User's Guide
SLVUAD9 – December 2014
TS3A227E EVM User's Guide
This document is the EVM user guide for the TS3A227E-EVM which provides an easy evaluation of TI's
autonomous audio jack switch with integrated key-press detection and power off noise removal.
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Contents
About this Manual............................................................................................................ 2
Information About Cautions and Warnings ............................................................................... 2
Introduction ................................................................................................................... 3
3.1
Hardware Items for Operation..................................................................................... 3
TS3A227E-EVM Connections Overview ................................................................................. 4
4.1
TS3A227E Design Under Test (DUT) ............................................................................ 4
4.2
Power ................................................................................................................. 5
4.3
Test Points ........................................................................................................... 6
4.4
Translator ............................................................................................................ 6
4.5
On-Board MICBIAS Output ........................................................................................ 7
4.6
Key-Press Matrix .................................................................................................... 7
4.7
External CODEC Interface......................................................................................... 8
LaunchPad Setup ........................................................................................................... 9
Installing the GUI ........................................................................................................... 11
Using the GUI ............................................................................................................... 12
7.1
Connecting the LaunchPad to the EVM and PC .............................................................. 12
7.2
GUI Area Descriptions and Use ................................................................................. 14
7.3
GUI Operation ..................................................................................................... 16
7.4
Using the TS3A227E to Develop a Headset................................................................... 17
7.5
Power Off Noise Removal Evaluation .......................................................................... 18
7.6
Slow Plug-In Issue ................................................................................................ 18
Board Documentation ...................................................................................................... 19
8.1
Schematic .......................................................................................................... 19
8.2
Bill of Materials .................................................................................................... 20
8.3
PCB Layout ........................................................................................................ 22
Related Documentation.................................................................................................... 25
List of Figures
1
TS3A227E-EVM Block Diagram ........................................................................................... 3
2
Connector to TS3A227E .................................................................................................... 4
3
Power Connections
4
5
6
7
8
9
10
11
......................................................................................................... 5
Breakout Test Point Headers .............................................................................................. 6
Translator ..................................................................................................................... 6
On-Board MICBIAS Output ................................................................................................. 7
Key Press Schematic........................................................................................................ 7
External CODEC Interface.................................................................................................. 8
LaunchPad Header Connections .......................................................................................... 9
LaunchPad J5 Header Connections ...................................................................................... 9
LaunchPad LED Indicators................................................................................................ 10
LaunchPad, Code Composer Studio are trademarks of Texas Instruments.
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About this Manual
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12
Application Install - Security Warning Window ......................................................................... 11
13
TS3A227E-EVM GUI Window ............................................................................................ 11
14
COM PORT Detection Error Window .................................................................................... 12
15
LaunchPad to EVM Connection .......................................................................................... 12
16
LaunchPad LED Indicators................................................................................................ 13
17
TS3A227E-EVM GUI
18
19
20
21
22
23
24
25
......................................................................................................
TS3A227E-EVM GUI Details .............................................................................................
MSP430 LaunchPad Warning Window ..................................................................................
EVM GUI Settings When Using On-Board Keys .......................................................................
Schematic ...................................................................................................................
Top Copper .................................................................................................................
Ground Plane (Negative Image)..........................................................................................
Power Plane (Negative Image) ...........................................................................................
Bottom Copper..............................................................................................................
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15
16
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19
22
23
24
25
List of Tables
1
1
Default Jumper Locations ................................................................................................. 13
2
Jumper Locations for On-Board Keys ................................................................................... 16
3
TS3A227E-EVM Bill of Materials ......................................................................................... 20
About this Manual
This user’s guide describes the TS3A227E evaluation module (EVM) and its intended use. This guide
contains the EVM schematics, bill of materials, and board layer information.
2
Information About Cautions and Warnings
The information in a caution or a warning is provided for personal protection. Read each caution and
warning carefully.
ATTENTION
STATIC SENSITIVE DEVICES
HANDLE ONLY AT
STATIC SAFE WORK STATIONS
CAUTION
This EVM contains components that can potentially be damaged by
electrostatic discharge. Always transport and store the EVM in its supplied ESD
bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, see the
Electrostatic Discharge (ESD) application note (SSYA008).
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Introduction
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3
Introduction
The TS3A227E-EVM is an evaluation module for TI's autonomous audio jack switch with integrated keypress detection and power off noise removal. Designed to interact with the audio jack, the device
automatically detects the presence of 3- or 4-pole audio accessories and also features an integrated
switch matrix for automatic routing of the MICBIAS, codec ground sense, and ground connections.
The device also incorporates a high-resolution ADC for distinguishing from up to four keys in the default
mode. Additionally, the TS3A227E features the ability for on-the-fly key-press bin adjustment and a raw
ADC output mode to add the ability for the system to define non-standard key-press bins, as desired.
The evaluation board is designed both as a demonstration and development board by using the MSP430
LaunchPad™ as a base platform for interacting with the device. There is an example firmware stack and
GUI provided with the EVM. Figure 1 is a block diagram of the EVM structure.
Codec Jack
Ring1
3.6 V
VCC
VCC
2.2 k
Adjustable
LDO
VDD
TS3A227E
MICP
VDDIO
GND_SENSE
TIP
/DET_TRIGGER
RING2
MSP40 LaunchPad
VCCB VCCA
Translator
SDA
RING2_SENSE
SCL
SLEEVE
TS3A227E Jack
/MIC_PRESENT SLEEVE_SENSE
/INT
GNDA
GND
KP Demo Buttons
Figure 1. TS3A227E-EVM Block Diagram
3.1
Hardware Items for Operation
The following items are required for EVM evaluation:
• TS3A227E-EVM
• MSP-EXP430G2 LaunchPad Rev 1.5
• MSP430G2553
• USB cable
The following items are optional for EVM evaluation:
• 4-pole headset
• 3-pole headset
• Code Composer Studio™ (CCS)
• Visual Studio 2012
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TS3A227E-EVM Connections Overview
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TS3A227E-EVM Connections Overview
This section contains information about TS3A227E-EVM design under test, power, test points, translator,
on-board MICBIAS output, key-press matrix, and external codec interface.
4.1
TS3A227E Design Under Test (DUT)
The TS3A227E audio lines are connected to audio jack J4. Plug a headset into audio jack J4 for testing.
The audio jack used on the EVM is normally a closed jack that has the wrong transition polarity for an
insertion event (low to high). The DET_TRIGGER pin has an internal 1-MΩ resistor and Q1 is used to
invert the polarity of the insertion event and create a high-to-low transition.
The supply voltage for the TS3A227E is VDD and the digital IO lines are pulled up to VDDIO.
VDD
VDD
C1
1µF
C2
0.1µF
VDDIO
R3
4.7k
R4
4.7k
R5
4.7k
R6
4.7k
Connector to TS3A227E
U1
4
VDD
GND
/MIC_PRESENT 16
TIP
14
TIP
DET_TRIGGER
15
/DET_TRIGGER
RING2_SENSE
7
SLEEVE_SENSE
8
MIC_PRESENT
SCL
SDA
9
3
SCL
SDA
/INT
13
INT
MICP
6
MICP
GND_SENSE
5
GND_SENSE
R2
330k
Q1
RING2
12
RING2
SLEEVE
10
SLEEVE
GNDA
11
GND
GND
PAD
1
2
17
TIP
RING1
RING2
SLEEVE
2
5
3
4
1
J4
TIP
RING1
GND
R7
10k
R8
10k
TS3A227ERVA
GND
GND
Figure 2. Connector to TS3A227E
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4.2
Power
The TS3A227E-EVM derives its power from the LaunchPad. The EVM board power is labeled VCC in the
schematic and the power supplied to the TS3A227E is labeled VDD. Header connection explanations
follow:
• Header J1 provides a point to check VCC or to provide the board power if the LaunchPad is not being
used.
• Header J2 provides a means to power the TS3A227E from the board power. Populate this jumper to
connect VDD to VCC. If external power is being applied to the TS3A227E, remove this jumper.
• The blue diode D1 lights up when board power is applied.
• J3 selects the digital IO pull-up voltage. By shorting pins 1 and 2, the digital IO lines are pulled up to
the board supply voltage. Shorting pins 2 and 3 allows an external pull-up voltage to be used (such as
1.8 V) from J5.
• J5 provides a connection for supplying an external IO voltage.
VCC is the MSP430 supply to the board.
J_VDD can be used to connect the MSP430 supply to the TS3A227E
VCC
J1
VCC
VDD
1
2
VCC
D1
Blue
VDD input range is 2.5 V to 4.5 V
J2
R1
1.50k
GND
VCC
J3
1
2
3
VDDIO
J5
VDDIO can be separate supply
VDDIO input range is 1.8 V to
J3 is used to select between a
the MSP430 supply being used
for GPIO pins
VDD
separate VDDIO voltage and
to power the board
Figure 3. Power Connections
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Test Points
The headers in Figure 4 provide breakout test points on the EVM for connecting to external hosts and
systems.
J6
SCL
J7
SDA
J8
/MIC_PRESENT
J9
/INT
J11
RING2
J13
TIP
VDD
J14
1
2
3
GND_SENSE
/DET_TRIGGER
1
2
3
RING1
MICP
SLEEVE
J17
Figure 4. Breakout Test Point Headers
4.4
Translator
Because the TS3A227E VDDIO supply can vary from 1.8 V to 4.5 V, a translator is needed to translate
the VDDIO voltage domain to the LaunchPad 3.6-V domain. U3 provides this functionality.
If the LaunchPad is not used, remove the jumpers on J27.
VCC
VDDIO
C3
1µF
C4
0.1µF
R15
200k
C5
1µF
C6
0.1µF
R16
4.7k
R17
4.7k
R18
4.7k
R19
4.7k
U3
2
GND
/INT
/MIC_PRESENT
SDA
SCL
1
3
5
7
2
4
6
8
J27
3
4
5
6
7
8
9
10
VREF_A
A1
A2
A3
A4
A5
A6
A7
A8
VREF_B
19
EN
20
B1
B2
B3
B4
B5
B6
B7
B8
18
17
16
15
14
13
12
11
GND
LSF0108PW
GND
MSP430_/INT
MSP430_/MIC_PRESENT
MSP430_SDA
MSP430_SCL
1
GND
Figure 5. Translator
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4.5
On-Board MICBIAS Output
U2 provides the following MICBIAS outputs by moving the jumper position on J22 and shorting different
sets of pins. The EVM also has a spare 0603 resistor and jumper position if a different MICBIAS voltage is
desired.
• Pins 7–8 → 2.2 V
• Pins 5–6 → 2.5 V
• Pins 3–4 → 2.8 V
• Pins 1–2 → user-populated resistor
TPS71401DCKT
U2
4
OUT
R14
5
C7
1µF
C8
0.1µF
3
NC
FB
C9
2.2µF
J22
1
MICP
2.20k
2
4
6
8
IN
1
2
VCC
C10
33µF
2
GND
GND
GND
J24
1
3
5
7
GND
Vout = (Vref) * (1 + (R1/R2))
R20
DNP
GND
R21
1.07M
R22
866k
R23
680k
Vref = 1.20 V R2= 1M
Feeback Loop Resistors
2.8 V: R1 = 1.07M
R24
806k
2.5 V: R1 = 866k
2.2 V: R1 = 673k
GND
Figure 6. On-Board MICBIAS Output
4.6
Key-Press Matrix
The TS3A227E EVM features on-board keys for quick evaluation of the key press functionality. Setting up
the EVM for key press is discussed in Section 7.3.1. By placing a jumper on both headers J15 and J20,
the matrix is attached to the TS3A227E SLEEVE and RING2 pins allowing the keys to be used.
The on-board microphone is used to simulate a headset microphone in parallel with the keys and can be
disconnected by removing the jumper on J16. R9 is not populated to allow for headset manufacturers to
develop key resistances that fall accurately into the buckets.
Key1
2
1
2
1
2
1
2
1
1
2
RING2
Key2
Key3
1
2
Key4
MK1
R10
1.0
R11
143
3
4
3
4
3
4
J15
3
4
R9
DNP
2.2kohm
R12
270
J16
1
2
SLEEVE
1
2
R13
590
J20
Figure 7. Key Press Schematic
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4.7
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External CODEC Interface
J10 provides a means to connect an external codec to the TS3A227E-EVM through a 3.5-mm jack. J12 is
provided to switch the microphone and ground of the EVM between the SLEEVE and RING2 pins.
Shorting pins 1-2 and pins 3-4 connects MICP to RING2 and SLEEVE to ground. Shorting pins 2–4 and
1–3 connects MICP to SLEEVE and RING2 to ground.
TIP
J12
MICP
1
3
RING1
2
4
2
5
3
4
1
J10
GND
Figure 8. External CODEC Interface
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LaunchPad Setup
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5
LaunchPad Setup
Use the following steps to set up the LaunchPad:
1. With the LaunchPad unplugged, configure the headers on the LaunchPad to match the yellow box in
Figure 9.
The right 3 headers are vertical and the left are horizontal.
Figure 9. LaunchPad Header Connections
2. With the LaunchPad still unplugged, remove the right-most jumper on the J5 header to match the
yellow box in Figure 10.
Figure 10. LaunchPad J5 Header Connections
3. Connect the LaunchPad to a computer with a USB-to-mini cable. A green LED and a red LED now turn
on as shown in Figure 11.
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LaunchPad Setup
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Figure 11. LaunchPad LED Indicators
4.
5.
6.
7.
8.
10
This is sufficient to setup the LaunchPad to interact with the EVM. If using CCS to do firmware
development, continue the following steps:
Download Code Composer Studio.
Extract the TS3A227E_GUI_Fimware.zip to any folder.
Example: C:\Users\USER\Documents \TS3A227E
Open Code Composer Studio and create a new workspace. Select the Project drop-down menu and
click on Import existing CCS/CCE Eclipse Project. Select Browse on the Select-search directory option
and select the location where the source code is stored. Click the Finish button and select debug
launch to load the code to the MSP430G2553 microcontroller. Once completed, disconnect the USB
cable from the LaunchPad.
CCS can also be used as a firmware development/experimentation platform and the EVM/GUI will
work while using the debugging functionality of Code Composer Studio.
If the LaunchPad is running and the TS3A227E-EVM daughter board is disconnected, the I2C
communication fails. Pause the debugger, reset the MSP430, and then rerun the code.
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Installing the GUI
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6
Installing the GUI
Install the GUI using the following steps:
1. Extract the TS3A227E_GUI_Fimware.zip contents to any destination folder.
2. Double click setup.exe located in the /TS3A227E_GUI_Firmware/TS3A227E_GUI folder that was
extracted in step 1.
3. The Application Install - Security Warning window pops up. Click the Install button.
Figure 12. Application Install - Security Warning Window
4. After the installation finishes, the GUI opens. The GUI is illustrated in Figure 13.
Figure 13. TS3A227E-EVM GUI Window
If the window shown in Figure 14 appears, verify that the EVM is plugged into the PC.
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Figure 14. COM PORT Detection Error Window
5. When launching the GUI in the future, open it by double clicking the TS3A227E.application file.
7
Using the GUI
This section includes instructions for connecting the LaunchPad to the EVM and PC, GUI window
descriptions, GUI operation, headset development, power off noise removal evaluation, and slow plug-in
issues.
7.1
Connecting the LaunchPad to the EVM and PC
Use the following steps to connect the LaunchPad to the EVM and PC.
1. Connect the MSP430 LaunchPad to the EVM as shown in Figure 15. The EVM sits on top of the
LaunchPad so there is minimal overlap.
Figure 15. LaunchPad to EVM Connection
2. The jumper locations for default operation are listed in Table 1.
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Table 1. Default Jumper Locations
Reference Designator
Jumper Locations
J2
Populated
J3
Pins 1–2
J12
Pins 1–2
Pins 3–4
J15
Not Populated
J16
Populated
J20
Not Populated
J22
Pins 7–8 only
No jumper on other pins
J24
Populated
J27
Pins 1–2
Pins 3–4
Pins 4–5
Pins 7–8
3. Connect the LaunchPad to the PC. A blue LED now lights up along with the red and green LEDs on
the LaunchPad.
Figure 16. LaunchPad LED Indicators
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Using the GUI
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GUI Area Descriptions and Use
This section describes the various sections of the GUI. Figure 17 shows the TS3A227E-EVM GUI.
Figure 17. TS3A227E-EVM GUI
•
•
•
•
14
The blue section of the GUI denotes the Register Address, Register Name, and the current stored Reg
Value at that register in Hex. These fields cannot be edited and clicking them has no effect.
The green section of the Register Map indicates Read-only registers. These values are only updated
with data from the MSP430 LaunchPad
The red section of the Register Map indicates Read/Write registers. Clicking on any bit of these
registers not labeled Reserved toggles that bit. If Auto Write on Click is checked, clicking on a bit also
sends a command to the MSP430 to write the value entered to the TS3A227E.
– For example, if register 0x03 currently has the value 0x01 and bit 1 of that register is clicked, bit 1
toggles from a value of ‘0’ to a new value of ‘1’. The GUI then sends the new register value of 0x03
to the LaunchPad to write to the TS3A227E.
– Bits that a colored in yellow are == 1. Bits that are colored gray are == 0.
The pink section of the GUI denotes the Read/Write buttons.
– Clicking a Read button reads the value of the corresponding register it is adjacent to (for example,
clicking the top-most Read button reads register 0x01 and updates the GUI contents).
– Clicking a Write button writes the currently shown value for the adjacent register in the GUI to the
TS3A227E.
– Clicking the Read All button reads the entire register map and also updates the pin status.
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Figure 18. TS3A227E-EVM GUI Details
Figure 18 highlights areas of the EVM GUI that are explained in the following:
• The orange section runs algorithms to determine the real-world values corresponding to the output of
the TS3A227E, that is, the Accessory Detection box in the top left monitors the Accessory Type
register (0x08) to determine what is attached.
• The purple section of the GUI denotes the current status of the MSP430 GPIOs, in addition to
indicating when a key is pressed:
– Green indicates an active(true) GPIO
– Gray indicates an inactive(false) GPIO
• The green section of the GUI are user input controls for the EVM:
– Un-checking Auto Write on Click disables the auto-write feature when a bit is clicked. Use the 5
Write buttons to write to the device instead of a simple click of a bit cell.
– Auto Read on /INT controls whether the firmware automatically reads the TS3A227E device
registers and sends the values back to the GUI when an Interrupt occurs. Unchecking this box
makes the firmware only update the GUI that an interrupt has occurred.
– The Flash Firmware button installs the default firmware that comes with the GUI onto the
LaunchPad without opening CCS.
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7.3
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GUI Operation
The GUI automatically searches to see if the LaunchPad is connected upon startup and immediately
attempts to read the register values from the LaunchPad. If the message in Figure 19 appears, the GUI
was unable to detect the LaunchPad and starts up without reading the registers. Ensure that the
LaunchPad is connected to the PC correctly.
Figure 19. MSP430 LaunchPad Warning Window
If there are no connection issues, try unplugging the LaunchPad and plugging it back in, since windows
sometimes encounters errors with COM Ports. Try to read from the device when the LaunchPad is
plugged back in, there is no need to restart the GUI. If not connected, the GUI tries to connect every time
a read or write is attempted on the LaunchPad. This allows the LaunchPad to be unplugged without
having to close the GUI.
If Auto Write on Click is enabled and a Reserved register bit in one of the R/W registers is clicked, the GUI
does not populate that bit as a ‘1’ in the register map. The GUI still writes the existing value to the register.
If Auto Write on Click is disabled, nothing happens.
7.3.1
Using the TS3A227E-EVM On-Board Keys
Make sure nothing is inserted into the EVM jack.
1. Setup the jumpers on the EVM to the positions listed in Table 2:
Table 2. Jumper Locations for On-Board Keys
Reference Designator
Jumper Location
J2
Populated
J3
Pins 1-2
J12
Not Populated
J15
Populated
J16
Populated
J20
Populated
J22
Pins 7-8 only
No jumper on other pins
J24
Populated
J27
Pins 1-2
Pins 3-4
Pins 4-5
Pins 7-8
2. Enable the following switches by clicking on the appropriate bits in the GUI:
• S3GR
• S3PS
• RING2 GNDFET
• Manual switch control
3. Enable key press by pressing the Key Press Enable bit.
4. The GUI should now appear as shown in Figure 20.
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Figure 20. EVM GUI Settings When Using On-Board Keys
5. Now press any of the keys and watch the various interrupts fire. The Auto Read on /INT checkbox can
be unclicked to view what occurs if the interrupt is not read after numerous key presses.
For more information on key press operation, refer to the datasheet (SCDS358).
7.4
Using the TS3A227E to Develop a Headset
If the EVM is being used to test/develop headset keys by a manufacturer, there are multiple ways to test
this:
Method One
If there is an existing headset that the manufacturer is looking to add keys to without changing the
microphone, insert the headset into audio jack J4. Place jumpers on J15 and J20 and remove the jumper
on J16. Enable key-press detection in the GUI and enable raw data mode. Enabling raw data mode shows
the exact detected resistance instead of the bin the resistor falls in.
Once setup, attach the parallel or resistor between the SLEEVE and RING2 pins, not between one of the
SLEEVE/RING2 pins and ground. The TS3A227E sees this drop in voltage on the MIC line and detects
the parallel resistance combination.
Method Two
Creating a new headset with a prototype microphone.
If the headset is in development and testing the key resistance values is needed, use the following
method:
1. Enable Manual Switch control
2. Set the S3 matrix so the ground and microphone are routed to the appropriate pin:
• S3PS → MIC on SLEEVE
• S3PR → MIC on RING2
• S3GS → ground on SLEEVE
• S3GR → ground on RING2
3. Turn on the appropriate GNDFET for the location of the ground pin.
4. Place jumpers on J15 and J20 and remove the jumper on J16.
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5. Attach the external microphone between the SLEEVE and RING2 and match the microphone ground
to the location of the ground chosen in step 3.
6. Enable Key Press Detection and Raw Data.
7. Attach the key and the GUI now reports the detected resistance.
7.5
Power Off Noise Removal Evaluation
The depletion FETs of the TS3A227E provide a ground connection when the device is unpowered,
eliminating the humming noise phenomenon associated with previous-generation audio jack switches. The
EVM provides an easy means to evaluate this performance with the following procedure:
1. Remove both jumpers from J12. This floats the ground lines of the codec audio jack J10 and simulates
what the TS3A227E would be like without the depletion FETs.
2. Insert the speakers into jack J10.
3. Turn on the speakers and turn the volume up until a humming noise appears.
4. Turn off the speakers.
5. Remove the jumper from J2. This removes power from the TS3A227E.
6. Insert the speakers into the TS3A227E audio jack J4.
7. Turn on the speakers and turn the volume up and the humming noise is no longer present.
7.6
Slow Plug-In Issue
Any system which utilizes an audio jack must overcome the slow plug-in issue to deliver a positive
end-user experience. On the TS3A227E-EVM, the audio jack follows the guideline of having the detection
mechanism on the tip pin but the mechanical structure of the jack trips too early for a standard insertion.
This causes an incorrect detection because the RING2 pin is not making contact when the detection
algorithm runs, resulting in a false OMTP detection when a 4-pole standard or 3-pole is inserted.
To remove this issue, there are two immediate options:
• Increase the insertion de-bounce period to compensate for the mechanical shortcomings of the jack:
– This option can be tested with the TS3A227E-EVM and GUI. Increase the insertion de-bounce
incrementally and observe how the detection passes. At 150 ms de-bounce, the slow plug-in issue
is eliminated.
– Conversely, the de-bounce can be reduced to observe the effects of having a shorter de-bounce.
• Change the audio jack to a better mechanical structure:
– This is the best option, by choosing a jack with the detection mechanism further inside the jack it
would ensure that the headset is fully inserted and is entirely reliant on the de-bounce
TI recommends developers that use the TS3A227E utilize the EVM test points for the audio jack pins and
connect the EVM to the audio jack that is planned for implementation. This allows the system designer to
test how the TS3A227E and the audio jack perform together and makes changes as necessary.
18
TS3A227E EVM User's Guide
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8
Board Documentation
This section includes the TS3A227E-EVM schematic, BOM, and board layouts.
8.1
Schematic
Figure 21 illustrates the TS3A227E-EVM schematic.
VCC is the MSP430 supply to the board.
J_VDD can be used to connect the MSP430 supply to the TS3A227E
VCC
J1
VCC
VDD
1
2
VCC
D1
Blue
VDD input range is 2.5 V to 4.5 V
J2
R1
1.50k
VDD
VDD
C1
1µF
GND
VCC
J3
C2
0.1µF
VDDIO
R3
4.7k
R4
4.7k
R5
4.7k
R6
4.7k
J5
VDDIO can be separate supply for GPIO pins
VDDIO input range is 1.8 V to VDD
J3 is used to select between a separate VDDIO voltage and
the MSP430 supply being used to power the board
GND
/MIC_PRESENT 16
MIC_PRESENT
SCL
SDA
9
3
SCL
SDA
INT
/INT
13
MICP
6
GND_SENSE
5
J7
TIP
14
TIP
DET_TRIGGER
15
/DET_TRIGGER
RING2_SENSE
7
VDD
SLEEVE
GND_SENSE
TIP
8
RING2
MICP
R2
330k
Q1
SLEEVE_SENSE
J6
SCL
Connector to TS3A227E
U1
4
VDDIO
1
2
3
RING1
RING2
SLEEVE
12
RING2
10
SLEEVE
GNDA
11
GND
GND
PAD
1
2
17
2
5
3
4
1
J4
TIP
RING1
GND
R7
10k
R8
10k
TS3A227ERVA
GND
SDA
GND
Connector to interface with Codec
J8
/MIC_PRESENT
J9
/INT
TIP
J12
J11
MICP
RING2
RING1
1
3
Key 1-4 resistance are calculated so that when in parallel with a 2.2 kohm mic the equivalent resistance seen by the TS3A227E is within
the bins shown above
2
4
GND
Key1
Key2
Key3
1
2
Key4
MK1
VCC
1
2
3
4
5
6
7
8
9
10
GND_SENSE
/DET_TRIGGER
R10
1.0
R11
143
2.2kohm
3
4
3
4
J15
3
4
R9
DNP
3
4
1
2
3
2
1
2
1
2
1
2
1
1
2
RING2
VDD
J14
J10
MSP430 LaunchPad Jumper connectors
J13
TIP
2
5
3
4
1
R12
270
1
2
R13
590
J16
1
2
SLEEVE
1
2
3
4
5
MSP430_SDA 6
MSP430_SCL 7
8
9
10
GND
MSP430_/INT
MSP430_/MIC_PRESENT
J17
1
2
3
RING1
MICP
SLEEVE
J18
J19
VCC
J20
VDDIO
TPS71401DCKT
U2
IN
3
NC
OUT
5
FB
1
R14
2
4
6
8
4
C7
1µF
C8
0.1µF
C9
2.2µF
J22
2.20k
C10
33µF
C3
1µF
MICP
1
2
VCC
J21
C4
0.1µF
R15
200k
2
2
GND
GND
GND
VREF_A
J24
1
3
5
7
GND
J25
Vout = (Vref) * (1 + (R1/R2))
GND
GND
J26
R20
DNP
R21
1.07M
R22
866k
R23
680k
Vref = 1.20 V R2= 1M
/INT
/MIC_PRESENT
SDA
SCL
1
3
5
7
Feeback Loop Resistors
2.8 V: R1 = 1.07M
R24
806k
C5
1µF
C6
0.1µF
R16
4.7k
R17
4.7k
R18
4.7k
R19
4.7k
U3
GND
J23
2
4
6
8
J27
3
4
5
6
7
8
9
10
A1
A2
A3
A4
A5
A6
A7
A8
LSF0108PW
GND
EN
20
B1
B2
B3
B4
B5
B6
B7
B8
18
17
16
15
14
13
12
11
GND
2.5 V: R1 = 866k
2.2 V: R1 = 673k
VREF_B
19
MSP430_/INT
MSP430_/MIC_PRESENT
MSP430_SDA
MSP430_SCL
1
GND
GND
Figure 21. Schematic
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19
Board Documentation
8.2
www.ti.com
Bill of Materials
Table 3 lists the TS3A227E-EVM BOM.
Table 3. TS3A227E-EVM Bill of Materials
Designator
Quantity
!PCB1
1
Part Number
Manufacturer
HVL094
C1, C3, C5, C7
4
1uF
CAP, CERM, 1uF, 6.3V, +/-10%, X7R, 0603
Any
0603
GRM188R70J105KA01D
C2, C4, C6, C8
4
0.1uF
MuRata
CAP, CERM, 0.1uF, 6.3V, +/-10%, X7R, 0603
0603
GRM188R70J104KA01D
C9
1
MuRata
2.2uF
CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603
0603
C0603C225K8PACTU
C10
Kemet
1
33uF
CAP, CERM, 33uF, 6.3V, +/-20%, X5R, 1210
1210
GRM32DR60J336ME19L
MuRata
D1
1
Blue
LED, Blue, SMD
Blue LED
SMLP12BC7TT86
Rohm
J1, J5, J6, J7, J8, J9, J11, J13,
J21, J23, J25, J26
12
Header, TH, 100mil, 1pos, Gold plated, 230 mil above insulator
Testpoint
TSW-101-07-G-S
Samtec
J2, J15, J16, J20, J24
5
Header, 100mil, 2x1, Gold with Tin Tail, SMT
2x1 Header
TSM-102-01-L-SV
Samtec
J3, J14, J17
3
Header, 100mil, 3x1, Gold, SMT
Samtec_TSM-103-01-X-SV
TSM-103-01-L-SV
Samtec
J4, J10
2
Audio Jack, 3.5mm, Stereo, R/A, SMT
3.5 mm Audio Jack Connector, Body 17
x 6 mm
SJ-43515TS-SMT-TR
CUI Inc.
J12
1
Header, 100mil, 2x2, Tin, SMT
2x2 100mil Tin Header
15-91-2040
Molex
J18, J19
2
Receptacle, 100mil, 10x1, Tin, TH
Receptacle, 10x1, 100mil, Tin
PPTC101LFBN-RC
Sullins Connector Solutions
J22, J27
2
Header, 100mil, 4x2, Gold, SMT
Header, 100mil, 4x2, SMT
0015910080
Molex
Key1, Key2, Key3, Key4
4
SWITCH TACTILE SPST-NO 0.02A 15V, TH
6x4.3x6mm
EVQ-PAD04M
Panasonic
MK1
1
Microphone, Omnidirectional, -38DB, TH
TH, 2-Leads, Dia 5.8mm, Pitch 1.9mm
ROM-2238P-NF-R
PUI Audio
Q1
1
60V
MOSFET, N-CH, 60 V, 0.24 A, SOT-23
SOT-23
2N7002E-T1-E3
Vishay-Siliconix
R1
1
1.50k
RES, 1.50 k, 1%, 0.1 W, 0603
0603
CRCW06031K50FKEA
Vishay-Dale
R2
1
330k
RES, 330 k, 5%, 0.1 W, 0603
0603
CRCW0603330KJNEA
Vishay-Dale
R3, R4, R5, R6, R16, R17, R18,
R19
8
4.7k
RES, 4.7 k, 5%, 0.1 W, 0603
0603
CRCW06034K70JNEA
Vishay-Dale
R7, R8
2
10k
RES, 10 k, 5%, 0.1 W, 0603
0603
CRCW060310K0JNEA
Vishay-Dale
R10
1
1.0
RES, 1.0, 5%, 0.1 W, 0603
0603
CRCW06031R00JNEA
Vishay-Dale
R11
1
143
RES, 143, 1%, 0.1 W, 0603
0603
CRCW0603143RFKEA
Vishay-Dale
R12
1
270
RES, 270, 1%, 0.1 W, 0603
0603
RC0603FR-07270RL
Yageo America
R13
1
590
RES, 590, 1%, 0.1 W, 0603
0603
CRCW0603590RFKEA
Vishay-Dale
Designator
Quantity
Value
Description
PackageReference
PartNumber
Manufacturer
R14
1
2.20k
RES, 2.20 k, 1%, 0.1 W, 0603
0603
RC0603FR-072K2L
Yageo America
R15
1
200k
RES, 200 k, 1%, 0.1 W, 0603
0603
RC0603FR-07200KL
Yageo America
R21
1
1.07Meg
RES, 1.07 M, 1%, 0.1 W, 0603
0603
CRCW06031M07FKEA
Vishay-Dale
R22
1
866k
RES, 866 k, 1%, 0.1 W, 0603
0603
RC0603FR-07866KL
Yageo America
R23
1
680k
RES, 680 k, 1%, 0.1 W, 0603
0603
RC0603FR-07680KL
Yageo America
R24
1
806k
RES, 806 k, 1%, 0.1 W, 0603
0603
RC0603FR-07806KL
Yageo America
SH-J1, SH-J2, SH-J3, SH-J4,
SH-J5, SH-J6, SH-J7, SH-J8,
SH-J9, SH-J10, SH-J11, SH-J12,
SH-J13
13
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
20
Value
Description
Package Reference
Printed Circuit Board
TS3A227E EVM User's Guide
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Table 3. TS3A227E-EVM Bill of Materials (continued)
Designator
Quantity
Description
Package Reference
Part Number
Manufacturer
U1
1
Value
Autonomous Audio Accessory Detection and Configuration Switch,
RVA0016A
RVA0016A
TS3A227ERVA
Texas Instruments
U2
1
Single Output LDO, 80 mA, Adjustable 1.2 to 8.8 V Output, 2.5 to 10
V Input, with Low IQ, 5-pin SC70 (DCK), -40 to 125 degC, Green
(RoHS & no Sb/Br)
DCK0005A
TPS71401DCKT
Texas Instruments
U3
1
8 Channel Bidirectional Multi-Voltage Level Translator for Open-Drain
and Push-Pull Application, PW0020A
PW0020A
LSF0108PW
Texas Instruments
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
R9, R20
0
RES, 38.8k ohm, 0.1%, 0.1W, 0603
0603
RT0603BRD0738K8L
Yageo America
38.8k
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Board Documentation
8.3
www.ti.com
PCB Layout
Figure 23 through Figure 25 illustrate the TS3A227E-EVM PCB layouts.
Figure 22. Top Copper
22
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Figure 23. Ground Plane (Negative Image)
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23
Board Documentation
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Figure 24. Power Plane (Negative Image)
24
TS3A227E EVM User's Guide
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Related Documentation
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Figure 25. Bottom Copper
9
Related Documentation
•
•
•
•
•
Product page: http://www.ti.com/product/ts3a227e?qgpn=ts3a227e
Datasheet link: http://www.ti.com/lit/ds/symlink/ts3a227e.pdf
Link to software: TBD
Link to Code Composer Studio Wiki: http://www.ti.com/tool/CCSTUDIO
Link to MSP430 LaunchPad: http://www.ti.com/tool/msp-exp430g2
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TS3A227E EVM User's Guide
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25
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan are NOT certified by
TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
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IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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