CP210-2N4416A
N-Channel JFET Die
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The CP210-2N4416A is a silicon N-Channel JFET designed for VHF amplifier and mixer
applications.
MECHANICAL SPECIFICATIONS:
G
D
S
BACKSIDE GATE
Die Size
15 x 15 MILS
Die Thickness
8.0 MILS
Drain Bonding Pad Size
3.2 x 4.0 MILS
Source Bonding Pad Size
3.2 x 4.0 MILS
Gate Bonding Pad Size
3.2 x 4.0 MILS
Top Side Metalization
Al – 30,000Å
Back Side Metalization
Au – 6,000Å
Scribe Alley Width
3.0 MILS
Wafer Diameter
5 INCHES
Gross Die Per Wafer
72,000
R1
MAXIMUM RATINGS: (TA=25°C)
Gate-Drain Voltage
Gate-Source Voltage
Drain-Source Voltage
Gate Current
Operating and Storage Junction Temperature
SYMBOL
VGD
VGS
35
UNITS
V
35
V
VDS
IG
35
V
10
mA
TJ, Tstg
-65 to +150
°C
ELECTRICAL CHARACTERISTICS: (TA=25°C)
SYMBOL TEST CONDITIONS
IGSS
VGS=20V, VDS=0
MIN
MAX
0.1
UNITS
nA
IDSS
5.0
15
mA
2.5
6.0
V
4.5
7.5
mS
50
μS
1.0
pF
4.0
pF
VDS=20V,
BVGSS
IG=1.0μA
VGS(OFF) VDS=15V,
gFS
VDS=15V,
gOS
Crss
Ciss
Coss
NF
VGS=0
35
ID=1.0nA
VGS=0, f=1.0kHz
VDS=15V, VGS=0, f=1.0kHz
VDS=15V, VGS=0, f=1.0MHz
VDS=15V, VGS=0, f=1.0MHz
VDS=15V, VGS=0, f=1.0MHz
VDS=15V, ID=5.0mA, RG=1.0kΩ, f=100MHz
V
2.0
pF
2.0
dB
R0 (9-February 2016)
CP210-2N4416A
Typical Electrical Characteristics
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R0 (9-February 2016)
CP210-2N4416A
Typical Electrical Characteristics
R0 (9-February 2016)
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BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: S
ingulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: F
ull wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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(001)
http://www.centralsemi.com
PDN01135
10/02/19
Stock Only
Stock Only
Please be advised that Central Semiconductor must immediately discontinue the product(s) listed in the attached PDN notice. We are unable
to accept any further orders for these products unless
_____ we have available inventory on hand.
You may have purchased one or more of the products listed. Please do not hesitate to contact your local Central Semiconductor sales
representative with any questions or needs you may have. Central regrets any inconvenience this may cause.
Sincerely,
Central Semiconductor Corp.
PDN01135
10/02/19
Stock Only
Stock Only
http://www.centralsemi.com
Summary:The CP210 wafer process is being discontinued and is now classified as End of Life (EOL). The replacement wafer process is
CP232V.
Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by
other manufacturers, it is an accepted industry practice to discontinue certain devices when customer demand falls below a minimum level of
sustainability. Accordingly, the following product(s) have been transitioned to End of Life status as part of Central's ongoing Product
Management Process. Any replacement products are noted below. The effective date for placing last purchase orders will be six (6) months
from the date of this notice and twelve (12) months from the notice date for final shipments, and minimum order quantities may apply.
The last purchase and shipment dates may be extended if inventory is available.
Central Part Number
CP210-CEN1308-CT
CP210-2N4416-CT
CP210-2N4416-CT20
CP210-2N4416A-CT
CP210-2N4416A-CT20
CP210-2N4416A-WN
CP210-2N5486-CT
Replacement
CP232V-CEN1308-CT
CP232V-2N4416A-CT
CP232V-2N4416A-CT
CP232V-2N4416A-CT
CP232V-2N4416A-CT20
CP232V-2N4416A-WN
CP232V-2N5486-CT
Central would be happy to assist you by providing additional information or technical data to help locate an alternate source if we
have no replacement available. Please email your requests to engineering@centralsemi.com.
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