SLLS794 – JUNE 2007
FEATURES
•
•
•
•
•
•
•
•
•
ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 500 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Alternative High-Speed Pin-Compatible Device
(1 Mbit/s) for TRSF3223E
DB, DW, OR PW PACKAGE
(TOP VIEW)
EN
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
1
20
2
3
19
18
4
5
17
16
6
7
15
8
9
13
12
10
11
14
RHL PACKAGE
(TOP VIEW)
The TRS3223E consists of two line drivers, two line
receivers, and a dual charge-pump circuit with
±15-kV ESD protection pin to pin (serial-port
connection pins, including GND). The device meets
the requirements of TIA/EIA-232-F and provides the
electrical interface between an asynchronous
communication controller and the serial-port
connector. The charge pump and four small external
capacitors allow operation from a single 3-V to 5.5-V
supply. The device operates at typical data signaling
rates up to 500 kbit/s and a maximum of 30-V/μs
driver output slew rate.
C1+
N.C.
V+
C1–
C2+
C2–
V–
DOUT2
N.C.
RIN2
24
2
23 VCC
3
4
22 N.C.
21 GND
20 DOUT1
19 RIN1
5
6
8
18 ROUT1
17 FORCEON
9
10
16 DIN1
15 N.C.
7
11
14 DIN2
12
13
INVALID
DESCRIPTION/
ORDERING INFORMATION
1
ROUT2
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
EN
APPLICATIONS
•
•
•
•
•
•
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
FORCEOFF
www.ti.com
TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
N.C. − No internal connection
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 mA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is
used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 μs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than
30 μs. Refer to Figure 4 for receiver input levels.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
ORDERING INFORMATION
TA
PACKAGE
QFN – RHL
SOIC – DW
0°C to 70°C
SSOP – DB
TSSOP – PW
QFN – RHL
SOIC – DW
–40°C to 85°C
SSOP – DB
TSSOP – PW
(1)
(2)
(1) (2)
ORDERABLE PART NUMBER
Reel of 2000
TRS3223ECRHLR
Tube of 25
TRS3223ECDW
Reel of 2000
TRS3223ECDWR
Tube of 70
TRS3223ECDB
Reel of 2000
TRS3223ECDBR
Tube of 70
TRS3223ECPW
Reel of 2000
TRS3223ECPWR
Reel of 2000
TRS3223EIRHLR
Tube of 25
TRS3223EIDW
Reel of 2000
TRS3223EIDWR
Tube of 70
TRS3223EIDB
Reel of 2000
TRS3223EIDBR
Tube of 70
TRS3223EIPW
Reel of 2000
TRS3223EIPWR
TOP-SIDE MARKING
PREVIEW
TRS3223EC
RS23EC
RS23EC
PREVIEW
TRS3223EI
RS23EI
RS23EI
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLES
ABC
EACH DRIVER (1)
INPUTS
DIN
(1)
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
DRIVER STATUS
X
X
L
X
Z
Powered off
L
H
H
X
H
H
H
H
X
L
Normal operation with
auto-powerdown disabled
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER (1)
INPUTS
(1)
2
RIN
EN
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
L
L
X
H
L
X
L
X
H
X
Z
Open
L
No
H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
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H
TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
FORCEOFF
FORCEON
EN
ROUT1
ROUT2
13
17
12
8
20
DOUT1
DOUT2
11
Powerdown
14
INVALID
1
15
16
10
9
RIN1
RIN2
Pin numbers are for the DB, DW, and PW packages.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.3
6
V
V+
Positive-output supply voltage range (2)
–0.3
7
V
0.3
–7
V
13
V
V–
Negative-output supply voltage range
V+ – V–
Supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
(2)
Package thermal impedance (3) (4)
Driver (FORCEOFF, FORCEON, EN)
–0.3
6
Receiver
–25
25
Driver
Receiver (INVALID)
–13.2
13.2
–0.3
VCC + 0.3
DB package
70
DW package
58
PW package
83
RHL package
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
UNIT
V
V
°C/W
PREVIEW
–65
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
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3
TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
Recommended Operating Conditions (1)
See Figure 6
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control
high-level input voltage
DIN, EN, FORCEOFF, FORCEON
VIL
Driver and control
low-level input voltage
DIN, EN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, EN, FORCEOFF, FORCEON
VI
TA
(1)
VCC = 3.3 V
VCC = 5 V
Receiver input voltage
TRS3223EC
Operating free-air temperature
TRS3223EI
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
V
0
5.5
V
–25
25
V
0
70
–40
85
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
II
ICC
(1)
(2)
4
Input leakage
current
Supply current
TEST CONDITIONS
EN, FORCEOFF,
FORCEON
MIN
TYP (2) MAX
±0.01
±1
μA
0.3
1
mA
Auto-powerdown disabled
VCC = 3.3 V or 5 V, TA = 25°C,
No load, FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown enabled
No load, FORCEOFF at VCC, FORCEON at GND,
All RIN are open or grounded
1
10
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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UNIT
μA
TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
UNIT
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND
–5
–5.4
IIH
High-level input current
VI = VCC
±0.01
±1
μA
IIL
Low-level input current
VI at GND
±0.01
±1
μA
±35
±60
mA
IOS
Short-circuit output current (3)
ro
Output resistance
IOZ
(1)
(2)
(3)
Output leakage current
VCC = 3.6 V, VO = 0 V
VCC = 5.5 V, VO = 0 V
VCC, V+, and V– = 0 V, VO = ±2 V
300
V
V
Ω
10M
FORCEOFF = GND, VCC = 3 V to 3.6 V, VO = ±12 V
±25
FORCEOFF = GND, VCC = 4.5 V to 5.5 V, VO = ±12 V
±25
μA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
250
500
kbit/s
100
ns
MAX
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
SR(tr)
Slew rate, transition region
(See Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
(1)
(2)
(3)
UNIT
V/μs
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
IOZ
Output leakage current
EN = VCC
ri
Input resistance
VI = ±3 V to ±25 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.6
1.4
UNIT
V
0.4
VIT+
(1)
(2)
MIN
TEST CONDITIONS
V
V
V
0.5
V
±0.05
μA
5
kΩ
3
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
150
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tsk(p)
Pulse skew (3)
See Figure 3
50
ns
(1)
(2)
(3)
6
TEST CONDITIONS
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT(valid)
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold for
INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = 1 mA,
FORCEOFF = VCC
FORCEON = GND,
VOL
INVALID low-level output voltage
IOL = 1.6 mA,
FORCEOFF = VCC
FORCEON = GND,
MAX
UNIT
2.7
V
V
0.3
V
VCC – 0.6
V
0.4
V
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TYP (1)
UNIT
tvalid
Propagation delay time, low- to high-level output
1
μs
tinvalid
Propagation delay time, high- to low-level output
30
μs
ten
Supply enable time
100
μs
(1)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
3V
FORCEOFF
tTLH
VOH
3V
3V
Output
−3 V
−3 V
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
SR(tr) +
t
THL
6V
or t
TLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0V
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
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TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
GND
S1
RL
3 V or 0 V
Output
CL
(see Note A)
EN
3V
Input
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
VOH
Output
50%
0.3 V
Generator
(see Note B)
1.5 V
50 Ω
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
tPZL
(S1 at VCC)
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
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TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
PARAMETER MEASUREMENT INFORMATION (continued)
2.7 V
EN
50 Ω
0V
−2.7 V
tvalid
50% V CC
50% V CC
0V
ten
INVALID
CL = 30 pF
(see Note A)
≈V+
V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
FORCEOFF
DIN
DOUT
≈V−
V−
TEST CIRCUIT
−3 V
VCC
INVALID
Output
FORCEON
2.7 V
tinvalid
Autopowerdown
3V
0V
Receiver
Input
ROUT
Generator
(see Note B)
2.7 V
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
If Signal Remains Within This Region
for More Than 30 ms, INVALID Is Low †
0V
0.3 V
Indeterminate
2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers
reduces supply current to 1 µA
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
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and
TRS3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS794 – JUNE 2007
APPLICATION INFORMATION
1
EN
2
20
AutoPowerdown
VCC
C1+
FORCEOFF
19
CBYPASS
+
3
C1
V+
GND
18
= 0.1mF
C3 †
4
5
17
C1
16
C2+
DOUT1
RIN1
+
C2
6
15
C2
ROUT1
5 kΩ
7
C4
DOUT2
RIN2
ROUT2
14
V
FORCEON
+
8
13
9
12
10
11
DIN1
DIN2
INVALID
5 kΩ
† C3 can be connected to V
CC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
3.3 V " 0.3 V
C1
0.1 µF
C2, C3, and C4
0.1 µF
5 V " 0.5 V
0.047 µF
0.33 µF
3 V to 5.5 V
0.1 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
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11
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TRS3223ECDB
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
RS23EC
TRS3223ECDBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
RS23EC
TRS3223ECDW
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
0 to 70
TRS3223ECDWG4
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
0 to 70
TRS3223ECDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TRS3223EC
TRS3223ECPW
ACTIVE
TSSOP
PW
20
70
TBD
Call TI
Call TI
0 to 70
RS23EC
TRS3223ECPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
RS23EC
TRS3223EIDB
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RS23EI
TRS3223EIDBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RS23EI
TRS3223EIDWR
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
-40 to 85
TRS3223EIDWRG4
OBSOLETE
SOIC
DW
20
TBD
Call TI
Call TI
-40 to 85
TRS3223EIPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RS23EI
TRS3223EIPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
RS23EI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2016
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TRS3223ECDBR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
TRS3223ECDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
TRS3223ECPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
TRS3223EIDBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
TRS3223EIPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRS3223ECDBR
SSOP
DB
20
2000
367.0
367.0
38.0
TRS3223ECDWR
SOIC
DW
20
2000
367.0
367.0
45.0
TRS3223ECPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
TRS3223EIDBR
SSOP
DB
20
2000
367.0
367.0
38.0
TRS3223EIPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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