TPS53625RSMR

TPS53625 ZHCSQF5 – JUNE 2022 TPS53625 适用于 VR12.0 VCPU 的两相 D-CAP+™ 降压控制器 1 特性 • • • • • • • • • • • • • • 3 说明 符合 VR12.0 串行 VID (SVID) 标准 单相或两相运行 支持零负载和非零负载线路应用 8 位 DAC 输出范围：0.25 V 至 1.52 V 优化了轻负载和重负载条件下的效率 8 级独立的过冲衰减 (OSR) 和下冲衰减 (USR) 无驱动器配置，有助于实现高效的高频开关 支持分立式、电源块、功率级或 DrMOS MOSFET 实施 精确可调电压定位 300kHz 至 1MHz 的频率选择 获得专利的 AutoBalance 相位平衡 可选 8 级电流限制 4.5V 至 28V 转换电压范围 小型 4mm × 4mm 32 引脚 VQFN PowerPAD™ 集 成电路封装 2 应用 TPS53625 器件是一款无驱动器、完全符合 SVID 标准 的 VR12.0 降压控制器。高级控制特性（例如 D-CAP+ 架构）借助重叠脉冲支持下冲衰减 (USR) 和过冲衰减 (OSR)，可提供快速瞬态响应、最低输出电容和高效 率。TPS53625 器件还支持在 CCM 或 DCM 运行情况 下进行单相运行，从而提高轻负载情况下的效率。 TPS53625 器件集成了完整的 VR12.0 I/O 功能，包括 VR_READY (PGOOD)、ALERT 和 VR_HOT。SVID 接口地址允许在 0 到 7 的时间范围内进行编程。VOUT 压摆率和电压定位的可调节控制完善了 VR12.0 功能。 与 TPS51604 FET 栅极驱动器配合使用时，该解决方 案可提供超高速度和低开关损耗。TPS53625 器件与选 定的 TI 功率级产品以及 DrMOS 产品一起使用，可实 现出色效率。TPS53625 器件以 1V 的默认启动电压运 行。通过在设计中添加一个外部电阻分压器，应用可以 覆盖默认启动电压。 TPS53625 器件采用节省空间的热增强型 32 引脚 VQFN 封装，可在 –40°C 到 105°C 温度下运行。 • 内核存储器 (1) 器件型号(1) 封装 封装尺寸（标称值） TPS53625 VQFN (32) 4.00mm × 4.00mm 要了解所有可用封装，请参阅文档末尾的可订购产品附录。 TPS53625 TPS51604 Drive Power Block TPS51604 Drive Power Block PWM1 SVID BUS PWM2 SKIP 图 3-1. 简化版原理图 本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。 English Data Sheet: SLUSEW7 TPS53625 www.ti.com.cn ZHCSQF5 – JUNE 2022 Table of Contents 1 特性................................................................................... 1 2 应用................................................................................... 1 3 说明................................................................................... 1 4 Revision History.............................................................. 2 5 Device and Documentation Support..............................3 5.1 接收文档更新通知....................................................... 3 5.2 支持资源......................................................................3 5.3 Trademarks................................................................. 3 5.4 Electrostatic Discharge Caution..................................3 5.5 术语表......................................................................... 3 6 Mechanical, Packaging, and Orderable Information.... 3 4 Revision History 2 DATE REVISION NOTES June 2022 * Initial release Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53625 TPS53625 www.ti.com.cn ZHCSQF5 – JUNE 2022 5 Device and Documentation Support 5.1 接收文档更新通知 要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更 改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。 5.2 支持资源 TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解 答或提出自己的问题可获得所需的快速设计帮助。 链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI 的《使用条款》。 5.3 Trademarks D-CAP+™, PowerPAD™, and TI E2E™ are trademarks of Texas Instruments. 所有商标均为其各自所有者的财产。 5.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.5 术语表 TI 术语表 本术语表列出并解释了术语、首字母缩略词和定义。 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53625 3 PACKAGE OPTION ADDENDUM www.ti.com 13-Apr-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS53625RSMR ACTIVE VQFN RSM 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS 53625 TPS53625RSMT ACTIVE VQFN RSM 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS 53625 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of