CPS053-CS92D
Silicon Controlled Rectifier Die
0.8 Amp, 400 Volt
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The CPS053-CS92D is a Silicon Controlled Rectifier designed for sensing circuit and control
system applications.
MECHANICAL SPECIFICATIONS:
Die Size
53.2 x 53.2 MILS
Die Thickness
8.7 MILS
Gate Bonding Pad Size
7.9 x 7.9 MILS
Source Bonding Pad Size
20.1 x 10.2 MILS
Top Side Metalization
Al – 45,000Å
Back Side Metalization
Al/Mo/Ni/Ag – 32,000Å
Scribe Alley Width
1.96 MILS
Wafer Diameter
4 INCHES
Gross Die Per Wafer
3,884
MAXIMUM RATINGS: (TA=25°C unless otherwise noted)
SYMBOL
Peak Repetitive Off-State Voltage
VDRM, VRRM
RMS On-State Current
IT(RMS)
400
0.8
A
Peak One Cycle Surge Current (t=10ms)
10
A
0.24
A2s
I2t Value for Fusing (t=10ms)
Peak Gate Power Dissipation (tp=10μs)
Average Gate Power Dissipation
Peak Gate Current (tp=10μs)
Peak Gate Voltage (tp=10μs)
ITSM
I2t
PGM
PG(AV)
IGM
UNITS
V
2.0
W
0.1
W
1.0
A
8.0
V
Operating Junction Temperature
VGM
TJ
-65 to +125
°C
Storage Temperature
Tstg
-65 to +150
°C
MIN
MAX
1.0
UNITS
μA
ELECTRICAL
SYMBOL
IDRM, IRRM
IGT
CHARACTERISTICS: (TA=25°C)
TEST CONDITIONS
VDRM, VRRM=400V, RGK=1.0kΩ
VD=12V
IH
VGT
IT=100mA, RGK=1.0kΩ
VD=12V
VTM
ITM=1.0A, tp=380μs
200
μA
5.0
mA
0.8
V
1.7
V
R0 (7-May 2018)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: S
ingulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: F
ull wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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