TRSF3232CPW

TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER www.ti.com SLLS858 – AUGUST 2007 FEATURES • • • • • • • D, DB, DW, OR PW PACKAGE (TOP VIEW) Operates With 3-V to 5.5-V VCC Supply Operates up to 1 Mbit/s Low Supply Current . . . 300 μA Typ External Capacitors . . . 4 × 0.1 μF Accepts 5-V Logic Input With 3.3-V Supply Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 APPLICATIONS • • • • • • 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 NC − No internal connection Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment DESCRIPTION/ORDERING INFORMATION The TRSF3232 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin-to-pin (serial-port connection pins, including GND). This device provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232 operates at typical data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/μs to 150 V/μs. ORDERING INFORMATION TA PACKAGE ORDERABLE PART NUMBER Tube of 40 TRSF3232CD Reel of 2500 TRSF3232CDR Tube of 25 TRSF3232CDW Reel of 2000 TRSF3232CDWR Tube of 70 TRSF3232CDB Reel of 2000 TRSF3232CDBR Tube of 70 TRSF3232CPW Reel of 2000 TRSF3232CPWR SOIC – D Tube of 40 TRSF3232ID SOIC – DW Reel of 2000 TRSF3232IDR Tube of 25 TRSF3232IDW Reel of 2000 TRSF3232IDWR Tube of 70 TRSF3232IDB Reel of 2000 TRSF3232IDBR Tube of 70 TRSF3232IPW Reel of 2000 TRSF3232IPWR SOIC – D SOIC – DW 0°C to 70°C SSOP – DB TSSOP – PW SOIC – DW –40°C to 85°C SSOP – DB TSSOP – PW (1) (2) (1) (2) TOP-SIDE MARKING TRSF3232C TRSF3232C RT22C RT22C TRSF3232I TRSF3232I RT22I RT22I Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER www.ti.com SLLS858 – AUGUST 2007 FUNCTION TABLES XXX Each Driver (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level Each Receiver (1) (1) INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level Open = input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 9 8 ROUT2 2 RIN2 Submit Documentation Feedback TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER www.ti.com SLLS858 – AUGUST 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive-output supply voltage range (2) –0.3 7 V 0.3 –7 V 13 V V– Negative-output supply voltage range V+ – V– Supply voltage difference (2) VI Input voltage range VO Output voltage range θJA (2) Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) –0.3 6 Receivers –25 25 Drivers Receivers Package thermal impedance (3) (4) TJ Drivers –13.2 13.2 –0.3 VCC + 0.3 D package 82 DB package 46 DW package 57 PW package 108 –65 UNIT V V °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) See Figure 4 MIN NOM MAX UNIT VCC = 3.3 V Supply voltage VCC = 5 V VIH Driver high-level input voltage DIN VIL Driver low-level input voltage DIN Driver input voltage DIN VI TA (1) VCC = 3.3 V VCC = 5 V 3 3.3 3.6 4.5 5 5.5 V 2 V 2.4 0.8 Receiver input voltage TRSF3232C Operating free-air temperature TRSF3232I 0 5.5 –25 25 0 70 –40 85 V V °C Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER ICC (1) (2) Supply current TEST CONDITIONS No load, VCC = 3.3 V or 5 V MIN TYP (2) MAX 0.3 1 UNIT mA Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback 3 TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER www.ti.com SLLS858 – AUGUST 2007 DRIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND ±0.01 IOS Short-circuit output current (3) VO = 0 V ro Output resistance VCC, V+, and V– = 0 V, (1) (2) (3) MAX V V ±1 μA μA ±0.01 ±1 VCC = 3.6 V ±35 ±60 VCC = 5.5 V ±35 ±90 VO = ±2 V 300 UNIT mA Ω 10M Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER MIN TYP (2) TEST CONDITIONS CL = 1000 pF Maximum data rate RL = 3 kΩ, (see Figure 1) One DOUT switching 4 UNIT 250 CL = 250 pF, VCC = 3 V to 4.5 V 1000 CL = 1000 pF, VCC = 4.5 V to 5.5 V 1000 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF, VCC = 3.3 V (1) (2) (3) MAX kbit/s 300 18 Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback ns 150 V/μs TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER www.ti.com SLLS858 – AUGUST 2007 RECEIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) MIN TYP (2) VCC – 0.6 VCC – 0.1 MAX UNIT V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 V V V 0.3 VI = ±3 V to ±25 V 3 5 V 7 kΩ Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3) PARAMETER TEST CONDITIONS TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF 300 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF 300 ns tsk(p) Pulse skew (3) 300 ns (1) (2) (3) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback 5 TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER www.ti.com SLLS858 – AUGUST 2007 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V CL (see Note A) tTHL tTLH 3V 3V Output −3 V −3 V VOH VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr) + t THL 6V or t TLH A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V CL (see Note A) tTHL tTLH 3V 3V Output −3 V −3 V TEST CIRCUIT VOH VOL VOLTAGE WAVEFORMS SR(tr) + t THL 6V or t TLH A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 Submit Documentation Feedback TRSF3232 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER www.ti.com SLLS858 – AUGUST 2007 APPLICATION INFORMATION 1 16 + CBYPASS = 0.1 µF − + C1 VCC C1+ 2 + † − C3 V+ GND 15 − 3 4 14 DOUT1 C1− 13 C2+ + C2 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 − V− 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ † C3 can be connected to VCC or GND. VCC vs CAPACITOR VALUES VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF Figure 4. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) TRSF3232IDWR ACTIVE Package Type Package Pins Package Drawing Qty SOIC DW 16 2000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Op Temp (°C) Device Marking (4/5) -40 to 85 TRSF3232I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TRSF3232IDWR Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 10.75 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.7 2.7 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3232IDWR SOIC DW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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