOSI 2 W8 J3 2 5 6 3 4 1 W11 R10 16 C21 47nF R11 16 5 4 6 8 7 9 R13 4.7K W13 11 2 1 HPVDD W4 1 W14 1 2 3 SJ1-3515-SMT 0.47uF 0.1uF TP21 INR 0.47uF 14 INL 15 INR 16 REF 17 MICBIAS 18 J5 TP31 /SS TP32 MOSI TP33 MISO TP34 SCLK 2 TP26 TP27 DIG_MIC_DATA DIG_MIC_CLK 1 3 2 7 8 SCL/SS SDA/MOSI MISO/MFP4 DIGMIC_PWR IOVDD DIGMIC_PWR C32 C33 10uF C34 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF VCCA VCCB A B GND DIR U8 6 4 5 1 3 2 VCCA VCCB A B GND DIR SCLK/MFP3 DOUT/MFP2 INL DIN/MFP1 INR WCLK REF BCLK MICBIAS MCLK 6 MFP3 5 DOUT 4 DIN 3 WCLK 2 BCLK 1 MCLK 6 4 5 SN74AVC1T45DBV IOVDD AVSS SCLK DIGMIC_PWR R34 4.7K C DIG_MIC_PWR 2 2 3 3 4 4 TP28 MFP3 TP35 DOUT TP36 DIN TP37 WCLK TP38 BCLK TP39 MCLK TP40 /RESET DIG_MIC_CLK DIG_MIC_DATA DIG_MIC_GND R23 DOUT 0 R24 DIN 0 R25 WCLK 0 R26 BCLK 0 B R27 MCLK 0 R28 /RESET PPAD 0 R29 10K /RESET C38 0.1uF C14 0.1uF C19 22uF 10uF ti IOVDD IOVDD 1 W7 2 1 W6 2 TP17 +1.8VD 1 S2 0.1uF C18 TP16 DVDD DIG_MIC 2 J7 10uF C35 0.1uF 24 23 22 21 20 C13 A MISO R22 1 DVDD VREF /RESET SPI_SEL 19 TP15 LINE IN R21 0 C37 3 INR 0 IOVDD IOVDD IOVSS 10uF MOSI 0 DVDD 0.1uF C17 DVSS TP41 MICBIAS RESET SPI_SELECT INL 2 /SS R20 DIG_MIC 1 J6 C12 1 R19 0 DIGMIC_PWR C31 SN74AVC1T45DBV TLV320AIC3253 AVDD SDA C36 C30 U7 SCL/SSZ SDA/MOSI MISO HPR HPR 9 10 11 LDOIN/HPVDD HPL 13 SCL R18 HP_DET IOVDD HPL 12 22uF C11 C27 C28 LINE IN B C16 AVDD TP20 INL R17 0 0 U1 2 D MICROCHIP_24AA64 HD_DET 2 0.1uF TP14 AVDD R16 2.7K 0 C15 +1.8VA W5 1 8 7 6 5 TP29 SCL TP30 SDA 22uF C10 2 4 5 3 1 A0 VCC A1 WP A2 SCL VSS SDA TP25 TP13 HPVDD R12 2.2K J4 1 2 3 4 W15 1 W12 MICBIAS R15 2.7K U4 10 12 SJ1-3515-SMT HEADPHONE TEST ONLY HEADPHONE JACK CUI_SJ-43516-SMT C 4PDT_ESW_EG4208 SW1 1 2 3 TP22 SPI_SEL TP19 HPR 47uF 2 2 J2 R9 100 1 R8 100 HPR HEADPHONE IOVDD 2 1 R14 2.7K SW1: I2C SEL = 0 SPI SEL = 1 TP18 HPL C25 1 C22 NI J1 DATA ACQUISITION PRODUCTS HIGH PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 12500 T.I. Boulevard, Dallas, Texas 75243 USA TITLE ENGINEER Mike Tsecouras TLV320AIC3253_RGE_EVM DRAWN BYSteve Leggio DOCUMENT CONTROL NO.N/A SHEET 1 1 2 3 4 5 OF 3 SIZE A DATE 18-Mar-2009 REV 01 FILE 6 A www.ti.com Appendix C TLV320AIC3253EVM Layout Views C.1 Layout Views Figure 12. Top Layer Figure 13. Mid-Layer 1 24 TLV320AIC3253EVM Layout Views SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Layout Views www.ti.com Figure 14. Mid-Layer 2 Figure 15. Bottom Layer SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM Layout Views 25 Layout Views www.ti.com Figure 16. Top Overlay Figure 17. Bottom Overlay 26 TLV320AIC3253EVM Layout Views SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Layout Views www.ti.com Figure 18. Drill Drawing Figure 19. Composite SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated TLV320AIC3253EVM Layout Views 27 www.ti.com Appendix D TLV320AIC3253EVM Bill of Materials The complete bill of materials for the TLV320AIC3253EVM is provided as a reference. Table 7. TLV320AIC3253EVM Bill of Materials PCB Qty Value 1 Ref Des Description Vendor N/A TLV320AIC3253_RGE_EVM_REV01 (PWB) Texas Instruments Part number RESISTORS Qty Value Ref Des Description Vendor Part number 12 0 R17, R18, R19, R20, R21, R22, R23, R24, R25, R26, R27, R28 RES ZERO OHM 1/10W 5% 0603 SMD Panasonic ERJ-3GEY0R00V 2 0 R6, R7 RES ZERO OHM 1/4W 5% 1206 SMD Panasonic ERJ-8GEY0R00V 1 2 R3 RESISTOR 2.0 OHM 1/4W 5% 1206 Panasonic ERJ-8GEYJ2R0V 1 10 R2 RES 10 OHM 1/4W 5% 1206 SMD Panasonic ERJ-8GEYJ100V 2 16 R10, R11 RES 16 OHM 1W 5% 2512 SMD Panasonic ERJ-1TYJ160U 1 47 R4 RES 47 OHM 1/10W 5% 0603 SMD Panasonic ERJ-3GEYJ470V 2 100 R8, R9 RES 100 OHM 1/10W 1% 0603 SMD Panasonic ERJ-3EKF1000V 1 240 R5 RES 240 OHM 1/10W 5% 0603 SMD Panasonic ERJ-3GEYJ241V 1 500 R1 TRIMPOT 500 OHM 4MM TOP ADJ SMD Bourns Inc. 3214W-1-501E 1 2.2K R12 RES 2.2K OHM 1/10W 5% 0603 SMD Panasonic ERJ-3GEYJ222V 3 2.7K R14, R15, R16 RES 2.7K OHM 1/10W 5% 0603 SMD Panasonic ERJ-3GEYJ272V 3 4.7K R13, R29, R34 RES 4.7K OHM 1/10W 5% 0603 SMD Panasonic ERJ-3GEYJ472V CAPACITORS Qty Value Ref Des Description Vendor Part number 2 47000pF C20, C21 CAP CER 47000PF 50V X7R 10% 0603 TDK Corporation C1608X7R1H473K 5 0.1uF C10, C11, C12, C13, C14 CAP CER .10UF 6.3V X5R 10% 0402 TDK Corporation C1005X5R0J104K 8 0.1uF C29, C30, C31, C32, C33, C34, C35, C38 CAP CER .1UF 25V X7R 0603 TDK Corporation C1608X7R1E104K 4 0.1uF C3, C4, C8, C9 CAP .1UF 25V CERAMIC X7R 0805 Panasonic ECJ-2VB1E104K 2 0.47uF C27, C28 CAP CER .47UF 10V X5R 10% 0603 Panasonic C1608X5R1A474K 4 10uF C17, C19, C36, C37 CAP CERAMIC 10UF 6.3V X5R 0603 Panasonic ECJ-1VB0J106M 3 10uF C5, C6, C7 CAP CERAMIC 10UF 10V X5R 0805 Panasonic ECJ-2FB1A106K 3 22uF C15, C16, C18 CAP CER 22UF 6.3V X5R 20% 0805 TDK Corporation C2012X5R0J226M 4 47uF C1, C2, C25, C26 CAP CER 47UF 10V X5R 1210 Murata GRM32ER61A476KE 20L 3 no value – not installed C22, C23, C24 CAP 1206 N/A N/A Ref Des Description Vendor Part number 1 U1 Audio Codec Texas Instruments TLV320AIC3253IRGE 1 U2 Single Output LDO, 1.0A, Fixed(1.8V) Texas Instruments REG1117A-1.8 (SOT-223, DCY) 1 U3 3-Pin 1.5-A Adjustable Voltage Regulator Texas Instruments LM317DCY 1 U4 IC SERIAL EEPROM 64K 2.5V 8-SOIC MicroChip 24LC64-I/SN 2 U7, U8 Single-Bit Dual-Supply Bus Transceiver Texas Instruments SN74AVC1T45DBVR 28 TLV320AIC3253EVM Bill of Materials INTEGRATED CIRCUITS Qty Value SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Appendix D www.ti.com Table 7. TLV320AIC3253EVM Bill of Materials (continued) MISCELLANEOUS ITEMS Used Value Ref Des Description Vendor Part number 1 S2 SWITCH LT TOUCH 6X3.5 240GF SMD Panasonic EVQ-5PN04K 1 SW1 SWITCH SLIDE 4PDT 30V RT ANGLE E-Switch EG4208 2 P12, P22 20 Pin SMT Plug Header Samtec TSM-110-01-L-DV-P 4 J11, J12, J21, J22 20 pin SMT Socket Header Samtec SSW-110-22-F-D-VSK 1 P23 10 Pin SMT Plug Header Samtec TSM-105-01-L-DV-P 1 J23 10 pin SMT Socket Header Samtec SSW-105-22-F-D-VSK 1 J2 JACK AUDIO MINI(3.5MM ,4-COND PCB-RA ROHS CUI Inc. SJ-43516-SMT 2 J3, J4 3.5mm Audio Jack, T-R-S, SMD CUI Inc. SJ1-3515-SMT 2 J1, J5 Screw Terminal Block, 3 Position On Shore Technology ED555/3DS 2 J6, J7 Screw Terminal Block, 4 Position On Shore Technology ED555/4DS 12 not installed TP1, TP2, TP3, TP4, TP5, TP11, TP12, TP13, TP14, TP15, TP16, TP17 TEST POINT PC MINI .040"D RED Keystone Electronics 5000 24 not installed TP18, TP19, TP20, TP21, TP22, TP23, TP24, TP25, TP26, TP27, TP28, TP29, TP30, TP31, TP32, TP33, TP34, TP35, TP36, TP37, TP38, TP39, TP40, TP41 TEST POINT PC MINI .040"D WHITE Keystone Electronics 5002 5 TP6, TP7, TP8, TP9, TP10 TEST POINT PC MULTI PURPOSE BLK Keystone Electronics 5011 12 W3, W4, W5, W6, W7, W8, W9, W10, W11, W12, W13, W15 2 Pin Thru-hole Plug Header (Jumper), 0 .1" spacing Samtec TSW-102-07-L-S 3 W1, W2, W4 3 Position Jumper , 0 .1" spacing Samtec TSW-103-07-L-S Header Shorting Block Samtec SNT-100-BK-T Installed Installed per test per test procedure. procedure. ATTENTION: Alternate Resistor and Capacitor vendors may be used. In this case substitutions must have like descriptions. All components should be RoHS compliant. Some part numbers may be either leaded or RoHS. Verify purchased components are RoHS compliant. SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback TLV320AIC3253EVM Bill of Materials Copyright © 2010–2012, Texas Instruments Incorporated 29 www.ti.com Appendix E USB-MODEVM Schematic The schematic diagram for USB-MODEVM Interface Board is provided as a reference. 30 USB-MODEVM Schematic SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated 1 2 3 4 6 5 REVISION HISTORY REV ENGINEERING CHANGE NUMBER APPROVED D D USB Interface USB Interface Daughtercard Interface Daughtercard Interface MCLK BCLK LRCLK I2SDIN I2SDOUT MISO MOSI SS SCLK RESET INT PWR_DWN P3.3 P3.4 P3.5 P1.0 SDA SCL P1.1 P1.2 P1.3 C MCLK BCLK LRCLK I2SDIN I2SDOUT MISO MOSI SS SCLK RESET INT PWR_DWN P3.3 P3.4 P3.5 P1.0 SDA SCL P1.1 P1.2 P1.3 C B B ti A DATA ACQUISITION PRODUCTS HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA TITLE ENGINEER FRYE D. ZERKETTS untitled DRAWN BY I. C. SPOTTS DOCUMENT CONTROL NO.1234567 SHEET 1 1 2 3 4 5 OF 1 FILE SIZE B DATE dd MMM yyyy ??? 6 REV A A 1 2 3 4 6 5 REVISION HISTORY REV ENGINEERING CHANGE NUMBER APPROVED D 1 2 3 D J11 J12 A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND 2 4 6 8 10 12 14 16 18 20 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 +5VA DAUGHTER-ANALOG 1 3 5 7 9 +5VD JMP1 1 -VA -5VA AGND VD1 +5VD SCLK TP1 TP2 J12A (TOP) = SAM_TSM-110-01-L-DV-P J12B (BOTTOM) = SAM_SSW-110-22-F-D-VSIOVDD +5VD RESET IOVDD IOVDD C3 TP3 PWR_DWN 2 JMP3 R21 390 2.7K J2 +5VA D6 SML-LX0603GW-TR D7 SML-LX0603GW-TR GREEN GREEN J3 +5VD P3.3 P3.4 P3.5 P1.0 C P1.1 P1.2 P1.3 P3.1-P3.2 R7 200k +3.3VD R8 R1 R22 390 J1 -5VA GATE B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 INT MOSI 1 +3.3VD GND A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 24 23 22 21 20 19 18 17 16 15 14 13 SN74TVC3010PW MISO 10uF 1 10uF R6 U6 1 2 3 4 5 6 7 8 9 10 11 12 JMP4 TP4 10uF IOVDD SS +5VD C2 0.1uF 2 +5VA C29 +3.3VD RA2 10k DAUGHTER-SERIAL JMP2 C1 IOVDD -5VA 2 4 6 8 10 DAUGHTER-POWER TP7 TP8 AGND DGND 1 -5VA JMP5 2 4 6 8 10 12 14 16 18 20 200k +VA +5VA DGND +1.8VD +3.3VD 2 JPR-2X1 C GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA J13 J11A (TOP) = SAM_TSM-110-01-L-DV-P J11B (BOTTOM) = SAM_SSW-110-22-F-D-VS+5VA J13A (TOP) = SAM_TSM-105-01-L-DV-P J13B (BOTTOM) = SAM_SSW-105-22-F-D-VS- CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 2 1 3 5 7 9 11 13 15 17 19 SCL 200k R2 TP5 +1.8VD C4 C5 10uF 10uF 2.7K SDA MCLK I2SDOUT J4 +1.8VD J5 +3.3VD I2SDIN LRCLK BCLK J16 1 3 5 7 9 11 13 15 17 19 B A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND J17 2 4 6 8 10 12 14 16 18 20 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 +5VA CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA 2 4 6 8 10 12 14 16 18 20 B DAUGHTER-SERIAL DAUGHTER-ANALOG J18 J16A (TOP) = SAM_TSM-110-01-L-DV-P J16B (BOTTOM) = SAM_SSW-110-22-F-D-VS- +1.8VD 1 3 5 7 9 +VA +5VA DGND +1.8VD +3.3VD -VA -5VA AGND VD1 +5VD 2 4 6 8 10 -5VA J17A (TOP) = SAM_TSM-110-01-L-DV-P J17B (BOTTOM) = SAM_SSW-110-22-F-D-VS- DAUGHTER-POWER +3.3VD +5VD IOVDD ti J18A (TOP) = SAM_TSM-105-01-L-DV-P J18B (BOTTOM) = SAM_SSW-105-22-F-D-VS- A DATA ACQUISITION PRODUCTS A HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA TITLE ENGINEER RICK DOWNS USB-MODEVM INTERFACE DRAWN BY ROBERT BENJAMIN DOCUMENT CONTROL NO.6463996 SHEET 2 1 2 3 4 5 OF 2 FILE SIZE B DATE 3-Apr-2007 REV D C:\01_TI\designs\USB_MODEVM\usb-modevm_revD\USB Motherboard - ModEvm.ddb - Documents\SCH\Daughtercard Interface 6 1 2 3 4 6 5 REVISION HISTORY REV C33 +3.3VD +3.3VD APPROVED C41 0.1uF 5 1 IOVDD C32 ENGINEERING CHANGE NUMBER SDA C31 U11 VREF1 J6 1 3 SDA1 SCL1 GND EXTERNAL I2C 0.1uF 0.1uF USB I2S SN74AVC4T245PW PCA9306DCT +3.3VD 5 VCCB VCCA OE1 DIR1 OE2 DIR2 1B1 1A1 1B2 1A2 2B1 2A1 2B2 2A2 GND GND 0.1uF SCL C19 C C20 J7 USB SLAVE CONN 46 47 48 1 3 5 6 7 4 16 28 45 100pF GND D+ DVCC 4 3 2 1 C21 R9 1.5K R12 3.09K .001uF R10 27.4 897-30-004-90-000000 R11 C14 47pF 1 2 3 C13 47pF 27.4 XTALO XTALI PLLFILI PLLFILO MCLKI PUR DP DM DVSS DVSS DVSS AVSS 75 I2SDIN BCLK LRCLK IOVDD J14 I2SDOUT 1 3 5 7 9 11 0.1uF U5 1 VCCB VCCA 3 B A 2 DIR GND PWR_DWN IOVDD C26 C U7 6 4 IOVDD 5 31 30 29 27 26 25 24 23 8 21 33 2 VCCB VCCA B A DIR GND 0.1uF MOSI 16 15 14 13 12 11 10 9 P1.0 +3.3VD C11 0.1uF C12 0.1uF R13 C27 VCCB VCCA OE1 DIR1 OE2 DIR2 1B1 1A1 1B2 1A2 2B1 2A1 2B2 2A2 GND GND J15 1 2 3 4 5 6 7 8 0.1uF 1 3 5 7 9 11 2 4 6 8 10 12 EXTERNAL SPI SN74AVC4T245PW INT USB SPI P3.5 D2 P3.4 SML-LX0603YW-TR YELLOW P3.1-P3.2 R17 +3.3VD 100K C36 IOVDD C44 1uF SML-LX0603GW-TR +5VD JMP6 PWR SELECT 6VDC-10VDC IN CUI-STACK PJ102-BH 2.5 MM GREEN 3 9 3 C16 0.33uF VIN GND U2 REG1117-5 D1 C15 DL4001 0.1uF U9 5 6 4 2 VOUT C6 10uF R15 10K 10 11 12 R16 10K SW1 1 2 4 3 1IN 1IN 1EN 1GND 2GND 2EN 2IN 2IN 1RESET 1OUT 1OUT 2RESET 2OUT 2OUT TPS767D318PWP 3.3VD ENABLE 1.8VD ENABLE R4 10 C7 28 10uF 24 23 22 +3.3VD 18 17 10uF IOVDD 2 D8 4 SN74LVC1G06DBV IOVDD 0.1uF U16 GREEN SML-LX0603GW-TR TP6 R25 R26 22.1k 137k R27 R28 25.5k 76.8k R29 R30 28k 56.2k R31 R32 32.4k 48.7k R33 R34 39.2k 36.5k R35 R36 46.4k 30.9k R37 R18 52.3k 30.1k 1 3 2 RED C37 0.1uF IN OUT EN GND FB TPS73201DBV R19 220 C8 10uF IOVDD R38 10M 5 SW3 4 1.2V 1.4V 1.6V 1.8V 2.0V 2.5V 3.0V 3.3V 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 ti DATA ACQUISITION PRODUCTS IOVDD SELECT 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA GREEN TITLE ENGINEER RICK DOWNS USB-MODEVM INTERFACE DRAWN BYROBERT BENJAMIN DOCUMENT CONTROL NO.6463996 SHEET 1 2 3 A HIGH PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP REGULATOR ENABLE 1 B U14 D5 D4 SML-LX0603GW-TR C17 0.33uF R24 220 0.1uF C25 1 J9 6 4 5 VCCA VCCB A B GND DIR SN74AVC1T45DBV SML-LX0603IW-TR 1 2 3 EXT PWR IN 1 3 2 +1.8VD D3 +3.3VD C39 U13 0.1uF R14 390 +3.3VD C38 5 +3.3VD P3.3 3 649 ED555/2DS SN74AUP1G125DBV 2 4 IOVDD U4 P1.1 U17 0.1uF RESET 0.1uF C10 0.1uF C40 IOVDD SS SN74AVC1T45DBV +3.3VD C43 P1.2 C24 0.1uF USB RST MISO 1 3 2 SCLK P1.3 USB ACTIVE A SW DIP-8 MRESET +3.3VD J8 1 2 3 4 5 6 7 8 0.1uF TP11 B 16 15 14 13 12 11 10 9 2 4 6 8 10 12 EXTERNAL AUDIO DATA +3.3VD C42 9 10 11 12 13 14 15 17 18 19 20 22 JMP7 JPR-1X3 SW2 A0 A1 A2 USB I2S USB MCK USB SPI USB RST EXT MCK R20 MCLK U8 TAS1020BPFB P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 DVDD DVDD DVDD AVDD RA1 10K JMP8 JPR-2X1 SN74LVC1G125DBV SN74AVC1T45DBV 33pF 6.00 MHZ D IOVDD 2 44 43 42 41 40 39 37 38 36 35 34 32 33pF MA-505 6.000M-C0 SCL SDA VREN RESET MCLKO2 MCLKO1 CSCLK CDATO CDATI CSYNC CRESET CSCHNE 24LC64I/SN X1 C18 6 4 IOVDD 5 MRESET TEST EXTEN RSTO P3.0 P3.1 P3.2/XINT P3.3 P3.4 P3.5 NC NC VSS 1 2 3 C9 0.1uF 4 A0 A1 A2 VCC 0.1uF WP 8 +3.3VD SN74LVC1G126DBV J10 EXT MCLK U10 4 U1 SDA SCL 16 15 14 13 12 11 10 9 SN74AVC4T245PW +3.3VD C35 C23 TP10 7 2 4 4 3 1 VREF2 EN SDA2 SCL2 7 8 5 6 USB MCK 6 2 0.1uF U3 1 2 3 4 5 6 7 8 U15 4 2 1 TP9 R5 2.7K C28 +3.3VD 5 R3 2.7K C22 IOVDD 3 EXT MCK R23 200k 0.1uF +3.3VD C34 16 15 14 13 12 11 10 9 2 C30 0.1uF VCCA VCCB DIR1 OE1 DIR2 OE2 1A1 1B1 1A2 1B2 2A1 2B1 2A2 2B2 GND GND 1 1 2 3 4 5 6 7 8 3 +3.3VD 1 +3.3VD 5 IOVDD 3 0.1uF U12 D 4 5 OF 2 FILE SIZE B DATE 3-Apr-2007 REV D C:\01_TI\designs\USB_MODEVM\usb-modevm_revD\USB Motherboard - ModEvm.ddb - Documents\SCH\USB Interface 6 www.ti.com Appendix F USB-MODEVM Bill of Materials The complete bill of materials for USB-MODEVM Interface Board is provided as a reference. Table 8. USB-MODEVM Bill of Materials Designators Description Manufacturer Mfg. Part Number R4 10Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1300V R10, R11 27.4Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF27R4V R20 75Ω 1/4W 1% Chip Resistor Panasonic ERJ-14NF75R0U R19 220Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ221V R14, R21, R22 390Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ391V R13 649Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF6490V R9 1.5KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1352V R1–R3, R5–R8 2.7KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V R12 3.09KΩ 1/16W 1% Chip Resistor Panasonic ERJ-3EKF3091V R15, R16 10KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1303V R17, R18 100kΩ 1/10W 5%Chip Resistor Panasonic ERJ-3GEYJ1304V RA1 10KΩ 1/8W Octal Isolated Resistor Array CTS Corporation 742C163103JTR C18, C19 33pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H330J C13, C14 47pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H470J C20 100pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H101J C21 1000pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H102J C15 0.1μF 16V Ceramic Chip Capacitor, ±10%, X7R TDK C1608X7R1C104K C16, C17 0.33μF 16V Ceramic Chip Capacitor, ±20%, Y5V TDK C1608X5R1C334K C9–C12, C22–C28 1μF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C1608X5R0J1305K C1–C8 10μF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C3216X5R0J1306K D1 50V, 1A, Diode MELF SMD Micro Commercial Components DL4001 D2 Yellow Light Emitting Diode Lumex SML-LX0603YW-TR D3– D7 Green Light Emitting Diode Lumex SML-LX0603GW-TR D5 Red Light Emitting Diode Lumex SML-LX0603IW-TR Q1, Q2 N-Channel MOSFET Zetex ZXMN6A07F X1 6MHz Crystal SMD Epson MA-505 6.000M-C0 U8 USB Streaming Controller Texas Instruments TAS1020BPFB U2 5V LDO Regulator Texas Instruments REG1117-5 U9 3.3V/1.8V Dual Output LDO Regulator Texas Instruments TPS767D318PWP U3, U4 Quad, 3-State Buffers Texas Instruments SN74LVC125APW U5–U7 Single IC Buffer Driver with Open Drain o/p Texas Instruments SN74LVC1G07DBVR U10 Single 3-State Buffer Texas Instruments SN74LVC1G125DBVR U1 64K 2-Wire Serial EEPROM I2C Microchip 24LC64I/SN USB-MODEVM PCB Texas Instruments 6463995 TP1–TP6, TP9–TP11 Miniature test point terminal Keystone Electronics 5000 TP7, TP8 Multipurpose test point terminal Keystone Electronics 5011 J7 USB Type B Slave Connector Thru-Hole Mill-Max 897-30-004-90-000000 J13, J2–J5, J8 2-position terminal block On Shore Technology ED555/2DS J9 2.5mm power connector CUI Stack PJ-102B J130 BNC connector, female, PC mount AMP/Tyco 414305-1 J131A, J132A, J21A, J22A 20-pin SMT plug Samtec TSM-110-01-L-DV-P J131B, J132B, J21B, J22B 20-pin SMT socket Samtec SSW-110-22-F-D-VS-K J133A, J23A 10-pin SMT plug Samtec TSM-105-01-L-DV-P J133B, J23B 10-pin SMT socket Samtec SSW-105-22-F-D-VS-K J6 4-pin double row header (2x2) 0.1" Samtec TSW-102-07-L-D J134, J135 12-pin double row header (2x6) 0.1" Samtec TSW-106-07-L-D JMP1–JMP4 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated USB-MODEVM Bill of Materials 31 Appendix F www.ti.com Table 8. USB-MODEVM Bill of Materials (continued) Designators Description Manufacturer Mfg. Part Number JMP8–JMP14 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S JMP5, JMP6 3-position jumper, 0.1" spacing Samtec TSW-103-07-L-S JMP7 3-position dual row jumper, 0.1" spacing Samtec TSW-103-07-L-D SW1 SMT, half-pitch 2-position switch C&K Division, ITT TDA02H0SK1 SW2 SMT, half-pitch 8-position switch C&K Division, ITT TDA08H0SK1 Jumper plug Samtec SNT-100-BK-T 32 USB-MODEVM Bill of Materials SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated www.ti.com Appendix G Writing Scripts G.1 Writing Scripts A script is simply a text file that contains data to send to the serial control buses. Each line in a script file is one command. No provision is made for extending lines beyond one line, except for the > command. A line is terminated by a carriage return. The first character of a line is the command. Commands are: i Set interface bus to use r Read from the serial control bus w Write to the serial control bus > Extend repeated write commands to lines below a w # Comment b Break d Delay f Wait for Flag The first command, I, sets the interface to use for the commands to follow. This command must be followed by one of the following parameters: i2cstd i2cfast spi8 spi16 Standard mode I2C bus Fast mode I2C bus SPI bus with 8-bit register addressing SPI bus with 16-bit register addressing For example, if a fast mode I2C bus is to be used, the script begins with: I i2cfast A double quoted string of characters following the b command can be added to provide information to the user about each breakpoint. When the script is executed, the software's command handler halts as soon as a breakpoint is detected and displays the string of characters within the double quotes. The Wait for Flag command, f, reads a specified register and verifies if the bitmap provided with the command matches the data being read. If the data does not match, the command handler retries for up to 200 times. This feature is useful when switching buffers in parts that support the adaptive filtering mode. The command f syntax follows: f [i2c address] [register] [D7][D6][D5][D4][D3][D2][D1][D0] where 'i2c address' and 'register' are in hexadecimal format and 'D7' through 'D0' are in binary format with values of 0, 1 or X for don't care. Anything following a comment command # is ignored by the parser, provided that it is on the same line. The delay command d allows the user to specify a time, in milliseconds, that the script pauses before proceeding. The delay time is entered in decimal format. A series of byte values follows either a read or write command. Each byte value is expressed in hexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to the TAS1020B by the program. The first byte following an r (read) or w (write) command is the I2C slave address of the device (if I2C is used) or the first data byte to write (if SPI is usednote that SPI interfaces are not standardized on protocols, so the meaning of this byte varies with the device being addressed on the SPI bus). The second byte is the starting register address that data will be written to (again, with I2C; SPI varies. Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes to read, (expressed in hexadecimal). SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Writing Scripts 33 Writing Scripts www.ti.com For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x30, starting at a register address of 0x03, the user writes: #example script I i2cfast w 30 03 AA 55 r 30 03 02 This script begins with a comment, specifies that a fast I2C bus will be used, then writes 0xAA 0x55 to the I2C slave device at address 0x30, writing the values into registers 0x03 and 0x04. The script then reads back two bytes from the same device starting at register address 0x03. Note that the slave device value does not change. It is unnecessary to set the R/W bit for I2C devices in the script; the read or write commands does that. If extensive repeated write commands are sent and commenting is desired for a group of bytes, the > command can be used to extend the bytes to other lines that follow. A usage example for the > command follows: #example script for '>' command I i2cfast # Write AA and BB to registers 3 and 4, respectively w 30 03 AA BB # Write CC, DD, EE and FF to registers 5, 6, 7 and 8, respectively > CC DD EE FF # Place a commented breakpoint b "AA BB CC DD EE FF was written, starting at register 3" # Read back all six registers, starting at register 3 r 30 03 06 The following example demonstrates usage of the Wait for Flag command, f: I # w # w # f i2cfast Switch to Page 44 30 00 2C Switch buffers 30 01 05 Wait for bit D0 to clear. 'x' denotes a don't care. 30 01 xxxxxxx0 Any text editor can be used to write these scripts; Jedit is an editor that is highly recommended for general usage. For more information, go to: http://www.jedit.org. Once the script is written, it can be used in the command window by running the program, and then selecting Open Script File... from the File menu. Locate the script and open it. The script is then displayed in the command buffer. The user can also edit the script once it is in the buffer and save it by selecting Save Script File... from the File menu. Once the script is in the command buffer, it can be executed by pressing the Execute Command Buffer button. If there are breakpoints in the script, the script executes to that point, and the user is presented with a dialog box with a button to press to continue executing the script. When ready to proceed, push that button and the script continues. 34 Writing Scripts SLAU317A – May 2010 – Revised October 2012 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Evaluation Board/Kit Important Notice Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. 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