TRSF3232
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE
LINE DRIVER/RECEIVER
www.ti.com
SLLS858 – AUGUST 2007
FEATURES
•
•
•
•
•
•
•
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
Operates With 3-V to 5.5-V VCC Supply
Operates up to 1 Mbit/s
Low Supply Current . . . 300 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
APPLICATIONS
•
•
•
•
•
•
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
NC − No internal connection
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRSF3232 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin-to-pin (serial-port connection pins, including GND). This device provides the electrical interface
between an asynchronous communication controller and the serial-port connector. The charge pump and four
small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232 operates at typical
data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/μs to 150 V/μs.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE PART NUMBER
Tube of 40
TRSF3232CD
Reel of 2500
TRSF3232CDR
Tube of 25
TRSF3232CDW
Reel of 2000
TRSF3232CDWR
Tube of 70
TRSF3232CDB
Reel of 2000
TRSF3232CDBR
Tube of 70
TRSF3232CPW
Reel of 2000
TRSF3232CPWR
SOIC – D
Tube of 40
TRSF3232ID
SOIC – DW
Reel of 2000
TRSF3232IDR
Tube of 25
TRSF3232IDW
Reel of 2000
TRSF3232IDWR
Tube of 70
TRSF3232IDB
Reel of 2000
TRSF3232IDBR
Tube of 70
TRSF3232IPW
Reel of 2000
TRSF3232IPWR
SOIC – D
SOIC – DW
0°C to 70°C
SSOP – DB
TSSOP – PW
SOIC – DW
–40°C to 85°C
SSOP – DB
TSSOP – PW
(1)
(2)
(1) (2)
TOP-SIDE MARKING
TRSF3232C
TRSF3232C
RT22C
RT22C
TRSF3232I
TRSF3232I
RT22I
RT22I
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TRSF3232
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE
LINE DRIVER/RECEIVER
www.ti.com
SLLS858 – AUGUST 2007
FUNCTION TABLES
XXX
Each Driver (1)
(1)
INPUT
DIN
OUTPUT
DOUT
L
H
H
L
H = high level, L = low level
Each Receiver (1)
(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
H = high level, L = low level
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
14
DIN1
DOUT1
10
7
DIN2
DOUT2
12
13
ROUT1
RIN1
9
8
ROUT2
2
RIN2
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TRSF3232
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE
LINE DRIVER/RECEIVER
www.ti.com
SLLS858 – AUGUST 2007
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.3
6
V
V+
Positive-output supply voltage range (2)
–0.3
7
V
0.3
–7
V
13
V
V–
Negative-output supply voltage range
V+ – V–
Supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
(2)
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
–0.3
6
Receivers
–25
25
Drivers
Receivers
Package thermal impedance (3) (4)
TJ
Drivers
–13.2
13.2
–0.3
VCC + 0.3
D package
82
DB package
46
DW package
57
PW package
108
–65
UNIT
V
V
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
See Figure 4
MIN NOM MAX UNIT
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver high-level input voltage
DIN
VIL
Driver low-level input voltage
DIN
Driver input voltage
DIN
VI
TA
(1)
VCC = 3.3 V
VCC = 5 V
3
3.3
3.6
4.5
5
5.5
V
2
V
2.4
0.8
Receiver input voltage
TRSF3232C
Operating free-air temperature
TRSF3232I
0
5.5
–25
25
0
70
–40
85
V
V
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
ICC
(1)
(2)
Supply current
TEST CONDITIONS
No load, VCC = 3.3 V or 5 V
MIN
TYP (2)
MAX
0.3
1
UNIT
mA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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3
TRSF3232
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE
LINE DRIVER/RECEIVER
www.ti.com
SLLS858 – AUGUST 2007
DRIVER SECTION
abc
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP (2)
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at GND
±0.01
IOS
Short-circuit output current (3)
VO = 0 V
ro
Output resistance
VCC, V+, and V– = 0 V,
(1)
(2)
(3)
MAX
V
V
±1
μA
μA
±0.01
±1
VCC = 3.6 V
±35
±60
VCC = 5.5 V
±35
±90
VO = ±2 V
300
UNIT
mA
Ω
10M
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
MIN TYP (2)
TEST CONDITIONS
CL = 1000 pF
Maximum data rate RL = 3 kΩ,
(see Figure 1)
One DOUT switching
4
UNIT
250
CL = 250 pF,
VCC = 3 V to 4.5 V
1000
CL = 1000 pF,
VCC = 4.5 V to 5.5 V
1000
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ,
See Figure 2
SR(tr)
Slew rate,
transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ,
CL = 150 pF to 1000 pF,
VCC = 3.3 V
(1)
(2)
(3)
MAX
kbit/s
300
18
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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ns
150
V/μs
TRSF3232
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE
LINE DRIVER/RECEIVER
www.ti.com
SLLS858 – AUGUST 2007
RECEIVER SECTION
abc
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
ri
Input resistance
(1)
(2)
MIN
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
UNIT
V
0.4
VCC = 3.3 V
1.5
2.4
VCC = 5 V
1.8
2.4
VCC = 3.3 V
0.6
1.2
VCC = 5 V
0.8
1.5
V
V
V
0.3
VI = ±3 V to ±25 V
3
5
V
7
kΩ
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF
300
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF
300
ns
tsk(p)
Pulse skew (3)
300
ns
(1)
(2)
(3)
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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TRSF3232
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE
LINE DRIVER/RECEIVER
www.ti.com
SLLS858 – AUGUST 2007
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
tTLH
3V
3V
Output
−3 V
−3 V
VOH
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
SR(tr) +
t
THL
6V
or t
TLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
tTLH
3V
3V
Output
−3 V
−3 V
TEST CIRCUIT
VOH
VOL
VOLTAGE WAVEFORMS
SR(tr) +
t
THL
6V
or t
TLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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TRSF3232
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE
LINE DRIVER/RECEIVER
www.ti.com
SLLS858 – AUGUST 2007
APPLICATION INFORMATION
1
16
+ CBYPASS = 0.1 µF
−
+
C1
VCC
C1+
2
+
†
−
C3
V+
GND
15
−
3
4
14
DOUT1
C1−
13
C2+
+
C2
RIN1
5 kΩ
−
5 C2−
12
6
C4
DOUT2
RIN2
−
V−
11
ROUT1
DIN1
+
7
10
8
9
DIN2
ROUT2
5 kΩ
†
C3 can be connected to VCC or GND.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 4. Typical Operating Circuit and Capacitor Values
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TRSF3232CD
ACTIVE
SOIC
D
16
TBD
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TRSF3232CDB
ACTIVE
SSOP
DB
16
TBD
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TRSF3232CDBG4
ACTIVE
SSOP
DB
16
TBD
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TRSF3232CDBR
ACTIVE
SSOP
DB
16
TBD
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TRSF3232CDBRG4
ACTIVE
SSOP
DB
16
TBD
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TRSF3232CDG4
ACTIVE
SOIC
D
16
TBD
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TRSF3232CDR
ACTIVE
SOIC
D
16
TBD
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TRSF3232CDRG4
ACTIVE
SOIC
D
16
TBD
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TRSF3232CDW
ACTIVE
SOIC
DW
16
TBD
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TRSF3232CDWG4
ACTIVE
SOIC
DW
16
TBD
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TRSF3232CDWR
ACTIVE
SOIC
DW
16
TBD
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TRSF3232CDWRG4
ACTIVE
SOIC
DW
16
TBD
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TRSF3232CPW
ACTIVE
TSSOP
PW
16
TBD
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TRSF3232CPWG4
ACTIVE
TSSOP
PW
16
TBD
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TRSF3232CPWR
ACTIVE
TSSOP
PW
16
TBD
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TRSF3232CPWRG4
ACTIVE
TSSOP
PW
16
TBD
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TRSF3232ID
ACTIVE
SOIC
D
16
TBD
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TRSF3232IDB
ACTIVE
SSOP
DB
16
TBD
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TRSF3232IDBG4
ACTIVE
SSOP
DB
16
TBD
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TRSF3232IDBR
ACTIVE
SSOP
DB
16
TBD
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TRSF3232IDBRG4
ACTIVE
SSOP
DB
16
TBD
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TRSF3232IDG4
ACTIVE
SOIC
D
16
TBD
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TRSF3232IDR
ACTIVE
SOIC
D
16
TBD
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TRSF3232IDRG4
ACTIVE
SOIC
D
16
TBD
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TRSF3232IDW
ACTIVE
SOIC
DW
16
TBD
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TRSF3232IDWG4
ACTIVE
SOIC
DW
16
TBD
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TRSF3232IDWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TRSF3232IDWRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
24-Jul-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TRSF3232IPW
ACTIVE
TSSOP
PW
16
TBD
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TRSF3232IPWG4
ACTIVE
TSSOP
PW
16
TBD
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TRSF3232IPWR
ACTIVE
TSSOP
PW
16
TBD
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TRSF3232IPWRG4
ACTIVE
TSSOP
PW
16
TBD
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(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TRSF3232IDWR
Package Package Pins
Type Drawing
SOIC
DW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.7
2.7
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRSF3232IDWR
SOIC
DW
16
2000
346.0
346.0
33.0
Pack Materials-Page 2
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acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
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