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TPS60400-Q1, TPS60401-Q1, TPS60402-Q1, TPS60403-Q1
SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
TPS6040x-Q1 Unregulated 60-mA Charge Pump Voltage Inverter
1 Features
3 Description
•
•
The TPS6040x-Q1 family of devices generate an
unregulated negative output voltage from an input
voltage ranging from 1.8 V to 5.25 V. The devices are
typically supplied by a preregulated supply rail of 5 V
or 3.3 V. Due to its wide-input voltage range, two or
three NiCd, NiMH, or alkaline battery cells, as well as
one Li-Ion cell, can also power them.
1
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Test Guidance With the Following
Results:
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C6
Inverts Input Supply Voltage
Up to 60-mA Output Current
Only Three Small 1-µF Ceramic Capacitors
Needed
Input Voltage Range From 1.8 V to 5.25 V
PowerSave-Mode for Improved Efficiency at Low
Output Currents (TPS60400-Q1)
Device Quiescent Current Typical: 100 µA
Integrated Active Schottky-Diode for Start-Up Into
Load
Small 5-Pin SOT23 Package
Evaluation Module Available: TPS60400EVM-178
Only three external 1-μF capacitors are required to
build a complete DC-DC charge pump inverter.
Assembled in a 5-pin SOT-23 package, the complete
converter can be built on a 50-mm2 board area.
Replacing the Schottky diode typically needed for
start-up into load with integrated circuitry can achieve
additional board area and component count
reduction.
The TPS6040x-Q1 can deliver a maximum output
current of 60 mA, with a typical conversion efficiency
of greater than 90% over a wide output current range.
Three device options TPS60401/2/3-Q1 with 20-kHz,
50-kHz, and 250-kHz fixed frequency operation are
available. TPS60400-Q1 device comes with a
variable switching frequency to reduce operating
current in applications with a wide load range and
enables the design with low-value capacitors.
2 Applications
•
•
•
•
Device Information(1)
Automotive Infotainment
Automotive Cluster
LCD Displays
Negative Supply Voltages
Typical Application Circuit
C (fly)
PART NUMBER
PACKAGE
TPS6040x-Q1
BODY SIZE (NOM)
SOT-23 (5)
2.80 mm × 2.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Output Voltage vs Input Voltage
1 µF
0
C FLY−
Input
1.8 V to 5.25 V
2
CI
1 µF
I O = 60 mA
5
C FLY+
TPS60400-Q1
IN
OUT
GND
4
1
CO
1 µF
Output
−1.6 V to −5 V,
Max 60 mA
Copyright © 2016, Texas Instruments Incorporated
VO − Output Voltage − V
3
I O = 30 mA
−1
I O = 1 mA
−2
−3
−4
TA = 25°C
−5
0
1
2
3
4
5
VI − Input Voltage − V
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS60400-Q1, TPS60401-Q1, TPS60402-Q1, TPS60403-Q1
SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
3
7.1
7.2
7.3
7.4
7.5
7.6
3
4
4
4
4
5
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
9
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Applications ................................................ 13
9.3 System Examples ................................................... 15
10 Power Supply Recommendations ..................... 21
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 22
12.1
12.2
12.3
12.4
12.5
12.6
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
22
22
22
22
22
22
13 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
Changes from Revision A (June 2008) to Revision B
Page
•
Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
•
Changed TPS6040x to TPS6040x-Q1 throughout document ............................................................................................... 1
•
Added AEC-Q100 Test Guidance bullets ............................................................................................................................... 1
•
Changed Input voltage range throughout document to 1.8 V to 5.25 V................................................................................. 1
•
Changed input voltage 5.5 V to 5.25 V. ................................................................................................................................. 1
•
Added device options TPS60401/2/3-Q1 .............................................................................................................................. 1
•
Deleted Available Options table and moved device family products section and renamed to Device Comparison Table .... 3
•
Changed reference to Thermal Information .......................................................................................................................... 3
•
Deleted Machine model (MM) from ESD Ratings table.......................................................................................................... 4
•
Added table note to reference values .................................................................................................................................... 4
•
Deleted Dissipation Ratings section and replaced with Thermal Information table ............................................................... 5
•
Changed Figure 1 and Figure 2 Output Current limit to 60 mA ............................................................................................ 6
•
Split equation (1) into two separate numbered equations ................................................................................................... 11
•
Moved equation definitions to corresponding equation ....................................................................................................... 11
•
Deleted Voltage Inverter title ............................................................................................................................................... 13
•
Deleted Table 4 and Table 5 manufacturer part information ............................................................................................... 13
•
Moved Figure 21 and 22 to Application Curves section....................................................................................................... 15
2
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SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
5 Device Comparison Table
PART NUMBER
TYPICAL FLYING CAPACITOR (µF)
TPS60400-Q1
1
Variable switching frequency 50 kHz to 250 kHz
FEATURE
TPS60401-Q1
10
Fixed frequency 20 kHz
TPS60402-Q1
3.3
Fixed frequency 50 kHz
TPS60403-Q1
1
Fixed frequency 250 kHz
6 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
C
OUT
1
IN
2
FLY–
3
5
C
4
GND
FLY+
Not to scale
Pin Functions
PIN
NAME
NO.
CFLY+
5
CFLY–
GND
I/O
DESCRIPTION
I
Positive terminal of the flying capacitor C(fly)
3
I
Negative terminal of the flying capacitor C(fly)
4
GND
Ground
IN
2
PWR
Supply input. Connect to an input supply in the 1.8-V to 5.25-V range.
Bypass IN to GND with a capacitor that has the same value as the flying capacitor.
OUT
1
O
Power output with VO = –VI
Bypass OUT to GND with the output filter capacitor CO.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
–0.3
5.5
OUT to GND
–5
0.3
CFLY– to GND
0.3
VO – 0.3
–0.3
VI + 0.3
IN to GND
Voltage range
CFLY+ to GND
Continuous power dissipation
Maximum junction temperature, TJ
(1)
V
See Thermal Information
Continuous output current
Storage temperature, Tstg
UNIT
–55
80
mA
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2004–2016, Texas Instruments Incorporated
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SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
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7.2 ESD Ratings
VALUE
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002 (1)
±2000
Charged-device model (CDM), per AEC Q100-011
±1000
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
VI
Input voltage
IO
Output current at OUT
CI
Input capacitor
C(fly)
Flying capacitor
1
CO
Output capacitor
1
TJ
Operating junction temperature
(1)
1.8
MAX
UNIT
5.25
V
60
0
C(fly) (1)
mA
µF
µF
–40
100
µF
125
°C
Refer to Device Comparison Table for Cfly values
7.4 Thermal Information
TPS6040x-Q1
THERMAL METRIC (1)
DBV (SOT-25)
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
221.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
81.9
°C/W
RθJB
Junction-to-board thermal resistance
39.8
°C/W
ψJT
Junction-to-top characterization parameter
3.3
°C/W
ψJB
Junction-to-board characterization parameter
38.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics.
7.5 Electrical Characteristics
CI = C(fly) = CO (according to Table 2), TJ = –40°C to 125°C, and VI = 5 V over recommended operating free-air temperature
range (unless otherwise noted)
PARAMETER
VI
Supply voltage range
IO
Maximum output current at VO
VO
Output voltage
VP–P
4
TEST CONDITIONS
MIN
At TJ = –40°C to 125°C, RL = 5 kΩ
1.8
At TC ≥ 0°C, RL = 5 kΩ
1.6
TYP
5.25
60
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IO = 5 mA
UNIT
V
mA
–VI
Output voltage ripple
MAX
TPS60400-Q1,
C(fly) = 1 µF, CO = 2.2 µF
35
TPS60401-Q1,
C(fly) = CO = 10 µF
20
TPS60402-Q1,
C(fly) = CO = 3.3 µF
20
TPS60403-Q1,
C(fly) = CO = 1 µF
15
V
mVP–P
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SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
Electrical Characteristics (continued)
CI = C(fly) = CO (according to Table 2), TJ = –40°C to 125°C, and VI = 5 V over recommended operating free-air temperature
range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
125
270
TPS60401-Q1
65
190
TPS60402-Q1
120
270
TPS60403-Q1
425
700
TPS60400-Q1
VI = 5 V
IQ
Quiescent current
(no-load input current)
TJ = 60°C,
VI = 5 V
fOSC
Internal switching frequency
Impedance at 25°C, VI = 5 V
TPS60400-Q1
210
TPS60401-Q1
135
TPS60402-Q1
210
TPS60403-Q1
640
TPS60400-Q1, VCO version
25
50 to 250
375
TPS60401-Q1
10
20
30
TPS60402-Q1
25
50
75
TPS60403-Q1
115
250
325
TPS60400-Q1, CI = C(fly) = CO = 1 µF
12
15
TPS60401-Q1, CI = C(fly) = CO = 10 µF
12
15
TPS60402-Q1, CI = C(fly) = CO = 3.3 µF
12
15
TPS60403-Q1, CI = C(fly) = CO = 1 µF
12
15
UNIT
µA
kHz
Ω
7.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
η
Efficiency
vs Output current at 3.3 V and 5 V (TPS6040x-Q1)
Figure 1, Figure 2
II
Input current
vs Output current (TPS6040x-Q1)
Figure 3, Figure 4
IS
Supply current
vs Input voltage (TPS6040x-Q1)
Figure 5, Figure 6
Output resistance
vs Input voltage at –40°C, 0°C, 25°C, 85°C
CI = C(fly) = CO = 1 µF (TPS60400-Q1)
CI = C(fly) = CO = 10 µF (TPS60401-Q1)
CI = C(fly) = CO = 3.3 µF (TPS60402-Q1)
CI = C(fly) = CO = 1 µF (TPS60403-Q1)
Figure 7, Figure 8,
Figure 9, Figure 10
VO
Output voltage
vs Output current at 25°C, VIN = 1.8 V, 2.5 V, 3.3 V, 5 V
CI = C(fly) = CO = 1 µF (TPS60400-Q1)
CI = C(fly) = CO = 10 µF (TPS60401-Q1)
CI = C(fly) = CO = 3.3 µF (TPS60402-Q1)
CI = C(fly) = CO = 1 µF (TPS60403-Q1)
Figure 11, Figure 12,
Figure 13, Figure 14
fOSC
Oscillator frequency
vs Temperature at VI = 1.8 V, 2.5 V, 3.3 V, 5 V (TPS6040x-Q1)
Figure 15, Figure 16,
Figure 17, Figure 18
vs Output current TPS60400 at 2 V, 3.3 V, 5 V
Output ripple and noise
VI = 5
VI = 5
VI = 5
VI = 5
Copyright © 2004–2016, Texas Instruments Incorporated
V, IO = 30
V, IO = 30
V, IO = 30
V, IO = 30
mA,
mA,
mA,
mA,
Figure 19
CI = C(fly) = CO = 1 µF (TPS60400-Q1)
CI = C(fly) = CO = 10 µF (TPS60401-Q1)
CI = C(fly) = CO = 3.3 µF (TPS60402-Q1)
CI = C(fly) = CO = 1 µF (TPS60403-Q1)
Figure 24, Figure 25
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SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
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100
100
TPS60401-Q1
VI = 5 V
95
TPS60401-Q1
V I = 3.3 V
90
90
TPS60400-Q1
VI = 5 V
TPS60400-Q1
V I = 3.3 V
80
TPS60403-Q1
VI = 5 V
85
Efficiency – %
85
Efficiency – %
TPS60402-Q1
VI = 5 V
95
75
TPS60402-Q1
V I = 3.3 V
75
70
70
65
65
60
TPS60403-Q1
V I = 3.3 V
80
60
0
10
20
30
40
50
60
0
10
20
I O – Output Current – mA
30
40
50
60
I O – Output Current – mA
Figure 1. TPS60400-Q1, TPS60401-Q1
Efficiency vs Output Current
Figure 2. TPS60402-Q1, TPS60403-Q1
Efficiency vs Output Current
100
100
TA = 25 °C
TA = 25 °C
TPS60400-Q1
VI = 5 V
TPS60401-Q1
VI = 5 V
I I – Input Current – mA
I I – Input Current – mA
TPS60403-Q1
VI = 5 V
10
10
TPS60401-Q1
VI = 2 V
1
TPS60403-Q1
VI = 2 V
1
TPS60402-Q1
VI = 5 V
TPS60402-Q1
VI = 2 V
TPS60400-Q1
VI = 2 V
0.1
0.1
1
10
0.1
0.1
100
1
10
Figure 3. TPS60400-Q1, TPS60401-Q1
Input Current vs Output Current
Figure 4. TPS60402-Q1, TPS60403-Q1
Input Current vs Output Current
0.6
0.6
I O = 0 mA
TA = 25 °C
I DD – Supply Current – mA
I O = 0 mA
TA = 25 °C
I DD – Supply Current – mA
100
I O – Output Current – mA
I O – Output Current – mA
0.4
0.2
0.4
TPS60403-Q1
0.2
TPS60400-Q1
TPS60402-Q1
TPS60401-Q1
0
0
1
2
3
4
V I – Input Voltage – V
Figure 5. TPS60400-Q1, TPS60401-Q1
Supply Current vs Input Voltage
6
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0
5
0
1
2
3
4
5
V I – Input Voltage – V
Figure 6. TPS60402-Q1, TPS60403-Q1
Supply Current vs Input Voltage
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SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
40
40
I O = 30 mA
C I = C (fly) = C O = 1 µF
30
30
25
25
TA = 85 °C
20
TA = 25 °C
15
I O = 30 mA
C I = C (fly) = C O = 10 µF
35
r o – Output Resistance – W
r o – Output Resistance – W
35
10
20
TA = 25 °C
TA = 85 °C
15
10
5
5
TA = –40 °C
TA = –40 °C
0
1
2
3
4
V I – Input Voltage – V
5
0
6
1
4
5
6
Figure 8. TPS60401-Q1 Output Resistance
vs Input Voltage
40
40
I O = 30 mA
C I = C (fly) = C O = 3.3 µF
35
I O = 30 mA
C I = C (fly) = C O = 1 µF
35
30
30
r o – Output Resistance – W
r o – Output Resistance – W
3
V I – Input Voltage – V
Figure 7. TPS60400-Q1 Output Resistance
vs Input Voltage
25
TA = 25 °C
20
TA = 85 °C
15
10
TA = –40 °C
5
25
20
TA = 25 °C
TA = 85 °C
15
10
5
0
TA = –40 °C
0
1
2
3
4
V I – Input V oltage – V
5
1
6
2
3
4
5
6
V I – Input Voltage – V
Figure 9. TPS60402-Q1 Output Resistance
vs Input Voltage
Figure 10. TPS60403-Q1 Output Resistance
vs Input Voltage
0
0
TA = 25 °C
–1
TA = 25 °C
–1
V I = 1.8 V
V I = 1.8 V
V I = 2.5 V
–2
VO – Output V oltage – V
VO – Output V oltage – V
2
–3
V I = 3.3 V
–4
VI = 5 V
–5
V I = 2.5 V
–2
V I = 3.3 V
–3
–4
VI = 5 V
–5
–6
–6
0
10
20
30
40
50
60
I O – Output Current – mA
Figure 11. TPS60400-Q1 Output Voltage
vs Output Current
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0
10
20
30
40
50
60
I O – Output Current – mA
Figure 12. TPS60401-Q1 Output Voltage
vs Output Current
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0
0
TA = 25 °C
TA = 25 °C
–1
–1
V I = 1.8 V
V I = 2.5 V
–2
VO – Output V oltage – V
VO – Output V oltage – V
V I = 1.8 V
V I = 3.3 V
–3
–4
VI = 5 V
V I = 2.5 V
–2
V I = 3.3 V
–3
–4
VI = 5 V
–5
–5
–6
–6
0
10
20
30
40
50
0
60
10
Figure 13. TPS60402-Q1 Output Voltage
vs Output Current
30
40
50
60
Figure 14. TPS60403-Q1 Output Voltage
vs Output Current
24
250
I O = 10 mA
23.8
V I = 1.8 V
150
V I = 2.5 V
V I = 3.3 V
100
VI = 5 V
50
I O = 10 mA
23.6
f osc – Oscillator Frequency – kHz
200
f osc – Oscillator Frequency – kHz
20
I O – Output Current – mA
I O – Output Current – mA
V I = 3.3 V
23.4
VI = 5 V
23.2
23
V I = 2.5 V
22.8
22.6
V I = 1.8 V
22.4
22.2
0
–40 –30 –20 –10 0
10
22
–40 –30 –20 –10 0
20 30 40 50 60 70 80 90
TA – Free-Air Temperature – °C
Figure 15. TPS60400-Q1 Oscillator Frequency
vs Free-Air Temperature
Figure 16. TPS60401-Q1 Oscillator Frequency
vs Free-Air Temperature
250
57
VI = 5 V
I O = 10 mA
240
56
V I = 3.3 V
55
54
V I = 2.5 V
53
V I = 3.3 V
230
52
V I = 1.8 V
51
50
f osc – Oscillator Frequency – kHz
f osc – Oscillator Frequency – kHz
VI = 5 V
V I = 2.5 V
220
210
V I = 1.8 V
200
190
180
170
I O = 10 mA
160
49
–40 –30 –20 –10 0
10 20 30 40 50 60 70 80 90
TA – Free-Air Temperature – °C
Figure 17. TPS60402-Q1 Oscillator Frequency
vs Free-Air Temperature
8
10 20 30 40 50 60 70 80 90
TA – Free-Air T emperature – °C
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150
–40 –30 –20 –10 0
10 20 30 40 50 60 70 80 90
TA – Free-Air Temperature – °C
Figure 18. TPS60403-Q1 Oscillator Frequency
vs Free-Air Temperature
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SGLS246B – JUNE 2004 – REVISED OCTOBER 2016
300
TA = 25°C
V I = 3.3 V
250
f osc – Oscillator Frequency – kHz
V I = 1.8 V
200
VI = 5 V
150
100
50
0
0
10
20
30
40
50
60
70
80
90 100
I O – Output Current – mA
Figure 19. TPS60400-Q1 Oscillator Frequency
vs Output Current
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8 Detailed Description
8.1 Overview
The TPS6040x-Q1 charge pumps invert the voltage applied to their input. For the highest performance, use low
equivalent series resistance (ESR) capacitors (for example, ceramic). During the first half-cycle, switches S2 and
S4 open, switches S1 and S3 close, and capacitor (C(fly)) charges to the voltage at VI. During the second halfcycle, S1 and S3 open, and S2 and S4 close. This connects the positive terminal of C(fly) to GND and the
negative to VO. By connecting C(fly) in parallel, CO is charged negative. The actual voltage at the output is more
positive than −VI, since switches S1–S4 have resistance and the load drains charge from CO.
VI
S1
C (fly)
S4
+
VO (-VI )
1 µF
S2
CO
1 µF
S3
GND
GND
Figure 20. Operating Principle
8.2 Functional Block Diagram
I
V I – VCFL Y+ < 0.5 V
VI
MEAS
R
Start
FF
VI < 1 V
V O > V be
Q
DC_ Startup
VI
S
VO
Q1
VO
MEAS
OSC
CHG
OSC
Q
+
Phase
Generator
Q
50 kHz
Q2
B
Q3
V O > –1 V
VI
VO
Q4
C (fly)
Q5
GND
VO
DC_ Startup
VCO_CONT
VI / V O
MEAS
V O < –V I – V be
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8.3 Feature Description
8.3.1 Charge-Pump Output Resistance
The TPS6040x-Q1 devices are not voltage regulators. The output source resistance of the charge pumps is
approximately 15 Ω at room temperature (with VI = 5 V), and VO approaches –5 V when lightly loaded. VO will
droop toward GND as load current increases as seen in Equation 1.
VO = -(VI - RO ´ IO )
RO
(1)
1
»
+ 4 (2 ´ R SWITCH + ESR CFLY ) + ESR CO
ƒosc ´ C(fly)
where
•
•
•
RO = output resistance of the converter
RSWITCH = resistance of a single MOSFET-switch inside the converter
fOSC = oscillator frequency
(2)
8.3.2 Efficiency Considerations
The power efficiency of a switched-capacitor voltage converter is affected by three factors: the internal losses in
the converter IC, the resistive losses of the capacitors, and the conversion losses during charge transfer between
the capacitors. The internal losses are associated with the internal functions of the ICs, such as driving the
switches, oscillator, and so forth. These losses are affected by operating conditions such as input voltage,
temperature, and frequency. The next two losses are associated with the voltage converter circuit’s output
resistance. Switch losses occur because of the on-resistance of the MOSFET switches in the IC. Charge-pump
capacitor losses occur because of their ESR. The relationship between these losses and the output resistance is
Equation 3.
PCAPACITOR LOSSES + PCONVERSION LOSSES = IO 2 ´ R O
(3)
The first term is the effective resistance from an ideal switched-capacitor circuit. Conversion losses occur during
the charge transfer between C(fly) and CO when there is a voltage difference between them. The power loss is
Equation 4.
1
é1
ù
PCONV.LOSS = ê ´ C(flY) (VI2 - VO2 ) + CO (VRIPPLE2 - 2VO VRIPPLE )ú ´ ƒosc
2
ë2
û
(4)
The efficiency of the TPS6040x-Q1 devices is dominated by their quiescent supply current at low output current
and by their output impedance at higher current (see Equation 5).
h=
IO
IO + IQ
æ IO ´ RO ö
ç1 ÷
VI ø
è
where
•
IQ = quiescent current
(5)
8.4 Device Functional Modes
8.4.1 Active-Schottky Diode
For a short period of time, when the input voltage is applied, but the inverter is not yet working, the output
capacitor is charged positive by the load. To prevent the output being pulled above GND, a Schottky diode must
be added in parallel to the output. The function of this diode is integrated into the TPS6040x-Q1 devices, which
gives a defined startup performance and saves board space.
A current sink and a diode in series can approximate the behavior of a typical, modern operational amplifier.
Figure 21 shows the current into this typical load at a given voltage. The TPS6040x-Q1 devices are optimized to
start into these loads.
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Device Functional Modes (continued)
VI
C (fly)
5
C1+
1 µF
+V
Typical
Load
3
−V
C1−
TPS60400-Q1
2
OUT
IN
CI
1 µF
V O (−V I )
1
CO
1 µF
GND
4
GND
IO
Copyright © 2016, Texas Instruments Incorporated
Figure 21. Typical Load
Load Current
60 mA
0.4 V
25 mA
0.4 V 1.25 V
5V
Voltage at the Load
Figure 22. Maximum Start-Up Current
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS6040x-Q1 family of devices generate an unregulated negative output voltage from an input voltage
ranging from 1.8 V to 5.25 V.
9.2 Typical Applications
The most common application for these devices is a charge-pump voltage inverter (see Figure 23). This
application requires only two external components; capacitors C(fly) and CO, plus a bypass capacitor, if
necessary. See Capacitor Selection for suggested capacitor types.
C (fly)
2
Input 5 V
CI
1 µF
IN
1 µF
3
5
C1−
C1+
TPS60400-Q1
OUT
GND
4
1
CO
1 µF
−5 V,
Max 60 mA
Copyright © 2016, Texas Instruments Incorporated
Figure 23. Typical Operating Circuit
9.2.1 Design Requirements
The TPS6040x-Q1 is connected to generate a negative output voltage with 60-mA maximum load, from a
positive input voltage between 1.8 V and 5.25 V.
9.2.2 Detailed Design Procedure
For the maximum output current and best performance, three ceramic capacitors of 1 μF (TPS60400-Q1,
TPS60403-Q1) are recommended. For lower currents or higher allowed output voltage ripple, other capacitors
can also be used. TI recommends the output capacitors has a minimum value of 1 μF. With flying capacitors
lower than 1 μF, the maximum output power will decrease.
9.2.2.1 Capacitor Selection
To maintain the lowest output resistance, use capacitors with low ESR (see Table 2). The charge-pump output
resistance is a function of the ESR of C(fly) and CO. Therefore, minimizing the ESR of the charge-pump capacitor
minimizes the total output resistance. The capacitor values are closely linked to the required output current and
the output noise and ripple requirements. It is possible to only use 1-μF capacitors of the same type. Ceramic
capacitors will provide the lowest output voltage ripple because they typically have the lowest ESR-rating.
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Table 2. Recommended Capacitor Values
DEVICE
VI [V]
IO [mA]
CI [µF]
C(fly) [µF]
CO [µF]
TPS60400
1.8 to 5.25
60
1
1
1
TPS60401
1.8 to 5.25
60
10
10
10
TPS60402
1.8 to 5.25
60
3.3
3.3
3.3
TPS60403
1.8 to 5.25
60
1
1
1
9.2.2.2 Input Capacitor (CI)
Bypass the incoming supply to reduce AC impedance and the impact of the TPS6040x-Q1 switching noise. The
recommended bypassing depends on the circuit configuration and where the load is connected. When the
inverter is loaded from OUT to GND, current from the supply switches between 2 × IO and zero. Therefore, use a
large bypass capacitor (for example, equal to the value of C(fly)) if the supply has high AC impedance. When the
inverter is loaded from IN to OUT, the circuit draws 2 × IO constantly, except for short switching spikes. A 0.1-μF
bypass capacitor is sufficient.
9.2.2.3 Flying Capacitor (C(fly))
Increasing the flying capacitor’s size reduces the output resistance. Small values increases the output resistance.
Above a certain point, increasing the capacitance of C(fly) has a negligible effect, because the output resistance
becomes dominated by the internal switch resistance and capacitor ESR.
9.2.2.4 Output Capacitor (CO)
Increasing the output capacitor’s size reduces the output ripple voltage. Decreasing its ESR reduces both output
resistance and ripple. Smaller capacitance values can be used with light loads if higher output ripple can be
tolerated. Use Equation 6 to calculate the peak-to-peak ripple.
IO
VO(ripple) =
+ 2 ´ IO ´ ESRCO
fosc ´ CO
(6)
9.2.2.5 Power Dissipation
As given in Thermal Information, the thermal resistance of the unsoldered package is RθJA = 221.2°C/W.
Soldered on the EVM, a typical thermal resistance of RθJA(EVM) = 180°C/W was measured. The terminal
resistance can be calculated using Equation 7.
T - TA
RqJA = J
PD
where
•
•
•
TJ is the junction temperature
TA is the ambient temperature
PD is the power that needs to be dissipated by the device
(7)
The maximum power dissipation can be calculated using Equation 8.
PD = VI × II – VO × IO = VI(max) × (IO + I(SUPPLY)) – VO × IO
(8)
The maximum power dissipation happens with maximum input voltage and maximum output current.
At maximum load the supply current is 0.7 mA maximum (see Equation 9).
PD = 5 V × (60 mA + 0.7 mA) – 4.4 V × 60 mA = 40 mW
(9)
With this maximum rating and the thermal resistance of the device on the EVM, the maximum temperature rise
above ambient temperature can be calculated using Equation 10.
ΔTJ = RθJA × PD = 180°C/W × 40 mW = 7.2°C
(10)
This means that the internal dissipation increases TJ by < 10°C.
The junction temperature of the device shall not exceed 125°C.
This means the device can easily be used at ambient temperatures up to Equation 11.
TA - TJ(max) – ΔTJ - 125°C/W – 10°C = 115°C
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(11)
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9.2.3 Application Curves
VI = 5 V
I O = 30 mA
TPS60400-Q1
VO – Output Voltage – mV
VO – Output Voltage – mV
VI = 5 V
I O = 30 mA
100 mV/DIV
TPS60403-Q1
50 mV/DIV
TPS60401-Q1
50 mV/DIV
TPS60402-Q1
50 mV/DIV
4 µs/DIV
20 µs/DIV
t – Time – µs
t – T ime – µs
Figure 24. TPS60400-Q1, TPS60403-Q1
Output Voltage vs Time
Figure 25. TPS60401-Q1, TPS60402-Q1
Output Voltage vs Time
9.3 System Examples
9.3.1 RC-Post Filter
To reduce the output voltage ripple a RC-post filter can be used (Figure 26).
VI
C (fl y )
1
2
3
OUT
1 µF
C1+
5
TPS60400-Q1
IN
C1–
CI
1 µF
GND
GND
4
RP
V O (–V I )
CO
1 µF
CP
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 26. TPS60400 and TPS60401 With RC-Post Filter
An output filter can easily be formed with a resistor (RP) and a capacitor (CP). Cutoff frequency is given by
Equation 12.
1
ƒc =
2pRP CP
(12)
The ratio VO/VOUT is determined by Equation 13.
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System Examples (continued)
VO
1
=
VOUT
1 + (2pƒRP CP )2
with RP = 50 W,CP = 0.1 mF and f = 250 kHz :
VO
= 0.125
VOUT
(13)
The formula refers only to the relation between output and input of the ac ripple voltages of the filter.
9.3.2 LC-Post Filter
To reduce the output voltage ripple, an LC-post filter can be used.
Figure 27 shows a configuration with a LC-post filter to further reduce output ripple and noise.
VI
C (fly)
1
2
3
OUT
1 µF
C1+
5
V OUT
TPS60400-Q1
IN
C1–
GND
LP
4
CI
1 µF
V O (–V I )
CO
1 µF
CP
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 27. LC-Post Filter
Table 3 contains the typical measurement results using the TPS60400-Q1 device.
Table 3. Measurement Results on the TPS60400-Q1 (Typical)
VI
[V]
IO(2)
[mA]
CI
[µF]
CERAMIC
C(fly)
[µF]
CERAMIC
CO
[µF]
CERAMIC
5
60
1
1
1
5
60
1
1
2.2
5
60
1
1
1
5
60
1
1
1
5
60
1
1
5
60
1
1
LP
[µH]
CP
[µF]
CERAMIC
BW = 500 MHz
VPOUT
VP–P [mV]
BW = 20 MHz
VPOUT
VP–P [mV]
VPOUT
VACeff [mV]
320
240
65
120
240
32
0.1 (X7R)
260
200
58
0.1
0.1 (X7R)
220
200
60
2.2
0.1
0.1 (X7R)
120
100
30
10
0.1
0.1 (X7R)
50
28
8
9.3.3 Rail Splitter
A switched-capacitor voltage inverter can be configured as a high efficiency rail-splitter. This circuit provides a
bipolar power supply that is useful in battery powered systems to supply dual-rail ICs, like operational amplifiers.
Moreover, the SOT23-5 package and associated components require very little board space.
The maximum input voltage between VI and GND in Figure 28 (or between IN and OUT at the device itself) must
not exceed 6.5 V.
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VI
C (fly)
1
2
3
1 µF
OUT
C1+
C3
1 µF
5
TPS60400-Q1
IN
C1-
GND
VO = VI / 2
4
CI
1 µF
CO
1 µF
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 28. TPS60400 as a High-Efficiency Rail Splitter
After power is applied, the flying capacitor (C(fly)) connects alternately across the output capacitors C3 and CO.
This equalizes the voltage on those capacitors and draws current from VI to VO as required to maintain the
output at 1/2 VI.
9.3.4 Combined Doubler/Inverter
The application allows to generate a voltage rail at a level of -Vi as well as 2 x Vi (V(pos)).
In the circuit of Figure 29, capacitors CI, C(fly), and CO form the inverter, while C1 and C2 form the doubler. C1
and C(fly) are the flying capacitors; CO and C2 are the output capacitors. Because both the inverter and doubler
use part of the charge-pump circuit, loading either output causes both outputs to decline toward GND. Make sure
the sum of the currents drawn from the two outputs does not exceed 60 mA. The maximum output current at
V(pos) must not exceed 30 mA. If the negative output is loaded, this current must be further reduced.
I I ≈ –I O + 2 × I O ( PO S)
VI
C (fly)
1 µF
+
C1
1
2
3
+
CI
1 µF
OUT
C1+
D2
5
V (pos)
+
TPS60400-Q1
IN
C1–
GND
–V I
4
+
CO
1 µF
+
C2
GND
GND
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Figure 29. TPS60400-Q1 as Doubler/Inverter
9.3.5 Cascading Devices
Two devices can be cascaded to produce an even larger negative voltage (see Figure 30). The unloaded output
voltage is normally −2 × VI, but this is reduced slightly by the output resistance of the first device multiplied by
the quiescent current of the second. When cascading more than two devices, the output resistance rises
dramatically.
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VI
V O (–2 V I)
C (fly)
1
OUT
C1+
1
5
TPS60400-Q1
2
2
IN
3
+
C (fly)
1 µF
C1–
4
GND
CI
1 µF
3
+
1 µF
OUT
C1+
5
TPS60400-Q1
IN
C1–
GND
4
CO
1 µF
+
CO
1 µF
GND
GND
GND
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Figure 30. Doubling Inverter
9.3.6 Paralleling Devices
Paralleling multiple TPS6040x-Q1s reduces the output resistance. Each device requires its own flying capacitor
(C(fly)), but the output capacitor (CO) serves all devices (see Figure 31). Increase CO’s value by a factor of n,
where n is the number of parallel devices. Equation 2 shows the equation for calculating output resistance.
VI
C (fly)
1
2
3
1 µF
OUT
C1+
C (fly)
5
TPS60400-Q1
2
IN
C1–
GND
1
4
3
OUT
1 µF
C1+
5
TPS60400-Q1
V O (–V I )
IN
C1–
GND
CI
1 µF
4
+
CO
2.2 µF
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 31. Paralleling Devices
9.3.7 Shutting Down the TPS6040x-Q1
If shutdown is necessary, use the circuit in Figure 32. The output resistance of the TPS6040x-Q1 will typically be
15 Ω plus two times the output resistance of the buffer.
Connecting multiple buffers in parallel can reduce the output resistance of the buffer driving the IN pin.
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VI
VO (–V I)
C (fl y )
1
2
SDN
3
OUT
1 µF
5
C1+
TPS60400-Q1
CO
1 µF
IN
C1–
4
GND
CI
1 µF
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 32. Shutdown Control
9.3.8 GaAs Supply
A solution for a –2.7-V/3-mA GaAs bias supply is proposed in Figure 33. The input voltage of 3.3 V is first
inverted with a TPS60403-Q1 and stabilized using a TLV431 low-voltage shunt regulator. Resistor RP with
capacitor CP is used for filtering the output voltage.
RP
V I (3.3 V)
V O (–2.7 V/3 mA)
C (fly )
0.1 µ F
R2
1
OUT
2
C1+
5
CO
TPS60400-Q1
CP
1 µF
IN
TLV431
3
C1–
GND
R1
4
CI
0.1 µ F
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 33. GaAs Supply
A 0.1-μF capacitor was selected for C(fly). By this, the output resistance of the inverter is about 52 Ω.
RPMAX can be calculated using Equation 14.
R1 ö
æ
VO = - ç 1 +
÷ ´ Vref - R1´ II(ref )
R2
è
ø
(14)
A 100-Ω resistor was selected for RP.
The reference voltage across R2 is 1.24 V typical. With 5-μA current for the voltage divider, R2 gets Equation 16
to Equation 17.
(15)
æ V - VO
ö
RPMAX = ç CO
- RO ÷
IO
è
ø
(16)
With: VCO = −3.3 V; VO = −2.7 V; IO = −3 mA
RPMAX = 200 Ω − 52 Ω = 148 Ω
With CP = 1 μF the ratio VO/VI of the RC post filter is Equation 18.
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R2 =
1.24 V
» 250 kW
5 mA
R1 =
2.7 - 1.24 V
» 300 kW
5 mA
www.ti.com
(17)
VO
1
=
» 0.01
VI
1 + (2p125000Hz ´ 100W ´ 1 mF)2
(18)
9.3.9 Step-Down Charge Pump
The application generates an output voltage of 1/2 of the input voltage.
By exchanging GND with OUT (connecting the GND pin with OUT and the OUT pin with GND), a step-down
charge pump can easily be formed. In the first cycle S1 and S3 are closed, and C(fly) with CO in series are
charged. Assuming the same capacitance, the voltage across C(fly) and CO is split equally between the
capacitors. In the second cycle, S2 and S4 close and both capacitors with VI/2 across are connected in parallel.
VI
C (fl y )
VI
1 µF
S1
C (fly)
1
S4
+
VO (-VI )
2
1 µF
S2
CO
1 µF
S3
3
C1+
5
TPS60400-Q1
IN
C1 -
GND
4
CI
1 µF
GND
GND
OUT
VO (VI / 2)
CO
1 µF
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 34. Step-Down Principle
Figure 35. Step-Down Charge Pump Connection
The maximum input voltage between VI and GND in the schematic (or between IN and OUT at the device itself)
must not exceed 5.5 V. For input voltages in the range of 5.5 V to 11 V, an additional Zener-diode is
recommended (see Figure 36).
5V6
VI
C (fly)
1
2
3
CI
1 µF
GND
OUT
1 µF
C1+
5
TPS60400-Q1
IN
C1−
GND
4
VO − V I
CO
1 µF
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 36. Step-Down Charge Pump Connection With Additional Zener Diode
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10 Power Supply Recommendations
The TPS6040x-Q1 device family has no special requirements for its power supply. The power supply output
needs to be rated according to the supply voltage, output voltage and output current of the TPS6040x-Q1.
11 Layout
11.1 Layout Guidelines
Figure 37 shows a PCB layout proposal for a single-layer board. Take care to connect all capacitors as close as
possible to the device to achieve optimized output voltage ripple performance.
11.2 Layout Example
CFLY
CIN
COUT
OUT
IN
GND
U1
Figure 37. Recommended PCB Layout for TPS6040x-Q1 (Top Layer)
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12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS60400-Q1
Click here
Click here
Click here
Click here
Click here
TPS60401-Q1
Click here
Click here
Click here
Click here
Click here
TPS60402-Q1
Click here
Click here
Click here
Click here
Click here
TPS60403-Q1
Click here
Click here
Click here
Click here
Click here
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
22
Submit Documentation Feedback
Copyright © 2004–2016, Texas Instruments Incorporated
Product Folder Links: TPS60400-Q1 TPS60401-Q1 TPS60402-Q1 TPS60403-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Sep-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPS60400QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AWP
Samples
TPS60401QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AWQ
Samples
TPS60402QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AWR
Samples
TPS60403QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AWS
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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